prof. fritz j. neff l m h s - hs-karlsruhe.denefr0001/ensmmlessonsfjn/engl... · 2008. 12. 3. ·...

Micro mechatronics 1

part 1: introduction

Prof. Fritz J. NeffDirector of the Laboratory forMicro mechatronics and Hybrid integrated thick film circuitSat the University of AppliedSciences Karlsruhe (FH)Germany, 1.12.2008

Prof.Fritz J. Neff, Steinbeis TZ Mechatronik Karlsruhe 2

contentMicro mechatronics = Micro systems technology = MEMS SubstratesPastesScreen printing technology for line widths >100µmSurface mount technologyBonding technologyQuality assurance / quality managementTechnology for micro conductors(line widths < 100 µm)


objectives

Nescessary knowledge formanufacturing of thick film hybrid integrated circuits and micro systems

Practical trainee in clean room for the use of all instruments and machines of the LMHSAbility to manufacture hybrid integrated micromechatronic systems


Your experiences and interests

experiences: none!?

interests:very interested!? ☺

therefore:some examples! !☺!


Application of micromechatronic systems

Chemical analysiscarsAirplanes and space shuttlesTool machinesHouse technics

MedicintechnicsMedio ambienteBio technicsCommunicationtechnics


Objective of micromechatronics technologies


Applicated micro mechatronics


Mechatronics for Aerospace Applications


What is SMART?

Simple to use

Maintenable

Accurate

Reliable

Trainable


Main requirements to micromechatronic systems

Unsensitive against:Changes of temperatureChanges of mechanical stresspollutionElectro magnetic fields

Further on:Smallest dimensionsPossibilities for communication


They contain:Sensoresprocessorsactuators

They are:Elements of macro mechatronic systemsintelligent(partly) autonomous

Characteristics of micromechatronic systems


µ-Elektronik is a homologic technologyµ-mechatronics contains a lot of technologies and materials, therefore it is a non homologic technologyA µ-mechatronic system is a technical product whichhas been manufactured by micro technologiesTolerances very often have the same dimensions likethe mechanical partVery dominant are the surfaces not the volumeforcesIf a monolithic construction is not possible than thehybride integration is requested.

Important characteristics of micro mechatronic systems


Homologicalµ-electronic systems

90% of all wafers are Silizium


None homologicµ-mechatronik

/NEXUS/


Layout of micromecha-tronic

systems

Actuatorarray

Sensor array

actuator

Sensor

amplifieramplifier

AD

AD

AD

AD

AD

AD

D/A converter

A/D converter

Multiplex

RAM ROM µP I/O

data -treatment

InternalBus

ExternalBusinterface


Manufacturing of micromechatronic systems

1. possibilitymonolithic integration (semi conductor)

2. possibilityHybride Integration (thick film)

3. possibilitysurface mount technology


Monolithic IntegrationMicro mechanicalpressure sensorwith signaltreatment on onesingle silicon die

Quelle: Bosch Reutlingen, 2000


Hybride IntegrationPartly autarc

micro mechatronicsystem to detectand treat datas of Air pressure,temperature and Light intensity

Quelle: Neff, LMHS – FH Karlsruhe, 1997


Frommonolithiclayout to the printedcircuitboard

Silicon wafer

Chip

housedIC

HISSSMD-

PCB

Housed circuit

Quelle: Neff, Lernprogramm hybridintegrierteSchichtschaltungen, 1999


Mechatronik as interface forinterdisciplinary cooperation

AktuatorsSensors

MechatronicSystems

Mechanics Electronics

Information technics

Simulation &modelling

Process-algorithms

„Mechatronik is the best possible integration of Mechanics, Electronics and Informatics on one substrate. This includes as well the functional integrationand also the methods in developing and manufacturing.“ (Werner Vogt, BSH)


Macro- and Micro-Mechatronics


• Dish washer• Compact dish

washer• Washing centers

• Micro wave equipment

• Vacuum cleaner

• Damp exhaust • Climatiation equipment• Warm water equipment• Gas heating• Oil radiators

• Electric cooker• Electric backing oven• Glas ceramic-cooking

fields• Elektrokochmulden• Gas cooker• Gas backing oven• Gas cooking fields

• Kühlschränke• Kühl-Gefrier-

Kombinationen• Gefrierschränke• Gefriertruhen• Gewerbliche Kühl-

und Gefriergeräte

• Front loadingWash machins

• Top loader-Wash maschins

• Wash dryer

• Small• Domestic equipment

BSH – Product portfolio


Technologies Technologies fromfrom ExpertsExpertsSTEIN Automation - Partner for modular mounting

concepts

special station

Portal Robot Power screwdriving station

Labeling

test system cell Transportation systemConstrucion ofcontrols

• small risc by Technology leadership• Transparent calculation• short time to market• reliability


ANKA

Mask Making Hot EmbossingResist Lab ElectroplatingLithography

500/5 µm

LIGA Process SequenceForschungszentrum Karlsruhe GmbH Universität Karlsruhe (TH)


Faculté de Construction Mécanique et de Mécatronique

courses•Maschinenbau und Mechatronik M

•Mecatronic and Micro-Mechatronic Systems M•Maschinenbau B

• Fahrzeugtechnologie B

•Mechatronik B

Faculty Mechanical Engineering and Mechatronics


Participation in Formula StudentCompetition Germany and Italy

2007 2008


Reinraum des LMHSProf. Dipl.-Wirtsch. Ing. Fritz J. Neff

Schneiderand

Schneide

rand

Schneiderand

A0-Rahmen

LMHS: Laboratory for Micro-mechatronic Systemsand Hybridintegrated Thick film Circuits

Sch

neid

era

nd

Different Areas/Qualities in the Clean room:

Grey area: change clothes, reparation of SMT with solder paste dispensing, Pick and Place Unit and Vapor phase soldering

Rotation lock: surface cleaning for personal and material

White area: Class 7 acc to DIN EN ISO 14644-1 bzw. Klasse 10.000 nach FedStd.209D.

for screen masking, Lithography, screen printing, thermal processes: Drying (ca. 80°C), glue hardening(120°C – 180°C), fireing after screen print (max 850°C), Clean room test:Number of articles, over pressure (min 11 Pa – max 35 Pa), Temperature (ca. 20°C), rel. humidity (ca. 45% - 50%) Air flow intensity and direction, Recovery test, noise pressure level (max 70dB(A)),Light intensity (500 - 1100 lux)Clean room monitoring:Monitoring each 10 minutes: number of particles,

over pressure, rel. humidity, temperature

Class 6 acc to DIN EN ISO 14644-1bzw. Klasse 1000 nach FedStd.209D.

für wire bonding (100µm – 200µm Drahtdurchmesser), Flip-Chip-Bonding, Micro assembly

Class 5 acc to DIN EN ISO 14644-1bzw. Klasse 100 nach FedStd.209D

für wire bonding (25µm Drahtdurchmesser),Die-Bonding, Wedge-Wedge-Bonding, Ball-Wedge-Bonding, Pull & Shear Test

Erstellt am 5.11.2008-fjn

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Ergebnis eines Recoverytests 2007


International Conference of Mechatronic and Micro-Mechatronic

Systems

founded 2000 at HS Karlsruhe each year in september for students and industry

Together with City of Karlsruhe and KIT (Karlsruhe Institute of Technology) in Congress Center Karlsruhe15./16. September 2008Mechatronik-Tage – Workshop at Congress Center KA, HS Karlsruhe and Research Center KS28. April 2009Mechatronik-Tage International Conference and fairat Congress Center Karlsruhe9./10. February 2010

prof. fritz j. neff l m h s - hs-karlsruhe.denefr0001/ensmmlessonsfjn/engl... · 2008. 12. 3. ·...

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