product / process change notification - avnet · product / process change notification n°...

Product / ProcessChange Notification

N° 2013-078-A

2014-01-07 of 4

Dear Customer,

Please find attached our INFINEON Technologies PCN:

Implementation of Copper wire bonding and Halogen-free1) mold compoundfor products assembled in lead-free package PG-SOT223 & SOT89

Important information for your attention:

Please respond to this PCN by indicating your decision on the approval form,sign it and return to your sales partner before 07.02.2014.

Infineon aligns with the widely-recognized JEDEC STANDARD “JESD46-C“,which stipulates: “Lack of acknowledgement of the PCN within 30 daysconstitutes acceptance of the change.“

Your prompt reply will help Infineon Technologies to assure a smooth andwell executed transition. If Infineon does not hear from your side by the due date, we will assume your fullacceptance to this proposed change and its implementation.

This PCN includes a Product Discontinuation. Kindly refer to attachment 1_cip13078_a.

Your attention and response to this matter is highly appreciated.

Disclaimer:If we do not receive any response by the date in the PCN above we consider this as the acceptance of the PCN.After the last order date as stated herein, purchase orders related to the unchanged product(s) cannot beaccepted.


N° 2013-078-A

2014-01-07 of 4

SUBJECT OF CHANGE: Implementation of Copper wire bonding

Implementation of halogen-free1)

mold compound

PRODUCTS AFFECTED: Products assembled in lead free package PG-SOT223 & SOT89, as

listed per attachment 1_cip13078_a.

REASON OF CHANGE: Implementation of Copper wire bonding process improves the quality

and reliability of Infineon products and ensures market competiveness.

Halogen-free1)

mold compound material does cope with the increasing

requirements from customers for environment-friendly products

according the WEEE directive.

1)Note:

Halogen-free according to International Electrotechnical Commission

(IEC) Standard IEC 61249-2-21:

- 900 ppm maximum Chlorine

- 900 ppm maximum Bromine

- 1500 ppm maximum total Halogens


N° 2013-078-A

2014-01-07 of 4

DESCRIPTION OF CHANGE: OLD NEW

Mold compound Halogen containing moldcompound

Halogen-free1)

mold compound

Wire bonding material Au wire Cu wire

Marking on deviceDevice Marking for SOT223:

____________________________

Device Marking for SOT89:

Device Marking for SOT223:- “H” in front of Date Code

___________________________

Device Marking for SOT89:- No Change

Product barcode label Pb free logo Pb free and halogen-free logo

PRODUCT IDENTIFICATION: External traceability

A) Sales code

“E” in sales code will be substituted by “H” (see 1_cip13078_a)

B) SP numbers (ordering code)

Introduction of new SP numbers (see 1_cip13078_a)

Internal traceability

Ensured via Bau number, lot number and date code marking.

TIME SCHEDULE:

Final qualification report: See attachment 2_cip13078_a

First samples available: Lead types available.All other types on request with a lead time of 6 weeks from customersample order till PCN sample delivery

Start of delivery: From April 2014 onwards

Earlier customer deliveries on special customer agreement possible.

Last order date of unchanged product: 30-06-2014

Last delivery date of unchangedproduct:

30-12-2014


N° 2013-078-A

2014-01-07 of 4

ASSESSMENT: Product data sheet values and package dimensions remain

unchanged

Product reliability meets the high quality standards, verified by full

product qualification on defined test vehicles

Advantages of Cu wire against Au wire concerning quality and

reliability see 3_cip30178_a

DOCUMENTATION: 1_cip13078_a Affected product list including

a. Details in changes

b. Product discontinuation & new ordering codes

2_cip13078_a Final Qualification Report

3_cip13078_a Customer information package:

Additional information on Cu wiring

Type Sales Name SP number Package Sales Name SP number Package

AF TRANSISTOR (T) BCP 49 E6327 SP000010685 PG-SOT223 BCP 49 H6327 SP000747598 PG-SOT223




AF TRANSISTOR (T) BCP 51-16 E6327 SP000010694 PG-SOT223 BCP 51-16 H6327 SP000748090 PG-SOT223














AF TRANSISTOR (T) BDP 947 E6327 SP000010931 PG-SOT223 BDP 947 H6327 SP000748376 PG-SOT223







DISCONTINUED NEW (REPLACEMENT)

PRODUCT DISCONTINUATION

Last order date: 30.06.2014Last delivery date: 30.12.2014

AF TRANSISTOR (T) BFN 38 E6327 SP000011006 PG-SOT223 BFN 38 H6327 SP000748530 PG-SOT223


AF TRANSISTOR (T) BSP 50 E6327 SP000011126 PG-SOT223 BSP 50 H6327 SP000748534 PG-SOT223






AF TRANSISTOR (T) PZTA 14 E6327 SP000010688 PG-SOT223 PZTA 14 H6327 SP000749566 PG-SOT223

AF TRANSISTOR (T) PZTA 42 E6327 SP000014780 PG-SOT223 PZTA 42 H6327 SP000749568 PG-SOT223

AF DIODE (Q) BAW 78D E6327 SP000010370 PG-SOT89 BAW 78D H6327 SP001125530 PG-SOT89

AF DIODE (Q) BAW 79D E6327 SP000014594 PG-SOT89 BAW 79D H6327 SP001125532 PG-SOT89

AF TRANSISTOR (T) BCV 28 E6327 SP000010879 PG-SOT89 BCV 28 H6327 SP001125534 PG-SOT89




AF TRANSISTOR (T) BCX 51 E6327 SP000014826 PG-SOT89 BCX 51 H6327 SP001125334 PG-SOT89

AF TRANSISTOR (T) BCX 51-16 E6327 SP000014827 PG-SOT89 BCX 51-16 H6327 SP001125336 PG-SOT89


























RF BIP TRANSISTOR (D) BFQ 19S E6327 SP000011042 PG-SOT89 BFQ 19S H6327 SP001125294 PG-SOT89

RF BIP TRANSISTOR (D) BFQ 19S E6359 SP000011043 PG-SOT89 BFQ 19S H6359 SP001125296 PG-SOT89

Date: 2013-12-20

BCP 54-16 Smallest chip in PG-SOT223 BCX 56 Smallest chip in PG-SOT89 for NF-TR technology

PZTA 42 Type with 22µm Cu-wire BFN 19 Type with 22µm Cu-wire

BCP 53-16 Lead type BCX 53-16 Lead type

BDP 948 Biggest chip in PG-SOT223 BCX 68-15 Biggest chip type in PG-SOT89

BFQ 19S HF-TR technology product

Extension of qualification:

Assessment of Q-Results

PZTA 42 BCP 54-16 BCP 53-16 BDP 948 BFQ19S BCX 56 BCX 53-16 BFN19 BCX 68-25

NF-TR / Villach NF-TR / Villach NF-TR / Villach NF-TR / Villach B6HFD3 / RGB NF-TR / Villach NF-TR / Villach NF-TR / Villach NF-TR / Villach

T1125A T1161B T1162A T1142B T1296E T1161B T1162A T1225A T1163A

0.7 x 0.7 0.63 x 0.63 0.8 x 0.8 1.6 x 1.0 0.25 x 0.34 0.63 x 0.63 0.8 x 0.8 0.7 x 0.7 1.0 x 1.0

Halogen-free moldcompound









PG-SOT223 PG-SOT223 PG-SOT223 PG-SOT223 PG-SOT223 SOT89 SOT89 SOT89 SOT89

22µm Cu 43µm Cu 43µm Cu 43µm Cu17,5 µm AUno change

43µm Cu 43µm Cu 22µm Cu 43µm Cu

Test description Abbr. Condition Readout Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot Result: 1 lot

External Visual

JESD22 B-101EV - all all all all all all all all

Pre-conditioning

J-STD22 A-113PC

moisture soak :T= 85°C/ 85% RH; 168h

soldering: reflow 3 x 260°C-

Level 1 / 260°C0 / 240

Level 1 / 260°C0 / 240

Level 1 / 260°C0 / 240

Level 1 / 260°C0 / 240

Level 1 / 260°C0 / 240

Level 1 / 260°C0 / 240

Level 1 / 260°C0 / 240

Level 1 / 260°C0 / 240

Level 1 / 260°C0 / 240

Parametric Verification PV Ta = -55/+25/+150°C - 0 / 30 0 / 30 0 / 30 0 / 30 0 / 30 0 / 30 0 / 30 0 / 30 0 / 30

High temperature

storageHTS Ta=175°C, t=1000h

0 h168 h500 h

0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60

Reason for choosing following SOT223 test vehicles:

Final Qualification Report

PCN N° 2013-078-AImplementation of Copper wire bonding and Halogen-free mold compound for

products assembled in lead-free package PG-SOT223 & PG-SOT89

Reason for choosing following SOT89 test vehicles:

This qualification covers the change from Au to Cu wire and the change from halogen containing to halogen-free mold compound.

All qualifications passed with positive results.

Reference Products

Wafer Technology/ Location

Chip sizes [mm2]

Mold compound

Package type

Wire material

Chip type

storageHTS Ta=175°C, t=1000h

500 h1000 h

0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60

High Temperature

Reverse Bias

JESD22 A-108

HTRB Ta = 150 C , VR=VRmax, t=1000h

0 h168 h500 h

1000 h

0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60

Intermittent Operational Life

MIL-STD-750 Method 1037IOL

PrecondCycle time: 2 min

Tj=175°C

0 h168 h500 h

1000 h

0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60

Temperature Cycling

JESD22 A-104TC

PrecondTa=-55°C to 150°C, 1000 cycles

30' per cycle

0x300x500x

1000x

0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60

Autoclave

JESD22 A-102AC

PrecondTa=121°C / r.h.=100% / p=2,1 bar

0 h96 h

0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60

High Humidity

High Temp. Bias

JESD22 A-101

H3TRBPrecond

Ta=85°C, r.h.=85%, VR=Vrmaxt=1000h

0 h168 h500 h

1000 h

0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60 0 / 60

Physical Dimension

JESD B-100PD -

Resistance to Solder Heat

JESD B-106RTSH

Solder bath Ts=260°C,dip 3 x 10 sec

- 0 / 30 0 / 30 0 / 30 0 / 30 n.a. n.a. n.a. n.a. n.a.

Solderability

J-STD-002SD - -

Wire Bond Strength

MIL-STD-750 Method 2037WBS - -

Bond shear

AEC-Q101-003BS - -

Sitch pull SP -

Die shear

MIL-STD-750 Method 2017DS - -

Note: AEC Q101 asks for 3x77 pcs (in total 231pcs for each reliability test) at least from 3 different lots. Infineon’s testboards have a size of 60pcs / per board. Based on this boundary condition we decided to test ≥ 4 lots (for each package) à 60pcs (in total 240pcs) which is compliant to the Q101 requirements.

SOT2230 / 30

SOT2230 / 30

SOT890 / 30

SOT2230 / 30

SOT2230 / 30

SOT2230 / 30

SOT2230 / 30

SOT890 / 30

SOT890 / 30

SOT890 / 30

SOT890 / 30

SOT890 / 30

1 / 1

Customer Information Package

3_cip13078_a

PCN 2013-078-A

Implementation of Copper wire bonding and Halogen-free moldcompound for products assembled in lead-free package PG-SOT223& SOT89

Copyright © Infineon Technologies 2013. All rights reserved.For internal use only2014/1/7

Table of contents

Introduction

Motivation

Package portfolio and affected packages

Qualification status & PCN Issuance Timeline

Bill of Material (B.O.M) Changes for Qualification

Copyright © Infineon Technologies 2013. All rights reserved.For internal use only

Introduction

2014/1/7

Market trend clearly points to introduction of Copper wiring and Halogen freemold compound

Positive qualification results with Copper wiring were generated for the alreadyissued PCN’s- PCN 2008-187-A SC79 / SCD80 - All- PCN 2009-122-A SOT3x3 - All- PCN 2012-133-A SOT223 - Small Signal MOSFET- PCN 2012-134-A SOT89 - Small Signal MOSFET- PCN 2010-181-A SOT23 - Small Signal MOSFET

Infineon has already successfully implemented both Copper wiring and Halogenfree mold compound at Wuxi since 2010 and proved robust and reliableproduction capability on SCD80, SC79 & SOT3x3 packages.

As part of the proliferation strategy, the aim is to implement Copper wiring andHalogen free mold compound for further leaded packages at Wuxi.

Copyright © Infineon Technologies 2013. All rights reserved.For internal use only2014/1/7

Infineon Package Technology PortfolioAffected packages

Page 4

SMD leaded SC79 SCD80 SOT3x3 SOT223 SOT89 SOT23 SOD323 SC74 SOT143 TSFP TSSFP TSSOP10 TSOP6

Leadless TSLP

Wafer level WLP

DiscretesPower Sensors

Through Hole

TO, DIPSMD TO DSO SSOP

Leadless CanPAK SON QFN

SIP LowPower IDCSIP Medi.Power CIPOS

Through Hole

PSSOSMD LeadedDSOSCTSOP

OpencavityDSOF

High Power

PowerModules Easy 62mm Econo EconoPACK+ PrimePACK IHM IHV HybridPACK

Mold on LF P-MCCx MoldP-Mx.xChip on Flex UV GlobetopT-Mx.xPRELAM

PPxx

Flip Chip S-MFCx.x

Wafer Bumped Diced

Chip CardLeadframe

basedPackages

Wafer LevelPackages,Bare Die

SurfaceMountTechnology(SMD)

Without re-distribution WLP (fan-in)

Wafer levelw/redistribution

WLB (fan-in)

eWLB(fan-out)

Bare DieWirebondFlip chip

Through Hole

DIP 2)SMD PLCC 2) TSSOP TQFP,LQFP, MQFPLeadless VQFN O-LQFN 1)

1) for specialities only 2) phase-out

PowerIC

Laminatebased

Packages

SMD OCCN 1) BGA LBGA xFBGA,xFSGA

Flip chipFCxBGAxF2BGA,xF2SGA

Affected packages


Overview - Wuxi Copper Wire Experience

Discretes

SMD leaded SCD80 SC79 SOT3x3 SOT223 SOT89 SOT23 SOD323 SC74 SOT143 SC74 TSFP TSSFP TSSOP10 TSOP6

Leadless TSLP

Wafer level WLP

Packages Cu wireprod year

Volume shipped out(to date Nov/2013)

Affected product line (PL)

SCD80 2010 >1,700mils Tuner diode & RF diode, Schottky diode (Cu wire production)

SC79 2010 >500 mils Tuner diode & RF diode, Schottky diode (Cu wire production)

SOT3x3 2011 >2,500 mils Small Signal MOSFet (Cu wire production)Transistor and Diodes (Cu wire production)

SOT223 20132013

>10 mils Small Signal MOSFET (Cu wire production)AF Transistor (PCN distribution: Jan 2014)

SOT89 20132013

>1 mil Small Signal MOSFET (Cu wire production)AF Transistor (PCN distribution: Jan 2014)

SOT23 20122014

>600 mils Small Signal MOSFet (Cu wire production)AF Diode, AF Digital Transistor, & RF (Under qualification)

Current Wuxi Cu wire production covers numerous customers in allapplications such as Automotive, Industrial, Mobile & Consumer

2014/1/7


Motivation – Copper Wire Bonding

2014/1/7

Advantages of Copper wire compared to Gold wire:

Higher electrical conductivity and thermal conductance.

Extended stability of bond-pad connections over time.

Higher current-carrying capacity.

Lower cost material

Less intermetallic phase growth over temperature.



2014/1/7

Higher electrical conductivity and thermal conductance



2014/1/7

Extended stability of bond-pad connections over time

intermetallic compoundlimits Au on Alconnection lifetime

stable electricalresistance of bond padconnection enhancesconstant long termperformance of devices



2014/1/7

Higher current-carrying capacity


Risk Management and Technology Options

2014/1/7

Minimized risk by Methodology

Quality, reliability, electrical performance and package dimensions of theproducts will be the same as for existing products.

Automotive Standard AEC-Q100 / Q101 is used as qualification guideline ondefined reference products for each package assembly line

Technology Options

Former standard Gold (Au) wiring & Halogen (Hal) mold compounds change to

Halogen free mold compound for environmental reasons

Copper (Cu) wiring for long-term competiveness


Bill of Material (B.O.M) Changes for Qualification

2014/1/7

Package ChangesMaterial / Platformchange

Old B.O.M (Existing)New B.O.M(for Qualification)

SOT223 &SOT89

Cu wire + Halogen Free MoldCompound

Wire

Au : 22 um 38 um 50 um

Cu : 22 um 43 um 43 um

Mould compound Black compound : Green compound :

Product / Process Change Notification

CUSTOMER APPROVAL FORM N° 2013-078X-A

Implementation of Copper wire bonding and Halogen-free1) mold compound for products assembled in lead-free package PG-SOT223 & PG-SOT89

Please list product(s) affected in your application(s):

Please check the appropriate box below: We agree with this proposed change and its schedule.

We have objections:

We need more information:

We need samples:

Sender Company: Name: Address/Location :

E-Mail:

Telefon: Fax:

Signature Date:

Please return to : your Sales partner Company: Infineon Name:

Address/Location :

E-mail:

Telefon: Fax:

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