novembre 2008lcws chicago1 fcal report w. lohmann, desy challenges and design sensors and sensor...

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Novembre 2008 LCWS Chicago 1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure Labs involved: Argonne, BNL, Vinca Inst, Belgrade, Bukharest Univ. of Colorado, Cracow UST, Cracow INP, JINR, Royal Holloway, NCPHEP, Prague(AS), LAL Orsay, Tuhoku Univ., Tel Aviv Univ. , West Univ. Timisoara, Yale Univ. DESY (Z.) Associated: Stanford Univ. IKP Dresden

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Page 1: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 1

FCAL Report

W. Lohmann, DESY

• Challenges and Design

• Sensors and Sensor Studies

• FE ASICS development

• Data Transfer, InfrastructureLabs involved: Argonne, BNL, Vinca Inst, Belgrade, Bukharest Univ. of Colorado, Cracow UST, Cracow INP, JINR, Royal Holloway, NCPHEP, Prague(AS), LAL Orsay, Tuhoku Univ., Tel Aviv Univ. , West Univ. Timisoara, Yale Univ. DESY (Z.)

Associated: Stanford Univ. IKP Dresden Guests from : CERN

Page 2: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 2

Calorimeters in the very forward region (example ILD, 14 mrad )

LumiCal: -control of position on ~100 m level -control of the inner acceptance radius on ~m level BeamCal: -radiation hard sensors (~10 MGy/year)Both: -compact (smallest possible Moliere radius) -readout after each BX

Pair monitor: fast pixel device, harsh radiation conditions

TPC

LumiCal

(Luminometer)

ECA

L

HCAL

BeamCal

Challenges

Pair monitor

TPC

QD0

Page 3: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 3

one more calorimerter, GamCal

~ 180 m from IP < 5 mrad aperture (beamstr photons)

Thin foil to convertbeamstrahlung photons

EM calorimeter to detect converted electrons (positrons)

Page 4: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 4

Dedicated Functions

E_pairs (BCAL) and E_photon

0

20

40

60

80

100

120

140

160

180

200

-300 -200 -100 0 100 200 300

offset_y/2 (nm)

E_

pa

irs

(B

CA

L,T

eV

)

0

2

4

6

8

10

12

14

16

E_

ph

oto

n (

MT

eV

) BeamCal, Pair Monitor, GamCalFast feedback for beam tuning, beam diagnosticsusing beamstrahlung;

Beamparameter determination on percent level

BeamCalHermeticity,Electron veto at low angles,

Mask for the inner detectors

Local deposition from a single high energy electron

Fast analog summation of pad-groups

UCB

BNL,DESY, JINR,

Page 5: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 5

Dedicated Functions

e-

6.10m

e+

e-

IPe+

Precise Luminosity measurement

Gauge process: e+ e- e+ e-

()

L = N /

Count Bhabha events

From theory

Eve

nts

, (rad)

Fiducial volume for event counting

Goal: Precision <10-3

Cracow,Tel Aviv

Page 6: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 6

Beampipe Design

Conical, central part BeCylindrical, full Be, inner radius 5.5 cm(14 mrad crossing angle)

Pro: minimum material in front of LumiCal Contra: vacuum, HOM, mechanics

Pro: facilitates mechanics, vacuum Contra:material in front of LumiCal, pre- showering, electron measurement?Preshower

particles Difference in the Bhabha count rate: (1 ± 2) x 10-4; uncritical !

However: don’t use the ‘free space’ for other purposes!

Possiblesolution

Tel Aviv

Page 7: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 7

Radiation Dose and neutron fluxes

Ri R

oRe

30 X0

Suport tube (Iron)

Absorber (W)

Electronics

Sensor

Dead Area

RTo

GEANT4 model

Electromagnetic dose for FE electronics:

< 100 Gy /year

Neutron flux inside sensors:

Two different ‘physics lists’

1012 neutrons/mm2/year(needs more detailed studies)

Neutron flux through FE electronics:

1010 neutrons/mm2/year

IFIN HH

Page 8: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 8

BeamCal Mechanics

DESY

Page 9: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 9

Sensor R&D BeamCal

pCVD diamonds:•radiation hardness under investigation (e.g. LHC beam monitors, pixel detectors)

•advantageous properties like: high mobility, low εR = 5.7, thermal conductivity

GaAs:•semi-insulating GaAs, doped with Sn and compensated by Cr

•produced by the Siberian Institute of Technology

SC CVD diamonds:•available in sizes of mm2

Radiation hard silicon

CVD: Chemical Vapor Deposition

(courtesy of IAF)polycrystallineCVD diamond

GaAs

Single crystal CVD diamond

DESY, JINR

Page 10: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 10

Sensor Tests

Testbeam equipment for sensor performance studies using the EUDET telescope

Detector under test

Goal: precise measuremnt ofthe reponse of sCVD diamonds;Reference sensor

Data analysis in progress

Page 11: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 11

Sensor irradiation tests

pumping

decrease

depumpingby UV

Starting at about 50% ofthe sensor thickness.

Ending at about 3 %CVD diamond sensors: Smooth degradationNo increase of leakage current.

GaAs: acceptable increase of the leakage current

Ending at about 5%

Page 12: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 12

Sensor tests

A new batch of GaAs sensors with Cr concentrations between 1016 and 1018 was recently delivered, Lab tests completed

Sensors made of single crystal quartz and sapphire show promising sensitivity to ionising irradiation

With source

Without source

Testbeam investigations in December !

DESY, JINR

Page 13: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 13

Sensor Production

N-type silicon, p+ strips, n+ backplane,Crystal 0rientation <100>320 µm thickness ± 15 µm Strip pitch: 1800 µm Strip p+ width: 1600 µm Strip Al width: 1700 µm

Masks for prototypes ready (Hamamatsu)

Prototype sensors just ordered

In parallel: development of the fanout

INPAS Cracow, Tel Aviv U.

Page 14: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 14

FE Electronics

Tohoku Univ.

ASIC for the pair monitor .25 mm TSMC technology# of pixel: 36Pixel size: 400 x 400 mm2Bump bonding to a sensor

Prototype produced and successfully tested

Pair monitor will use SoI technology,Sensor and readout ASIC embeddd in the same wafer; prototype 2009

Page 15: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 15

FE Electronics, LumiCal

•One FE ASIC will contain 32 – 64 channels, 10 bit •One ADC will serve several channels (MC simulations not finished)•AMS 0.35 m technology• prototypes of the FE ASIC and ADC ASIC available, Tests of the FE ASICS so far promising.

Cracow UST

Page 16: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 16

FE Electronics, LumiCal

FE Asic:8 channles per chip, 4 with MOS feedback resistance,4 with passive Rf feedback

ADC Asic:•Pipeline architecture•10 bit resolution•Maximum sampling rate 35 MHz

First prototypes needed improvement,Submission ADC and DAC Sept. 2008Prototypes expected Nov. 2008

Page 17: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 17

FE Electronics, LumiCal

First successful tests of the analog part with a single pad sensor

DESY

Page 18: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 18

FE electronics, BeamCal

Dedicated FE electronics for BeamCal, based on KPiX (see talk by Herbst in the DAQ session)

Digital Buffering during bunch train, readout in between trains

Fast analog adder for groups of pads used for fast feedback

SLAC-Stanford

•32 channels per chip•all data is read out at 10 bits for physics purposes; •Low latency output, sum of all channels is read out after each bx at 8 bits for beam diagnosis (fast feedback)•Prototype in 0.18-m TSMC CMOS technology

Page 19: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 19

Data Transfer

IKP TU Dresden

LVDS links(few cm)220 Mbits/s

optical links(long distance)650 Mbits/s

First step: concept based commercial componentsSecond step: dedicated prototype for a system test

Page 20: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 20

Infrastructure

A dedicated silicon lab is created in Tel Aviv:

•Computer monitored prob station

•Computer supported I(V), C(V) measurements

in preparation:

•clean room

• spectroscopic set-up

A dedicated HEP lab building is designed for detector R&D, planned to be ready mid 2009

Page 21: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 21

Laser Position Monitoring

Over short distances accuracies reached: Displacements in the x-y plane: +-0.5mDisplacements in z direction: +- 1.5 m

INP PAS Cracow

Page 22: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 22

Laser Position Monitoring

Dedicated CMOS sensor Displacement calculations

Scheme of the readout and monitoring electronics

Page 23: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 23

Conclusions

Priority topics within FCAL:

•Large area radiation hard sensors for calorimetry (BeamCal)

•Precise position measurement of electromagnetic showers (Sensors for LumiCal)

•ASICS with high readout speed, large dynamic range, large buffering depth and low power dissipation, allowing fast feedback for luminosity optimisation •Prototyping and test of more complex subsystems

Page 24: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 24

backup

Page 25: Novembre 2008LCWS Chicago1 FCAL Report W. Lohmann, DESY Challenges and Design Sensors and Sensor Studies FE ASICS development Data Transfer, Infrastructure

Novembre 2008 LCWS Chicago 25

Test Beam Equipment and sensor tests

exit windowof beam line

collimator (IColl)

sensor box (IDia, TDia, HV) Faraday cup (IFC, TFC)

Setup used for radiation hardness tests at the SDALINAC accelerator

TU Darmstadt

Completed and more comfortable: more efficient use of the beam