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Pixel Pilot system

Simon KwanNovember 8, 2011

Pixel Upgrade Parallel Session

FPIX Pilot Blades with PSI46dig ROC (Roland Horisberger, February CMS Tracker Week)FPIX mechanics, cooling & cabling was originally designed for 3 disks each side.

Present installed FPIX system has only 2 disks equipped.

All cables, fibres and cooling pipes for 3rd disk exist !

Proposal:After repair of present FPIX during LS1 insert the 3rd disk mechanic and mount a few pilot blades of old design with new digital ROC (PSI46dig) and provide for these blades a few (already existing) readout fibres with old AOH.

Can operate and commission new digital ROC under realistic conditions (use CMS tracking as beam telescope) and write all the necessary software changes in DAQ, DB and DQM for a smooth and swift transition for the new upgraded pixel system in 2016/17

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Goals for the Pilot System• First and foremost, no or little impact on the operation of

the current pixel detector• operation experience in the new ROCs and TBM and

digital transmission and readout with the new POH and FED at P5

• Get a head start on DAQ (new FED firmware and software, perhaps new FEC firmware), calibration procedure, DQM

• Study how the TBM and FED would handle PKAM events• Study the performance (inefficiency) of new ROC in the

high rate environment of the LHC

General Considerations

• No or little impact on the current detector operation• Will use the new PSI46dig ROC and new TBM• Use the same electronic circuits that we plan for the FPIX

upgrade detector• New FED; modified DAQ software• What do we gain from doing this than couldn’t be

accomplished by doing a full system test of the real components/circuits that we will use for the Phase 1 upgrade – PROS: P5 running in collider environment; head-start on DAQ, DCS,

DQM etc; – CONS: resources, diversion from Operation and main Upgrade

effort; results may be affected by the existing system constraints

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Plan• Build a few blades using the new FPIX 2x8 module design• Mount the new modules on to the Al brazed channel and existing

Al ring support (same mechanical support/cooling arrangement as the current FPIX detector) as third disk on one of the existing FPIX half cylinders

• The geometrical configuration is similar to the outer assembly for the FPIX upgrade

• New HDI, Al cable, (probably) new port card, POHs• CCU board and token ring already exists• Since we are not short of fibers, we have the flexibility of using

either TBM_bpix or TBM_fpix with or without the new Datakeeper• Will try to use as close to the new FPIX readout chain as possible

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Pilot System Model

From Joe Howell

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DC-DC Conversion• Upgrade pixel detector will use DC-DC conversion

for power distribution• While DC-DC conversion is not needed for the pilot

system, we would like to test this as well to learn the operation and control, understand whether there could be any issues (e.g. interference and pick-up by other electronic circuits)

• Tentative plan: some modules will be powered by conventional method while some others will be powered by DC-DC converters; build two half disks and install them on different half cylinders

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Parts and hardware Needed• New 2x8 modules using PSI46dig ROC (PSI), new TBM (Rutgers)• New sensor (FNAL contract with SINTEF – expected delivery next Spring; Pixel upgrade

working on a new contract with CiS)• Bump bonding ?? (RTI? VTT?) • New Al cable prototype (results see doc #4970); need another submission• HDI (will start design this FY)• POH (prototype tested; re-design under review); but tests done at various places

showed that the old AOH should work (see next slides)• New port card (discussion with Sergey and others); but we have done tests to show

that the current port card would also work• Other chips (CCU, gatekeeper, TPLL, ALT…); datakeeper??• Module production & assembly (Purdue, Nebraska, …)• Module test-stand, Full chain readout system test-stand, and DAQ test stand (how

many?)• Mechanical support and cooling channel (exist)• New FED (Vienna, Vanderbilt) ; other proposals?? • Power supply , cables, and fibers (exist)• DC-DC converter

CERN MeasurementsAmplitude = 107 mWRise Time = 1.3 ns

FNAL MeasurementsAmplitude = 119 mW Rise Time = 1.45 ns

Input Amplitude = 600 mV differentialInput signal = 223 -1 PRBS

CERN and FNAL AOH Optical Eye Measurements @ 400 Mbps

KU Downstream readout tests

1. Linktester board with FPGA to spit out pattern and program I2C

2. LCDS driver chip3. 1m long Microtwisted pair4. AOH/POH mounted on adapter board5. Fiber from OH goes to fast O-scope input

1 2 3 4 5

Top: LCDS driver 1m micro-twisted pair cable, AOHBottom: FPGA board to scope directly

KU AOH Eye Diagram

3

400 MbpsPseudo-random bit result from KU setup

20ns

OH out

List of Tasks• ROC testing (performance test, beam test, high rate test, irradiation, SEU etc)• TBM design and test (functionality, irradiation, SEU test)• Sensor (qualification, irradiation, beam test?)• Bump bonding (qualification)• DC-DC converter board • Module test (qualification, characterization, temp cycle, calibration)• System test (full electronics readout chain)• Assembly and testing at TIF• Commissioning at TIF (with the existing pilot detector?)• Installation and test at new repair facility into one of the half cylinders• New FED hardware/firmware/software• FEC firmware• DAQ (stand-alone, integration with rest of FPIX, integration with CMS)• DCS (stand-alone, integration with Tracker DCS)• DQM• Simulation• Tracking• Database

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Schedule• LS1 will end late 2014?• PSI46digv1 : which version? Submission in Nov 2011; expect wafers back

in Feb/March 2012; tests …..; TBM (FPIX version) design not quite ready• Sensor: available say May/June 2012?• Bump bonding: starts summer 2012• Al cable: waiting to hear back from vendors on quote; in principle, could

go ahead and ask CERN to produce more another batch• Electronics: expect to have them (HDI, POH, Al cable) by the end of

CY2012 • Port card: needs to have some idea on Datakeeper (dimension, pinout).

But old port card also work with mods (maybe a small adapter to connect the Al cable to the old port card)

• DC-DC converter (AMIS5 submission early next year)• proposed milestones to USCMS Management: POH, Port card, and HDI

should be completed during FY12

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M&S Cost

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Interested Parties• CERN (activities to be defined; would like to

see the list of tasks first before deciding)• Finland – Helsinki (VTT bump—bonding)• France – Lyon (DAQ)• UK – RAL (DAQ, FED firmware)• US – FNAL, Purdue, Vanderbilt, MRI institutes

(KU,KSU, Rice, Rutgers, UIC, UNL, UPR)

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Summary• No show-stopper• Many groups have expressed interest• Good exercise to gain operation experience in

CMS for the new readout chain and any mods to the DAQ and power distribution

• Modest M&S cost• Instead of a diversion from pixel operation, we

could have a larger pool of experts if new people could get involved in the pixel DAQ