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Princeton Optronics
Overview
VCSELs for Time-of-Flight Application
Company Overview
• Founded in 1993
• Technology- VCSELs and VCSEL Arrays for High Power Applications
• Supplying highest performance VCSELs in the world
– Highest efficiency over temperature
– High volume manufacturing capability
– Manufacturing VCSELs for > 15 years
– Strong intellectual property position
• Substantial investment in R&D & manufacturing: Full Fab Capability
• Application Focus
– 3D Illumination (TOF)
– Proximity Sensing
– Surveillance Illumination
– Military Illuminators
3
VCSEL Technology
Active layer
(gain region)
Substrate
Light output from waveguide
(elliptical beam)
N-Contact
Special facet
coating
P-Contact
Light output
(circular beam)
P-DBR
Oxide
aperture
N-DBR
Dir
ec
tio
n o
f e
pit
ax
ial
gro
wth
(a) VCSEL (b) Edge-emitter
Comparison between edge-emitters & VCSELs
• Basic VCSEL structure: single-wavelength cavity sandwiched between two high reflecting
mirrors (DBRs)
• Narrow line width and low temperature dependence is because of DBR mirrors controlling the
wavelength
• No COD failure because there is no deposited mirror; also because of low gain, there is no
filamentation failure- therefore their reliability is extremely high
Advantages of VCSELs in TOF
Applications
• Fast rise/fall time – Sub nanosecond pulsing
• High operating temperature vs. LED and edge-emitting illuminators
• Very high reliability of VCSELs ( >100 years for operation at 70°C)
• Tighter spectral linewidth resulting in a narrow band filter for improved signal-to-noise
• Lower temperature dependence of the wavelength for better wavelength stability
• Circular beam profile and no astigmatic effect
• Narrow divergence with the option of higher angles via diffusers
• Does not need hermetic sealed TO packaging – Easier manufacturing requirements
Princeton Optronics’
VCSEL Technology and Manufacturing
• Efficiency: > 40%
• Small form factor – Low height profile for consumer applications
• Offering VCSELs from 20mW to 100W for commercial applications
• Offering 500mW, 2W, 4W and 8W in surface mountable packaging
• High volume capacity – Internal fab site in addition to high volume partners
• Ability to add capacity in a controlled manner
