quarterly technical report 1 for pittsburgh digital greenhouse

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1 Quarterly Technical Report 1 for Pittsburgh Digital Greenhouse Kyusun Choi The Pennsylvania State University Computer Science and Engineering Department High Speed CMOS A/D Converter Circuit for Radio Frequency Signal

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Quarterly Technical Report 1 for Pittsburgh Digital Greenhouse. High Speed CMOS A/D Converter Circuit for Radio Frequency Signal. Kyusun Choi. Computer Science and Engineering Department. The Pennsylvania State University. Project goals for this quater. - PowerPoint PPT Presentation

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1

Quarterly Technical Report 1for

Pittsburgh Digital Greenhouse

Kyusun Choi

The Pennsylvania State UniversityComputer Science and Engineering Department

High Speed CMOS A/D Converter Circuit

for Radio Frequency Signal

2

Project goals for this quater

1. Design a 6 and 8 bit TIQ based flash ADC circuits and CMOS layouts

2. Design the first prototype chip: 6 and 8 bit flash ADC

3. Chip fabrication submission

3

Accomplished project milestones for this quarter

1. Designed 6, 8, and 9 bit TIQ based ADC circuits and CMOS layouts in 0.25 m

2. Designed the first prototype chip:6, 8, and 9 bit flash ADC

3. Fabrication submission preparation4. Chip fabrication submission:

- Submission date: 4/2/2001- Vendor: MOSIS with TSMC 0.25 m foundry- Expected prototype chip delivery date: 7/16/2001

4

1. Systematic Variation Approach- Systematic Parameter Variation (SPV)

2. CAD Tools- MAX for layout- SUE for schematic capture- HSPICE for circuit simulation- Custom designed a set of C programs

3. Experiment base, Spice Model Base

Design Method

5

Chip Block Diagram

Chip Layout Design (1)

6

Dimension - ADCs

- Chip size (2580um * 2580um)

Chip Layout Design (2)

ADCs Size (W*H) um Area (mm2)

6bit high speed 198.740 * 256.350 0.051

6bit low power 289.840 * 352.350 0.102

8bit high speed 301.410 * 841.650 0.254

8bit low power 331.560 * 969.650 0.322

9bit high speed 339.720 * 1868.550 0.635

9bit low power 512.250 * 1612.550 0.826

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Layout- 6bit (0.24 um)

Chip Layout Design (3)

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Layout- 6bit (1.00 um)

Chip Layout Design (4)

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Layout- 8bit (0.24 um)

Chip Layout Design (5)

10

Layout- 8bit (0.50 um)

Chip Layout Design (6)

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Layout- 9bit (0.50 um)

Chip Layout Design (7)

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Layout- 9bit (1.00 um)

Chip Layout Design (8)

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Layout- Pad

Chip Layout Design (9)

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Layout- Chip

Chip Layout Design (10)

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Simulation Results (1)

ADCs

Max. Speed

(MSPS)

Max.

Current

(mA)

Avg.

Power

(mW)

Max.

Power

(mW)

6bit (0.24um) 1000 41.80 68.98 102.76

6bit (1.00um) 400 29.36 37.57 70.03

8bit (0.24um) 667 139.08 254.76 353.78

8bit (0.50um) 500 99.34 165.29 254.87

9bit (0.50um) 250 166.79 317.40 469.46

9bit (1.00um) 200 145.38 260.11 417.15

- pad delay : 0.864 ns

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Simulation Results (2)

- 6bit (0.24um)

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Simulation Results (3)

- 6bit (1.00um)

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Simulation Results (4)

- 8bit (0.24um)

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Simulation Results (5)

- 8bit (0.50um)

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Simulation Results (6)

- 9bit (0.50um)

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Simulation Results (7)

- 9bit (1.00um)

22

1. High Speed

2. Relatively small area

3. Relatively low-power

Features of the TIQ based ADC

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1. Dynamic fine-tuning 2. Supply voltage variation compensation3. Temperature variation compensation4. Process variation compensation5. Lower power6. FIFO design for on-chip high-speed data

acquisition  

Issues to Be Addressed in Future

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• 2 GSPS with 0.18um CMOS• Custom layout CAD tool• 10bit and 12bit ADC• Low power• Dynamic calibration

• Offset• Gain• Temperature• Power supply voltage• Process parameter variation

Innovation Challenges

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• High speed ADC for RF• ADC core - 6, 8 and 9 bit design

• first prototype chip (silicon test)• 0.25 m MOSIS (tsmc) process• CMOS digital logic technology

• Future ready• Dynamic calibration

Summary