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Organizational Chart China
Europe
Japan
Korea
North America
Taiwan
Last updated: March 15, 2016
Global Technical Committee and
TC Chapters
Legend:TCC — the Locale has a TC Chapter of the global technical committee. CFG — the Locale has a TC Chapter Formation Group, as defined in PM 6.5, of the global technical committee.
Note 1: An underlined Locale has an RSC and may also be referred as a Region (e.g., Europe Region ).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).
Locale
Global
technical committee
China Europe Japan KoreaNorth
AmericaTaiwan
EH&S TCC WG TCC TCC
Facilities TCC TCC TCC
Gases TCC TCC TCC
Liquid Chemicals TCC TCC TCC
FPD Materials & Components TCC TCC TCC TCC
FPD Metrology TCC TCC TCC TCC
MEMS / NEMS TCC
CFG
CFG
CFG
Locale
Global
technical committee
China Europe Japan KoreaNorth
AmericaTaiwan
Traceability TCC TCC
Information & Control TCC TCC TCC TCC TCC
Metrics TCC TCC TCC
Physical Interfaces & Carriers TCC TCC TCC
Automation Technology TCC TCC
Photovoltaic TCC TCC TCC TCC TCC
PV Materials TCC TCC TCC
Legend:TCC — the Locale has a TC Chapter of the global technical committee.CFG — the Locale has a TC Chapter Formation Group, as defined in PM 6.5, of the global technical committee.
Note 1: An underlined Locale has ab RSC and may also be referred as a Region (e.g., Europe Region ).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).
Locale
Global
technical committee
China Europe Japan KoreaNorth
AmericaTaiwan
Micropatterning
(Microlithography*)TCC TCC
Silicon Wafer TCC TCC TCC
Compound Semiconductor
MaterialsTCC TCC TCC
HB-LED WG TCC
3DS-IC TCC TCC
Assembly & Packaging
(Packaging**)TCC
Automated Test Equipment
(Test***)TCC TCC
Legend:TCC — the Locale has a TC Chapter of the global technical committee.
CFG — the Locale has a TC Chapter Formation Group, as defined in PM 6.5, of the global technical committee.Note 1: An underlined Locale has an RSC and may also be referred as a Region (e.g., Europe Region ).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (red rectangles). * In NA, Micropatterning is traditionally called Microlithography.** In Japan, Assembly & Packaging is traditionally called Packaging.*** In Japan, Automated Test Equipment is traditionally called Test.
CFGTCC
TCC
Regional Standards Committee (RSC)
Organizations
Co-chairs: Bert Planting - ASML, Werner Bergholz – International Standards Consulting
Vice-chair: Frank Petzold - Trustsec
SEMI Europe RSC Organization
Europe Chapter of Metrics Global Technical
CommitteeC: Alfred Honold - InReConC: Lothar Pfitzner - FhG IISB
Europe Chapter of PV Materials Global
Technical CommitteeC: Peter Wagner - ConsultantC: Huber Aulich - Solar Valley
Europe Chapter of Physical Interfaces &
Carriers Global Technical CommitteeC: Alfred Honold - InReConC: Frank Petzold - Trustsec
Europe Chapter of Gases Global
Technical CommitteeC: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier – Gordon F Consulting
Europe Chapter of Compound Semiconductor
Materials Global Technical CommitteeC: Arnd Weber - SiCrystal
Europe Chapter of Silicon Wafer Global
Technical CommitteeC: Werner Bergholz – International Standards ConsultingC: Peter Wagner - ConsultantC: Fritz Passek - Siltronic
Europe Chapter of Liquid Chemicals
Global Technical CommitteeC: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier – Gordon F Consulting
Europe Chapter of Information & Control
Global Technical CommitteeC: Alfred Honold - InReConC: Frank Petzold - Trustsec
Europe Chapter of Automation
Technology Global Technical Committee C: Christian Hoffmann - PEER Group
SEMI Japan RSC OrganizationCo-Chair: Kenji Yamagata - Daifuku, Naoyuki Kawai - The University of Tokyo
Vice Chair: Supika Mashiro - TEL
Special Groups
Reporting to the JRSC
Japan Chapter of Gases & Facilities
Technical CommitteeC: Hiromichi Enami - Hitachi High-TechnologiesC: Isao Suzuki - MKS Japan
Japan Chapter of Environmental Health
& Safety Global Technical CommitteeC: Supika Mashiro - TELC: Hidetoshi Sakura - IntelC: Moray Crawford - Hatsuta Seisakusho
FPD Coordination Group
L: Yoshitada Nogami - SK ElectronicsL: Makoto Yamamoto - Muratec
Standardization Process
Improvement (SPI)L: Supika Mahiro -TEL
Japan Chapter of Micropatterning
Global Technical CommitteeC: Morihisa Hoga - Dainippon Printing
Japan Chapter of Compound Semiconductor
Materials Global Technical CommitteeC: Masayoshi Obara - Shin-Etsu Handotai
Japan Chapter of Physical Interfaces &
Carriers Global Technical CommitteeC: Tsuyoshi Nagashima - MiraialC: Tsutomu Okabe - TDKC: Kenji Yamagata - DAIFUKU
Japan Chapter of Automation
Technology Global Technical CommitteeC: Terry Asakawa -TELC: Naoki Ito - Mitsubishi ElectricC: Makoto Ishikawa - Nisshinbo Mechatronics
Japan Chapter of PV Materials
Global Technical CommitteeC: Takashi Ishihara - Mitsubishi ElectricC: Kazuhiko Kashima – Kashima EngineeringC: Tetsuo Fukuda - AIST
Japan Chapter of FPD Materials &
Components Global Technical CommitteeC: Tadahiro Furukawa - Yamagata UniversityC: Yoshihiko Shibahara - FUJIFILM
Japan Chapter of Assembly &
Packaging Global Technical CommitteeC: Kazunori Kato - AiTC: Masahiro Tsuriya - iNEMI
Japan Chapter of FPD Metrology Global
Technical CommitteeC: Ryoichi Watanabe - Japan DisplayC: Akira Kawaguchi - Otsuka Electronics
Japan Chapter of PV Global
Technical CommitteeC: Hiromu Takatsuka - PVTECC: Kazuhiko Kashima – Kashima EngineeringC: Masaaki Yamamichi - AIST
Japan Chapter of Metrics
Global Technical CommitteeC: Toshio Murakami – Murakami Corporation
Japan Chapter of Traceability
Global Technical CommitteeC: Yoichi Iga - FreelanceC: Hirokazu Tsunobuchi - Keyence
Japan Chapter of Silicon Wafer
Global Technical CommitteeC: Naoyuki Kawai - The University of Tokyo C: Tetsuya Nakai - SUMCO
Japan Chapter of Information & Control
Global Technical CommitteeC: Takayuki Nishimura - SCREEN Semiconductor SolutionsC: Mitsuhiro Matsuda - Hitachi Kokusai Electric
Japan Chapter of Liquid Chemicals
Global Technical CommitteeC: Hiroshi Tomita - ToshibaC: Hiroyuki Araki - SCREEN Semiconductor Solutions
Japan Chapter of 3DS-IC Global
Technical CommitteeC: Masahiro Tsuriya -iNEMIC: Haruo Shimamoto - AIST
NA Chapter of Physical Interfaces &
Carriers Global Technical CommitteeC: Matt Fuller - EntegrisC: Stefan Radloff - Intel
NA Chapter of Metrics Global
Technical CommitteeC: David Bouldin - Fab ConsultingC: Mark Frankfurth - Cymer
NA Chapter of Silicon Wafer
Global Technical CommitteeC: Dinesh Gupta - STAC: Noel Poduje - SMSVC: Mike Goldstein
NA Chapter of Traceability
Global Technical CommitteeC: Win Baylies - BayTech-ResorC: Yaw Obeng - NIST
NA RSC Technical Architect
BoardC: James Moyne - University of MichiganC: Yaw Obeng - NIST
NA Chapter of Information & Control
Global Technical CommitteeC: Jack Ghiselli - Ghiselli ConsultingC: Brian Rubow - CimetrixC: Lance Rist - RistTex
NA Chapter of Flat Panel Display
Global Technical CommitteeC: Bill Colbran - Engenuity Systems
NA Chapter of Automated Test
Equipment Global Technical CommitteeC: Ajay Khoche - Khoche Consulting
NA Chapter of 3DS-IC Global
Technical CommitteeC: Richard Allen - NISTC: Sesh Ramaswami - Applied MaterialsC: Chris Moore - BayTech-Resor
NA Chapter of Facilities Global
Technical CommitteeC: Steve Lewis - LPCiminelli
NA Chapter of Liquid Chemicals
Global Technical CommitteeC: Frank Flowers - PeroxyChem
NA Chapter of HB-LED Global
Technical CommitteeC: Iain Black - PhilipsC: Mike Feng - SilianC: Chris Moore - BayTech-ResorC: Eric Armour - Veeco
NA Chapter of Gases
Global Technical CommitteeC: Mohamed Saleem - Fujikin
NA Chapter of PV Materials
Global Technical CommitteeC: Lori NyeC: John Valley - Sun EdisonC: Hugh Gotts - Air Liquide
NA Chapter of Photovoltaic
Global Technical CommitteeC: Win Baylies - BayTech-ResorC: James Moyne - University of Michigan
NA Chapter of MEMS/NEMS
Global Technical CommitteeC: Win Baylies - BayTech-ResorC: Steve Martell - Sonoscan
NA Chapter of Compound Semiconductor
Materials Global Technical CommitteeC: Russ Kremer - Freiberger Compound MaterialsC: James Oliver - Northrop Grumman
NA Chapter of Environmental Health &
Safety Global Technical CommitteeC: Chris Evanston - Salus EngineeringC: Sean Larsen - Lam ResearchC: Bert Planting - ASML
NA Chapter of Microlithography
Global Technical CommitteeC: Wes Erck - Wes Erck & AssociatesC: Bryan Barnes - NIST
SEMI North America (NA) RSC Organization - NA LocaleCo-Chairs: Steve Lewis – LPCimineli & Chris Evanston – Salus Engineering
Vice-Chairs: Brian Rubow – Cimetrix
China Chapter of HB-LED
Global Technical CommitteeC: Yong Ji - Guizhou Haotian Optoelectronics Technology C: Weizhi Cai - San an Optoelectronic
China Chapter of PV Global
Technical CommitteeC: Guangchun Zhang - CanadianSolarC: Jun Liu - China Electronics Standardization Institute
SEMI North America RSC Organization – China LocaleCo-Chairs: Steve Lewis – LPCimineli & Chris Evanston – Salus Engineering
Vice-Chairs: Brian Rubow – Cimetrix
Co-Chairs: Steve Lewis – LPCimineli & Chris Evanston – Salus Engineering
Vice-Chairs: Brian Rubow – Cimetrix
SEMI North America RSC Organization – Korea Locale
Korea HB-LED CFG
L: HyeongSoo Park - SEMESL: Jong Hyeob Baek - KOPTI
Korea Chapter of FPD Materials &
Components Technical Committee C: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution
Korea Chapter of Information &
Control Global Technical Committee C: Hyungsu Kim - Doople C: Chul Hong Ahn - SK hynixC: Gun Woo Lee - Lam Research
Korea Chapter of Global Facilities
Technical CommitteeC: Kwang Sun Kim - KUT
Korea Chapter of FPD Metrology
Global Technical CommitteeC: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution
SEMI North America RSC Organization – Taiwan LocaleCo-Chairs: Steve Lewis – LPCimineli & Chris Evanston – Salus Engineering
Vice-Chairs: Brian Rubow – Cimetrix
ISC Taiwan Advisor
Tzeng-Yow Lin - CMS/ITRI
Taiwan Chapter of Photovoltaic
Global Technical CommitteeC : B. N. Chuang - CMS/ITRI
C : J.S. Chen - TeraSolarC : Ray Sung - UL Taiwan
Taiwan Chapter of EHS Global
Technical CommitteeC:Shuh-Woei Yu - SAHTECHC: Fang-Ming Hsu - TSMC
Taiwan Chapter of 3DS-IC
Global Technical CommitteeC: Tzu-Kun Ku - ITRIC: Wendy Chen - King Yuan ElectronicsC: Roger Hwang - ASE
Taiwan Chapter of Information and
Control Global Technical CommitteeC:Robert Chien - TSMC
Taiwan Chapter of Flat Panel Display
Global Technical CommitteeC: Tzeng-Yow Lin - CMS/ITRIC: Jia-Ming Liu - TDMDA
Organization of Each TC Chapter
Taiwan TC Chapter of 3DS-IC
Global Technical CommitteeC: Tzu-Kun Ku - ITRIC: Wendy Chen - King Yuan ElectronicsC: Roger Hwang - ASE
Test TF
L: Tzong-Tsong Miau - ITRIL: Roger Hwang - ASEL: Ming-Chin Tsai - KYEC
Middle End Process TF
L: Arthur Chen - NTUSTL: Erh Hao Chen - ITRIL: Jerry Yang - SEMATECH
NA TC Chapter of 3DS-IC
Global Technical CommitteeC: Richard Allen - NISTC: Sesh Ramaswami - Applied MaterialsC: Chris Moore - BayTech-Resor
3DS-IC Bonded Wafer
Stack TFL: Richard Allen - NIST
3DS-IC Inspection and
Metrology TFL: Victor Vartanian -SEMATECH L: David Read - NIST
JA TC Chapter of 3DS-IC
Global Technical CommitteeC: Masahiro Tsuriya -iNEMIC: Haruo Shimamoto - AIST
Steering Group
L: Yoshihiro Tomita - IntelL: Masahiro Tsuriya – iNEMIL: Eiji Yoshino – Hitachi High Technologies
3DS-IC Global Technical Committee
Electromagnetic
Characterization SGL: Mikio Kiyono - AET
JA 450 mm ATDP TF
L: Akihito Kawai - DiscoL: Sumio Masuchi - Disco L: Kiyofumi Tanaka – Shin-Etsu PolymerL: Kenichi Watanabe - Lintec
3D-IC SG
L: Masahiro Tsuriya - iNEMIL: Haruo Shimamoto - AIST
Thin Chip Handling TF
L: Hideki Suzuki - Shin-Etsu PolymerL: Haruo Shimamoto - AIST
5 Year Review TF
L: Masahiro Tsuriya - iNEMIL: Kazunori Kato - AiT
Japan TC Chapter of Assembly &
Packaging Technical CommitteeC: Kazunori Kato - AiTC: Masahiro Tsuriya - iNEMI
Fiducial Mark
Interoperability TFL: Sumio Masuchi - Disco
Assembly & Packaging Global Technical Committee
Global Equipment Interface
Specification (EIS) TFL: Makoto Ishikawa - Nisshinbo Mechatronics
Europe TC Chapter of Automation
Technology Global Technical CommitteeC: Christian Hoffman - PEER Group
Japan TC Chapter of Automation
Technology Global Technical CommitteeC: Makoto Ishikawa - Nisshinbo MechatronicsC: Naoki Ito - Mitsubishi ElectricC: Terry Asakawa - TEL
Global Equipment Interface
Specification (EIS) TFL: Carsten Born - VITRONIC GmbH
PV Wafer Traceability TF
L: TBD
Automation Technology Global Technical Committee
= Global Task Force
Automated Test Equipment Global Technical Committee
NA TC Chapter of Automated Test
Equipment Technical CommitteeC: Ajay Khoche - Khoche Consulting
Standard Test Data
Format (STDF) TFL: Ajay Khoche - Khoche Consulting
Test Cell Communcations
TFL: Len Van Eck - LTX- CredenceL: Mark Roos - Roos Instruments
Compound Semiconductor Materials (CSM)
Global Technical Committee
Europe TC Chapter of CSM
Global Technical Committee C: Arnd Weber - SiCrystal
Contactless Resistivity
and Mobility Mapping TFL: Wolfgang Jantz - Semimap
SiC TF
L: Arnd Weber - SiCrystal
Japan TC Chapter of CSM
Global Technical CommitteeC: Masayoshi Obara - Shin-Etsu HandotaiC: open
5 Year Review TF
L: TBD
Global 200 mm GaAs
Wafer Specification TFL: TBD
Sapphire Substrate TF
L: Toshiro Kotaki - Namiki Precision Jewel
International SiC TF
L: Taizo Hoshino - Nippon Steel & Sumikin Materials
NA TC Chapter of CSM Global
Technical CommitteeC: Russ Kremer - Freiberger Compound MaterialsC: James Oliver - Northrop Grumman
Electrical Properties TF
L: Austin Blew - LEI
SEMI M55 5-Yr Review TF
L: Judy Kronwasser - NOVASiC
Silicon Carbide TF
L: Open
GaN TF
L: Judy Kronwasser - NOVASiC
= Global Task Force
Japan TC Chapter of EHS
Global Technical CommitteeC: Supika Mashiro - TELC: Hidetoshi Sakura - IntelC: Moray Crawford - Hatsuta Seisakusho
Global S23 Revision TF
L: George Hoshi - TEL
Environmental, Health & Safety (EHS)
Global Technical Committee
GHG Emission
Characterization TFL: George Hoshi - TEL
Seismic Protection
TFL: Naokatsu Nishiguchi - SCREEN Semiconductor Solutions
FPD System Safety TF
L: Naokatsu Nishiguchi- SCREEN Business Support Solutions
Taiwan TC Chapter of EHS
Global Technical CommitteeC: S. W. Yu - SAHTECHC: F. M. Hsu - TSMC
IC Equipment Safety TF
L: Colin Shen - MXICL: C. C. Huang - SAHTECH
Gas and Chemical Safety
TFL: Benny Chen - AUOL: Heng-Li Sue - SAHTECHL: Moony Lee - UMC
Seismic TF
L: K. C. Tsai - NCREEL: J. S. Hwang - NCREEL: D. W. Sun - TSMC
FPD Safety Subcommittee
L: C. C. Huang - SAHTECH
Equipment Safety TF
L: Benny Chen - AUOL: Juo Cho - AUOL: Alice Lin - CMO
Environmental
Sustainability TFL: Tony C. H. Lu - ITRIL: C Y Huang - TSMC
PV Safety
TFL: Eddie Wu - Nexpower
LED Safety
TFL: Eric Lin - Epistar
EHS TC Chapter
AdvisorRoger Wu - UMC
STEP Planning WG
L: Kenji Sugihara - Panasonic
SDRCM (S Documents REG-PG-SM
Conformance Maintenance) TFL: Supika Mashiro - TEL
= Global Task Force
Environmental, Health & Safety Global Technical Committee
S2 Interlock Reliability TF
L: Bert Planting - ASMLL: Tom Pilz - Pilz GmbH
Ergonomics TF
L: Ron Macklin - Macklin & AssociatesL: Paul Schwab - Texas Instruments
NA TC Chapter of EHS Global
Technical CommitteeC: Chris Evanston - Salus EngineeringC: Sean Larsen - Lam ResearchC: Bert Planting - ASML
S2 Ladders & Steps TF
L: Ron Macklin - Macklin & Associates L: Carl Wong - AKTL: Lindy Austin - Salus Engineering
Fire Protection TF
L: Eric Sklar - Safety GuruL: Matt Wyman - Koetter Fire
Lifting Equipment TF
L: Ron Macklin - Macklin & Associates
S2 Chemical Exposure TF
L: John Visty - Salus Engineering
S22 Revision TF
L: Chris Evanston - Salus EngineeringL: Sean Larsen - Lam Research
S6 Revision TF
L: John Visty - Salus EngineeringL: Glenn Holbrook - TUV SUD
S2 Non-Ionizing Radiation
TFL: Sean Larsen - Lam Research L: John Visty - Salus Engineering
S10 Revision TF
L: Eric Sklar - Safety GuruL: Mark Fessler - Tokyo Electron
Manufacturing Equipment Safety
SubcommitteeC: Cliff Greenberg - Nikon PrecisionC: Andrew Giles - ESTECC: Lauren Crane - KLA-Tencor
Seismic Liaison TF
L: Lauren Crane - KLA-Tencor
S27 Revision TF
L: Chris Evanston - Salus Engineering
Energetic Materials EHS
TFL: Steve Trammell - EORML: Andy McIntyre - EORM
Control of Hazardous
Energy (CoHE) Task ForceL: Andrew Giles - ESTEC L: Sean Larsen - Lam Research L: Mark Fessler - Tokyo Electron
Global S23 TF
L: Lauren Crane - KLA-Tencor
Device Removal Shipment
TFL: Eric Sklar - Safety Guru
Flow Limitation TF
L: Eric Sklar - Safety Guru
= Global Task Force
Facilities Global Technical Committee
Japan TC Chapter of Facilities
Global Technical CommitteeC: Hiromichi Enami - Hitachi High TechnologiesC: Isao Suzuki - MKS Japan
F1 Revision TF
L: Shuji Moriya - TEL YamanashiL: Yoshifumi Machii - Fujikin
Korea TC Chapter of Facilities
Global Technical CommitteeC: Kwang Sun Kim - KUT
Equipment Cleanness TF
L: TBD
NA TC Chapter of Facilities
Global Technical CommitteeC: Steve Lewis - LPCiminelli
F51 Revision TF
L: Dalia Vernikovsky - Applied Seals North America
Building Information Modeling (BIM) for
Semiconductor Capital Equipment TFL: Ben Bruce - Applied Materials
D31 Revision TF
L: Keizo Ochi - Konica Minolta
FPD Metrology Global Technical Committee
Transparent Display TF
L:JongSeo Lee - Samsung Display
Perceptual Image Quality
TFL: Jongho Chong - Samsung Display
Perceptual Viewing Angle
TFL: Myongyoung Lee - LG Electronics
Flexible Display TF
L: WangWen - Tung - ITRI
LCD Subcommittee
L: Kerson Wang - AUO
E-Paper Display TF
L: Fang Hui - MeiL: Bor-Jiunn Wen - CMS/ITRI
Touch Screen Panel TF
L: Yen-Wen Fang - AUOL: S.Y. Chou - CMS/ITRI
Korea TC Chapter of FPD Metrology
Global Technical CommitteeC: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution
Japan TC Chapter of FPD Metrology
Global Technical CommitteeC: Ryoichi Watanabe - Japan DisplayC: Akira Kawaguchi - Otsuka Electronics
Taiwan TC Chapter of FPD Metrology
Global Technical CommitteeC: Tzeng-Yow Lin - CMS/ITRIC: Jia-Ming Liu - TDMDA
FPD Materials & Components Global Technical Committee
Polarizing Film TF
L: Toshihito Otsuka - SanritzL: Yoshihiko Shibahara - Fujifilm
L: Shigeo Kobayashi - Nitto
Denko
Flexible Display TF
L: Haruhiko Itoh - Teijin L: Tadahiro Furukawa - Yamagata University
FPD Color Filter TF
L: Tadahiro Furukawa -Yamagata University
FPD Mask TF
L: Kazuya Shiojiri - SK ElectronicsL: Hirofumi Ihara - HOYA
NA TC Chapter of FPD
Technical CommitteeC:Bill Colbran - Engenuity Systems
Japan TC Chapter of FPD Materials &
Components Global Technical CommitteeC: Tadahiro Furukawa - Yamagata UniversityC: Yoshihiko Shibahara - Fujifilm
Korea TC Chapter of FPD Materials
& Component Technical CommitteeC: JongSeo Lee - Samsung DisplayC: II-Ho (William) Kim - Light Measurement Solution
NA TC Chapter of Gases
Global Technical CommitteeC: Mohamed Saleem - Fujikin
Mass Flow TF
L: Mohamed Saleem - Fujikin
Pressure Measurement TF
L: Joyce Chen - UCTL: Jeff Christian - WIKA
Filters & Purifiers TF
L: Mohamed Saleem - Fujikin
Materials of Construction
Gas Delivery Systems TFL: Bill Kiikvee - AP TECH
Gases Global Technical Committee
Heater Jacket TF
L: David Colquhoun - BriskHeat
Gas Specifications TF
L: Mark Ripkowski - CONSCI
Surface Mount Sandwich
Component Dimensions TFL: Matt Milburn - UCT
Europe TC Chapter of Gases
Global Technical CommitteeC: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Gordon F Consulting
Korea Gas & Liquid Chemicals
CFGL: TBD
Japan TC Chapter of Gases
Global Technical CommitteeC: Hiromichi Enami - Hitachi High TechnologiesC: Isao Suzuki - MKS Japan
Gas Panel Test Method TF
L: Yoshifumi Machii - Fujikin L: Shuji Moriya - TEL Yamanashi
Live Gas Flow Rate TF
L: Moriya Shuji - TEL YamanashiL: Shimizu Tetsuo - Horiba STECL: Ishihara Seiji - Flow Techno Service
5 Year Review TF
L: Yoshifumi Machii - Fujikin
China TC Chapter of HB-LED
Global Technical CommitteeC: Yong Ji - Guizhou Haotian Optoelectronics Technology C: Weizhi Cai - San an Optoelectronic
HB-LED Global Technical Committee
NA TC Chapter of HB-LED
Global Technical CommitteeC: Iain Black - PhilipsC: Mike Feng - SilianC: Chris Moore - BayTech-ResorC: Eric Armour - Veeco
HB-LED Equipment
Automation Interfaces TFL: Daniel Babbs - Brooks AutomationL: Jeff Felipe - Entegris
HB-LED Assembly TF
L: Paul Reid - Kulicke & Soffa
HB-LED Wafer TF
L: Win Bayles - BayTech-Resor
HB-LED Impurities and Defects
in Sapphire Wafers TFL: Luke Glinski - GT Advanced Technologies
HB-LED Equipment
Communication Interfaces TFL: Brian Rubow - Cimetrix
Patterned Sapphire
Substrate (PSS) TFL: Win Bayles - BayTech-Resor
Korea HB-LED CFG
L: HyeongSoo Park - SEMESL: Jong Hyeob Baek - KOPTI
Test Methods TF
L: Peter Wagner - Self
Single Crystal Sapphire TF
L: Yong Ji - Guizhou Haotian Optoelectronics Technology
L: Xinhong Yang - AURORA
GaN based LED Epitaxial Wafer
TFL: Fa Dong - THTF
L: Xinhong Yang - AURORA
Sapphire Single Crystal Ingot
TFL: Hongo Zuo – AURORA
L: Songbin Zhao - DDXDF
Sapphire Single Crystal
Orientation Task ForceL: Songbin Zhao - DDXDF
HB-LED Source Materials
TFL: Paul Ahn – VeecoL: H.B. Joo -Aixtron L: Sungjin Jun - LG InnotekL: Deok-gil - Samsung
Electronics
Process Control Systems
TFL: Martin Schellenberger - FhG IISB
Information & Control Global Technical Committee
TA
Hiroshi Kondo - Murata MachineryTadashi Mochizuki - TEL
GEM300 TF
L: Yoshihisa Takasaki - SCREEN Semiconductor SolutionsL: Yuko Toyoshima - Hitachi High-Technologies
Equipment Information
System Security TFL: Mitch Sakamoto - Freelance
Japan I&CC Maintenance
TFL: Mitsuhiro Matsuda - Hitachi Kokusai Electric
GEM300 TF
L: Jong Sub Shim - ASM L: Chang Yul Cho - SEMESL: Byoung Min Im - TEL Korea
DDA TF
L: Hyungsu Kim - Doople
Europe TC Chapter of Information &
Control Global Technical CommitteeC: Alfred Honold - InReConC: Frank Petzold - Trustsec
Japan TC Chapter of Information &
Control Global Technical CommitteeC: Takayuki Nishimura - SCREEN Semiconductor SolutionsC: Mitsuhiro Matsuda - Hitachi Kokusai ElectricAdviser: Mitch Sakamoto - Freelance
Korea TC Chapter of Information &
Control Global Technical CommitteeC: Hyungsu Kim - DoopleC: Chul Hong Ahn - SK hynixC: Gun Woo Lee - Lam Research
Fiducial Mark
Interoperability TFL: Mitsuhiro Matsuda - Hitachi Kokusai Electric
Information & Control Global Technical Committee
GEM300 TF
L: Brian Rubow - CimetrixL: Gino Crispieri - Consultant
Diagnostic Data
Acquisition (DDA) TFL: Brian Rubow - CimetrixL: Gino Crispieri - Consultant
Process Control System
Architecture (PCS) TFL: James Moyne - University of MichiganL: Chris Maloney - Intel
Energy Saving Equipment
Communication TFL: Gino Crispieri - ConsultantL: Mike Czerniak - Edwards Vacuum
Equipment Information
TFL : Liao Robin - TSMC
GEM 300 TF
L : Liao Robin - TSMC
NA TC Chapter of Information &
Control Global Technical CommitteeC: Brian Rubow - CimetrixC: Jack Ghiselli - Ghiselli ConsultingC: Lance Rist - RistTex
Taiwan TC Chapter of Information &
Control Global Technical CommitteeC: Robert Chien - TSMC
Sensor Bus TF
C: James Moyne - University of Michigan
Backend Factory Integration
TFL :Ivan Chen - TSMCL: C.Y. Chiu - TSMC
Precursor Specifications
TFL: Paul Williams - SAFC Hitech
Liquid Chemicals Global Technical Committee
Solvents in Advanced
Processes TFL: TBD
Analytical Methods TF
L: Frank Flowers - PeroxyChem
SEMI F57 Rewrite TF
L: James Henry - Arkema GroupL: Ian Francisco - Lam Research
Determining Roughness
of Polymer Surfaces TFL: Gunter Moeller - Arkema Group
SEMI IX Resin TF
L: Slava Libman - Air Liquide
UPW Filter Performance
TFL: Slava Libman - Air Liquide
SEMI F63 Rewrite TF
L: Slava Libman - Air Liquide
SEMI F31, F39 & F41
Rewrite TFL: David Kandiyeli - Mega Fluid SystemsL: Koh Murai - Mega Fluid Systems
SEMI F40 Rewrite TF
L: Don Hadder Jr. - Intel
Liquid Chemicals
SubcommitteeC: Frank Flowers - PeroxyChem
Liquid Chemical Distribution
SubcommitteeC: open
Diaphragm Valve TF
L: Shigeru Ohsugi - CKDL: Kimihito Sasao - Advance Electric
Welding Fitting TF
L: Kimihito Sasao - Advance ElectricL: Takashi Hasegawa - KITZ SCT
Liquid Filter TF
L: Takuya Nagafuchi - Nihon EntegrisL: Takehito Mizuno - Nihon Pall
Liquid-Borne Particle
Counter TFL: Kaoru Kondo - RIONL: Kazutoshi Kato - PMS
Europe TC Chapter of Liquid Chemicals
Global Technical CommitteeC: Jean-Marie Collard - Solvay ChemicalsC: Gordon Ferrier - Tiger Optics
Japan TC Chapter of Liquid Chemicals
Global Technical CommitteeC: Hiroshi Tomita - ToshibaC: Hiroyuki Araki - SCREEN Semiconductor Solutions
NA TC Chapter of Liquid Chemicals
Global Technical CommitteeC: Frank Flowers - PeroxyChem
Permeation Tubes for Trace
Moisture Calibration TFL: Jean-Marie Collard - Solvay ChemicalsL: Jim Mc Kinley - KIN-TEK
Ultrapure Liquid
Evaluation Study GroupL: Kaoru Kondo - Rion L: Hiroshi Sugawara - Organo
Korea Gas & Liquids
Chemicals CFGL: TBD
MEMS/NEMS Global Technical Committee
Packaging TF
L: Steve Martell - Sonoscan
Wafer Bond TF
L: Win Baylies - BayTech-ResorL: Richard Allen - NIST
Material Characterization
TFL: Richard Allen - NIST
International MEMS
Terminology TFL: Steven Martell - Sonoscan
Reliability TF
L: Open
Microfluidics TF
L: Mark Tondra - Diagnostic Biosensors
NA TC Chapter of MEMS/NEMS
Global Technical CommitteeC: Win Baylies - BayTech-ResorC: Steve Martell - Sonoscan
= Global Task Force
Europe TC Chapter of Metrics
Global Technical CommitteeC: Alfred Honold - InReConC: Lothar Pfitzner - FhG IISB
Metrics Global Technical Committee
Japan TC Chapter of Metrics
Global Technical CommitteeC: Toshio Murakami - Murakami Corporation
Int'l Environmental
Contamination Control TFL: Mikio Furukawa - Shin-Etsu Polymer
ESD/ESC TF
L: Toshio Murakami - Murakumi Corporation
EMC Study Group
L: Koji Ochi - Noise Laboratory
Cycle Time Metrics TF
L: Kenichiro Mukai - Applied Materials JapanL: Supika Mashiro - TEL
Metrics Education & Adoption
(MEA) Subc (inactive)C: TBD
EMC TF
L: Vladimir Kraz - BestESD Technical ServicesL: Mark Frankfurth - Cymer
ESD/ESC TF (inactive)
L: Arnold Steinman - Electronics WorkshopL: open
Factory Level Productivity
Metrics TF (inactive)L: Ron Billings - Georgia Tech/ FABQL: Jim Irwin - I/C Irwin Consulting
Equipment Training &
Documentation TFL: Mark Cohran - IntelL: Malthi Venkat - Nikon Precision
Wait Time Waste Metrics
and Methods TFL: Lance Rist - RistTex
Equipment RAMP Metrics
TFL: David Busing - ConsultantL: Steven Meyer - Intel
Equipment Cost of
Ownership TF (inactive)L: Daren Dance - WWKL: David Bouldin - Fab Consulting
NA TC Chapter of Metrics
Global Technical CommitteeC: David Bouldin - Fab ConsultingC: Mark Frankfurth - CymerTE: Carolyn Busing - Self TE: Chona Shumate - CymerTA: Greg Francis - Cymer
= Global Task Force
Micropatterning Global Technical Committee
5 Year Review TF
L: Morihisa Hoga - Dainippon Printing
Mask Data Format for
Mask Tools TF L: Toshio Suzuki - Dainippon Printing
Extreme Ultraviolet (EUV)
Mask TFL: David Chan - SEMATECH
Data Path TF
L: Thomas Grebinski - OASIS ToolingL: Kurt Wampler - ASML
NA TC Chapter of Microlithography
Global Technical CommitteeC: Wes Erck - Wes Erck & AssociatesC: Bryan Barnes - NIST
Japan TC Chapter of Micropatterning
Global Technical CommitteeC: Morihisa Hoga - Dainippon Printing
Extreme Ultraviolet (EUV)
Fiducial Mark TFL: Long He - SEMATECH
Photovoltaic Global Technical Committee
China TC Chapter of PV
Global Technical CommitteeC: Guangchun Zhang - CanadianSolarC: Jun Liu - China Electronics Standardization Institute
PV Silicon Wafer TF
L: Yuepeng Wan - LDKL: Liangping Deng - LONGi
L: Jingang Lu - Suntech
Thin Film PV TF
L: Yaohua Mai - Baoding Tianwei SolarfilmsL: Xinwei Niu - Chint SolarL: Jian Ding - Hanergy
PV Silicon Raw Materials
TF
L: Xiaoxia Liu - GCL
L: Dongxu Chu - SINOSICO
L: He Li - CPVT
Taiwan TC Chapter of PV
Global Technical CommitteeC : B. N. Chuang - CMS/ITRI
C : J.S. Chen - TeraSolarC : Ray Sung - UL Taiwan
Organic & Dye Sensitized
Solar Cell TFL : Der-Ray Huang - NDHUL: T.C. Wu - CMS/ITRI
PV Wafer Measurement
Method TFL : Samunine Chen - Chunson
PV Package Performance
TFL: C.C.Lin - PV GuiderL: Bor -Tsuen Wang - National Pingtung UnviersityL: T.C. Wu - CMS/ITRIL: Ivan Chou - DelsolarL: K.T.Lee - King Design
Building Integrated
Photovoltaic (BIPV) TFL: C.C.Lin - PV GuiderL: Der-Ray Huang - NDHUL: T.C. Wu - CMS/ITRIL: Ivan Chou - DelsolarL: K.T.Lee - King DesignL: K. Han Ke - Gran System
NA TC Chapter of Global PV
Technical CommitteeC: Win Baylies - BayTech-ResorC: James Moyne - University of Michigan
Japan TC Chapter of Global PV
Technical CommitteeC: Hiromu Takatsuka - PVTECC: Kazuhiko Kashima - Kashima ConsultantC: Masaaki Yamamichi - AIST
Multi-Wire Saws TF
L: Jingying Jia - National Engineering Research Center for Photovoltaic EquipmentL: Xianwu Cai - CETC 48th InstituteL: Zhixin Li – LCTL: Honglin Sui - CETC-48
Crystalline Silicon Solar Cell TF
L: Dengyuan Song - YingLi EnergyL: Ruling Chen - Suntech
L: Xianwu Cai - 48th Institute
PV Diffusion Furnace Test
Methods TFL: Liangyu Liu - CETC-48thL: Xianwu Cai - CETC-48th
L: Jianyu Zheng - SevenStar
PV Module TF
L: Wei Zhou - Trina Solar
L: Liang Luo - Hunan Red SolarL: Zhen Zhang - Hohai UniversityL: Jingbing Zhu - Suntech
PV Reliability Test Method
TFL: H.S. Wu – CMS/ITRI
EU TC Chapter of PV Materials
Global Technical Committee C: Peter Wagner - ConsultantC: Huber Aulich - Solar Valley
PV Silicon Materials TF
L: Peter Wagner - Consultant
PV Materials Global Technical Committee
NA TC Chapter of PV Materials
Global Technical Committee C: Lori NyeC: John Valley - Sun EdisonC: Hugh Gotts - Air Liquide Electronics US
JA TC Chapter of PV Materials
Global Technical Committee C: Takashi Ishihara - Mitsubishi ElectricC: Kazuhiko Kashima – Kashima EngineeringC: Tetsuo Fukuda - AIST
Japan PV Materials TF
L: Tetsuo Fukuda - AISTL: Takashi Ishihara - Mitsubishi Electronic
Int l PV Analytical Test Methods,
Metrology, and Inspection TFL: Hugh Gotts - Air Liquide Electronics USL: Ron Sinton - Sinton InstrumentsL: Chris Moore - BayTech-Resor
Int l PV Analytical Test Methods,
Metrology, and Inspection TFL: Peter Wagner - Consultant
= Global Task Force
International Reticle SMIF Pod
& Loadport Interoperability TFL: Jan Rothe - GLOBALFOUNDRIES
Physical Interfaces & Carriers Global Technical Committee
Global PIC Maintenance
TFL: Shoji Komatsu - Acteon
International 450 mm PIC
TFL: Shoji Komatsu - Acteon
Fiducial Mark Interoperability
TFL: Supika Mashiro - TEL
Glboal PIC Maintenance
TFL: Larry Hartsough - UA Associates
EUV Reticle Handling TF
L: Long He - SEMATECHL: David Chan - SEMATECHL: John Zimmerman - ASMLL: Kazuya Ota - Nikon
International 450 mm PIC
TFL: Melvin Jung - IntelL: Shoji Komatsu - Acteon
NA 450mm Shipping Box
TFL: Tom Quinn - Intel
International 450 mm
Shipping Box TFL: Tom Quinn - Intel
450mm ATDP TF
L: Stefan Radloff - Intel
International Reticle SMIF Pod
& Loadport Interoperability TFL: Jan Rothe - GLOBALFOUNDRIES
International Process Module
Physical Interface (IPPI) TFL: Richard Oechsner - Fraunhofer
NA TC Chapter of Physical Interfaces & Carriers
Global Technical CommitteeC: Matt Fuller - EntegrisC: Stefan Radloff - Intel
Japan TC Chapter of Physical Interfaces &
Carriers Global Technical CommitteeC: Tsuyoshi Nagashima - Miraial C: Tsutomu Okabe - TDKC: Kenji Yamagata - DAIFUKUTA: Shoji Komatsu - Acteon
Europe TC Chapter of Physical Interfaces &
Carriers Global Technical CommitteeC: Alfred Honold - InReConC: Frank Petzold - Trustsec
= Global Task Force
Europe TC Chapter of Si Wafer
Global Technical CommitteeC: Werner Bergholz - Jacobs University of BremenC: Peter Wagner - ConsultantC: Fritz Passek - Siltronic
International Terminology
TFL: Peter Wagner - Consultant
International Advanced
Wafer Geometry TFL: Fritz Passek - SiltronicL: Frank Riedel - Siltronic
International Test
Methods TFL: Peter Wagner - Consultant
International Advanced
Surface Inspection TF L: Frank Riedel - Siltronic
International Polished
Wafers TFL: Frank Riedel - Siltronic
Silicon Wafer Global Technical Committee
International Annealed
Wafers TFL: Dinesh Gupta - STA
International Epitaxial
Wafers TFL: Dinesh Gupta - STA
International Polished
Wafers TFL: John Valley - SunEdison SemiconductorL: Mike Goldstein
International SOI Wafers
TFL: Bich-Yen Nguyen - SOITEC
International Advanced
Wafer Geometry TFL: Noel Poduje - SMSL: Jaydeep Sinha
International Terminology
TFL: TBD
NA TC Chapter of Si Wafer
Global Technical CommitteeC: Dinesh Gupta - STAC: Noel Poduje - SMSVC: Mike Goldstein TE: Murray Bullis - Materials & Metrology
International Test
Methods TFL: Dinesh Gupta - STA
International Automated
Advance Surface Inspection TFL: Kurt Haller - KLA Tencor
= Global Task Force
Japan TC Chapter of Si Wafer
Global Technical CommitteeC: Naoyuki Kawai - The University of TokyoC: Tetsuya Nakai - SUMCO
International Annealed
Wafers TFL: Koji Araki - GlobalWafers Japan
Silicon Wafer Global Technical Committee
International Terminology
TFL: Tetsuya Nakai - SUMCO
International Advanced
Wafer Geometry TFL: Satoshi Akiyama - Raytex
Japan JWG TF
L: Masanori Yoshise - FreelanceL: Satoshi Akiyama - Raytex
International Test Method
TFL: Ryuji Takeda - GlobalWafers Japan
International SOI Wafers
TFL: Atsushi Ogura - Meiji University
International Advanced
Surface Inspection TFL: Masami Ikota - Hitachi High Technologies
JA Shipping Box TF
L: Shoji Komatsu - ActeonL: Tsuyoshi Nagashima - Mirial
International 450 mm
Shipping Box TFL: Shoji Komatsu - Acteon
GOI WG
L: Tsuyoshi Otsuki - Shin-Etsu Handotai
Surface Organic
Contaminant Analysis WGL: Mikako Omata - Sumika Chemical Analysis Service
Surface Metal Chemical
Analysis WGL: Ryuji Takeda - GlobalWafers JapanL: Ryo Machida - Sumika Chemical Analysis Service
BMD DZ WG
L: Satoshi Akiyama - RaytexL: Kazuo Moriya - Raytex
Bulk Heavy Metal Analysis by
Electrical Measurement WGL: Shingo Sumie - KOBELCOL: Masaru Akamatsu - KOBELCO
International Epitaxial
Wafers TFL: Naohisa Toda - Shin-Etsu Handotai
Japan Test Method TF
L: Ryuji Takeda - GlobalWafers JapanL: Tsuyoshi Otsuki Shin-Etsu HandotaiL: Mikako Omata - SCAS
International Polished
Wafers TFL: Yasutoshi Takamoti - GlobalWafers Japan
Fiducial Mark
Interoperability TFL: Tetsuya Nakai - SUMCO
= Global Task Force
Traceability Global Technical Committee
5 Year Review
TFL: Hirokazu Tsunobuchi - Keyence
NA TC Chapter of Traceability
Global Technical CommitteeC: Win Baylies - BayTech-ResorC: Yaw Obeng - NIST
5 Year Review TF
L: Win Baylies - BayTech-Resor
Japan TC Chapter of Traceability
Global Technical CommitteeC: Yoichi Iga - FreelanceC: Hirokazu Tsunobuchi - Keyence
Fiducial Mark
Interoperability TFL: Hirokazu Tsunobuchi - Keyence