Powerful administrative functions.

• Real time alert systems (option):

• Statistical systems:

• ICT console (option): • Remote access test results data and their statistic charts to support manager analyze production problems, adjust the engineering process or trace back fail components to meet the key issue, original problem solving strategy.• Edit and debug test program at remote side.

Automatic generate useful production administrative charts, such as components test value distribution charts, daily charts, period charts, test pins fails ranking, failure component ranking and test coverage rate analysis…etc.

PRG. DEMOPRG.

DEMO

Alert when meets criterion of test fails.

Board View functions.

• Physical tested board display on screen monitor.

• Board view functions:

• Pin edit function:Show the physical outline of fail pins and their relative circuit and components to find the failure points or components easily.

Support smart board view function for trouble shooting station needs. See demo program for details.

Support fail components physical outline on screen to make the trouble shooting work more easier.

PRG. DEMOPRG.

DEMO

Test program generator.

• Test Program Conversion:

• Auto learning functions:

Auto learning for items of Open/Short, Component, IC, TAJ, ECJ respectively, then generate test program and their guarding points up to 95% automatically. It can save huge test program debugging and tuning time.

ATPD: Automatic Test program Debug.

PRG. DEMOPRG.

DEMO

Direct import CAD data from FABMASTER or other ICT test program from TRI、 JET、 OKANO、 TESCON、 TCO-5….etc, and convert them to ICT360AT test program directly.

Unique test functions.

• TA Jet :

• EC Jet :

• 4 wires mini ohm measurement:

• Up to 0.05Ω，mini ohm grade measurement.

• Explosion free capacitor: 100% missing part and polarity reverse detect rate.

• Parallel capacitors: 100% missing part and polarity reverse detect rate.

• BGA IC test approach to 100% coverage rate.

• SMD Connector test approach to 100% coverage rate.

• Intel 845 north bridge approach to 100% coverage rate.

PRG. DEMOPRG.

DEMO

Compatibility

• TAJ / HPJ compatibility.

• ECJ Fixture :

• Test program conversion :

Import from TRI / JET / OKANO / TESTCON / TCO-5 test program or Fabmaster CAD data to generate ICT360AT test program directly.

Just remove the ribbon connector cable from MUX card of HPJ system and plug it into Switch Card connector of TAJ system.

Add 3rd pin on upper side of the fixture for contacted the surface of each electrolytic capacitors.

PRG. DEMOPRG.

DEMO

PRG DEMOPRG DEMOReview

• ICT360AT evaluations(Excel) EXITEXIT

Powerful administrative functions.

Trouble shooting auxiliary.

Excellent Compatibility.

Return from investment.

CompareCompare

Automatic test program debug.

Unique test function.P4 EVAL.P4 EVAL.

EC JetEC Jet

TA JetTA Jet

Evaluations

Evaluations

• Quality Alert system / Statistic system / Remote console.

• Board View function / Show No-Go parts on screen monitor. • Test Pin edit function.

• Import from other Test Program or CAD data from fabmaster.• Automatic test program learning.

• TA Jet / EC Jet / Mini ohm measurement.

• TAJ / HPJ compatibility / ECJ fixture / Test program conversion.

ICT360AT supports 7 kinds of charts:

Statistical charts.

Daily chart.

Period chart.

Distribution chart.

IC measure value distribution chart.

Rank for bad pins of the bed of nails.

Rank for fail components.

Coverage rate analysis chart.

Statistical charts Performance.

Test program tuning as well as upper/lower limits setting for each test step.

Tested board quality monitoring and production problems real time tracking.

Components quality monitoring and problems trace back (ISO9001).

Test pins quality monitoring and probe replace indication of the Bed of Nails.

Fixture convert for TAJ and HPJ .

HPJ wiring. TAJ wiring

MUX CardMUX Card SWCSWC

Decoder Card

Decoder Card

Convert TAJ to HPJ: CASE 1

HPJ TAJ (HPJ fixture wiring application on ICT360AT.)

No such as Intel north bridge package IC, connector plug to SWCof ICT360AT directly. I.e. 100% HP pad compatible.

Convert TAJ to HPJ: CASE 2

HPJ TAJ (HPJ fixture wiring application on ICT360AT.

Board pasted with IC package such as Intel North bridge.

Drilling 3rd hole for TA pad application and pull HP pad downthen replace TAJ pad up. Then

i. Pin+ / Pin- connect to Decoder Card of ICT360AT.ii. Connect 3rd pin(Sync pin) connector to Switch Card of

360AT.

Convert HPJ to TAJ: CASE3

TAJ HPJ (TAJ fixture wiring application on HPJ fixture.

• Replace TAJ pad to HPJ pad.

• Connect TAJ pad Pin+ / Pin- fixture connector of ribbon cable to MUX Card connector.

• Leave 3rd Pin connector open circuit.

Test Programming PreparationThe preparation for fixture making

1. CAD file or Gerber file of DUT2. BOM of DUT3. Bare board and assembled board

(For high precision or multi-layer board, CAD file is recommend)

Check list for fixture making 1. The probe for ECJ test should be Spherical type with long stroke and low

spring force, the location of the probe should be precise.2. The pitch of probe tube and the connection of the array-pin for TAJ test

should be correct and can easily convert to HPJ test.

Test programming preparation

1. DUT: 1 bare board, 20 assembled boards. 2. Pins diagram of fixture3. BOM of DUT 4. DUT circuit diagram(Option) 5. The files at right should be provided by fixture maker.

*. DAT *.ICN *.ICP FORMAT.ASC NAILS.ASC NETS.ASC PARTS.ASC PINS.ASC

EC Jet

On board electrolytic capacitor polarity and

missing parts inspection.

ECPD Technology( Electrolytic Capacitor Polarity Discriminating Technology .)

The challenges on production line.

Traditional ICT test systems.

1. Very low Electrolytic Capacitor polarity discriminating rate(30%-50%) .

2. Unable to find out the capacitor miss part during the test.

Missing Parts.

Wrong Orientation.

Challenge on production line.

Inspecting by human eyes not only

waste of time and money but also un-

reliable as well.

Traditional ICT Electrolytic Capacitor discriminate method.

Traditional ICT Electrolytic Capacitor discriminate method.

2 Terminals Leakage Current detect Method.

2 Terminals Leakage Current detect Method.

3 Terminals impedance

detect method.

3 Terminals impedance

detect method.

HP TestJetInduce method.

HP TestJetInduce method.

+M

~

Z-Z++

I+

+

I-

+

Characteristics of EC Jet.

For EC Polarity Discriminating Rate = 100%.

Explosion free EC Polarity Discriminating rate = 100%.

Ultra High Speed, on board 50 Capacitors Test time < 2 sec.

Parallel EC missing part detective ability.

EC Jet know how.

~

Signal source Response Signal

BLACK

BOX

Un-know network analysis model.

~

M

T(time)

V source

T(time)

VResponse

FFTDFT

Principle of EC Jet technology.

DSP

Pattern Match

~

M

F(freq.)

V

F(freq.)

VDUT

STD

Digital Signal Processing.

T(time)

V Source

T(time)

VResponse

Principle of EC Jet capacitor miss detection.

DSP

Pattern Match

~

M F(freq.)

V STD

DUT

F(freq.)

V

n

n

CnCt1

Why parallel capacitors missing parts can not be found?

Tolerance of electrolytic capacitance = -20% ~ +50%

Vcc

C1 C2 C3 C4 Cn? ? ? nn CC ?

Test limitations of EC Jet.

Temperature.

Parallel Capacitor

Explosion free capacitor

DUT with normal temperature between 0° ~ 55°C , failure rate = 0, 100% able to test.DUT with temp > 80°C , failure rate : about 20%

DUT with temp >60°C , failure rate : less than 5%

Huge value of capacitor affect the testing time (15-20ms /PCS), due to sampling time is a little longer.

Explosion free capacitor needs long testing time.

Due to the polarity characteristics of explosion free capacitor is not so clear as normal capacitor.

Testing time as long as 200 ms/ pcs.

Benefits of EC Jet.

Use old ICT: JET300 TR518.

Use EC Jet.

Instead of human Eyes Inspection.

Getting higher quality.

Use EC TestJet

Save 2 ~ 3 Operators.

Less Effort.Less Effort.

Higher Quality.Higher Quality.

TA JetApply the theory of electrostatic

strength measurement to detect the solder joint’s open / contacted BGA

pins up to 100%.

What’s the difference between TA Jet & HP TestJet?

TA Jet HP TestJet

TheoryElectrostatic

measurement.Capacitor coupling.

Signal Processing. Through SW CARD Through MUX CARD.

No. of Test Terminals.

3 2

Sensing signal ratio of contacted/open. 20~30 times， High. 10~15times， Low.

Test Frequency.2K~10K automatic

adjustable.Only one frequency at

10KHz.

Cost USD3,000- USD10,000-

MUX Card cost. No USD100/ board.

Sensor pad price. USD35/set USD35-85/set.

Know how(I)

MUX CARD

M

(Current Pre. AMP.)

SWITCH CARD

M

(Synchronous Detector AMP.)

HP TestJet

TA Jet

Know how(II)

HP TestJet

TA Jet εElectrostatic

strength. (V/m)

Measuring the capacitance between bonding line and HP sensor

pad. (fF)

Solder joints Contacted / Open sense level.

TA Jet testing ability is over 20 times of HP Test Jet.

SMD coverage rate.

FQFP, SOJ, SOP, PLCC

HP TestJet test results : good.

TA Jet test results : excellent.

BGA coverage rate.

HP TestJet

TA Jet

A

A

ε

ε Coverage rate up to

100%.

Unstable to test under 100fF level.

Normal IC

BGA

Intel 845(North Bridge) coverage rate.

HP TestJet about 10%

level.

Ad

d

ε

TA Jet coverage rate up to 100%.

r

SWITCH CARD

M DSP

Intel 845(North Bridge) Coverage Rate.

Intel 845(North Bridge) coverage rate.

TA Jet

SWITCH CARD

M DSP

V

F

Contacted

BGA845

NoiseOKopen

SMD

fs

SCSI / PCI SMD Connector.

HP TestJet

TA Jet

Benefits of TA Jet

• Up to 100% BGA pins of solder joint’s Contacted/ Open inspection.

• Up to 100% Intel 845 BGA pins of solder joint’s Contacted/Open inspection.

• Up to 100% SCSI / PCI SMD connector solder joint’s Contacted/Open inspection.

• Make sure where the true BGA failures are.

Parallel pins.

If circuit impedance small than 10ohms, the stimulus signal can not apply to almost a short circuit.

Logically BGA parallel pins are same circuit, we can not discriminate if one of them is open circuit.

Circuit impedance.

BGA relative components.

If the BGA relative component in O/S, missing part, wrong part fail, it may affect the test value of BGA.

Limitations of BGA Open/contacted test.