ng10-manual-01-2011

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1/164NG10 - Manual - 01 - 2011

MANUAL

NG10BIASED DIFFERENTIAL FOR

GENERATORS/MOTORS/SHORT LINES

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2/1642 NG10 - Manual - 01 - 2011 TABLE OF CONTENTS

T A B L E O F C O N T E N T ST A B L E O F C O N T E N T S

1 INTRODUCTION 5

Scope and liability ...........................................................................................................................................................................................5Applicability ......................................................................................................................................................................................................5Conformity ........................................................................................................................................................................................................5Technical support ............................................................................................................................................................................................5Copyright ...........................................................................................................................................................................................................5Warranty ...........................................................................................................................................................................................................5Safety recommendations ...............................................................................................................................................................................5Insulation tests ................................................................................................................................................................................................5Product identification .....................................................................................................................................................................................6Environment .....................................................................................................................................................................................................6Graphical conventions ...................................................................................................................................................................................6Glossary/definitions ........................................................................................................................................................................................6

2 GENERAL 10

Preface ........................................ ........................................... ............................................. ........................................... ................................ 10Photo ........................................... ........................................... ............................................ ........................................... ................................. 10

Main features.................................................................................................................................................................................................11

3 TECHNICAL DATA 12

3.1 GENERAL ........................................ ........................................... ............................................ ............................................ .................................12Mechanical data ...........................................................................................................................................................................................12Insulation ........................................................................................................................................................................................................12EMC tests for interference immunity .........................................................................................................................................................12Voltage dip and interruption ........................................................................................................................................................................12EMC tests for interference immunity .........................................................................................................................................................12Emission ...................................... ........................................... ............................................ ............................................ ................................ 13Mechanical tests..................................... ............................................ ........................................... ............................................ .................. 13Climatic tests ..................................... ........................................... ............................................. ........................................... ......................... 13Safety .......................................... ........................................... ............................................ ........................................... ................................. 13

Certifications ..................................................................................................................................................................................................143.2 INPUT CIRCUITS .......................................... ........................................... ............................................ ........................................... ...................14

Auxiliary power supply Uaux ......................................................................................................................................................................14Phase current input circuits (side H and side L) ......................................................................................................................................14Residual current input circuit......................................................................................................................................................................14Binary input circuits ......................................................................................................................................................................................14Block input (Logic selectivity) .....................................................................................................................................................................14

3.3 OUTPUT CIRCUITS ....................................... ........................................... ............................................ ........................................... ...................14Relays ..............................................................................................................................................................................................................14Block output (Logic selectivity) ...................................................................................................................................................................15

3.4 MMI ........................................... ........................................... ............................................ ........................................... ........................................153.5 COMMUNICATION INTERFACES ........................................... ........................................... ............................................ .................................15

Local port ........................................................................................................................................................................................................15Remote ports ..................................................................................................................................................................................................15

3.6 GENERAL SETTINGS ........................................... ........................................... ............................................ ........................................... ...........16Rated values (Base) ......................................................................................................................................................................................16Input sequence .............................................................................................................................................................................................16Polarity [3]............................................................................................................................................................................................................................................................................16

3.7 PROTECTIVE FUNCTIONS ........................................ ............................................ ........................................... ............................................ ....17Thermal protection with Pt100 probes - 26 ...............................................................................................................................................17Residual overcurrent or high impedance differential restricted ground fault - 50N/51N - 87NHIZ ................................................17Low impedance restricted ground fault - 64REF side H............................................ ............................................. ................................ 18Breaker failure - BF ......................................... ........................................... ............................................ ........................................... ........... 18

3.8 CONTROL AND MONITORING ........................................ ........................................... ............................................ ........................................ 19Trip Circuit Supervision side H and side L - 74TCS ....................................... ........................................... ............................................ ... 19Selective block - BLOCK2 ..................................... ........................................... ............................................ ........................................... .... 19Circuit Breaker supervision .......................................... ........................................... ............................................ ....................................... 19CT supervision - 74CT side H ........................................ ........................................... ............................................ ....................................... 19

CT supervision - 74CT side L ......................................... ........................................... ............................................ ....................................... 19Pilot wire diagnostic ....................................... ........................................... ............................................ ........................................... ........... 19Demand measures .......................................... ........................................... ............................................ ........................................... ........... 19Oscillography (DFR) ........................................ ........................................... ............................................ ........................................... ........... 20PLC (Programmable Logic Controller) ...................................... ........................................... ............................................ ......................... 20

3.9 METERING............................... ............................................ ........................................... ............................................ ........................................ 21

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4 FUNCTION CHARACTERISTICS 22

4.1 HARDWARE DESCRIPTION ...................................... ............................................ ........................................... ........................................... .....22Power supply board ........................................ ........................................... ............................................ ........................................... ........... 23CPU board .......................................... ........................................... ............................................. ........................................... ......................... 23Input board ........................................ ........................................... ............................................. ........................................... ......................... 23MMI (keyboard, LED and display) ...................................... ........................................... ............................................ ................................ 23

4.2 SOFTWARE DESCRIPTION ..............................................................................................................................................................................24

Base software ................................................................................................................................................................................................24Real-time operating system.........................................................................................................................................................................24Task ..................................................................................................................................................................................................................24Drivers .............................................................................................................................................................................................................25Application Software ....................................................................................................................................................................................25Data Base .......................................................................................................................................................................................................25Self test (Application) ...................................................................................................................................................................................25Development tools (Builder) ........................................................................................................................................................................25

4.3 I/O DESCRIPTION ........................................ ............................................ ............................................ ........................................... ...................26Metering inputs .............................................................................................................................................................................................26Signal processing ..........................................................................................................................................................................................26Conventions ........................................ ........................................... ............................................ ........................................... ......................... 29Polarity reversal ....................................... ........................................... ............................................ ........................................... .................. 30Use of measured values...............................................................................................................................................................................31

Binary inputs ..................................................................................................................................................................................................32Output relays ..................................................................................................................................................................................................37LED indicators ........................................... ........................................... ............................................ ........................................... .................. 39Communication interfaces...........................................................................................................................................................................41

4.4 PROTECTIVE ELEMENTS ........................................... ........................................... ............................................ ........................................... ....42Rated values...................................................................................................................................................................................................42Thermal protection with RTD thermometric probes - 26 ........................................................................................................................44Residual overcurrent / High impedance restricted ground fault - 50N/51N-87NHIZ .........................................................................46Low impedance restricted ground fault- 64REF .......................................................................................................................................56Differential protection for generator-motor-short line (87G-M-L) .......................................... ........................................... .................. 60Breaker failure - BF ......................................... ........................................... ............................................ ........................................... ........... 70

4.5 CONTROL AND MONITORING ........................................ ............................................ ........................................... .........................................72Logical block - BLOCK1 ................................................................................................................................................................................72Selective block -BLOCK2 .............................................................................................................................................................................74Logic block summary ...................................... ........................................... ............................................ ........................................... ........... 79Remote tripping ....................................... ............................................ ........................................... ........................................... ................... 80Frequency tracking .......................................................................................................................................................................................81CT supervision - 74CT - side H and side L .................................................................................................................................................82Trip circuit supervision - 74TCS .......................................... ........................................... ............................................ ................................ 83Circuit breaker supervision .........................................................................................................................................................................86Demand measures .......................................... ........................................... ............................................ ........................................... ........... 88Oscillography .......................................... ............................................ ........................................... ........................................... ................... 88

5 MEASURES, LOGIC STATES AND COUNTERS 89

Measures ............................................ ........................................... ........................................... ............................................ ......................... 89Protection ........................................... ........................................... ........................................... ............................................ ......................... 89Delayed inputs .......................................... ........................................... ............................................ ........................................... .................. 89

Internal states ........................................... ........................................... ............................................ ........................................... .................. 89Relays .......................................... ............................................ ............................................ ........................................... ................................ 90Counters ...................................... ............................................ ............................................ ........................................... ................................ 90Self test ........................................ ........................................... ............................................ ........................................... ................................ 90Pilot wire diagnostic .....................................................................................................................................................................................91Selective Block - BLOCK2 ............................................................................................................................................................................91Fault recording - SFR ....................................................................................................................................................................................91Event recording - SER...................................................................................................................................................................................91Oscillography - DFR ......................................................................................................................................................................................92

6 INSTALLATION 94

6.1 PACKAGING .......................................... ............................................ ............................................ ........................................... ..........................946.2 MOUNTING ........................................... ............................................ ............................................ ........................................... ..........................94

6.3 ELECTRICAL CONNECTIONS ........................................... ........................................... ........................................... ........................................ 986.4 NOMINAL CURRENT InANDIEn SETTING ................................................................................................................................................1066.5 LED ALLOCATION ........................................ ............................................ ............................................ ........................................... ................ 1106.6 FINAL OPERATIONS ........................................... ........................................... ............................................ ........................................... ......... 110

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7 PROGRAMMING AND SETTINGS 111

7.1 SW ThySetter......................................... ........................................... ........................................... ............................................ ........................ 111ThySetter installation ..................................................................................................................................................................................111ThySetter use ...............................................................................................................................................................................................111

7.2 MMI (Man Machine Interface) ...................................... ........................................... ............................................ .......................................112Reading variables (READ) ..........................................................................................................................................................................112Setting modifying (SET) ......................................... ........................................... ............................................ ........................................... .. 113

TEST ...............................................................................................................................................................................................................114Communication ............................................................................................................................................................................................114Circuit breaker commands ........................................................................................................................................................................114

7.3 MENU TREE............................................ ........................................... ........................................... ............................................ ........................1157.4 MAINTENANCE ..................................... ........................................... ........................................... ............................................ ........................1227.5 REPAIR ..................................... ............................................ ........................................... ............................................ ......................................1227.6 PACKAGING ........................................... ........................................... ............................................ ........................................... ........................122

8 APPENDIX 123

8.1 APPENDIX A1 - Inverse time IEC curves ........................................... ............................................ ........................................... ................ 123Mathematical formula ........................................... ............................................ ........................................... ........................................... .. 123Measures residual overcurrent 50N/51N - Standard inverse time curve (IEC 60255-3/BS142 type A) ........................................124Measures residual overcurrent 50N/51N - Very inverse time curve (IEC 60255-3/BS142 type B).................................................125

Measures residual overcurrent 50N/51N - Extremely inverse time curve (IEC 60255-3/BS142 type C) .......................................1268.2 APPENDIX A2 - Inverse time ANSI/IEEE curves ....................................... ............................................ ........................................... .........127Mathematical formula ................................................................................................................................................................................127Measured residual overcurrent 50N/51N - Moderately inverse time curve (ANSI/IEEE type MI) ....................................... ....... 128Measured residual overcurrent 50N/51N - Very inverse time curve (ANSI/IEEE type VI) ........................................................... 129Measured residual overcurrent 50N/51N - Extremely inverse time curve (ANSI/IEEE type EI) ........................................... ....... 130

8.3 APPENDIX A3 - Inverse time EM curves ..................................... ........................................... ............................................ ....................... 131Mathematical formula ................................................................................................................................................................................131Measured residual overcurrent 50N/51N - Electromechanical inverse curves (EM) ...................................... ..............................132

8.4 APPENDIX B1 - I/O Diagram ..................................... ............................................ ........................................... ........................................... . 1338.5 APPENDIX B2 - Interfaces ........................................ ............................................ ........................................... ........................................... ..1348.6 APPENDIX B3- Connection diagrams ........................................... ........................................... ............................................ .......................1358.7 APPENDIX C - Dimensions ........................................ ............................................ ........................................... ........................................... . 1388.8 APPENDIX D - Setting table ...................................... ............................................ ........................................... ........................................... . 139

8.9 APPENDIX E - Revisions history ....................................... ........................................... ........................................... ......................................1628.10 APPENDIX F - EC Declaration of conformity ........................................ ........................................... ........................................... ............... 163

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5/1645NG10 - Manual - 01 - 2011INTRODUCTION

I N T R O D U C T I O N1 I N T R O D U C T I O N

Scope and liabilityThis document describes the functions, the technical data of NT10 devices; instructions for mount-ing, setting and commissioning are included.This manual has been checked out, however, deviations from the description cannot be completelyruled out, so that no liability in a legal sense for correctness and completeness of the information orfrom any damage that might result from its use is formally disclaimed.

The information given in this document is reviewed regularly; any corrections and integration will beincluded in subsequent editions that are identified by the date of revision.We appreciate any suggestions for improvement.We reserve the right to make technical improvements without notice.

ApplicabilityThis manual is valid for NG10 devices with firmware version 2.00 and following.

ConformityThe product complies with the CEE directives:

EMC Council Directives: 2004/108/ECLow voltage Directives: 2006/95/EC

Technical supportContact: Service tecnico THYTRONIC www.thytronic.it

CopyrightAll right reserved; It is forbidden to copy, modify or store material (document and sw) protected bycopyright without Thytronic consent.

WarrantyThytronic warrants devices against defects in materials and workmanship under normal use for aperiod of ONE (1) YEAR from the date of retail purchase by the original end-user purchaser (War-ranty Period).

Safety recommendationsThe warming contained in this document are all-important for safety; special attention must be paidto the following symbols:

Installation and commissioning must be carried out by qualified person; Thytronic assumes no re-sponsibility for damages caused from improper use that does not comply all warning and caution inthis manual.In particular the following requirements must be met:

Remove power before opening it.Verify the voltage absence by means suitable instrumentation on relay connections; attention must

be paid to all circuits supplied by external sources (binary input, CT, etc...)Care must be taken when handling metal parts.

Insulation tests

After insulation tests, hazardous voltages (capacitor charges,...) may be arise; it is advisable to grad-ually reduce the test voltage avoiding to erase it abruptly.

DANGERDeath, severe personal injury or substantial property damage will result if proper precautions

are not takenDANGERDeath, severe personal injury or substantial property damage will result if proper precautions

are not taken

WARNINGDeath, severe personal injury or substantial property damage can result if proper precautions

are not taken.WARNINGDeath, severe personal injury or substantial property damage can result if proper precautions

are not taken.

CAUTIONSettings must be established on the basis of a coordination study.Numerical values inside examples have educational purpose only; they dont be used, in no way,

for actual applications.CAUTION

Settings must be established on the basis of a coordination study.Numerical values inside examples have educational purpose only; they dont be used, in no way,

for actual applications.

CAUTION Minor personal injury or property damage can result if proper precautions are not taken
http://www.thytronic.it/http://www.thytronic.it/

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Product identificationEach device is equipped with:

Identification label installed on the front side with following informations: code number, phase andresidual nominal currents, auxiliary voltage range and CE mark:

Connection diagramTest label with following informations: data, serial number and test operator signature.

EnvironmentThe NT10 device must be employed according to the environment conditions shown (see technicaldata).In case of different environment conditions, appropriate provisions must be provided (conditioningsystem, humidity control, etc...).If contaminants are present (dust, corrosive substances, etc...), filters must be provided.

Graphical conventionsThe CEI/IEC and ANSI symbols is employed where possible:e.g.: 51 = ANSI code concerning the overcurrent element.Following text formats are used:The ThySetter[1]menu: Phase overcurrent -50/51The parameter description (measures, thresholds, operate time,...) and related value: I> element Definite time I>defThe display messages (MMI) are shown as: NG10Notes are highlighted with cursive letters inside colored bar

Note: Useful description note

Glossary/definitionsfn Rated frequencyInH Relay phase nominal current side HInpH Phase CT primary nominal current side HInL Relay phase nominal current side LInpL Phase CT primary nominal current side LIEn Relay residual nominal current (input 1)

IEnp Residual CT primary nominal current26 Thermometric probe ANSI code50N/51N-87NHIZ Residual or High impedance restricted earth fault ANSI code87G-M-L Biased differential ANSI code64REF Low impedance restricted earth fault ANSI code87NHIZ Codifica ANSI della protezione differenziale di terra ristretta ad alta

impedenzaBF Breaker Failure ANSI code74CT CT monitoring ANSI code74TCS Trip Circuit Supervision ANSI code52 o CB (Circuit Breaker) Circuit Breaker

52a Auxiliary contact in the breaker that is in the same position as thebreaker. It can be assigned to a binary input to locate the CB position(Breaker failure and/or CB diagnostic functions). (52a open = CB open)

52b Auxiliary contact in the breaker that is in the opposite position as thebreaker (52b open = CB closed)

DFR Digital Fault RecorderSER Sequential Event Recorder

Note 1 The graphic interface and the operation of the ThySetter software are described in the relative chapters

NG10#0A2MM00

InH 5A

UAUX 110-230 Vac/dc

IEn 1A 1A

5A 1A InL 5A1A

5A

12345

NG10#0A2MM00

InH 5A

UAUX 110-230 Vac/dc

IEn 1A 1A

5A 1A InL 5A1A

5A

12345

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SFR Sequential Fault RecorderANSI American National Standard InstituteIEEE Institute of Electrical and Electronics EngineersIEC International Electrotechnical CommissionCENELEC Comit Europen de Normalisation Electrotechnique

K1...K6...K10 Output relaysIMPULSIVO Rel finale programmato con uscita impulsivaPulse Output relay with pulse operation

tTR Output relay minimum pulse widthLatched Output relay with latched operation (manual reset) Output relay with

latched operation (automatic reset)No-latched Output relay with no-latched operation (automatic reset)

CT Current TransformerP1 IEC nomenclature for primary polarity mark of CTs (as an alternative to

a ANSI dot)P2 IEC nomenclature for primary polarity mark of CTs (as an alternative to

a ANSI no-dot)S1 IEC nomenclature for secondary polarity mark of CTs (as an alternative

to a ANSI dot)S2 IEC nomenclature for secondary polarity mark of CTs (as an alternative

to a ANSI no-dot)Self test DiagnosticStart Leave an initial condition or reset condition (Pickup)Trip Operation (with operate time)

Operating time Duration of time interval between the instant when the character-istic quantity in reset condition is changed, under specified condi-tions, and the instant when the relay operates

Dropout ratio The ratio of a reset value to an operate value in well-specified con-ditions. The dropout ratio may be lower or greater than 1 accordingas an over or under element is considered

Reset time Duration of the time interval between the instant when the charac-teristic quantity in operate condition is changed, under specifiedconditions, and the instant when the relay operates.

The stated reset time is related to a step variation of characteristicquantity in operate condition to the reset condition.

Overshoot time The critical impulse time for a relay which is in its reset condition,is the longest duration a specified change in the input energizingquantity(ies) (characteristic quantity), which will cause the relayto change to operate condition, can be applied without the relayswitches. The overshoot time is the difference from the operate timeand the critical impulse time.

The declared values for the overshoot time are applicable with thelower setting value of the operation time.

MMI (Man Machine Interface) Operator front panel

ThySetter Setting and monitoring softwareLog file A text file that lists actions that have occurred (ThySetter).J2SE Java Platform Standard EditionSubnet Mask (Ethernet nomenclature)

Sw SoftwareFw FirmwareUpgrade Firmware upgradeXML eXtensible Markup Language

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Symbols.ai

Symbols

I>> Start

I>> BF_OUT

I Ph B lock2

Logic internal signal (output); may be a logical state (e.g.I>> Start) or a numerical valueIt is available for reading (ThySetter + communication interface)

Logic external signal (intput); may be a command coming from a binary input or a sw commandIt is available for reading (ThySetter + communication interface)

Internal signal (e.g. Breaker Failure output state concerning to the 2nd threshold of the 50 element)It is not available for reading (missing arrow)

AND and NAND logic gates

OR and NOR logic gates

Limit block (I>> threshold).

Computation block (Max phase current)

Threshold setting (e.g. pickup I>>).The value is available for reading and is adjustable by means ThySetter + MMI.

Switch

ON delay timer with reset (tON delay)

ON delay timer without reset (tON delay)

OFF delay timer (dropout) without reset (tOFF delay)

Curve type (definite/inverse time)0T

IL3M a x[ IL1 ,IL2 ,IL3 ]IL2

IL1

tON tON tON tON

t

RESET

INPUT

OUTPUT

tOFF

t

tOFF

INPUT

OUTPUT

tON tON tON

t

INPUT

OUTPUT

0T

tON

& &

1 1

EXOR logic gate

tOFF

=1

I>>

II I>>

tON

RESET

0T

0 T

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Symbols1 .ai

t

RESET

INPUT

OUTPUT

tOFF

tOFF

tOFF tOFF

Minimum pulse width operation for output relays (tTR) tTR

t

tTR

INPUT

OUTPUT

tTR

0 T

tTR

t

tTR

INPUT

OUTPUT

Latched operating mode for output relays and LEDs

Pulse operating mode for output relays

t

INPUT

OUTPUT

Latched

tTR

T0

RESET

OFF delay timer (dropout) with reset (tOFF delay)

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2 G E N E R A L2 G E N E R A LPreface

The relay can be typically used as differential protection fo generators, motors and short lines.

The phase and amplitude adaptation of the current for differential protection can be achieved boththrough internal compensation is through the use of external adapters transformers

Following input circuits are available:

Three phase current side HThree phase current side LOne residual current.

For any input the rated current is independently selectable at 1 A or 5 A using dip-switch.

In addition to the main protection element, the breaker failure (BF), CT monitoring (74CT), Trip CircuitSupervision (TCS) and programmable logic (PLC) are also provided.Setting, programming and reading operations must be effected by means of Personal Computer withThySetter software or by means of remote communication interface (RS485 bus and Ethernet net-work); all operations must be performed through MMI.According to the hardware configurations, the NT10 protection relay can be shipped in various casestyles depending on the required mounting options:

Flush.Projecting mounting.Rack.

With separate operator panel.Other options are:Auxiliary power supply operating range.Communication protocols.

Photo

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Main featuresMetallic case.Backlight LCD 4x16 Display.Eight LEDs that may be joined with matrix criteria to many and various functions.RESET key to clear LED indications and latched output relays.Two free settable binary inputs.Independently settable for start, trip, self-test and control six output relay (K1...K6) Each outputrelay may be set with normally energized or normally de-energized operating mode and manual orautomatic reset (latched/no-latched).

Rear Ethernet communication port, with MODBUS TCP/IP protocol, with RJ45 (copper wires) orFX (optical fiber) connection.Rear RS485 port, with ModBus protocol.RS232 front serial port (local communication for Thysetter).Real time clock with super capacitor.

The most significant constructive features are:Galvanically insulated input and output circuits (communication and binary circuits included).Optimum filtering of input signals through combined use of analog and digital filters.Traditional electromechanical-type final output contacts with continuous monitoring of control coilcontinuity.Auxiliary supply comprising a switching-type voltage stabilizing circuit having a very wide workingrange and a very small power dissipationNominal frequency: 50 or 60 Hz.

The most significant operating features are:Programming of operating modes and parameters by means of the front keys and alphanumericdisplay, with a programming procedure based on carrying out guided selections and on explicit andimmediate signalling of the operations being performed, so that such procedure can be carried outwithout coding tables or mnemonic informations.The feature modification operations do not interrupt the normal functions of the relay.Impossibility of programming unacceptable parameter values, thanks to the automatic limitation oftop and bottom scale values for the relative setting ranges.Currents are sampled 24 times per period and measured in the effective value (RMS) of the funda-mental component using the DFT (Discrete Fourier Transform) algorithm and digital filters.The fault recorder (SFR) runs continuously capturing in circular mode the last twenty events upontrigger of binary input/output and/or element pickup (start-trip).The event recorder (SER) runs continuously capturing in circular mode the last three hundredevents upon trigger of binary input/output.

Recording of the last setting changes (Logger).Digital fault recorder (DFR) in COMTRADE format (oscillography).

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3 T E C H N I C A L3 T E C H N I C A L D A T AD A T A

3.1 GENERAL

Mechanical dataMounting:

Flush.Projecting.

Rack.Separated operator panel.

External dimensions (Flush mounting) 177 x 107 x 235 (high x width x depth)Terminals screw connectionMax conductor cross section 4 mm2

Mass (Flush mounting) 2.0 kg

Reference standards EN 60529, EN 60529/A1Degrees of protection provided by enclosures (IP Code)

Front IP52Terminals IP20

InsulationReference standards EN 60255-5 IEC 60255-5

High voltage test (50 Hz 60 s)Auxiliary power supply 2 kVInput circuits 2 kVOutput circuits 2 kVOutput circuits (between open contacts) 1 kV

Impulse voltage withstand test (1.2/50 s):Auxiliary power supply 5 kVInput circuits 5 kVOutput circuits 5 kVOutput circuits (between open contacts) 2.5 kV

Insulation resistance >100 M

EMC tests for interference immunity

Reference standardsProduct standard for measuring relays EN 50263

Generic standards immunity for industrial environments EN 61000-6-2Electromagnetic compatibility requirements for measuring relays and protection equipment

EN 60255-26

Apparati di automazione e controllo per centrali e stazioni elettricheCompatibilit elettromagnetica - Immunit ENEL REMC 02

Normativa di compatibilit elettromeccanica per apparati e sistemiENEL REMC 01

Voltage dip and interruptionReference standards EN 61000-4-29 IEC 60255-22-11Voltage dips, short interruptions and voltage variations on dc input power port immunity tests

Auxiliary power supply in dc energizing quantityInterruption (UT=40%) 100 msInterruption (UT=0%) 50 ms

Voltage variations (UT=80...120%) 10 s

EMC tests for interference immunityReference standards EN 60255-22-1 IEC 60255-22-1 EN 61000-4-12 EN 61000-4-12Damped oscilsidery wave

0.1 MHz and 1 MHz common mode 2.5 kV0.1 MHz and 1 MHz differential mode 1.0 kVRing wave common mode 2.0 kVRing wave differential mode 1.0 kV

Reference standards EN 60255-22-2 IEC 60255-22-2 EN 61000-4-2 IEC 61000-4-2Electrostatic discharge

Contact discharge 6 kVAir discharge 8 kV

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Reference standards EN 60255-22-3 IEC 60255-22-3 EN 61000-4-3 IEC 61000-4-3Radiated radio-frequency fields

80...1000 MHz AM 80% 10 V/m900 MHz Pulse modulated 10 V/m

Reference standards EN 60255-22-4 IEC 60255-22-4 EN 61000-4-4 IEC 61000-4-4Fast transient burst (5/50 ns)

Auxiliary power supply 2 kVInput circuits 4 kV

Reference standards EN 60255-22-5 IEC 60255-22-5 EN 61000-4-5 IEC 61000-4-5High energy pulse

Uaux(line-to-ground 10 ohm, 9 F) 2 kVUaux(line-to-line 0 ohm, 18 F) 1 kVI/O ports (line-to-ground 40 ohm, 0.5 F) 2 kVI/O ports (line-to-line 40 ohm, 0.5 F) 1 kV

Reference standards EN 60255-22-6 IEC 60255-22-6 EN 61000-4-6 IEC 61000-4-6Conducted radio-frequency fields

0.15...80 MHz AM 80% 1kHz 10 V

Reference standards EN 60255-22-7 IEC 60255-22-7 EN 61000-4-16 IEC 61000-4-16Power frequency immunity tests

Dc voltage 30 V50 Hz continuously 30 V50 Hz 1 s 300 V0.015...150 kHz 30 V

Reference standards EN 61000-4-8 IEC 61000-4-8Magnetic field 50 Hz

50 Hz continuously 100 A/m50 Hz 1 s 1 kA/m

Reference standards EN 61000-4-10 IEC 61000-4-10Damped oscilsidery magnetic field

Damped oscilsidery wave 0.1 MHz 30 A/m Damped oscilsidery wave 1 MHz 30 A/m

EmissionReference standards EN 60255-25 IEC 60255-25

EN 61000-6-4 IEC 61000-6-4 EN 55011 CISPR 11Electromagnetic emission tests

Conducted emission auxiliary power supply 0.15...0.5 MHz 79 dB VConducted emission auxiliary power supply 0.5...30 MHz 73 dB VRadiated emission 30...230 MHz 40 dB V/m

Radiated emission 230...1000 MHz 47 dB V/m

Mechanical tests

Reference standards EN 60255-21-1 EN 60255-21-2 RMEC01Vibration, shock, bump and seismic tests on measuring relays and protection equipment

EN 60255-21-1 Vibration tests (sinusoidal) Class 1 EN 60255-21-2 Shock and bump test Class 1

Climatic testsReference standards IEC 60068-x ENEL R CLI 01 CEI 50Ambient temperature -25...+70 CStorage temperature -40...+85 CRelative humidity 10...95 %Atmospheric pressure 70...110 kPa

SafetyReference standards EN 61010-1Safety requirements for electrical equipment for measurement, control and laboratory usePollution degree 3Reference voltage 250 VOvervoltage category III

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CertificationsReference standardsProduct standard for measuring relays EN 50263CE Conformity

EMC Directive 2004/108/ECLow Voltage Directive 2006/95/EC

Type tests IEC 60255-6

3.2 INPUT CIRCUITS

Auxiliary power supply UauxVoltageNominal value (range)[1] 24...48 V~/- 115...230 V~/110...220 V-Operative range (each one of the above nominal values) 19...60 V~/- 85...265 V~/75...300 V-Inrush current (max)

24 V- 6 A, 5 ms48 V- 14 A, 5 ms110 V- 20 A, 1 ms230 V~ 50 A, 1 ms

Frequency (for alternate voltage supply) 45...66 HzMax distortion factor ( for alternating voltage supply) 15%

Max alternating component (for dc voltage supply):Full wave rectified sine wave 100 %Sine wave 80 %

Power consumption:Maximum (energized relays, Ethernet TX) 10 W (20 VA)

Maximum (energized relays, Ethernet FX) 15 W (25 VA)

Phase current input circuits (side H and side L)Relay nominal phase current InHand InL 1 A or 5 A selectable by dip-switchPermanent overload 25 AThermal overload (1 s) 500 ADynamic overload (half cycle) 1250 ARated consumption (for any phase) 0.002 VA with InH orInH = 1 A 0.04 VA with InH orInH = 5 A

Residual current input circuit Relay nominal residual current IEn 1 A or 5 A selectable by dip-switchPermanent overload 25 AThermal overload (1 s) 500 ADynamic overload (half cycle) 1250 ARated consumption 0.006 VA with IEn = 1 A 0.12 VA with IEn = 5 A

Binary input circuitsQuantity 2Type optocouplerOperative range 24...265 V~/-Min activation voltage 18 VMax consumption, energized 3 mAON delay time OFF->ON (IN1 tON, IN2 tON) 0.00...100.0 s

0.00...9.99 s 10.0...100.0 sOFF delay time ON->OFF (IN1 tOFF, IN2 tOFF) 0.00...100.0 s 0.00...9.99 s (step 0.01 s) 10.0...100.0 s (step 0.1 s)

Block input (Logic selectivity)Quantity 1Type polarized wet input (powered by internal isolated supply)Max consumption, energized 5 mA

3.3 OUTPUT CIRCUITS

RelaysQuantity 6

Type of contacts K1, K2 changeover (SPDT, type C)Type of contacts K3, K4, K5 make (SPST-NO, type A)Type of contacts K6 break (SPST-NC, type B)Nominal current 8 ANominal voltage/max switching voltage 250 V~/400 V~

Note 1 Version must be selected at ordering

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Breaking capacity:Direct current (L/R = 40 ms) 50 WAlternating current (= 0,4) 1250 VA

Make 1000 W/VAShort duration current (0,5 s) 30 AMinimum switching load 300 mW (5 V/ 5 mA)Life:

Mechanical 106operationsElectrical 105operations

Minimum pulse width 0...0.500 s (step 0.005 s)

Block output (Logic selectivity)Quantity 1Type optocoupler

3.4 MMI

Display 16 x 4 alphanumeric LCD

LEDsQuantity 8

ON/fail (green) 1Start (yellow) 1Trip (red) 1

Freely allocatable (red) 5Keyboard 8 keys

3.5 COMMUNICATION INTERFACES

Local portConnection RJ10Baud rate 19200 bpsParity NoneProtocol Modbus RTU

Remote portsRS485

Connection screw terminals

Baud rate 1200...57600 bpsProtocol[1] ModBusRTU IEC 60870-5-103 DNP3

Ethernet 100BaseTConnection[2] Optical fiber 1300 nm, ST

100 Base TX, RJ45Baud rate 100 MbpsProtocol ModBusTCP/IP

Note 1 Different version must be selected at ordering

Note 2 Different version must be selected at ordering

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3.6 GENERAL SETTINGS

Rated values (Base)Relay nominal frequency (fn) 50, 60 HzRelay phase nominal current side H and L (InHand InH) 1 A or 5 A [1]

Phase CT primary nominal current side H and L (InpHand InpH) 1 A...20.0 kA 1...499 A (step 1 A) 500...4990 A (step 10 A)

5000...20000 A (step 100 A)Relay residual nominal current (IEn) 1 A o 5 A [1]

Residual CT primary nominal current (IEnp) 1 A...20.0 kA 1...499 A (step 1 A) 500...4990 A (step 10 A) 5000...20000 A (step 100 A)Protected device nominal current (Ing) 1 A...20 kA 1...499 A (step 1 A) 500...4990 A (step 10 A) 5000...20000 A (step 100 A)Primary nominal current chosen as referrence (Inref)[2] - ALato di riferimento per la compensazione (Refsize)[2] -Current matching type (MatchType) INTERNAL/EXTERNALProtected object by differential protection (ProtObj) GEN-MOT-LINE-BAR

Input sequence [3]Phase current sequence side H (I-SequenceH) IL1-IL2-IL3 Default

IL1-IL3-IL2 IL2-IL1-IL3 IL2-IL3-IL1 IL3-IL1-IL2 IL3-IL2-IL2

Phase current sequence side L (I-SequenceL) IL1-IL2-IL3 BaseIL1-IL3-IL2

IL2-IL1-IL3 IL2-IL3-IL1 IL3-IL1-IL2 IL3-IL2-IL2

Polarity [3]C09-C10 (IL1H) terminal polarity (C09-C10 POL) NORMAL/REVERSEC11-C12 (IL2H) terminal polarity (C11-C12 POL) NORMAL/REVERSEC13-C14 (IL3H) terminal polarity (C13-C14 POL) NORMAL/REVERSEC15-C16 (IE1) terminal polarity(C15-C16 POL) NORMAL/REVERSEC01-C02 (IL1L) (terminal polarity C01-C02 Pol) NORMAL/REVERSEC03-C04 (IL2L) terminal polarity (C03-C04 POL) NORMAL/REVERSEC05-C06 (IL3L) terminal polarity (C05-C06POL) NORMAL/REVERSEC07-C08 (IL3L) terminal polarity (C07-C08POL) NORMAL/REVERSE

Note 1 The nominal current settings doesnt concern the protection elements; they must agree with hardware setting (dip-switch 1 A or 5 A) .

Note 2 Calculated by relay (L or H)

Nota 3 Adjusting enabled by working with session-level 1

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3.7 PROTECTIVE FUNCTIONS

Thermal protection with Pt100 probes - 26[1]

ThAL1...8 Alarm:Alarm threshold 26 PT1...PT8 (ThAL1...8) 0...200 COperating time ThAL1...8 (tThAL1...8) 0....100 s

Th>1...8 Trip:Trip threshold 26 PT1...PT8 (Th>1...8) 0...200 C

Operating time ThAL1...8 (tTh>1...8) 0....100 s

Residual overcurrent or high impedance differential restricted ground fault - 50N/51N - 87NHIZIE> Element

IE> Curve type (IE>Curve) DEFINITE IEC/BS A, B, C ANSI/IEEE MI, VI, EI EMIE> Reset time delay (tE>RES) 0.00...100.0 s 0.00...9.99 s (step 0.01 s) 10.0...100.0 s (step 0.1 s)

Definite time50N/51N First threshold definite time (IE>def) 0.005...10.00 IEn 0.005...0.999 IEn (step 0.001 IEn) 1.00...10.00 IEn (step 0.01 IEn)

IE>defOperating time (tE>def) 0.04...200 s 0.04...9.99 s (step 0.01 s) 10.0...99.9 s (step 0.1 s) 100...200 s (step 1 s)

Inverse time[2]

50N/51N First threshold inverse time (IE>inv) 0.005...2.00 IEn 0.005...0.999 IEn (step 0.001 IEn) 1.00...2.00 IEn (step 0.01 IEn)IE>invOperating time (tE>inv) 0.02...60.0 s 0.02...9.99 s (step 0.01 s) 10.0...60.0 s (step 0.1 s)

IE>> ElementIE>> Reset time delay (tE>>RES) 0.00...100.0 s 0.00...9.99 s (step 0.01 s) 10.0...100.0 s (step 0.1 s)

Definite time50N/51N Second threshold definite time (IE>>def) 0.005...10.00 IEn

0.005...0.999 IEn (step 0.001 IEn) 1.00...10.00 IEn (step 0.01 IEn)IE>>defOperating time (tE>>def) 0.03...10.00 s (step 0.01 s)

IE>>> ElementIE>>> Reset time delay (tE>>>RES) 0.00...100.0 s 0.00...9.99 s (step 0.01 s) 10.0...100.0 s (step 0.1 s)

Definite time50N/51N Third threshold definite time (IE>>>def) 0.005...10.00 IEn

0.005...0.999 IEn (step 0.001 IEn) 1.00...10.00 IEn (step 0.01 IEn)IE>>>defOperating time (tE>>>def) 0.03...10.00 s (step 0.01 s)

Pickup time 0.03 sDropout ratio 0.95...0.98Dropout time 0.04 sOvershoot time 0.03 sPickup accuracy 4% 1% IEnOperate time accuracy 5% or 10 ms

Note 1 The 26 element is available when the MPT module is connect on Thybus and enabled

Note2 Standard Inverse Time (IEC 255-3/BS142 type A or SIT): t = 0.14 tE1>inv/ [(IE/IE>inv)0.02- 1] Very Inverse Time (IEC 255-3/BS142 type B or VIT): t = 13.5 tE1>inv/ [(IE/IE>inv) - 1] Extremely Inverse Time (IEC 255-3/BS142 type C or EIT): t = 80 tE1>inv/ [(IE/IE>inv)2 - 1]

Moderately Inverse (ANSI/IEEE type MI): t = tE1>inv {0.01 / [(IE/IE>inv)0.02- 1] + 0.023} Very Inverse (ANSI/IEEE type VI): t = tE1>inv {3.922 / [(IE/IE>inv)2- 1] + 0.098} Extremely Inverse (ANSI/IEEE type EI): t = tE1>inv {5.64 / [(IE/IE>inv)2- 1] + 0.024} Electromechanical (EM): t = 0.28 tE>inv/ [-0.236 (IE/IE>inv)-1+ 0.339]

t: operate time tE1>inv :operate time setting IE1>inv : threshold setting IE1: residual current input (measured at IE1 input) Asymptotic reference value:1.1 IE1>inv Minimum operate time: 0.1 s Equation is valid for: 1.1 IE/IE>inv 20; with IE1>invsetting 0.5 IE1n, the upper limit is 10 IE1n

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Low impedance restricted ground fault - 64REF side H64REF) Minimum threshold (IREF>) 0.05...2.00 IEn (step 0.01 IEn)64REF Intentional delay (tREF>) 0.03...60.00 s (step 0.01 s)

Differential - 87G-M-LCT saturation detector

87G-M-L Saturation detector enable (Sat-Det) ON/OFF87T Saturation detector intentional reset time delay (tSat-Det-RES) 0.00...0.50 s(step 0.01 s)

Id> Element87G-M-L First threshold (Id>) 0.05...2.00 Inref(step 0.01 Inref)87G-M-L First stretch slope percentage (K1) 10...50%(step 1 %)87G-M-L Second branch slope percentage (K2) 25...100%(step 1 %)87G-M-L Second branch intersection with vertical axis (Q) 0.00...3.00 Inref(step 0.01 Inref)87G-M-L First thresholdoperating time Id>(td>) 0.04 s

Id>> Element87G-M-L Second threshold (Id>>) 0.50...30.00 Inref(step 1.00 Inref)87G-M-L Second thresholdoperating timeId>>(td>>) 0.03 s

Breaker failure - BFBF Phase current threshold (IBF>) 0.05...1.00 In (step 0.01 In)BF Operating time (tBF) 0.06...10.00 s (step 0.01 s)Dropout ratio 0.95...0.98Dropout time 0.05 s

IBF>Pickup accuracy 4% 1% IntBFOperate time accuracy 5% or 10 ms

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3.8 CONTROL AND MONITORING

Trip Circuit Supervision side H and side L - 74TCSOperate time:

One binary input supervision 40 sTwo binary inputs supervision 2 s

Reset time delay:One binary input supervision 6 s

Two binary inputs supervision 0.6 s

Selective block - BLOCK2Selective block IN:

BLIN Selective block operating mode (ModeBLIN1) OFF-ON IPh/IE-ON IPh-ON IEBLIN maximum activation time for phase protections (tB-IPh) 0.10...10.00 s (step 0.01 s)BLIN maximum activation time for ground protections (tB-IE) 0.10...10.00 s (step 0.01 s)

Selective block OUT:BLOUT Selective block operating mode (ModeBLOUT1) OFF-ON IPh/IE-ON IPh-ON IEBLOUT Dropout time for phase protections (tF-IPh) 0.00...1.00 s (step 0.01 s)BLOUT Dropout time for ground protections (tF-IE) 0.00...1.00 s (step 0.01 s)BLOUT Dropout time for ground and phase protections (tF-IPh/IE) 0.00...1.00 s (step 0.01 s)

Circuit Breaker supervisionCircuit breaker diagnostic

Number of CB trips threshold (CB N.Open) 0...10000(step 1)Cumulative CB tripping currents threshold (CB SumI) 0....5000 In (step 1 In)Cumulative CB tripping I2t threshold (CB SumI^2t) 0....5000 (In)2s(step 1 In2s)Circuit Breaker opening time for I^2t calculation (CB tbreak) 0.05...1.00 s (step 0.01 s)Circuit Breaker maximum allowed opening time (CB tbreak>) 0.05...1.00 s (step 0.01 s)

CT supervision - 74CT side H74CT(H) Threshold (S(H)

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Oscillography (DFR)[1]

Format COMTRADERecording mode circularSampling rate 16 samples / cycle

Trigger setup:Pre-trigger time 0.05...1.00 s (step 0.01 s)Post-trigger time 0.05...60.00 s (step 0.05 s)

Set sample channels: iL1H, iL2H, iL3H, iL1L, iL2L, iL3L, iE,iL1cH,

iL2cH, iL3cH, iL1cL , iL2cL ,iL3cL , iSL1 , iSL 2, iSL 3, idL1 , idL 2, idL 3,

Set analog channels:Analog 1...Analog 12 IL1H, IL2 H, IL3 H, IL1L , IL2 L, IL 3L , IE, IL1cH, IL2cH, IL3cH, IL1cL , IL2cL ,

IL3cL ,ISL1 , ISL 2, ISL 3, IdL1, IdL 2, IdL 3, IE, IESH ,T1...T8[2]

Set digital channels:Digital 1...Digital 16 K1... K6, K7...K10, IN1, IN2, IN3.. .IN42 [3]

Set digital channels from 87G-M-L states(Digital 17...32)

Start states ST Id>-L1...L3, ST Id>>-L1...L3, ST2nd-REST, ST 5th-REST, ST H-REST-L1...

L3, ST satDetTrip states TR Id>-L1...L3, TR Id>>-L1...L3

PLC (Programmable Logic Controller)[4]

Reference standard IEC 61131-3Language[5] IL (Instruction List)

Inputs:Binary inputs IN1, IN2 on board IN8...IN10 with MRI module IN11...IN26 with one MID16 module IN27...IN42 with two MID16 modulesDelayed binary inputs[6] IN1, IN2 on board IN8...IN10 with MRI module

IN11...IN26 with one MID16 module IN27...IN42 with two MID16 modulesStart (all elements) Start U

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3.9 METERING

More data (range and accuracy) are available inside Section 5 - MEASURES, LOGIC STATES AND COUNTERS

DiretteFrequency (f)RMS value of fundamental component for phase currents side H (IL1H, IL2 H, IL3 H)RMS value of fundamental component for phase currents side L (IL1L , IL2 L , IL3 L)

RMS value of fundamental component for measured residual current ( IE)Calculated

Calculated residual currents side H (IEH)Maximum current between IL1-IL2-IL3side H and side L (ILMAXH, ILMAXL)Minimum current between IL1-IL2-IL3side H and side L (ILMINH, ILMINL)Average current between side H and side L (ILH, ILL )Compensated phase currents side H (IL1cH, IL2cH, IL3cH)Compensated phase currents side L (IL1cL, IL2cL, IL3cL)Stabilization currents (87 element) (ISL1, ISL2 , ISL3 )Differential phase currents (IdL1, IdL2 , IdL3 )(H) Stabilization current (64REF-1 element) side H (IESH)

Demand phasePhase fixed currents demand side H (IL1FIXH, IL2FIXH, IL3FIXH)Phase fixed currents demand side L (IL1FIXL, IL2FIXL , IL3FIXL)

Phase rolling currents demand side H (IL1ROLH , IL2ROLH, IL3ROLH)Phase rolling currents demand side L (IL1ROLL , IL2ROLL, IL3ROLL)Phase peak currents demand side H (IL1MAXH, IL2MAXH , IL3MAXH)Phase peak currents demand side L (IL1MAXL , IL2MAXL , IL3MAXL )Phase minimum currents demand side H (IL1MINH, IL2MINH, IL3MINH)Phase minimum currents demand side L (IL1MINL , IL2MINL , IL3MINL)

PT100 [1]

Temperature PT1 (T1)Temperature PT2 (T2)Temperature PT3 (T3)Temperature PT4 (T4)Temperature PT5 (T5)Temperature PT6 (T6)Temperature PT7 (T7)Temperature PT8 (T8)

Note 1 The measures of temperature are available only when the MPT module on Thybus is enabled (eight Pt100 inputs)

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22/1642222 NG10 - Manual - 01 - 2011 FUNCTION CHARACTERISTICS

4 F U N C T I O N C H A R A C T E R I S T I C S4 F U N C T I O N C H A R A C T E R I S T I C S

4.1 HARDWARE DESCRIPTION

The following figure illustrates the device layout.

Printed boards hold the circuit components arranged according to a modular allocation of the mainfunctions.

hw.ai

RTC

EEprom Flash SRam SRam

SPICPU

ETHERNET

CPU BOARD

POWER SUPPLY BOARD

INPUT MODULE

8 x CTs

DSPDUALPORT

1A/5A

EEprom

Thybus

RS485

RELAYS

K1...K6 Output contacts

RS232

MMI

LCDLEDs

BINARY INPUTS

IN1Input

IN2

BLOCK I/O

BLKIN Input

OutputBLKOUT

POWER SUPPLY

+5V

+10V

0V

+24V

-10V

POWERFAIL

RESET

Uaux

hw.ai

RTC

EEprom Flash SRam SRam

SPICPU

ETHERNET

CPU BOARD

POWER SUPPLY BOARD

INPUT MODULE

8 x CTs

DSPDUALPORT

1A/5A

EEprom

Thybus

RS485

RELAYS

K1...K6 Output contacts

RS232

MMI

LCDLEDs

BINARY INPUTS

IN1Input

IN2

BLOCK I/O

BLKIN Input

OutputBLKOUT

POWER SUPPLY

+5V

+10V

0V

+24V

-10V

POWERFAIL

RESET

Uaux

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23/16423NG10 - Manual - 01 - 2011FUNCTION CHARACTERISTICS

Power supply boardAll the components necessary for conversion and stabilization functions are present.Two versions are envisaged suited to the input ranges 24...48 V and 115...230 V.The circuit provides stabilized voltages of +10 V and -10 V, required for the analogue measurement,+24 V for relays and +5 V for supplying the digital circuits.The circuit board additionally comprises:INPUT CIRCUITS:

Two binary input circuits,One block input circuit (BLIN1).

The logical input circuits and the block circuits include photo-couplers which provide for galvanicseparation.OUTPUT CIRCUITS:

One block output circuit (BLOUT 1),Six output relays (k1...K6).

CPU boardThis circuit board contains all the circuits necessary for performing the analogue and digital pro-cessing of the signals.

Analog processingThe following are envisaged:

Anti aliasing filter circuits,Amplifier circuits for conditioning the input signals,Reference voltage adjustment circuits for the measurement A/D converter.

The Pro-n relays use a DSP processor operating at 40 MHz; it performs all the processing on theanalogue signals and furthermore coordinates management of the TX-RX signals to the CPU.The input currents are sampled at a frequency of 24 samples per period by means of a dual conver-sion system which allows the attainment of information pertaining to polarity and amplitude with highresolution. The measurement criterion allows precise measurement of even those signals having aunidirectional component, such as transient currents with overlapping exponential, which typicallyappear during faults.The circuit board also houses the output relays with the corresponding command and control cir-cuits, communication circuits, buttons, LCD display, LEDs and the key switch.

CPUA 32 bit CPU is provided.The following are envisaged:

Real Time Clock circuits with oscillator and super capacitor,RS232 communication port,RS485 communication port,

Thybus communication circuits for external modules and MMI board,Network communication circuits (optional Ethernet).Memories:

SRam: high speed static memory, used for data and cache,Flash memory: used for fw storage and upgrade,EEprom memory: used for calibration data storage,Dual port Ram for data transfer between CPU and DSP.

Input boardThree CTs committed for phase currents acquisition side HThree CTs committed for phase currents acquisition side LOne CT committed for residual current acquisition side 1One CT committed for residual current acquisition side 2

The input circuits are suitable for 1 A or 5 A external CTs [1]

MMI (keyboard, LED and display) The MMI module (Man Machine Interface) includes:An eight keys 8 keyboard,a backlight LCD display,Eight signalling LEDs,

The removable plug allows separation of the MMI module for free access to the CPU board whenDIP-switch setting is required.

Note 1 The phase and residual nominal currents must be adjusted by means dip-switch.

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DriversInside the driver library, all the specialized module for protection and control function are provided.They are the link from kernel and application layer. Ejemplos are:

Data base managementPC messages managementTCP/IP messages managementBasic Protocol managementCounter management

Event and fault managementMeasuring managementOscillography management

Application SoftwareThe software acts the specialization of the base system; all protective and control elements areinside it.The main modules ate:

Diagnostic function for application layer,Input management (binary inputs),Protective functions,Event recording,Output management (LEDs and relays)

Each element (Kernel, Drivers and Application) may, in turn, be split into modules:

Base protocol (kernel)The module known as the Basic Protocol (BP) manages the service communication between thekernel and the other modules through the communication buses with the following services:

Data and information exchange,Calibration,Upgrade fw DSP,Upgrade application sw

Communication (drivers)

The ModBus TCP/IP protocol, with ethernet interface, the ModBus RTU, IEC 60870-5-103 and DNP3protocol over RS485 interface and the ModBus RTU RS232 for ThySetter are provided.

MMI (drivers)The drivers deal with the menu management (MMi and/or communication messages).

Data BaseThe data base is split into three main sections:

RAM for volatile data,REE and PAR for non volatile data.

Self test (Application)The main hw and sw function are permanently verified in background; no additional delay are intro-duced.In particular the following function are tested:

Reference voltages;Output relays;Sw flow with execution time monitoring;REE and PAR data congruence.

Development tools (Builder) For the development of the project, a CASE instrument has been developed, responsible for the opti-mized production of software code for the management of collaboration, the database and the MMIdata and the Xml files used for communication. The automatic code generation criteria ensures thequality of the result in terms of the reusability, verifiability and maintainability of the software lifecycle.

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4.3 I/O DESCRIPTION

Metering inputsThe following inputs are provided:

Three phase current inputs for side HThree phase current inputs for side LOne residual current input

The nominal currents are independently adjustable at 1 A or 5 A through DIP-switches

The input circuits are appropriately dimensioned in order to withstand the currents which arisewhen a fault occurs, both in transient and steady state condition.

Signal processingVarious processing levels are involved:

Acquisition (base level).Direct measures of physical channels (first level).Calculated measures (second level).Derived (third level).

The measures concerning a level are based on data worked out in the previous level.For each level the required resources concerning the priority for tasks (conditioning circuits, DSPand CPU) are on hand.

ACQUISITION (base level)The input signals are sampled 16 times per period:

- iL1H...iL3H Phase current instantaneous values - side H- iL1L...iL3L Phase current instantaneous values - side L- iE Residual current instantaneous value

From the sampled quantities, several measures are computed for protection, monitoring and meter-ing purposes.

DirectCalculatedPhaseSequenceHarmonic

Demand

sensori .ai

NG10

side H

side L

52

G

Three phase current inputs - side H

Three phase current inputs - side L

One residual current input IE

sensori .ai

NG10

side H

side L

52

G

Three phase current inputs - side H

Three phase current inputs - side L

One residual current input IE

acquisizione.ai

ACQUISITION

instantaneous values

acquisizione.ai

ACQUISITION

instantaneous values

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DirectSamples are processed by means DFT (Discrete Fourier Transform) algorithm and the phase andamplitude of fundamental are computed:

Phase currents IL1H,IL2H,IL3H, IL1L,IL2L,IL3L,

Residual current IE

CalculatedBy means vector addition of direct measures the following are calculated (RMS value of fundamen-tal components):

Phase compensated currents - side H IL1cH, IL2cH, IL3cH and side L IL1cL , IL2cL , IL3cL

Stabilization currents (8 7 e lement) ISL1 , ISL 2, ISL

Differential currents (87 element) IdL1 , IdL 2, IdL 3

IL1.ai

(InH, InL)iL1H, iL2 H, iL3 H

iL1L, iL2 L, iL3 LDFT

IL1H, IL2 H, IL3H

IL1L, IL2L, IL3L

ACQUISITION

IL1.ai

(InH, InL)iL1H, iL2 H, iL3 H

iL1L, iL2 L, iL3 LDFT

IL1H, IL2 H, IL3H

IL1L, IL2L, IL3L

ACQUISITION

IE .ai

(IEn1, IEn2)

ACQUISITION

iE1, iE2DFT

IE1, IE2

IE .ai

(IEn1, IEn2)

ACQUISITION

iE1, iE2DFT

IE1, IE2

ILC.ai

iL1H

iL3 H

iL2 H

iL1L

iL3 L

iL2 L

iL1cH, iL2cH, iL3cH IL1cH, IL2cH, IL3cH

iL1cL, iL2cL, iL3cL

iL1cH = iL1HPHMHCH

iL2cH = iL2HPHMHCH

iL3cH = iL3HPHMHCH

iL1cL = iL1LPLMLCL

PH,PL: Polarity matchingMH,ML: Magnitute matching

CH,CL: Phase and Ciclic sequence and zero sequence matching

iL2cL = iL2LPLMLCL

iL3cL = iL3LPLMLCL

(Inref)DFT

IL1cL, IL2cL, IL3cL(Inref)DFT

ILC.ai

iL1H

iL3 H

iL2 H

iL1L

iL3 L

iL2 L

iL1cH, iL2cH, iL3cH IL1cH, IL2cH, IL3cH

iL1cL, iL2cL, iL3cL

iL1cH = iL1HPHMHCH

iL2cH = iL2HPHMHCH

iL3cH = iL3HPHMHCH

iL1cL = iL1LPLMLCL

PH,PL: Polarity matchingMH,ML: Magnitute matching

CH,CL: Phase and Ciclic sequence and zero sequence matching

iL2cL = iL2LPLMLCL

iL3cL = iL3LPLMLCL

(Inref)DFT

IL1cL, IL2cL, IL3cL(Inref)DFT

ISL.ai

iL1cH,iL1cL

iL2cH,iL2cL

iL3cH,iL3cL

iSL1, iSL 2, iSL 3 ISL1, ISL 2, ISL 3iSL1 = {iL1cH+sign[iL1cLiL1cH]iL1cL}/ 2

iSL2 = {iL2cH+sign[iL2cLiL2cH]iL2cL}/2


sign[ab]=+1 se ab 0sign[ab]=-1 se ab< 0

(Inref)DFT

ISL.ai

iL1cH,iL1cL

iL2cH,iL2cL

iL3cH,iL3cL

iSL1, iSL 2, iSL 3 ISL1, ISL 2, ISL 3iSL1 = {iL1cH+sign[iL1cLiL1cH]iL1cL}/ 2



sign[ab]=+1 se ab 0sign[ab]=-1 se ab< 0

(Inref)DFT

IdL.ai

iL1cH,iL1cL

iL2cH,iL2cL

iL3cH,iL3cL

idL1, idL2 , idL3 IdL1, IdL2 , IdL3

idL1 = iL1cH+iL1cL

idL2 = iL1cH+iL1cL

idL3 = iL1cH+iL1cL

(Inref)DFT

IdL.ai

iL1cH,iL1cL

iL2cH,iL2cL

iL3cH,iL3cL

idL1, idL2 , idL3 IdL1, IdL2 , IdL3

idL1 = iL1cH+iL1cL

idL2 = iL1cH+iL1cL

idL3 = iL1cH+iL1cL

(Inref)DFT

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ConventionsCyclic phase sequence order

For three phase rotating currents, a direct cyclic sequence is defined when the three phases areL1, L2, L3 ordered, while an inverse cyclic sequence is defined when the three phases are L1, L3, L2ordered.By setting with ThySetter, working at level 1, you can select any one of the six combinations of cycli-cal succession of the phasor currents.

fasori1.ai

cyclic direct sequencefor current phasors side H (default)

IL1H-IL3H-IL2H

IL2H-IL1H-IL3H

IL2H-IL3H-IL1H

IL3H-IL1H-IL2H

IL3H-IL2H-IL1H

IL1H

IL2HIL3H

IL1H

IL2H IL3HIL2H

IL3H IL1H

IL2H

IL1H IL3HIL3H

IL2H IL1HIL3H

IL1H IL2H

cyclic inverse sequencefor current phasors side L (default)

IL1L-IL3L-IL2L

IL2L-IL1L-IL3L

IL2L-IL3L-IL1L

IL3L-IL1L-IL2L

IL3L-IL2L-IL1L

IL1L

IL2LIL3L

IL1L

IL2L IL3LIL2L

IL3L IL1L

IL2L

IL1L IL3LIL3L

IL2L IL1LIL3L

IL1L IL2Lfasori1.ai

cyclic direct sequencefor current phasors side H (default)

IL1H-IL3H-IL2H

IL2H-IL1H-IL3H

IL2H-IL3H-IL1H

IL3H-IL1H-IL2H

IL3H-IL2H-IL1H

IL1H

IL2HIL3H

IL1H

IL2H IL3HIL2H

IL3H IL1H

IL2H

IL1H IL3HIL3H

IL2H IL1HIL3H

IL1H IL2H

cyclic inverse sequencefor current phasors side L (default)

IL1L-IL3L-IL2L

IL2L-IL1L-IL3L

IL2L-IL3L-IL1L

IL3L-IL1L-IL2L

IL3L-IL2L-IL1L

IL1L

IL2LIL3L

IL1L

IL2L IL3LIL2L

IL3L IL1L

IL2L

IL1L IL3LIL3L

IL2L IL1LIL3L

IL1L IL2L

cycl ic.ai

Right connection -> cyclic sequence correction is not required

Sequence = IL1-IL2-IL3 default

IL1-> IL1

IL2-> IL2

IL3-> IL3

IL1-> IL1

IL2-> IL3

IL3-> IL2

L1 L2 L3

Wrong connections -> cyclic sequence correction is required

Sequence = IL1-IL3-IL2

L1 L2 L3

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Polarity reversalFor each of the inputs for each phase current and residual current inputs, the user can select thepolarity NORMAL or REVERSE. By selecting an input with polarity NORMAL the measured input from this line is not reversed,while selection of an input with REVERSE polarity the measured input is reversed. This featureallows you to correct any polarity mistakes.

polari ty.ai

Right connection -> polarity correction is not required

Wrong connections -> polarity correction is required

CTs side L

G

G

CTs side H

Polarity = NORMAL

Polarity = NORMAL

Terminals C9-C11-C13


Terminals C1-C3-C6

Terminals C2-C4-C8

TA side L

TA side H

Phase current inputs side H Polarity = REVERSE

Polarity = REVERSE



Phase current inputs side L

Phase current inputs side H


Terminals C1-C3-C6

Terminals C2-C4-C8

NG10

NG10

polari ty.ai

Right connection -> polarity correction is not required

Wrong connections -> polarity correction is required

CTs side L

G

G

CTs side H

Polarity = NORMAL

Polarity = NORMAL



Terminals C1-C3-C6

Terminals C2-C4-C8

TA side L

TA side H

Phase current inputs side H Polarity = REVERSE

Polarity = REVERSE




Phase current inputs side H


Terminals C1-C3-C6

Terminals C2-C4-C8

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Use of measured values

iL1H,

iL2H,iL3H,

iL1L,

iL2L,iL3L

IL1H,

IL2H,IL3H,

IL1L,

IL2L,IL3L

iL1cH,

iL2cH,i

L3c

H,

iL1cL,

iL2cL,i

L3cL

IL1cH,

IL2cH,I

L3cH,

IL1cL,

IL2cL,I

L3cL

iSL1,

iSL2,iSL3

ISL1,ISL2,ISL3

idL1,idL2,idL3

IdL1,IdL2,IdL3

IESH

IEH

iEIETemperature(PT1....

PT8)

IBinaryinputs

IN1,IN2

PROTECTION

Thermal with Pt100 probes (26) gResidual current or high impedance restrictedth fault- 50N1/51N-87NHIZ gLow impedance restricted ground fault- 64REF g gDifferential (87G-M-L) g g gBreaker failure (BF) g g

CONTROL and MONITORING

CT Monitoring(74CT) g

Trip Circuit Supervision(TCS) gMEASURES

Phase currents (side L and H) gCompensated phase currents (side L and H) gStabilization currents gDifferential phase currents gCalculated residual overcurrent gMeasured residual current gTemperature (Pt100 with MPT module) g

FAULT RECORDER

Fault 0 g g g g g g g g gFault 1 g g g g g g g g gFault ... g g g g g g g g gFault 19 g g g g g g g g g

EVENT RECORDER

Event 0Event 1Event ...Event 299

OSCILLOGRAPHY

Record 1 g g g g g g g g g g g g g gRecord 2 g g g g g g g g g g g g g gRecord ... g g g g g g g g g g g g g g

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Binary inputsTwo binary inputs are available on board.The dry inputs must be powered with an external voltage, (usually the auxiliary power supply).The connections are shown in the schematic diagrams.The following settings can be used to configure each input:

Logic Active-ON (activated when powered), or Active-OFF (activated when power is turned off).ON Timer (OFF-to-ON time delay) and OFF Timer (ON-to-OFF time delay).Binary input allocation.

Adjustable debounce timer allows any transient to decay avoiding false activation of the input; thepositive transition is acquired if the input is permanently high for a time interval longer than the tONsetting delay; similarly for the negative transitions, the negative transition is acquired if the input ispermanently high for a time interval longer than the tOFFsetting delay.

In the above shown diagram, INTERNAL STATE represents the logical state of the binary input usedin the following processing.Each binary input may be matched to one of the following default functions.

FUNCTIONSBinary inputs

IN1 IN2

Reset LEDs g gSet profile (switching setting A and B) g gFault trigger (fault recording) g gBlock2 IPh/IE (selective block from phase and/or ground elements) g gBlock2 IPh (selective block from phase elements) g gBlock2 IE (selective block from ground elements) g gBlock1 (logic block) sides H-L-87GML g g

Block1 (logic block) sides H g gBlock1 (logic block) sides L g gBlock1 (logic block) 87T g gTCS1 (Trip Circuit Supervision) g gTCS2 (Trip Circuit Supervision) g gTrip ProtExt (trip from external protection relays) side H and side L g gTrip ProtExt (trip from external protection relays) side H g gTrip ProtExt (trip from external protection relays) side L g gReset counters g gReset CB Monitor (clear CB monitoring data) g g52a (CB auxiliary contact) g g52b (CB auxiliary contac) g gOpen CB g gClose CB g gRemote trip g gReset on demand measures g g

BINARY INPUT

INTERNAL STATE

tON tON tOFF tOFF

t

binary-t imers.ai

BINARY INPUT

INTERNAL STATE

tON tON tOFF tOFF

t

binary-t imers.ai

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Block2 IPhA change in status of a binary input effects a block [1]for the phase protective elements.

Block2 IEA change in status of a binary input effects a block [1]for the earth protective elements.

Block1A change in status of a binary input effects a block for a length of time equal to the activation of theinput[2]; the element pickup that wish be blocked must be enabled (the Block1parameter must beset to ONin the concerning menu).[3]

The application of the INx binary input for the acquisition of the Block1 (logic block) coming from

external signal is shown in the following figure; in the example the block signal is ORed with Block2(selective block) to block the generic (xxx) element).The following signals are provided for logic block:

87GML logical block sides H-L (single-input blocking enabled features on the sides H and L as wellas the differential protection 87GML)H-side logic block (an input lock features enabled on the H side)L-side logical block (an input lock features enabled on the L side)87T logic block (an input lock the 87GML element)

TCS1 and TCS2Trip Circuit Supervision.Supervision with one or two binary input can be performed.The exhaustive treatment of the TCS function is described in the concerning paragraph.

Trip ProtExtThe binary input detects a trip coming from an external protective relay: the information is availablefor the breaker failure function (BF)The following signals are provided:

Trip Protext sides H-L (a single input block functions on H and L sides)Trip Protext side H (a single input block functions on H side)Trip Protext side L (a single input block functions on L side)

Note 1 The exhaustive treatment of the Block 2 function is described in the Logic selectivity paragraph. The application of the inputs for the acquisition of Block2 (selective block) for Phase (Block2 Iph) and earth protective functions (Block2 IE) is

similar to that illustrated in the scheme concerning the Block2 IphIIE

Note 2 Unlike the Block2 (selective block), that houses a safety logic founded on programmable timers, the Block1 (logic block) keeps block of the

protection for the whole time when the input is active.

Note 3 The activation of one binary input produces indiscriminately a block of all protective elements programmed for being blocked from Block1

Block1.ai

xxxx Block1

Enable (ONEnable)

Block1 input (ONBlock)

Block1

from Block2 (ONBlock)

&

Block1

Block1

Binary input INx

Blocking

T 0

INx tON

T0n.o.n.c.

INx tONLogic INx t O F F

INx tOFF

1

Binary input allocation for Block 1 acquisition Block1.ai

xxxx Block1

Enable (ONEnable)

Block1 input (ONBlock)

Block1

from Block2 (ONBlock)

&

Block1

Block1

Binary input INx

Blocking

T 0

INx tON

T0n.o.n.c.

INx tONLogic INx t O F F

INx tOFF

1

Binary input allocation for Block 1 acquisition

TCS2.aiTrip Circuit Supervision - 74TCS

CB TC

TRIP TRIP

74TCS

52a 52b

Uaux

Uaux Uaux

IN1

IN2

CB TC

74TCS

52a 52b

Uaux

IN1

74TCSIN2IN1

001

011

010

1 (2 s after)00

74TCSIN1

011 (40 s af

ng10-manual-01-2011

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