patent pending sinkpad · 2018-10-17 · patent pending sinkpadtm th ll effi i t pcb t h l f patent...
TRANSCRIPT
Patent Pending
SinkPADTM
Th ll Effi i t PCB T h l f
Patent Pending
Thermally Efficient PCB Technology for the LED Application
Sinkpad Corporation
1
R5Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to beaccurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makesno warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.
PRESENTATION OUTLINE
Thermal Challenges In The LED Applications
How it is Addressed? Metal Back PCB Technology
Is There a Better Way? SinkPADTM Technologyy gy
What Would I Gain Using SinkPADTM?
Comparisons Of “Metal Back” & “SinkPADTM” Comparisons Of Metal Back & SinkPADTM
Potential Applications
Test Data
Conclusion
2R5
THERMAL CHALLANGES
Increasing Trend For LED Power Increasing Trend For LED Power
Increasing Trend For Higher Brightness
Primary Thermal Path: Conduction Cooling
Higher Thermal Resistance
Power Density Increasing – more LEDs in a small area
Long Life Expectation Long Life Expectation
3R5
How Heat Issues Addressed Historically?
Metal Back PCB TechnologyExample: MCPCB, Aluminum PCB etc…type products
THERMALLY CONDUCTIVE DIELECTRICS Arlon 92ML – 2.0W/m.kExample: MCPCB, Aluminum PCB etc…type products Bergquist – 2.2-3.0W/m.k Doosan – 2.0W/m.k Denka Hit Plate – 2.0-8.0 W/m.k DuPont CoolLam – Polyimide based – 0.80W/m.k ITEQ- IT859 GTA – 2.0W/m.k Laird Technology HKA 3 0W/m k
Thermally Conductive Dielectric
Laird Technology HKA – 3.0W/m.k Polytronics – 2.7W/m.k Sekisui – 2.0W/m.k Ventec - VT 4A1 – 1.6W/m.k
Thermally Conductive Dielectric (TC~ 1 to 4 W/m.k)
Thermal Pad Z-axis HeatThermal Pad or Bond Pad
Metal Thermal Conductivity (TC)Al ~135-180W/m.k
Z-axis Heat Transfer rate:
Only 1-4 W/m.kCu ~385W/m.k
Z-axis heat transfer is limited by the TC & thickness of the Dielectric Material4R5
Is There a Better Way to Remove Heat?
YES
SinkPADTM TechnologySinkPADTM Technology
5R5
What is SinkPAD?
SinkPADTM is a MCPCB Technology gyWhich Provides
Direct Thermal Path to Hot LEDDirect Thermal Path to Hot LED
6R5
“SinkPADTM” TECHNOLOGY
Direct Heat Transfer (NO dielectric barrier)Patent Pending
Circuit Layer
Standard Dielectric material
SinkPAD
Z-axis Heat
Metal Thermal Conductivity (TC)Al ~135-180W/m.kCu ~385W/m.k
Transfer rate: 150-385 W/m.k
Cu 385W/m.k
Z-axis heat transfer is same as the TC of the base material used7R5
“SinkPADTM” TECHNOLOGY
Top View of a SinkPADTM PCBPatent Pending
SinkPAD
Circuit padCircuit traces
8R5
COMPARISION OF “METAL BACK” & “SinkPAD”
“Metal Back PCB” “SinkPADTM PCB”Patent Pending
Higher Thermal Resistance Slow Heat Transfer Rate
Special Dielectric Required
Thick Base Metal Required
Direct Thermal Path Fast Heat Transfer Rate
Standard Dielectric Used
Thinner Base Metal Optionsq
Limited to Epoxy dielectric only Metal is Insulated Thermally From The Component
p
Epoxy, Polyimide or any typical dielectric can be used Metal is Connected Thermally to the Component
“No” PCB Design Change Required No PCB Design Change Required
9R5
“SinkPADTM” TECHNOLOGY
Multilayer Examples
“ l k C ” “SinkPADTM PCB”
Patent Pending
PTH Pl t d Th h H l
Does not increase thermal resistanceSubstantial increase in thermal resistance
“Metal Back PCB” SinkPADTM PCB
PTH = Plated Through Holes
Limitation: Components can be assembled only on one side of the PCB10R5
REQUIREMENT TO USE SinkPADTM
Patent Pending
“Thermal Path” should be electrically neutral or isolated from the Anode and Cathode within the LED package Example packages:Anode and Cathode within the LED package. Example packages:
Neutral Thermal Path packages Luxeon Rebel
Elec. Active Thermal Path packages Osram - Golden Dragon
Cree – XP, XR, XTE. XBD, XML MT-G, MCE Everlight– Shuen, Shwo, Yi, Tsan series Luminus – PhlatLight SST-90, SSM80 Osram – OSLON SSL
g Seoul - Z-Power Avago Moonstone Emitter
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Osram OSLON SSL Nichia - N219 Seoul Z5P, Z5M Samsung 3535 Can not solder directly to the
SinkPADTM surfaceR5
SinkPADTM Product FamilyPatent Pending
SinkPAD P/N Base Metal Base Metal thickness
SP-A530 ALUMINUM 5052 ~0.032” (~0.80mm)
SP-A540* ALUMINUM 5052 ~0.040” (~1.0mm)
SP-A560* ALUMINUM 5052 ~0.063” (~1.60mm)
SP-A630 ALUMINUM 6061 ~0.032” (~0.80mm)
SP-A640 ALUMINUM 6061 ~0.040” (~1.0mm)SP A640 ALUMINUM 6061 0.040 ( 1.0mm)
SP-A660 ALUMINUM 6061 ~0.059” (~1.50mm)
SP-C40 COPPER ~0.040” (~1.0mm)
SP-C60 COPPER ~0.059” (~1.50mm)
* Most running product
12R5
POTENTIAL APPLICATIONS
Commercial / Industrial lights
13R5
POTENTIAL APPLICATIONS
Street lights
14R5
POTENTIAL APPLICATIONS
Back lights
15R5
POTENTIAL APPLICATIONS
PAR38 bulbs
16R5
POTENTIAL APPLICATIONS
Residential down lights
17R5
TEST DATA
SinkPAD v/s MCPCB thermal data
thSinkPAD Rth: 0.45 0C/W
th MCPCB Rth : 1.75 0C/W
deg
C)
deg
C)
Power (W)Power (W)
dT*
dT*
18R5
SinkPADTM makes a lot of sense at mid to high power application, for example the new Cree XML can be driven up to 3A. At this power level, It can be a big difference in junction temp
TEST DATA, Cree 1-XPG
SinkPAD v/s Typical Aluminum back PCB thermal data
19R5
TEST DATA, Cree 9-XPG
SinkPAD v/s Conventional MCPCB thermal data (IR Camera)
MCPCB SinkPAD PCB
- Cree XPG 9 LEDs- Current: 1 Amp.- Power: 3W each- PCB ~ 1”x1”
1410 C 1190 C
20R5
SinkPADTM PCB & Aluminum PCB mounted onto a separate heatsink. LEDs on a SinkPADTM pcb running ~220C cooler than on the conventional MCPCB
TEST DATA, Luxeon Rebel at 700mA
SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)
- Luxeon Rebel at 700mALuxeon Rebel at 700mA
MCPCB Type-1MCPCB Type 1MCPCB Type-24
MCPCB-1MCPCB 1
MCPCB-2
Test was conducted by Quadica Developments Inc
21R5
LED on a SinkPADTM PCB running ~290C cooler than on the MCPCB-1 and 100C cooler than the MCPCB-2
TEST DATA, Luxeon Rebel at 1A
SinkPAD v/s Conventional MCPCB thermal data (Thermocouple method)
- Luxeon Rebel at 1000mALuxeon Rebel at 1000mA
MCPCB Type-1MCPCB Type-1
MCPCB Type-24
MCPCB-1
MCPCB-2
Test was conducted by Quadica Developments Inc
22R5
LED on a SinkPADTM PCB running ~470C cooler than on the MCPCB-1 and 160C cooler than the MCPCB-2
Other Available Test Data
Nichia N219
Luxeon RebelLuxeon Rebel
Cree MTG
Osram Oslon SSLOsram Oslon SSL
Cree XML
Customize Your TestCustomize Your Test
23R5
Advantages of SinkPAD
Lower LED Junction TemperatureLower LED Junction Temperature
As a result:
1) O ti t LED t l j ti t t1) Option to run LED at lower junction temperature i.e Increase Life of the LED Fixture
2) Option to run LED at higher power / maintain temperature i.e. Get more lumens per LED
3) R d b f LED li h3) Reduce number of LEDs to get same light i.e. Reduces Fixture Cost
Industry Experts say:
24R5
“LED life doubles at every 10oC it runs cooler”Industry Experts say:
Highlights and Q&A
Magnitude Higher Thermal Transfer Rate Direct Thermal Path
Patent Pending
Direct Thermal Path 135 to 385W/m.k vs. 1 to 4 W/m.k LOWER JUNCTION TEMPERATURE
High Tg (Up to 225oC)
Multilayer Possible Without Increase In Thermal Resistance
Weight Saving Possibly thinner profile
Di t R l t f MCPCB M t l B k PCB & Al i PCB Direct Replacement for MCPCB, Metal Back PCB & Aluminum PCB
Most Economical Direct Thermal Path Solution Q&AQ
25R5
THANK YOUTHANK YOUFor more information contact
[email protected] us at www.sinkpad.com
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Users of SinkPADTM technology are reminded that they bear the responsibility for testing for their applications. Any information furnished by SinkPAD Corporation, its licensees and representative is believed to beaccurate, but users of the technology must bear all responsibility for the use and testing of the product since SinkPAD Corp., its licensees and representatives cannot be aware of all potential uses. SinkPAD Corp. makesno warranties as to the applicability, fitness or suitability of SinkPADTM technology for any specific or general uses. SinkPAD Corporation shall not be liable for incidental or consequential damages of any kind.