Preparation of Mock tile MCPs

01042011

Anil Mane, Qing Peng, Jeffrey ElamArgonne National Laboratory

Objective:

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•To prepare 8 workable MCPs for mock tile assembly•Collect within batch MCPs resistance data for resistive coating ALD process •Collect batch-to-batch MCPs resistance data for resistive coating ALD process

Experimental:

• Used 2 batch of 5 MCPs with NiCr electrode• Passivation (53A)• Resistive coating chemistry-2 (~800A)• SEE coating (53A)

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NiCr deposition at Fermi lab:

NiCr electrode on 1st batch of 5 MCPs

MCP# 125 126 127 128 129

•One of the MCP holder has electrode exposure dimension issue

NiCr electrode on 2nd batch of 5 MCPs

MCP# 130 131 132 133 134

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MCPs placement prior to ALD in substrate loading tray

MCP with NiCr electrode Before ALD

After ALD

MCP# 125 126 127 128 129

•Uniform deposition on monitors (quartz and Si(100)) as well as on all MCPs

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ALD coating thickness across the reactor

•Thickness uniformity on monitor Si(100) <2%• The resistive layer thickness ~800A• Similar thickness trend observed on second batch of 5 MCPs Excellent batch-to-batch reproducibility

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I-V(-10V to +10V) Response in air for 10 MCPs

•Linear I-V response for all MCPs•MCP 131 resistance is out of targeted value (Outlier)•Little scatter in I-V plot

Removed MCP 131 data

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I-V(-100V to +100V) Response in vacuum (4e-3mbar) for 10 MCPs

•Linear I-V response for all MCPs•MCP 131 resistance is out of targeted value•Little scatter in I-V plot

Removed MCP 131 data

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I-V Comparison (air vs. vacuum) 9 MCPs

•Linear I-V response for all MCPs•Very little change in I-V values•Little scatter in I-V plot

•Electrical contact cause by electrode underneath?•Related to end spoiling ?•ALD chemistry composition across the reactor? •Electrode area ?

I-V in Air I-V in Vacuum (4e-3mbar)

-10V to +10V -100V to +100V

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Resistance Comparison for 9 MCPs (air vs. vacuum)

•Very little change in average resistance ( air 111 M vs. vacuum 115 M) •Average resistance in vacuum = 115 ±12 M ~10% resistance variation

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Resistance for 10 MCPs

What's wrong with MCP# 131?

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Resistance for 10 MCPs

Cause for outlier (MCP131): •

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Resistance for 10 MCPs

Cause for outlier (MCP131): •

•Gap in triple points can cause electrode penetration and cause localize low resistance regimes

Will affect greatly on 8”x8” MCPNeed minimum(?) defects on MCPs

Summary

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Prepared 10 MCPs with ALD resistive layer chemistry-2 and SEE (Al2O3) layer

•Excellent resistive layer uniformity across the ALD reactor

•Within batch good ALD layer reproducibility

•Very good batch-to-batch reproducible of ALD process

All MCPs shows linear I-V response

•Very little change in resistance of MCPs (Air vs. Vacuum)

•Average resistance for MCP = 115M

Big gap @ triple point are responsible for outliers

NiCr electrode deposition need same dimension MCP holders

•Will vary the total # of active pores (resistances)

Next plan for Mock tile:

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Selected 8 MCPs Gain test in APS test set-up

George and grid (A, B, & C) spacer resistance tuning

Resistance test on stack of [MCPs, George and & spacer (A, B, & C ) on Mock tile

Gain test at UCB (Prof. Ossy’s Lab)