prototype photonic integrated circuit (protopic) platform ... · protopic - 6 dk 03/06/18...
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Prototype Photonic Integrated Circuit (ProtoPIC) Platform
and Applications
Dr. David Kharas
MIT Lincoln Laboratory
6 March 2018
Materials Integration: from Nanoscale to Waferscale
This material is based upon work supported by the Assistant Secretary of Defense for Research and Engineering under Air ForceContract No. FA8721-05-C-0002 and/or FA8702-15-D-0001. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the Assistant Secretary of Defense for Research and Engineering.
Distribution Statement A: Approved for public release: distribution unlimited.
© 2018 Massachusetts Institute of Technology.
Delivered to the U.S. Government with Unlimited Rights, as defined in DFARS Part 252.227-7013 or 7014 (Feb 2014). Notwithstanding any copyright notice, U.S. Government rights in this work are defined by DFARS 252.227-7013 or DFARS 252.227-7014 as detailed above. Use of this work other than as specifically authorized by the U.S. Government may violate any copyrights that exist in this work.
ProtoPIC - 2DK 03/06/18
• Motivation
• Integrated Photonics Platforms at Lincoln Laboratory
• Hybrid Integration and ProtoPIC
• Applications
Outline
ProtoPIC - 3DK 03/06/18
Photonic Integration in the Commercial Space
• Photonic integrated circuits (PICs) enable manipulation of light on a chip
– Commercial driver: Internet/Telecom
– Silicon photonics incorporate on-chip modulators and photodetectors, but no native light sources!
– Challenge: Hybrid integration of III-V lasers
• Light enables higher data speeds with less power consumption
Discrete Optical Components Chip-Scale Integration
ProtoPIC - 4DK 03/06/18
Photonic Integration in Other Domains
Electronic-PhotonicIntegration Technology
Inertial Sensors
Microwave Systems Laser Radar
Optical Imaging
Quantum Information
Free-Space Lasercom
High-Energy LasersChem/Bio Sensors
ProtoPIC - 5DK 03/06/18
Photonic Integration in Other Domains
Electronic-PhotonicIntegration Technology
Inertial Sensors
Microwave Systems Laser Radar
Optical Imaging
Quantum Information
Free-Space Lasercom
High-Energy LasersChem/Bio Sensors
ProtoPIC - 6DK 03/06/18
Electronic-Photonic Integration Development Resourcesat Lincoln Laboratory
• InP, GaAs, GaN, Diamond • Optoelectronic Components• Emitter and Detector Arrays• III-V Photonic Integration
• 200 mm Silicon Fab Toolset• 90 nm CMOS and Silicon and Nitride Photonics• Wafer-Scale 3D Integration• Multi-Project Runs
• Precision Flip-Chip Packaging• Laser-Welded Fiber Pigtailing• Reliability and Lifetime Testing• Heterogeneous Hybrid Integration
InP Laser Wafer50 mm Diameter
Silicon PIC Wafer200 mm Diameter
Microelectronics Laboratory
III-V Fabrication Cleanroom
Back-end Processing Cleanroom
Electronic-Photonic Packaging
Materials Growth (III-V, Diamond)
Trusted Foundry
ProtoPIC - 7DK 03/06/18
Photonic Components at Lincoln Laboratory
Compound Semiconductor (III-V) Photonic Integration
Silicon and Silicon Nitride Photonic Integration
III-V to Si Hybrid Integrationand Electronic-Photonic Integration
Gratings
ModulatorsLasers and Optical
Amplifiers
Si Photonics+ CMOS
III-V Laser+ CMOS Driver
Hybrid Si/III-VWafer Bonding
Waveguides and Optical Filters
Photodiodes and Modulators
Photodiodes
Monolithic III-V PICs
Materials: InP, GaAs, GaN, Diamond
Multi-ProjectFab Runs
Optomechanics(MEMS + NEMS)
Materials: Si, SiNx, Al203, Ge
200 mm
SiN Photonics+ III-V Laser
InPLasers
ProtoPIC - 8DK 03/06/18
Reconfigurable Silicon Nitride (SiNx) Photonic Integrated Circuits (PICs)
Image of SiNx/SiO2-on-Silicon PIC Fiber Pigtailed SiNx PIC on Printed Circuit Interface Board
• Operating wavelength ~1550 nm
• Fabricated using MIT LL’s 200 mm silicon fabrication toolset
• SiNx PIC contains ~80 components:
Adiabatic 3-dB couplers
1-to-N power dividers
Ring resonators
Mach-Zehnder modulators
Thermo-optic phase shifters
15 mm
Reconfigurable Optical Filter Response
ProtoPIC - 9DK 03/06/18
Semiconductor Waveguide Optical Gain Media
Slab
Standard Rib Waveguide
•High gain (30 dB)•Mode propagation in QW layer leads to high loss
and limits power to <100 mW• Small mode 1 × 3 m size complicates optical coupling
Semiconductor Optical Amplifiers (SOA) and Lasers• III-V compound semiconductor p-i-n diode structures that use quantum wells (QW)• Can act as an optical amplifier or an emitter source• Optical mode is confined by a sandwich of lower refractive index materials
Slab-Coupled Optical Waveguide Amplifier (SCOWA)
•Moderate gain (15 dB)•Propagation in slab with low loss – higher power >1 W• Large mode 5 × 5 µm improves coupling tolerance
ProtoPIC - 10DK 03/06/18
Field Demonstration of SCOWA Emitter Technology
Methane-Emission Mapping Demonstration (September 2017)
Integrated 3D Lidar and
Gas SensorPackaged
1.65-μm SCOWA
CH4 Leak Rate = 30 scfh
Lincoln Laboratory SCOWA technology has been flight tested
Methane (CH4) Concentration Map
ProtoPIC - 11DK 03/06/18
Prototype Photonic Integrated Circuit (ProtoPIC)
Goal: Create a platform for hybrid integration of III-V components with SiN photonics
Concept: • Create a SiN PIC with a recess to receive a III-V device• Flip chip (FC) bond III-V die with indium bumps• Vertical alignment with mechanical stops• Fiducials to enable sub-micron lateral alignment
Upper CladSiN WGLower CladBottom Dielectric
Indium Solder Bumps
Silicon Nitride PIC on Silicon
Mechanical Stops
III-V WaveguideDevice
Upper CladInGaAsP WG
Lower Clad
Transverse Mode
ProtoPIC - 12DK 03/06/18
Prototype Photonic Integrated Circuit (ProtoPIC)
Goal: Create a platform for hybrid integration of III-V components with SiN photonics
Concept: • Create a SiN PIC with a recess to receive a III-V device• Flip chip (FC) bond III-V die with indium bumps• Vertical alignment with mechanical stops• Fiducials to enable sub-micron lateral alignment
Upper CladSiN WGLower CladBottom Dielectric
Indium Solder Bumps
Silicon Nitride PIC on Silicon
Mechanical Stops
III-V WaveguideDevice
Flip Devicefor Flip Chip Bonding
ProtoPIC - 13DK 03/06/18
Prototype Photonic Integrated Circuit (ProtoPIC)
Goal: Create a platform for hybrid integration of III-V components with SiN photonics
Concept: • Create a SiN PIC with a recess to receive a III-V device• Flip chip (FC) bond III-V die with indium bumps• Vertical alignment with mechanical stops• Fiducials to enable sub-micron lateral alignment
Upper CladSiN WGLower CladBottom Dielectric
Silicon Nitride PIC on Silicon
Indium Solder Bumps
III-V WaveguideDevice
Flip Devicefor Flip Chip Bonding
ProtoPIC - 14DK 03/06/18
PROTO2SL lot after waveguide and grating etch:
4 waveguides at slot junction waveguides with gratings SEM image of 250nm grating posts
ProtoPIC Hybrid Integration Submount
InP SCOWA Insert Devices
Silicon Nitride PIC on Silicon
Bragg Gratings
SEM Image of Input Facet
ProtoPIC Submount
14InsertSlots
8mm
~1 µm Placement
Lateral Offset (Microns)
Bond Campaign
1
0
-1
-2
-3
-4
ProtoPIC - 15DK 03/06/18
100
101
102
103
104
105
102
103
104
105
106
107
108
109
Proto-PIC
External Cavity Laser
RIO Laser
Fre
qu
en
cy
No
ise
(H
z2/H
z)
Offset Frequency (Hz)
-70
-60
-50
-40
-30
-20
-10
0
1350 1450 1550 1650
dB
Wavelength (nm)
ProtoPIC Hybrid LaserOptical Spectrum
ProtoPIC Hybrid Laser with Narrow Line Width
10 mW
90 mW at 2A Bias
40 kHzLine Width
Hybrid Laser Array (Top View)
Line width on par with commercial laser but with 9 higher power
Line Width Measurement
SiNx PIC
ProtoPIC - 16DK 03/06/18
Photonic Integrated Resonant Accelerometer (PIRA)
250 µm
Modulated
Signal
Output
Laser
Input
Optical Microresonator
(Diameter = 20 μm)
• Integration of mm-scale proof mass + micron-scale tether + silicon photonics
• Present performance is on par with compact commercial accelerometers: Measured ~3 µg/√Hz sensitivity
• Path to <100 ng/√Hz – best compact accelerometer
Output
Coupler
Optical Wavelength
Op
tic
al
Tra
ns
mis
sio
n
𝝀𝟎
Strain
Schematic Transmission-Spectra
of Microresonator
Waveguide
2 mm
Proof Mass
Sensing Tethers
Vibrational Motion
ProtoPIC - 17DK 03/06/18
Non-Mechanical Optical Beam-Steeringfor Compact 3D Lidar Imaging
Integrated Beam-Steering System
Initial Demo of 16-Channel Planar-Lens Element
SwitchingInput Port
Nanolidar for Ultra-Small Platforms
SweepingWavelength
Input PortSets Azimuth
WavelengthSets Elevation
Low-Cost Lidar for Self-Driving Cars
ProtoPIC - 18DK 03/06/18
Future Direction: Trapped Ion Quantum Computing
Dual-cell physical architecture concept
Two-species ion chain
2D ion trap array on multilayer chip
Testing of CMOS electronic control
Ion quantum control with photonics integrated on chip trap
Ion trap with integrated APDs and CMOS
Sr+
Ca+
ProtoPIC - 19DK 03/06/18
Future Direction: Laser Light Sources for Wafer Satellite Propulsion
1 m
Power Conditioning
Phased Array with Uniform Top-Hat
Profile
Optics Array for High Fill Factor
Phase Control
Thermal Management
ProtoPIC Seed Distribution to a Semiconductor Optical Amplifier Array
Light Sail
Wafer Satellite
Star Shot Missionto Alpha Centauri
Propulsion Laser Array
3 cm
ProtoPIC - 20DK 03/06/18
• MIT Lincoln Laboratory has developed a library of photonic component technologies
– SiN and silicon photonics, waveguides, splitters, modulators, thermal tuners, and filter architectures
– III-V SCOWA amplifiers, lasers, photodiodes, modulators
• Recently developed a flexible hybrid integration platform ProtoPIC that can be used to combine a variety of III-V devices with our SiN PICs
– Flip chip III-V attach with ~1 µm placement capability
– Initial applications of the technology have been applied to demonstrate an extended cavity hybrid laser with narrow line width 40 kHz and 90 mW optical power
• The technology is amenable to adoption for a wide variety of applications
Summary