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TRANSCRIPT
©2016 by System Plus Consulting | Fairchild FDMS86181 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
ON Semiconductor FDMS86181 100V 124A PowerTrench MosfetPower Semiconductor report by Elena Barbarini June 2017
©2016 by System Plus Consulting | Fairchild FDMS86181 2
SUMMARY
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o ON Semiconductor
o Fairchild
Physical Analysis 6
o Synthesis of the Physical Analysis
o Package analysis
Package opening
Package Cross-Section
o MOSFET Die
MOSFET Die View & Dimensions
MOSFET Die Process
MOSFET Die Cross-Section
MOSFET Die Process Characteristic
MOSFET Manufacturing Process 35
o MOSFET Die Front-End Process
o MOSFET Die Fabrication Unit
o Final Test & Packaging Fabrication unit
Cost Analysis 39
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o MOSFET die
MOSFET Die Front-End Cost
MOSFET Die Probe Test, Thinning & Dicing
MOSFET Die Wafer Cost
MOSFET Die Cost
Wafer Cost Evolution
Die Cost Evolution
o Complete MOSFET
Assembled Components Cost
Synthesis of the assembling
Component Cost
Price Analysis 51
o Estimation of selling price
Company services 55
©2016 by System Plus Consulting | Fairchild FDMS86181 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodology
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the ON Semiconductor FDMS86181 PowerTrench MOSFET.
The Power Trench 100V MOSFET is the latest MOSFET specifically designed for automotive applications by ONSemiconductor/Fairchild. The FDMS86181 is driving 124A with an Rdson of 4.2 mΩ and a current density of 11.8 A/mm2.
The MOSFET is designed with the typical PowerTrench structure of Fairchild where the shield electrode is connected to thesource. The shield electrode provides charge balance for drift region. This enables the use of higher doping in the drift region,resulting in reduced drift resistance. Fairchild new medium voltage MOSFETs are optimized to improve the diode characteristicsas well as the output capacitance. The specific resistance has been significantly improved while improving the switchingcharacteristic.
Another important innovation is present in the packaging; the Power56 is not yet standard so Fairchild proposes a copper leadframe connection both for the source and the gate.
The two lead frames can be connected to the metal contact with a specific Ni layer deposited during front end process.
Based on a complete teardown analysis, the report also provides an estimation of the production cost of the IGBT, Diode andpackage.
The report shows the impact of the technical innovations on final MOSFET cost breakdown.
©2016 by System Plus Consulting | Fairchild FDMS86181 4
Overview / Introduction
Company Profile & SupplyChain o ON Semiconductorso Fairchild
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Datasheet
©2016 by System Plus Consulting | Fairchild FDMS86181 5
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Synthesis of the Physical Analysis
Package Power 56:
o Package size : xxxmm xxxxmm xxxxmm
o Number of Pins: 8 pin
o Pitch: xxx
MOSFET:
o Dimension: xxxxxxx=xxx mm2
o Electrical Connection: xxxxLeadframe for Source and gate
o Placement in the package: xxxxxx oncopper lead frame.
Package
Si MOSFET
Package opening
Source Leadframe
©2016 by System Plus Consulting | Fairchild FDMS86181 6
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package characteristics
o The package type is a Power 56
o Package size : xxxmm xxxxmm xxxxmm
o Pin pitch : xxxmm
o The package markings include the following markings :
Fairchild logo
0G19AB
FOMS
86181
Package Front view
Package Back view
Package Side view
©2016 by System Plus Consulting | Fairchild FDMS86181 7
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Cross section #3
©2016 by System Plus Consulting | Fairchild FDMS86181 8
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section #1
Package cross section
Package cross section
It is visible, from the specific shape of the packaging, how the upper leadframe has been xxxxxxxx.
©2016 by System Plus Consulting | Fairchild FDMS86181 9
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section
Package cross section Package cross section
©2016 by System Plus Consulting | Fairchild FDMS86181 10
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MOSFET die Dimensions
MOSFET : Optical view
xxx
µm
o Die dimensions:xxx mm2 (xxxxxxxx)
o There is no marking on the die.
xxx µm
©2016 by System Plus Consulting | Fairchild FDMS86181 11
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die process
©2016 by System Plus Consulting | Fairchild FDMS86181 12
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die cross section
Die cross section
o Die thickness: xxxx µm
©2016 by System Plus Consulting | Fairchild FDMS86181 13
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die cross section
Die cross section
o Epitaxy thickness: xxx µm
©2016 by System Plus Consulting | Fairchild FDMS86181 14
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die cross section
o Al contact thickness: xxx µm
o W contact thickness: xxx µm
o Polyimide thickness: xxx µm
©2016 by System Plus Consulting | Fairchild FDMS86181 15
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die cross section
Die cross section
Al contact
o Ti layer thickness: xxx µm Oxyde thickness: xxx µm
©2016 by System Plus Consulting | Fairchild FDMS86181 16
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die cross section
Die cross section
©2016 by System Plus Consulting | Fairchild FDMS86181 17
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Description of the Wafer Fabrication Units - MOSFET
In our calculation, we simulate a production unit using xxxxmm wafers.
MOSFET wafer fab unit:
Name: Fairchild xxxxx
Wafer diameter: xxxmm
Capacity: xxxx wafers / month
Year of start: xxxx
Most advanced process: Power transistors
Products: Power, transistors, Mosfet, IGBT
Location: xxxxxx
The clean room is supposed not to be totally depreciated in xxxx.
Equipment are supposed not to be totally depreciated in xxxxx.
©2016 by System Plus Consulting | Fairchild FDMS86181 18
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MOSFET Process Flow
MOSFET Wafer Process:
o The manufacturing of theMOSFET begins with the implantation and the trench etching. Then the oxide layers and the polysilicon are deposited and patterned. Then the tungsten and aluminum layer is deposited. Finally a Ni layer for copper connection is deposited.
o The wafer is thinned to have a final thickness of xxxxµm. The implantation on the backside are performed. Finally, the metal layers on the backside are deposited.
o A polyimide protection layer is deposited on the guard ring and on the gate supply line.
MOSFET Structure Schema
©2016 by System Plus Consulting | Fairchild FDMS86181 19
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MOSFET Process Flow
Si wafer
• Shield Electrode
Si wafer
• Gate
Si Wafer
• Metal contact
MOSFET Structure Schematic
©2016 by System Plus Consulting | Fairchild FDMS86181 20
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Description of the Component Packaging Units
The power module packaging Process:
o The package type is a Power 56
o Package size : xxxmm xxxxmm xxxxmm
In our calculation, we simulate an assembly unit using Fairchild plant in xxxx.
Assembly unit:
Name: Fairchild xxxx
Products: Assembly, Test
Location: xxxx
This assembly line has been created in xxxx.
Most of the equipment are certainly fully depreciated.
We estimate that a residual depreciation of 25% is existing on both equipment and clean room to maintain the efficiency of the line.
©2016 by System Plus Consulting | Fairchild FDMS86181 21
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Die Costo Packaging Costo Component Costo Cost Evolution
Selling Price Analysis
About System Plus
MOSFET Front-End Cost
©2016 by System Plus Consulting | Fairchild FDMS86181 22
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Die Costo Packaging Costo Component Costo Cost Evolution
Selling Price Analysis
About System Plus
MOSFET Wafer Cost per process steps
©2016 by System Plus Consulting | Fairchild FDMS86181 23
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Die Costo Packaging Costo Component Costo Cost Evolution
Selling Price Analysis
About System Plus
MOSFET Die Cost
The MOSFET Component cost ranges from $xxx to $xxxxaccording to yield variations.
The Front end manufacturing represents xxx% of thecomponent cost, medium yield.
Probe test, dicing and scrap account for xxxx% of thecomponent cost.
©2016 by System Plus Consulting | Fairchild FDMS86181 24
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Die Costo Packaging Costo Component Costo Cost Evolution
Selling Price Analysis
About System Plus
Component Cost
The Component cost ranges from $xxx to $xxx accordingto yield variations.
The MOSFET die manufacturing represents xxx% of thecomponent cost.
The packaging represents xxxx% of the component cost.
Final test and yield losses account for xxx% of thecomponent cost.
©2016 by System Plus Consulting | Fairchild FDMS86181 25
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Estimated Manufacturer Price
The component manufacturing cost rangesfrom $xxx to $xxx according to yield variations.
The component selling price ranges from $xxxto $xxxx according to yield variations.
©2016 by System Plus Consulting | Fairchild FDMS86181 26
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
MARKET AND TECHNOLOGY REPORTS - YOLE SÉVELOPPEMENT
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and cost comparison
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IGBT Power Module• Infineon FS600R07A2E3 HybridPACK2 100KW 3-
phase• Infineon EconoPACK4™ 1200V IGBT4 Module• Semikron SKiM306GD12E4
Related Reports
©2016 by System Plus Consulting | Fairchild FDMS86181 27
COMPANYSERVICES
©2016 by System Plus Consulting | Fairchild FDMS86181 28
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>40 reports per year)
Costing Tools
Trainings
©2016 by System Plus Consulting | Fairchild FDMS86181 29
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
Contact
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