qfn die-attached film (daf) to the changes to alternative ......qfn die-attached film (daf) to the...

CONFIDENTIAL

Date: January 21, 2020 Ref. No.: O-HKN-18-00099E

To : MOUSER ELECTRONICS Dear Sir/ Madam:

QFN Die-attached film (DAF) to the Changes to Alternative Materials

We greatly appreciate your continued business. This is to notify our customers of our plan to change wafer fab of our products supplied to you. Full details of the planned change are given in the following page. If you have any questions or inquiry regarding this change, please inform our Sales representatives nearest you as soon as possible. We appreciate your understanding and cooperation. Yours faithfully, Reviewed by H. Kashima Approved by I.Tajima, Manager

Quality Reliability Service Group Oita Office Quality & Reliability Engineering Dept. Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices & Storage Corporation

3500, Matsuoka Oita City OITA 870-0197, JAPAN PHONE: +81-97-524-6093 FACSIMILE: +81-97-524-6287

CONFIDENTIAL

QFN Die-attached film (DAF) to the Changes to Alternative Materials

1. Product to be

Affected :

See Attached file for the list of affected products.

2. Description of Change

: - die-attached film (DAF) Current product: A (Company A) - Replacement: B (Company B)

(See Attached file for details)

3. Reason of Change : End of production of die-attached film (DAF) used in your products We propose to make changes to alternative products with mass production results.

4. Scheduled Date of Change

: With your approval from April 2020 onward

5. Remark

: If you have any questions or requests regarding this change, please inform our Sales representatives nearest you as soon as possible.

CONFIDENTIAL

Notice of Approval (For customer use) Ref. No.: O-HKN-18-00099E

We approve the above change. We approve the above change with the following conditions. We disapprove the above change for the following reasons.

[Specify the conditions/ reasons] Date : Company : Department : Approved by :

© 2019 Toshiba Electronic Devices & Storage Corporation

Die-attached film (DAF) to the Changes to Alternative Materials

＜QFN Package＞

January 21, 2020

Quality Reliability Service Group

Quality & Reliability Engineering Dept.

Toshiba Electronic Devices & Storage Corporation

1© 2019 Toshiba Electronic Devices & Storage Corporation

Change Point

Material/process changes

Evaluation & Result

Schedule

Contents

01

02

03

04

05

Change Overview


01Change Overview


End of production of die-attached film (DAF) used in your products

We propose to make changes to alternative products with mass production results.

1) Change of die-attached film (DAF)

Current product: A (Company A) - Replacement: B (Company B)

2) Target products

LQFP products (see attached product list)

3) Others

There is no product name change. When switching, the

first Weekly Code is I will contact you.

1. Change Overview


02Change Point


Description of change Change Die Attach Film (DAF)

Item Novelty/changes to be verified Changed? Verification result

Man Operator, inspector and maintenance No

MachineManufacturer, specifications (machining

point/transfer/alignment), tooling and software versionNo

MethodProcess(operation) flow, process conditions, inspection

conditions and transfer/incoming & release proceduresNo

Material

Manufacturer, manufacturing method, material

characteristic, storage conditions, floor life in process and

packing

Yes Manufacturer：Ａ→ B

Measurement Measuring instrument, inspection accuracy, test program No

EnvironmentTemp/humidity, particle, ESD, layout, work table and

storage rackNo

Influence on other processes (If there is any influence, analysis of

process in question will be performed.)Yes

Dicing process, mounting process,Mold process

The manufacturer of the die-attached film (DAF) will be changed.

2. Change Point


03Material/process changes

ItemCurrent

manufacturerReplacing manufacturer

● BSG No change

● Die-attached film (DAF) pasting No change

● Wafer mountNo change

＜Die-attached film (DAF) change＞

● Dicing No change

Changed the die-attached film (DAF) used to glue between lower chip frames I will. There are no changes to other parts materials, package designs, processes, etc.

3. Material/process changes

Lower chip

Upper chip

Frame

Die Attach Film (DAF)


04Evaluation & Result


１） Unit Test

Evaluation items extracted from the change, evaluated in the representative motif product,

Appearance abnormality /process capability (Ppk: 1.67 or higher) is a good result.

Item Test itemNumber of

measurements (/Lot)

Criteria Result Judge

Dicing appearance 1Wafer no abnormality. No problem OK

Chipping amount

30pointProcess capability 1.67 or more

Ppk：3.22 OK

Die-attach

appearance １Frame no abnormality. No problem OK

Die Share Strength

30pointProcess capability

1.67 or more Ppk：1.75 OK

位置精度(X) 30pointProcess capability


位置精度(Y) 30pointProcess capability


4. Evaluation & Result


２） Reliability Test

Evaluation items extracted from the changes are evaluated by the representative products,All items, no problem results.

Test item

条件Result Judge

ConditionFinal read-

point

Sample size

Heat resistance

125℃/24h Bake→ 30℃/70%/216h→260℃×3times

no abnormality

32pcs0/32 NG

(No delamination）

OK

ＴＣＴ -65℃⇔150℃ 500cyc 32pcs 0/32 NG OK

ＰＣＴ 127℃/2.5atm/100% 500hrs 32pcs 0/32 NG OK

4. Evaluation Result


05Schedule


Your understanding and early approval for this change will be highly

appreciated.

項目2020

Jan Feb Mar Apr May Jun Jul Aug

PCN

Customer approval

Changeover

Final order

ingress

5. Schedule

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