ptw asia & epicrew presents
TRANSCRIPT
PTW Asia & Epicrew PresentsASM EPI Systems Upgrade
( XE2 )
2021
Target Equipment: ASM Epsilon(1 or 2) / E2000(+)
Background Information
Current Tool Design:
• Expensive / Obsolete OEM parts• Throughput & Particle performance cannot be improved• Software Limitations
• Lack of Process Control• Eg: No real-time monitoring through FDC
• Hardware Limitations• Does not allow narrow boundary layers (limited growth rate)
To improve upkeep and extend equipment life with
low Cost Of Ownership (COO) by:
1. Replacement to more robust hardware
• New models (non-obsolete)
2. Replacement of controller with new software• New features
3. Achieve better Process performance• Throughput• Particle
Our Upgrade Focus
XE2 Upgrade Items Summary
• New WHC (Transfer chamber) design• New Robot selection: JEL (CE Approved)• New Wafer blade design• New slit valve selection: VTEX (Japanese)• New Single cooldown station inside WHC• New Rotation modification• Improved Process kit design• New Controller with software• New Software screen design and function• Eliminated Foxboro and manage in software• SMIF control design for CHAD model• SECS communication function• WHC auto leak check function
XE2 Upgrade
*Finished first customer evaluation in Japan
XE2
Throughput Improvement
Throughput Improvement - CoolDown (CD) Station
ASM & XE2 Comparison – Wafer Cooling
Throughput Improvement (CD Station)
Recipe on XE2 System: ~9850 seconds to run 25 wafers (With Cooldown Station)
*Scheduler Information for Every Wafer Etch
25/10/2020 16:54 Information Job Scheduler.exe Scheduler Lot 'Left Lot #1' Started
25/10/2020 19:38 Information Recipe Scheduler.exe Scheduler Wafer completed SLOT recipe (CYCLE TEST STD) completed for Cassette 1/Slot 26 at wand
About 6% Improvement with Cooldown Station
Recipe on ASM System: ~10450 seconds to run 25 wafers
Quality Improvement
Quality Improvement - Backside Handling for Particle Reduction
Backside Wafer Handling◆ Cost reduction for
eliminate N2 Gas◆ Reduce particle
Side View: XE2 Wand (Backside Handling)
Wafer
Wand
<- N2
Wafer
Wand
Side View: ASM Bernoulli Wand (Frontside Handling)
ASM Bernoulli Wand
Damaged N2 Holes
Designs with Particle Reduction Focus
New type Gate Valve ◆ Reduce particle◆ Roll cam L-motion
Cooldown Station◆ Low particle impact from LLC
Bellows due to high positioning during cool down
Particle Performance Improvement<Particle Test>Tool Model : SP1Spec : ≦30 (≧0.2µm)
Result :1st wafer : 02nd wafer : 13rd wafer : 04th wafer : 2
<Slip>Tool Model : SP1Spec : ≦1000 line, length≦10,000mm
Particle count on old system at other customer site: ~20-30 counts.
Particle Performance: ~90% Improvement!
New Controller
New Controller Upgrade
Before AfterVS
1. EPIC controller is confirmed by OEM2. Replacement for the obsoleted Gespac-based legacy control system for the ASM Epsilon E2000 & E2000plus (E3200 is possible with additional development)3. Able to replace from Gespaccontroller space (No need for additional space)
Gespac-Based EPIC Controller
Software UpgradeNew Added Features◆ EPIC eliminates the use of Foxboro cards◆ Direct TC input◆ Drives the E2000 SCR directly◆ Changeable SCR ratio each step in the recipe◆ Easy setting SCR power – Adjustable without adjustment of PCB potentiometer◆ Visible all SCR power on the one screen◆ Easy trouble shooting by defect zone determination◆ I/O charting and plotting – Datalogging and SECSGEM / HSMS◆ Enables Multi-Dep / 1 Etch sequence
Multiple Dep 1 Etch Capability
Scheduler Information for 2 Dep 1 Etch
cassette 1:20) doing step 1 (START) with 1 s duration
cassette 1:20) doing step 2 (HTNLC) with 32 s duration
cassette 1:20) doing step 3 (PREETCH) with 25 s duration
cassette 1:20) doing step 4 (PURGE) with 3 s duration
cassette 1:20) doing step 5 (COOL1) with 12 s duration
cassette 1:20) doing step 6 (COOL2) with 10 s duration
cassette 1:20) doing step 7 (HOMSUS) with 12 s duration
cassette 1:20) doing step 8 (TCHECK) with 100 ms duration
cassette 1:20) doing step 9 (END) with 1 s duration
Etch
Depo
Throughput can be further improved by testing shorter Etch timeNeeds to be co-developed with customer
Upkeep Cost Improvement
Lower Upkeep Costs
No more need for:◆ Foxboro Boards / repair◆CompuMotors Driver repair◆Bernoulli Wand repair
Upkeep Cost Improvement
More Robust and New Parts:◆New WHC design◆ JEL Robot (CE Approved)◆New Rotation Assy design◆New Susceptor design◆New SMART motors
Wafer Handling Chamber (WHC)
SMART Motor – Built-in Driver Susceptor
Rotation Unit
JEL Robot
Thank YouFor Enquiries Please Contact:
Name: Torsten Seifried (Managing Director)
Telephone: +65 90261590
Email: [email protected]
Name: Don Yeoh (S.E.A. Sales Manager)
Telephone: +65 91784446
Email: [email protected]
PTW Asia Pte. Ltd.