r17 server - toshiba.semicon-storage.com

Solution Proposal by Toshiba

© 2019 Toshiba Electronic Devices & Storage Corporation

ServerR17


Toshiba Electronic Devices & Storage Corporation provides comprehensive device solutions to customers developing new products by applying its thorough understanding of the systems acquired through the analysis of basic product designs.

BlockDiagram


4© 2019 Toshiba Electronic Devices & Storage Corporation

Server Overall block diagram

System Power(Power Supply Unit) DIMM/CPU/SMC/PCH

System Management Controller

Platform Controller HubI/O(SAS/SATA)

Environment Sensor- Pressure- Humidity

- Accelerometer

System Monitoring- Temperature

- Current Backplane

DIMM DIMM

CPU CPU

ACInput

Fan


DCInput Nch

MOSFET

NchMOSFET

NchMOSFET

NchMOSFET

Photocoupler

PhotocouplerDriver

Photocoupler

ControllerDC

Output

Server Detail of the Server Power Supply Circuit (1)Device selection points- A MOSFET having a high withstand voltage and

a low on-resistance is suitable for the PFC circuit of the DC-DC power supply.

- A transistor-output photocoupler is typically used for feeding back voltages to the primary in the DC-DC power supply.

- The IC output coupler is used for signal isolation.

Proposals from Toshiba- Suitable for high-voltage power supply

switchingU-MOSIX Series Power MOSFET

- Photocoupler with excellent environmental resistanceTransistor output photocoupler

- Photocoupler with excellent environmental resistanceIC output photocoupler

※ Click the number in the circuit diagram to jump to the detailed description page.

DC-DC converters for 48 V systemsPower supply for 1.2 V and 100 A output insulated DC-DC converters(Vindc=40~59.5 V, Vout=1.2 V, Iout=100 A)

Reference Design from here → Click Here

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https://toshiba.semicon-storage.com/ap-en/design-support/referencedesign/12V-100A-Output-DC-DC_Power_Supply_RD040.html


DCInput Nch

MOSFET

NchMOSFET

NchMOSFET

NchMOSFET

Photocoupler

PhotocouplerDriver

Photocoupler

ControllerDC

Output

NchMOSFET

NchMOSFET

Server Detail of the Server Power Supply Circuit (2)Device selection points- A MOSFET having a high withstand voltage and

a low on-resistance is suitable for the PFC circuit of the DC-DC power supply.

- A transistor-output photocoupler is typically used for feeding back voltages to the primary in the DC-DC power supply.



DC-DC converters for 48 V systems300 W Isolated DC-DC Converters Power Supply(Vindc=36~75 V, Vout=12.0 V, Iout=25 A)

Proposals from Toshiba- Suitable for high-efficiency power

supply switchingU-MOSIX Series Power MOSFET

- Photocoupler with excellent environmental resistanceTransistor output photocoupler

- Photocoupler with excellent environmental resistanceIC output photocouplerReference Design from here → Click Here

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https://toshiba.semicon-storage.com/ap-en/design-support/referencedesign/300W-Isolated-DC-DC_PowerManagement_RD024.html


AC Input90 to 264V

Controller

NchMOSFET

NchMOSFET

DCOutput

NchMOSFET

NchMOSFET

NchMOSFET

NchMOSFET

NchMOSFET

NchMOSFET

ControllerPhoto-coupler

Driver Driver

NchMOSFET

Controller

SiCSBD

SiCSBD

Server Detail of the Server Power Supply Circuit (3)Device selection points- A MOSFET having a high withstand voltage and a low

on-resistance is suitable for the PFC circuit of the AC-DC power supply.

- A transistor-output photocoupler is typically used for feeding back voltages to the primary in the AC-DC power supply.


Proposals from Toshiba- Photocoupler with excellent environmental

resistanceIC output photocoupler

- Suitable for high-voltage power supply switchingDTMOSIV Series Power MOSFET

- Preferred for high efficiency and miniaturization of power sourcesSiC Schottky barrier diode

- Suitable for high-efficiency power supply switchingU-MOS Series Power MOSFET


AC-DC converters for 12 V systems (bridgeless PFCs)1.6 kW power supply(Vinac=90~264 V, Vout=12.0 V, Iout=66.7 A/133 A)

Reference Model of the power supply circuit from here →

Reference Design of PFC Circuit from here →

Click Here

Click Here

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https://toshiba.semicon-storage.com/ap-en/design-support/referencedesign/16kwacdcserver.html

https://toshiba.semicon-storage.com/ap-en/design-support/referencedesign/Bridgeless-PFC_PowerManagement_RD033.html


AC Input90 to 264V

PFCController

NchMOSFET

NchMOSFET

DCOutput

NchMOSFET

NchMOSFET

NchMOSFET

NchMOSFET

NchMOSFET

NchMOSFET

ControllerPhoto-coupler

Driver Driver

NchMOSFET

Controller

SiCSBD

SiCSBD

Server Detail of the Server Power Supply Circuit (4)


AC-DC converters for 12 V systems (interleaved PFCs)1.6 kW power supply(Vinac=90~264 V, Vout=12.0 V, Iout=66.7A/133A)

Device selection points- A MOSFET having a high withstand voltage and a low on-

resistance is suitable for the PFC circuit of the AC-DC power supply.

- A transistor-output photocoupler is typically used for feeding back voltages to the primary in the AC-DC power supply.


Proposals from Toshiba- Photocoupler with excellent environmental resistance

IC output photocoupler- Suitable for high-voltage power supply switching

DTMOSIV Series Power MOSFET- Preferred for high efficiency and miniaturization of

power sourcesSiC Schottky barrier diode

- Suitable for high-efficiency power supply switchingU-MOS Series Power MOSFETClick Here

Click Here

Reference Model of the power supply circuit from here →

Reference Design of PFC Circuit from here →

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https://toshiba.semicon-storage.com/ap-en/design-support/referencedesign/16kwacdcserver.html

https://toshiba.semicon-storage.com/ap-en/design-support/referencedesign/Interleaved-PFC_PowerManagement_RD032.html


RS-232CConnector

LineDriver

PeripheralController

TVS

USBConnector

PeripheralController

TVS

Server Detail of Peripheral Interface

Peripheral interface

Device selection points- To improve the reliability of the set, ESD

protection is required for connectors that may come into contact with the human body.

- Small, low-Ct TVS diodes are suitable for ESD protection.

Proposals from Toshiba- Static electricity (ESD) from external

terminals Absorb to prevent malfunction of the circuit.TVS diode

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Motor ControlDriver M

Brushless

MOSFETBackplane

Server Detail of the fan unit

Fan unit

Device selection points- Using brushless motor drivers, 3-phase

brushless motors can be easily controlled

Proposals from Toshiba- Very easy control of motors

Motor control driver- Suitable for switching

Semi-power MOSFET

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RecommendedDevices



Device Solutions to Solve Customer Problems

As described above, in the design of the server system, "Low powerconsumption and low heat generation", "Improved set reliability" and"Miniaturization of PCB boards" are important factors. Toshiba'sproposals are based on these three solution perspectives.

Lowpower consumption

・Lower heat

・High heat dissipation

efficiency

SmallPackage

Noiseimmunity

Low power consumption and low heat generation Improved set reliability Miniaturization of PCB boards


Device Solutions to Solve Customer Problems

U-MOS Series Power MOSFETTransistor output photocouplerIC output photocoupler

SiC Schotky barrier diodeTVS diode

DTMOS Series Power MOSFET


・Lower heat


efficiency

Noiseimmunity

SmallPackage

Motor control driverSemi-power MOSFET

1

2

3

5

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4

7

8


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Value provided

U-MOS Series Power MOSFETTPWR8004PL/TPH1R306PL/TPH3R70APL

Low RDS(ON) and high heat dissipation characteristics reduce the temperature of application.

Low on-resistance Small output charge Qoss Wide variety of packages

Low RDS(ON) characteristics makes heatgeneration and power consumption small.Our RDS(ON) lineup starts from 0.36 mΩ.

The Qoss is small and contributes to thereduction of power loss. The RDS(ON)*Qoss

has been reduced by 63% compared tothat of the latest competitor’s. Note 1

Toshiba have a double-sided coolingpackage (DSOP Advance) with samefootprint as SOP Advance. Wide packagelineup for many kinds of applications.

Part number TPWR8004PL TPH1R306PL TPH3R70APL

Package DSOPAdvance

SOPAdvance

SOPAdvance

VDSS [V] 40 60 100

ID [A] 150 100 90

RDS(ON) [mΩ]@VGS = 10 V

Typ. 0.65 1.0 3.1

Max 0.80 1.34 3.7

TPWR6003PL TPWR8004PL

63%reduction

1a

*Note1: As of Nov. 2017, products with the same rating, in-company surveyed.


・Lower heat


efficiency

Noiseimmunity

SmallPackage

RDS(ON)*Qoss - VDSUltra-low RDS(ON)

◆Return to Block Diagram TOP


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Value provided

U-MOS Series Power MOSFETTPWR6503PL/TPHR9003NC/TPHR9203PL

Part number TPHR6503PL TPHR9003NC TPHR9203PL

Package SOPAdvance

SOPAdvance

SOPAdvance

VDSS [V] 30 30 30

ID [A] 150 60 150

RDS(ON) [mΩ]@VGS = 10 V

Typ. 0.36 0.77 0.61

Max 0.60 0.90 0.92

1bLow

power consumption・

Lower heat ・

High heat dissipationefficiency

Noiseimmunity

SmallPackage

Ultra-low RDS(ON)TPWR6003PL TPWR8004PL

63%reduction

RDS(ON)*Qoss - VDS

Low RDS(ON) and high heat dissipation characteristics reduce the temperature of application.

Low on-resistance Small output charge Qoss Wide variety of packages

Low RDS(ON) characteristics makes heatgeneration and power consumption small.Our RDS(ON) lineup starts from 0.36 mΩ.

The Qoss is small and contributes to thereduction of power loss. The RDS(ON)*Qoss

has been reduced by 63% compared tothat of the latest competitor’s. Note 1

Toshiba have a double-sided coolingpackage (DSOP Advance) with samefootprint as SOP Advance. Wide packagelineup for many kinds of applications.

*Note1: As of Nov. 2017, products with the same rating, in-company surveyed.



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Value provided

Transistor output photocouplerTLP785/TLP291(SE

High current transfer ratio

These are photo couplers of high isolation type that consists of aphototransistor optically coupled to an infrared LED. It achieveshigher current transfer ratio than conventional insulatedtransformers.

High operation temperature range

(up to 110 °C)

It is designed to operate even under severe ambienttemperature conditions, such as inverters, robots, machinery,and high-output power supplies.

Contributing to the reduction of the board footprint area and the elimination of equipment maintenance by improving reliability.

Part number TLP785 TLP291(SE

Package DIP4 SO4

BVS (Min) [Vrms] 5000 3750

Topr [°C] -55 to 110 -55 to 110


・Lower heat


efficiency2 Noise

immunitySmall

Package

High level of isolation and

noise blocking

Industrial equipmentGeneral-purpose inverterServo amplifierRobotMachine ToolHigh-output power supplySecurity equipmentSemiconductor testerPLC (Programmable Logic Controller)



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Value provided

Photocoupler that consists of an infrared light-emitting diode and an integrated photodetector with high gain and high speed.

High speedOperation assurance at ambient temperature of 125 °C

Wide range of power supply voltages 2.7-5.5 V

The propagation delay is guaranteed20ns (Max) at TLP2767, 60ns (Max) atTLP2370. Margin design becomes easierthan general phototransistor couplers.

It is designed to operate even undersevere ambient temperature conditions,such as inverters, robots, machinery, andhigh-output power supplies.

The products can be used even insystems in which 3.3 V and 5.0 V aremixed, thereby possible to standardizecomponents.

Part number TLP2767 TLP2370

Package SO6L SO6(5pin)

VCC [V] 2.7 to 5.5 2.7 to5.5

ICC (Max) [mA] 2.5 0.4

Tpd (Max) [ns] 20 60

BVS (Min) [Vrms] 5000 3750

Topr [°C] -40 to 125 -40 to 125

IC output photocouplerTLP2767/TLP23703


・Lower heat


efficiency

Noiseimmunity

SmallPackage

Internal CircuitTLP2767 (Inverter logic output) TLP2370 (Buffer logic output)



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Value provided

DTMOS Series Power MOSFETTK040N65Z/TK040Z65Z/TK090A65Z/TK099V65Z

RDS(ON)*Qgd 40% reduction

The RDS(ON)*Qgd of figure of merit has been reduced by 40% withgate design and process optimization.(Comparison of DTMOSIV-H Products: In-company comparison)

Various package lineup

Various package lineup from the TO-247-4L package with Kelvinterminal to thin SMD package (DFN8x8) with package thickness0.85mm.

The RDS(ON)*Qgd is reduced by 40% (compared with conventional products) to improve power efficiency, and contributing to miniaturization of the set.

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10

100

0.01 0.1

Qgd

(nC)

RDS(ON) (Ω)

60

30

0.060.0397

97.2

97.4

97.6

97.8

98

98.2

98.4

0 1000 2000 3000

Conv

ersio

n ef

ficie

ncy

(%)

Output power (W)

Conventional product(DTMOSIV-H)

New product(DTMOSVI)

40%reduction

Part number TK040N65Z TK040Z65Z TK090A65Z TK099V65Z

Package TO-247 TO-247-4L TO-220SIS DFN8x8

VDSS [V] 650 650 650 650

ID [A] 57 57 30 30

RDS(ON) [Ω]@VGS=10V

Typ. 0.033 0.033 0.075 0.080

Max 0.040 0.040 0.090 0.099

New product(DTMOSVI)

Conventional product(DTMOSIV-H)

0.36%[email protected]


・Lower heat


efficiency

Noiseimmunity

SmallPackage



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Value provided

Applicable to PFC circuits or a wide range of power supply applications, and greatly contributes to miniaturization.

High surge current capability

Second-generation chip design

Small package

The surge current (IFSM) is improved than1st Gen. product.IFSM = 69 [A] (Max)

The figure of merit (VF * QC) Note 1 isimproved by 30% than 1st gen. product.

Provided in TO-220F-2L through-holetype package.

SiC Schottky barrier diodeTRS8E65F5


・Lower heat


efficiency

Noiseimmunity

SmallPackage

Part number TRS8E65F

Package TO-220F-2L

VRRM [V] 650

IF(DC) [A] 8

IFSM [A] 69

VF (Typ.) [V] @ IF=4A 1.2

Comparison between the 1st and 2nd generations

Note1: The VF*Qc : (product of forward voltage and total charge) is an index representing the loss performance of the SiC SBD. When comparing the products with the same current rating, the smaller the index, the lower the loss.

TRS10A/E65C(1st Gen.) vs TRS10A/E65F(2nd Gen.)Qc, Ec - VR

Elec

tric

char

gebe

twee

n te

rmin

als

Qc

(nC)

Char

ge e

nerg

y pe

r cyc

le E

c(μJ/

cycl

e)

Reverse voltage VR (V)

1st Gen. Qc2nd Gen. Qc1st Gen. Ec2nd Gen. Ec

Comparison of the surge peak forward current

Surg

e pe

ak fo

rwar

d cu

rren

t IFS

M(A

)

Forward DC current IF(DC) (A)2nd Gen. 1st Gen.



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Value provided

TVS diodeDF2B7ASL/DF2S14P1CT/DF2B5M4SL/DF2B6M4SL

This absorbs static electricity (ESD) from external terminals, prevents circuit malfunction, and protects devices.

Improved ESD absorptionReduce ESD energy by low clamp voltage

Optimal for high-density mounting

Improved ESD absorption compared to conventional products. (50% reduction in operating resistance)Both low operating resistance and low capacitance are realized and ensures high signal protection performance and signal quality.

Steadily protect the connected circuits/devices using proprietary technology.

A wide range of packages (single-to-multi-flow-through) are available.

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Part number DF2B7ASL DF2S14P1CT DF2B5M4SL DF2B6M4SL

Packaging SL2 CST2 SL2 SL2

VESD [kV] ±30 ±30 ±20 ±20

VRWM (Max) [V] 5.5 12.6 3.6 5.5

Ct (Typ.) [pF] 8.5 40 0.2 0.2

RDYN (Typ.) [Ω] 0.2 0.5 0.5 0.5


・Lower heat


efficiency

Noiseimmunity

SmallPackage

(NOTE) : This product is designed for ESD protection purpose and cannot be used for purposes other than ESD protection (including but not limited to voltage regulation applications).

Suitable for paths such as logic signals. There is lineups of 1in1, 2in1, 4in1, 5in1, 7in1.

Unidirectional Bidirectional

Suitable for paths with both polar signals such as audio signals



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Value provided

1 hall sine wave PWM control driver for 3-phase BLDC motor

1 hall phase difference detection circuit

Closed loop speed control Small package

Monitoring 1 hall component outputvoltage and controlling a motor. Possibleto reduce motor unit BOM cost.

Configurable speed curve by settingbuilt-in NVM without an external MCU. Itcontributes motor unit BOM cost.

VQFN24 is suitable for limited foot printarea.

7 3-phase BLDC motor control driverTC78B025FTG/TC78B027FTG

Part number TC78B025FTG TC778B027FTGOperation voltage 4.5-16V 5-16V

Drive type Sine wave PWM drive

Others

1 hole component input position detectionClosed loop speed control function、Configurable speed curve

Stand by modeSoft start

Built-in driver(3.5A max.) Built-in pre driver for Nch FET drivePackage VQFN24VQFN24

(4mm×4mm×1mm)

TC78B025FTG/TC78B027FTG


・Lower heat


efficiency

Noiseimmunity

SmallPackage



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Value provided

Semi-power MOSFETSSM6K341NU/SSM3K341R

Low on-resistance, small and high power dissipation packages contributes to miniaturization and low power consumption of the systems.

Low loss (reduced chip resistance)

Small and high heat-dissipating package

Low voltage drive

Using an optimized chip process, thereduction in resistance per unit area isreduced, contributing to lower losses perunit area.

Small and high heat-dissipating packages(2mm2:UDFN6B, SOT-23F) contributes tospace saving during mounting.

Power consumption of the set can bereduced by low voltage drive.

Part number SSM6K341NU SSM3K341R

Package UDFN6B SOT-23F

VDS(DC) [V] 60 60ID [A] 6 6

RDS(ON) [mΩ]@VGS = 4.5 V

Typ. 36 36

Max 51 51

Polarity N-ch N-ch


・Lower heat


efficiency

Noiseimmunity

SmallPackage8



If you are interested in these products andhave questions or comments about any of them,please do not hesitate to contact us below:

Contact address: https://toshiba.semicon-storage.com/ap-en/contact.html

https://toshiba.semicon-storage.com/ap-en/contact.html


Terms of useThis terms of use is made between Toshiba Electronic Devices and Storage Corporation (“We”) and customers who use documents and data that are consulted to design electronics applications on which our semiconductor devices are mounted (“this Reference Design”). Customers shall comply with this terms of use. Please note that it is assumed that customers agree to any and all this terms of use if customers download this Reference Design. We may, at its sole and exclusive discretion, change, alter, modify, add, and/or remove any part of this terms of use at any timewithout any prior notice. We may terminate this terms of use at any time and for any reason. Upon termination of this terms of use, customers shall destroy this Reference Design. In the event of any breach thereof by customers, customers shall destroy this Reference Design, and furnish us a written confirmation to prove such destruction.

1. Restrictions on usage1.This Reference Design is provided solely as reference data for designing electronics applications. Customers shall not use this Reference Design for any other purpose, including without

limitation, verification of reliability.2.This Reference Design is for customer's own use and not for sale, lease or other transfer.3.Customers shall not use this Reference Design for evaluation in high or low temperature, high humidity, or high electromagnetic environments.4.This Reference Design shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.

2. Limitations1.We reserve the right to make changes to this Reference Design without notice.2.This Reference Design should be treated as a reference only. We are not responsible for any incorrect or incomplete data and information.3.Semiconductor devices can malfunction or fail. When designing electronics applications by referring to this Reference Design, customers are responsible for complying with safety standards

and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of semiconductor devices could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Customers must also refer to and comply with the latest versions of all relevant our information, including without limitation, specifications, data sheets and application notes for semiconductor devices, as well as the precautions and conditions set forth in the "Semiconductor Reliability Handbook".

4.When designing electronics applications by referring to this Reference Design, customers must evaluate the whole system adequately. Customers are solely responsible for all aspects of their own product design or applications. WE ASSUME NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

5.No responsibility is assumed by us for any infringement of patents or any other intellectual property rights of third parties that may result from the use of this Reference Design. No license to any intellectual property right is granted by this terms of use, whether express or implied, by estoppel or otherwise.

6.THIS REFERENCE DESIGN IS PROVIDED "AS IS". WE (a) ASSUME NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (b) DISCLAIM ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO THIS REFERENCE DESIGN, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

3. Export ControlCustomers shall not use or otherwise make available this Reference Design for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). This Reference Design may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of this Reference Design are strictly prohibited except in compliance with all applicable export laws and regulations.

4. Governing LawsThis terms of use shall be governed and construed by laws of Japan.


RESTRICTIONS ON PRODUCT USE• Toshiba Electronic Devices & Storage Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related

hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if

reproduction is without alteration/omission.• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing

adequate designs and safeguards for their hardware, software and systems which Minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights

of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW,

TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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r17 server - toshiba.semicon-storage.com

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