report intra

8/10/2019 Report Intra

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INDUSTRIAL TRAINING (WIB39908)

CHAPTER 1

INTRODUCTION

1.1 Industrial training objective

The main objective of the Industrial Training is to experience and understand

real life situations in industrial organizations and their related environments and

accelerating the learning process of how students knowledge could be used in a

realistic way. In addition to that, industrial training also makes one understand the

formal and informal relationships in an industrial organization so as to promote

favorable human relations and teamwork. esides, it provides the exposure to practice

and apply the ac!uired knowledge "hands # on$ in the working environment. Industrial

training also provides a systematic introduction to the ways of industry and developing

talent and attitudes, so that one can understand how %uman &esource 'evelopment

works.

(oreover, students can gain hands#on experience that is related to the students

majoring so that the student can relate to and widen the skills that have been learnt

while being in university. Industrial training also exposes the students to the real career

world and accustoms them to an organizational structure, business operation and

administrative functions.

)urthermore, students implement what they have learned and learn more

throughout this training. esides, students can also gain experience to select the

optimal solution in handling a situation. 'uring industrial training students can learn the

accepted safety practices in the industry. *tudents can also develop a sense of

responsibility towards society.

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CHAPTER

CO$PAN% IN&OR$ATION

.1 Co!"an' (ac)ground

*TT* -hip- /td. 0"*TT* -hip-$ or "the -ompany$ # *12#*T3

*TT*-h4 is a leading provider of advanced semiconductor packaging and test

services. *TT* -hip-s full turnkey semiconductor solutions include package

design, bump, probe, assembly, test and distribution services. +e have the scale to

provide a comprehensive range of semiconductor packaging and test solutions to a

diversified global customer base servicing the communication, consumer and

computing markets.

+ith a strong technology portfolio ranging from flip chip, wafer level and

advanced 5' packages to leadframe and laminate based packages, *TT* -hip-

provides customers with innovative and cost#effective semiconductor solutions. +e

have a leadership position in advanced packaging technology including fan#in and fan#out wafer level packaging, flip chip interconnect, 5' integration and Through *ilicon 6ia

0"T*6$4 to meet the increasing market demand for next#generation electronic devices

with higher levels of integration, increased functionality and compact sizes. +e provide

wafer probe and final testing on a diverse selection of test platforms, with expertise in

testing a broad variety of semiconductors for mixed#signal, radio fre!uency, analog and

high#performance digital devices.

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+ith corporate head!uarters in *ingapore, our global manufacturing facilities

are strategically located in *outh 7orea, *ingapore, -hina, (alaysia and Taiwan 0which

includes our 89:#owned subsidiary, *TT* -hip- Taiwan *emiconductor

-orporation4. +e market our services through our direct sales force in the ;nited

*tates, *outh 7orea, s ?@@,??@ s!uare

foot operation in 7uala /umpur provides a full range of integrated test and assembly

services. *TT* -hip- (alaysia 0*-(4 is *TT* -hip-s primary site for

advanced leadframe based packaging and test, offering high volume turnkey services

for -- and A)B packaging and test. *-( also offers a full range of I- testing

capabilities for analog and mixed signal devices, and is *TT* -hip-s -enter of

Cxcellence for &)Test. In operation since DEF?, the (alaysian facility features a state of

the art automated product distribution center with 9? hour support.

#igure 1 *TAT* C+i"PAC $ala'sia

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.1.1 Co!"an' Organi,ation C+art

.1. Co!"an' logo

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.1.- Co!"an' Pro#ile

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LTo be the premier packaging, test and back end supply chain solutions provider

delivering best in class service in our chosen marketsL

(ission 3

LTo deliver differentiating backend solutions to our customers in our chosen markets

through leadership in innovative advanced packaging solutions, world class operational

excellence, cost competitiveness, and efficient and reliable supply chain solutions.L

.1. Co!"an' Core /alues

-ustomer focus # L+e owe our business to our customers, we strive to meet and

exceed to our customers expectations at all time. +e understand our customers>

priorities and deliver to our commitments.L

Integrity # L+e mean what we say and say what we mean. +e establish relationship of

trust, honesty and sincerity with people we deal with.L

Teamwork # L+e collectively work as a team, bringing our individual talent, experience

and expertise to achieve common goals,L

Gwnership # L+e are owners of statschippac, we own our responsibilities and are

accountable for our actions.L

assion to win # L+e never give up till we succeed. +e will strive to excel in everything

we do and perseverse till we do.L

. De"art!ent (ac)ground o# IC Post Test

There are the major department in *-( 3

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)G/ 0front of line4

CG/ 0end of line4

Test

Post Test

..1 IC Post Test

)or *TT* -hip-, every stage in the manufacturing process is critical,

including ost Test. -onse!uently, *TT* -hip- has established highly#automated

ost Test systems to achieve extremely high throughput while maintaining a zero

defects standard of !uality.

*TT* -hip- has achieved this goal by working closely with technology

leaders in vision inspection, )inal (arking and Tape and &eel systems to integrate

these ost Test functions into a fully#automated ost Test process that maximizes

throughput while minimizing manual handling. Integrated within this process is

automatic 5' 0top, bottom and sides4 inspection of every device package to eliminate

any packaging flaws before the devices are shipped to the end customer.

Cach ost Test service is presented below, but it is important to realize thatmany of these services are performed on the same e!uipment, seamlessly integrating

these services within a fully automated manufacturing process. )or instance, it is

common at *TT* -hip- for Tape and &eel e!uipment to include a built#in 5' vision

inspection system. Cven )inal (arking can be performed on the same Tape and &eel

e!uipment. ;nless specifically stated otherwise, the following services apply to all

devices and all types of packages arriving from )inal Test in trays or tubes.

There are some machine in the ost Test department 3

6I* 'ynamics (achine

*TI (achine

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%exa (achine

I-G* (achine

.. &inal $ar)ing

*TT* -hip- provides )inal (arking services for customers who re!uire

multiple good bins to segregate their good units based on performance such as speed

grading their devices. These services include3

)inal laser mark to in#tray devices

)inal ink mark to in#tray devices

)inal laser mark to in#tube devices

&e#work ink mark for mold packages 0using black top method4

..- (a)ing

*TT* -hip- uses large capacity ovens in a fully automated baking process

with built#in oven control systems that control and monitor the entire bake cycle. This

system automatically tracks the baking process until the lot completes the dry packing

cycle and generates a moisture exposure tracking report at the end of the cycle.

.. -D Ins"ection *'ste!

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In its mission to eliminate the possibility of mistakes in ost Test, *TT*

-hip- uses automated visual aid systems to display a customers specified packing

method and bill of materials. /abel generation is also fully automated including the

automatic generation of device#dependent, (oisture *ensitivity /evels 0(*/4 labels.y

default, *TT* -hip- uses vacuum aluminum packing bags with bar code labeling,

but can also support custom re!uirements.

..4 Dro" *+i"

'rop ship means that *TT* -hip-s customers do not need to bear the

expenses of maintaining inventory at their own facilities. *TT* -hip- can instead

ship your final products directly to your end customers. Gf course, you can also choose

to have *TT* -hip- ship your final products to your own facility.

CHAPTER -

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PRE/ENTI/E $AINTENANCE

The care and servicing by personnel for the purpose of maintaining e!uipment

and facilities in satisfactory operating condition by providing for systematic inspection,

detection, and correction of incipient failures either before they occur or before they

develop into major defects. (aintenance, including tests, measurements, adjustments,

and parts replacement, performed specifically to prevent faults from occurring.

The primary goal of maintenance is to avoid or mitigate the conse!uences of

failure of e!uipment. This may be by preventing the failure before it actually occurs

which lanned (aintenance and -ondition ased (aintenance help to achieve. It is

designed to preserve and restore e!uipment reliability by replacing worn components

before they actually fail. reventive maintenance activities include partial or complete

overhauls at specified periods, oil changes, lubrication and so on. In addition, workers

can record e!uipment deterioration so they know to replace or repair worn parts before

they cause system failure. The ideal preventive maintenance program would prevent all

e!uipment failure before it occurs.

+hile preventive maintenance is generally considered to be worthwhile, there

are risks such as e!uipment failure or human error involved when performing

preventive maintenance, just as in any maintenance operation. reventive maintenance

as scheduled overhaul or scheduled replacement provides two of the three proactive

failure management policies available to the maintenance engineer. -ommon methods

of determining what reventive 0or other4 failure management policies should be

applied areM GC( recommendations, re!uirements of codes and legislation within a

jurisdiction, what an LexpertL thinks ought to be done, or the maintenance that>s already

done to similar e!uipment, and most important measured values and performance

indications.

In I- ost Test department, there are several e!uipment that re!uires preventive

maintenance, such as 3

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Ionizer lower )an

=ebra rinter

&ework (achine 0*#54

Transfer fixture N AAA flute

-.1 Ioni,er (lo5er &an

'evice that useshigh voltageto ionize0electrically charge4 airmolecules.

Begative ions, or anions, are particles with one or more extra electrons, conferring a net

negative charge to the particle. -ationsare positive ions missing one or more electrons,

resulting in a net positive charge. (ost commercial air purifiers are designed to

generate negative ions. nother type of air ionizer is the C*' ionizer 0balanced ion

generator4 used to neutralise static charge.

&igure - Ioni,er (lo5er &an

The ionizer can operate with external sensors to maintain precise balance

0better than OD64 by altering ion output and adapting to environment changes. +ith the

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optional sensor and collimator, the (odel 8@9i delivers precisely balanced and

directed ionized air to your target without taking up valuable room in your environment.

greater concentration of emitter points and internal circuitry suited for high humidity

applications makes the (odel 8@9i the standard choice for environments that need

!uality C*' protection with solid design.

-.1.1 (asic O"eration o# ioniser

The ench Top lower ioniser employs the safe non#nuclear - ionization

source. - systems utilize emitter electrodes that are switched rapidly between positive

and negative high voltage, usually at the power line fre!uency 08%z4. The ionizer>s

uni!ue )araday alance *ystem monitors ion output and automatically adjusts the unit

to teach an e!uilibrium at low offset voltage or balanced ion flow. The ionizer is

designed to achieve balance under extreme condition and is uni!uely able to maintain

balance in most any environment.

Ions are emitted in an efficient laminar flow. This reduce air turbulence and ion

recombination, prolongs cleanliness and increases efficiency. The ionizer>s uni!ue tri#

metallic ion emitter electrodes produce a high ion output for rapid charge dissipation.

The ench Top Ionizer is engineered for efficiency and durability, making the ench Top

Ionizer highly dependable and cost effective.

-.1. $aintenance o# ioni,er

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s with all ionizer, periodic maintenance will be needed to provide optimum

performance. The fre!uency of monitoring ionizer>s really depends on how and where

the are used. *ince the majority of them use a fan to transport the ions to the working

area, the cleanliness of the air directly affects their performance over time and how

often the emitters should be cleaned.

The ionizer recommends checking in every 5 months, but this may not be

suitable for many programs particularly since an out of balance may exist for months

before it checked again. There are a few servicing methods should be followed for any

preventive maintenance 3

1eneral -leaning

;se air gun to blow of the dusts accumulated inside the ionizer blower fan

-lean the ionising needle with erasing rubber orNand cotton stick dampened with

I

erformance -heck

lace the blower at about 9 feet away from the charge plate of (8 or

e!uivalent with the direction of air flow towards the plate. erform ion balance

and decay test.

Ion balance should be within PN# 586

The decay time should not be greater than 8 sec when discharge from PN#

D6 to PN# D6

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Ion balance6ti!e deca' be#ore cleaning (lo56clean t+e blo5er #an6grill

Ion balance6ti!e deca' a#ter cleaning Clean t+e ioni,er needle

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-. 7ebra Printer

=ebra Technologies is a manufacturer of thermal bar codelabel and receipt

printers, &)I'smart label printerNencoders, card and kiosk printers, based in 6ernon

%ills, Illinois. =ebra has products in D countries around the world. =ebra#brand

printers are used by more than E percent of)ortune 8companies.

#igure 7ebra 8abel Printer

The enhanced of zebra printer are 3

Cxtreme fast

)aster print speeds # up to 58Jmm per second for increase batch and print

productivity

)ast DND network connectivity as standard.

Totally reliable

'ependable print !uality # onboard diagnostics to ensure optimum print !uality

Improved ribbon and media # low /-'Nnetwork alerts

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Incredibly robust

-onstruction # D9 gauge steel frame

'esigned foe continuous use.

-..1 $aintenance o# 7ebra Printer

The =ebra printer recommends checking in every months. s with all zebra

printer, periodic maintenance will be needed to provide optimum performance. There

are some method that should to follow regarding on servicing 3

-leaning 3

&emove dirt and lint from the interior of the printer using brush and vacuum

cleaner

-lean the print head using I or e!uivalent

&otate the platen roller and clean with I

&otate and clean the peel#off upper guide rod, plated guide rod, rewind power

roller and lower guide rod with I

-lean tear offNpeel off plate with I

low media, ribbon and stuck media along the media path

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#igure Cleaning a t'"ical "rint+ead

djustment 3

-heck for ribbon spindle tension

-heck for ribbon guide plate

#igure 2 Ribbon #lo5

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rint !uality verification 3

rint test label by press the QpauseQ button while turning on the printer. &elease the

button when the front panel /C'* turn on.

-heck the test label and perform adjustment if missing print in printed area,

missing or light vertical line, missing horizontal line, light or no printing on the left

or right hand side, and illegible print.

aste the test label on the ( checklist

#igure 3 Test label

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#igure 4 Test sa!"le label

#igure 9 Test sa!"le label

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lean!n. p+75e##

A,"#tment

P+!nt "al!ty


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-.- Re5or) !ac+ine :*P;-


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This machine is to rework the failure lead of I-s 3

R /ead pitch

R ent lead

R Implied coplanarity

-.-.1 $aintenance o# re5or) !ac+ine

s with all ionizer, periodic maintenance will be needed to provide optimum

performance. The ionizer recommends checking in every weeks,

1eneral cleaning for 5 stations 3

-ombing 0stationD4

Initial forming 0station94

)inal forming 0station54

*ervicing method 3

-lean air and vacuum filter

-heck tubing for any leakage

-heck sensor 0working condition4

-heck Indicator lamp 0working condition4

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Stat!7n

Stat!7n

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-. Trans#er #i>ture 6 ??? #lute

device used as an intermediate in the Transfer of a unit. The transfer unit of the flute

to the tube.

*ervicing method of transfer fixture 3

/oosen the screw at the top section of the transfer fixture

&emove all dirt on transfer fixture by using brush

-lean the transfer fixture track by using I

low the transfer fixture track by using airgun

tighten tall screw at the top section of transfer fixture

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*ervicing method on AAA flute 3

&emove all dirt at flute using brush

-lean the flute track using I

low the flute track using airgun

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CHAPTER

/I* D%NA$IC $ACHINE

.1 Introduction

(achines for manufacturing, packing and packaging semiconductorsM handling

machines used for processing and production of semiconductor chips and electronic

components in the semiconductor industry, namely, tape and reel machines, vision

inspection machines

pparatus for testing semiconductors, namely, automated functional,

parametric, openNshort or high fre!uency 0%)4 testersM electronic test e!uipment,

namely, automated testing machines for use in the semiconductor fieldM vision

inspection apparatus for use in the semiconductor industryM test handler machines forfunctional, parametric, openNshort or high fre!uency 0%)4 testing of semiconductor chips

and electronic components

(C9@8 is an application that combines two applications listed below into one3

R (C9@5 Gn#Track 9'N5' /ead S (ark Inspection

R (C9@9 In#ocket 9' /ead S (ark Inspection

It is the advanced vision inspection software specifically catered for6is'ynamics 1J Tape and &eel machine that incorporates two independent vision

inspection sites.

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(C9@5 takes charge of on#the#track inspection of semiconductor devices as

the devices are being fed through singulation track on a conversion kit by gravitational

force.

fter the device has been transferred into the embossed pocket of the carrier

tape, just before the device is being sealed up under the cover tape, (C9@9 inspection

system performs another full inspection to ensure ultimate !uality assurance from

possible visual mechanical defects on the device.

Though (C9@8 is a single application, it provides a seamless graphical user

interface that accommodates two independent entities, (C9@9 and (C9@5.

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. Ca"abilit' o# $E


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.- &lo5 O"eration o# $E


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. -D /ision *'ste!

;sing (C9@8, an advanced vision inspection software that employs innovative

optics technology in that front lighting for mark inspection and back lighting for 9'N5'

lead inspection are combined and blended to produce a single high !uality image by a

single camera.

The optical station 0where inspection takes place4 consists of3

R track insert with flat top surface acting as seating pedestal

R The track insert may be flanged by shoulders of known height above the seating

pedestal

R 9 inwardly inclined reflective surfaces below the pedestal

R 9 reflective surfaces 0mirrors4 at both sides of the track insert, with adjustable

inclining angle

R /C' illumination panel at the bottom of the track insert to provide even and

diffused back lighting for lead inspection

R rogrammable multi#channel /C' light segments on top of track insert to

provide front illumination for mark and orientation inspection

R 6ision stopper, bottom vacuum and track guides 0optionally moveable4, all built

around the track insert to dynamically stabilize and precise device for inspection

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. D /ision *'ste!

It is important to have a focus image, before vision system can perform a good

inspection job. Tune the lens attached to the camera to adjust the focus. efore tuning

the focus, it is recommended to zoom the image to a larger scale 0zoom#in4. 'o not

zoom out the image since it is hard to be observed whether the image is in focus or not.

If fixed focal lens are used instead of zoom lens, adjusting the distance between

camera and object for zoom effect. )or focus effect, user needs to adjust the distance

between camera and lens.

There are type of 9' inpection 3

R /ead pitch

R /ead skew

R Tip to tip

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.2 -D 8ead Ins"ection Para!eters

D. /ead standoff 0from body4

/ead standoff is vertical distance of a lead tip from the plane 0zero datum plane4

along the bottom side of the package.

*ince during inspection, the device is vacuumed to ensure its bottom side is fully

resting on the surface of the vision track insert, it follows that lead standoff is

measured as vertical distance from the plane along the surface of the vision

track insert to the lead tip.

Typically, the vision track insert is designed with flanges 0of mirror finishing4 of 5

mils above the surface of track insert. This design allows negative lead standoff

0lead tip is above the surface of the bottom side of the package4 to be

measurable.

9. ody standoff 0from seating4

ody standoff is the vertical distance from the lead seating plane of the device

to the plane along the bottom side of the package 0within the footprint of the

leads4. *ince body standoff concerns with the distance between two planes, to

meet complete measurement interest, minimum and maximum body standoffs

are computed.

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.3 D 8ead Ins"ection Para!eters

D. /ead picth

itch is the distance between adjacent lead tips and is measured along 2direction of

the package.

9. /ead skew

*kew is the deviation of a lead tip from its ideal position measured along 2direction of

the package. *kew in clockwise direction is signed positive and vice versa.

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5. Tip to tip

Tip to tip is the distance between two opposite lead tips, measured along Hdirection of

the package.

?. /ead sweep

*weep at a side is the average of lead skews of all the leads on the same side.

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.4 @a! Rate anal'sis

In a machine, there are several related jam units used in the inspection process.

Cach machine will normally occur jam. fishbone> analysis.

.4.1 Pareto Anal'sis

areto analysis is a formal techni!ue useful where many possible courses of

action are competing for attention. In essence, the problem#solver estimates the benefit

delivered by each action, then selects a number of the most effective actions that

deliver a total benefit reasonably close to the maximal possible one.

areto analysis is a creative way of looking at causes of problems because it

helps stimulate thinking and organize thoughts. %owever, it can be limited by its

exclusion of possibly important problems which may be small initially, but which grow

with time. It should be combined with other analytical tools such as failure mode and

effects analysisand fault tree analysisfor example.

nalysis can be used to identify the root causes of the problems. +hile it is

common to refer to pareto as L@N9L rule, under the assumption that, in all situations,

9: of causes determine @: of problems, this ratio is merely a convenient rule of

thumb and is not nor should it be considered immutable law of nature.

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.4. &is+(one Anal'sis

-ommon uses of the fishbone diagram are product designand !uality defect

prevention, to identify potential factors causing an overall effect. Cach cause or reason

for imperfection is a source of variation. -auses are usually grouped into major

categories to identify these sources of variation. The categories typically include3

(an 3nyone involved with the process

(aterial 3 &aw materials, parts, pens, paper

(achine 3ny e!uipment, computers, tools

(ethod 3 3 %ow the process is performed and the specific re!uirements

)rom the pareto chart, the major errors that need to be analyzed are 3

i. 'evice jam at input tube inlet

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ii. 'evice jam after 5' vision stopper

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iii. 'evice jam at first singulator

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iv. 'evice jam after first singulator

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v. 'evice jam at reject tube inlet

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.4.- Corrective Actions O# *olution Proble!

-orrective actions are implemented in response to customer complaints,

unacceptable levels of product non#conformance, issues identified during an internal

audit,or adverse or unstable trends in product and process monitoring such as would

be identified by *-. reventive actions are implemented in response to the

identification of potential sources of non#conformity.

To ensure that corrective and preventive actions are effective, the systematic

investigation of the root causes of failure is pivotal. - is part of the overall !uality

management system0A(*4.

&esult in this case, the jam should be dealt with in the right way for no repetitive

problems occur that will taken to reduce the fre!uency of jam and to improve the

efficiency of the machine operation. There are some problem solution that use the

corrective action 3

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'evice jam at several situation

Cause #ro! :$an= Corrective Actions

'oes not clean input track low the input track before and after

running lot using airgun

'oes not replace worn out valve &eplace the valve with the new one in

every preventive maintenance

Input tube alignment lign the input tube in every conversion

input stacker.

'oes not clean 5' track -lean the 5' in every preventive

maintenance

Track width adjustment djust the track width following the specific

guide

'oes not clean reject track low the reject tube in every changing of

reject tube

&eject tube track alignment lign the reject tube track following the

specific guide

Cause #ro! :$aterials= Corrective Actions

(old flash -ut holder tip slant to exert backward

pushing action to second deviceent lead Inspection by ( before inserting

damaged unit to machine

Tube worn out opening Gnly provide high !uality material tubes for

productionTube dimension Gnly provide high !uality material tubes for

production

)riction from unit base package -heck for base package

;nit package out of spec Inspection by ( before inserting

damaged unit to machine

Cause #ro! :$ac+ine= Corrective Actions

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Track alignment Cnsure that alignment of track following

the specific guide

ir purge 0highNlow4 djust the air pressure every time

conversion is done

*topper pin worn out &eplace stopper pin with the new one in

every preventive maintenance

*ensor detection faulty irgun the every sensor located at

machine before start the new lot

*topper cylinder sluggish &eplace stopper with the new one in every

preventive maintenance

)aulty unit holder djust the the holder to avoid being too

tight or loose

Gutput track alignment lign the output track following the specific

guide

Cause #ro! :$et+od= Corrective Actions

Tube loading Cnsure the tube is used in correct position

-leaning -leaning should be neatly and cleanly

*topper replacement &eplacement of a device is in order and

following the specific guide

-ylinder replacement &eplacement of a device is in order and

following the specific guideTrack adjustment djustment of a device is in order and


Tube placement djustment of a device is in order and


CHAPTER

RECO$$ANDATION

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.1 Co!!ents

*tatschippac is a reputable company in the world. *erver of the relevant

industry training is a good knowledge of various aspects such as work ethic, know the

rules system department, arranging the machines, to recognize the wide range of

e!uipment industries. %ere also can be applied to the learning sciences during college

days to the working world. Therefore, it can improve the performance of control

communication between employees and customers, which is very important in any

other industry. )ollowing this, the place is a bit of learning can be applied to any other

company and it will provide useful experience in the future. *tatschippac provide a good

environment to do any work. *tatschippac also gives a free and relaxing environment to

worker as long as they get their job done at the specific time given by manager. ll the

tasks have given is suitable to the trainee, if the task is too heavy for trainee,

*tatschippac engineer will help and teach the trainee how to solve it.

. *uggestion

(y suggesting is *tatschippac (alaysia must give training and schedule for new

trainee to make sure they can learn and get knowledge faster rather than self#centered

in the beginning, fter two weeks then let the trainee be self#centered so they may

explore new thing and understanding the principle of works that were given.

Im also suggesting that *tatschippac (alaysia assign each trainee to only one

engineer, it is to make sure the engineer and the company know the valuable and

potential of the trainee. The engineer can works as a mentor give new knowledge to

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trainee and make sure after three month the trainee itself can already be independent

and trust them to be on site without engineer or supervisor.

*tatschippac (alaysia need to provide tools enough tools for trainee. This is

important because the trainee can do and solve the problem without any problem. lso

can solve the problem in a day without delay the problem two or three day. The most

important suggestion is always do the meeting each month with trainee. 'iscuss the

problem that trainee face. This will make all the work goes smooth.

CHAPTER 2

CONC8U*ION

2.1 Conclusion

'uring training, *TT*-hippac (alaysia calibrated with the most experience

and knowledge. Training to assist in the preparation and presentation of the work itself.

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;ni7/ industry training exposes students to the world of work in order to relate the

theoretical knowledge and real industry application. Industrial training was a valuable

exposure for student to gain the working experience which we cannot find it by reading

any books or search on the internet. This kind of exposure should not be missed by any

student especially in technical area. Gnly by experience the real environment then

someone will more understand what they should do and what they should not do in

order to train themselves to be more independence especially when involving critical

thinking and decision. The industrial program have helped us to developed an

understanding of what is re!uired in the industry.

report intra

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