report on ical electronics to the ino collaboration
DESCRIPTION
B.Satyanarayana, TIFR, Mumbai For and on behalf of ICAL electronics team. Report on ICAL electronics to the INO Collaboration. Parallel Session 1 - ICAL Electronics. Date and time: 11 th July 2011, 10am Venue: Ajay Divatia Lecture Hall, VECC, Kolkata - PowerPoint PPT PresentationTRANSCRIPT
REPORT ON ICAL ELECTRONICS
TO THE INO COLLABORATION
B.Satyanarayana, TIFR, MumbaiFor and on behalf of ICAL electronics team
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Parallel Session 1 - ICAL ElectronicsDate and time: 11th July 2011, 10am
Venue: Ajay Divatia Lecture Hall, VECC, Kolkata
Update and status of ICAL Electronics activities: B.Satyanarayana, TIFR Study of Anusparsh based front-end board with RPCs: B.Satyanarayana, TIFR Report on chip development activities at IITM: Anil Prabhakar, IITM Development of prototype RPC-DAQ module: Mandar Saraf, TIFR Feasibility studies of DRS for ICAL Electronics: Deepak Samuel, TIFR Alternate approach for ICAL backend DAQ: P.Nagaraj, TIFR Validation of ICAL trigger scheme: Sudeshna Dasgupta, TIFR Progress on ICAL power supply systems: Satyajit Saha, SINP Roadmap and action plan till the next meeting: All
2
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Functional diagram of RPC-DAQ
8, LVDS pairs of unshaped comparator signals (I)
1, amplified & multiplexed RPC pulse on 50 (I)
3-bit channel address bus for multiplexer (O)
Power supplies (O) Threshold control (d.c.
or DAC bus) (O)
Front-end to RPC-DAQ bus
3
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Design tools for TDC design Agreement with IMEC Already have an agreement for 0.35μm for the
front-end ASIC Now signed UMC NDA and IP agreement for
0.18μm mixed mode + RF (L180 MMRF) technology design kit & process
Europractice Faraday standard cell libraries
5
Licensed IPs
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Chip design activities at IIT Madras Front end amplifier (gain ~100, BW ~500MHz) Time to digital converter (delay line based, 50ps) Analog memory (64 samples, 2GSPS, 8-bit 10MHz ADC)
Comment: Right now DRS seems a good solution. Indigenous developments with similar capabilities will be welcomed
Designs will be submitted next month (August 2011) Chips expected sometime in October 2011 Characterisation and benchmarking will follow Requested detailed specifications of all these chips FPGA based TDC efforts are in good shape – 8-channel
chip seems possible. Useful right away
7
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Networked DAQ scheme Alternate to the “conventional” VME backend scheme The idea:
RPC module gets the capability to “acquire” and store its own data. Call this “Level 0” data
One “data concentrator server”, (one per N number of RPC's) collects RPC data, by either push or pull method, on master trigger. Call this “Level 1” data
One higher “Level 2” machine reads all “level 1” data
Benefits: Simple, standard, cheaper, hierarchical scheme Software development is easier Simpler data cabling (because terminated on local hubs) Interrupt driven data acquisition (level 0), client-server based DAQ (level 1),
monitoring and slow control are all handled this way Complete testing of RPC with a laptop and a HV/LV supply
8
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
SBC's based on ARM9 32 bit ARM9 cpu, fanless, 0.25W to 2W Board sizes 65mm x 65mm (approx) Example: Atmel Corp's AT91SAM9M10-CU,
400MHz Price: $18 per piece for MOQ of 100‘s Connectivities: Ethernet (Fast), USB, SPI General purpose digital i/o lines (few 10's of
them), 2 x 12-bit ADC 64KB ROM, 128KB RAM Linux 2.6, RTOS..
9
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Work to be done Study rates of data i/o in controlled network
environment, using normal servers/desktops with Linux/RTLinux
Obtain a few of the sample boards to get hands on experience
Understand network performance Integrating/interfacing, read out RPC signals
10
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Trigger scheme for ICAL Validation of the trigger schemes; document in good shape Ready to go for implementation Integration issues
Segment trigger module positions Pre-trigger signal driving issues
Specifications: Coincidence window: 100ns Maximum trigger latency: 1us Singles rate for RPC detector pickup strips: 250 Hz The skew and jitter in arrival instant of the global trigger at different RPCs should be
as low possible
News: BARC team (Anita Behere et al) joined the trigger team for implementation
Document on the implementation scheme is not yet place
11
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Software News: BARC team (Diwakar, Padmini et al) joined the software
team Backend Data Acquisition and Monitoring System
Event Data Acquisition Periodic Online Monitoring of RPC Parameters Event Data Quality Monitoring Control and Monitoring Console Local and Remote Consoles
Front-end firmware/software will be responsibility of the TIFR group Scope for more players (especially physicists) Technical document which will form part of the ICAL Electronics
TDR initiated
12
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Power supply issues HV (RPCs) and LV (electronics)
Generation, distribution, control and monitoring (V & I) Centralised versus local (DC-DC/DC-HVDC) Solutions for both schemes identified Technical, integration and cost considerations Consolidated proposals based on prototype
development and studies are needed urgently Only then the collaboration can choose one or the
other scheme Efforts to be led by SINP, ECIL, etc. Man power requirement from SINP
13
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Integration issues Mounting of electronics on top of RPC is not liked – wasting
of space/volume Suggestion to mount on the sides Increase the shamperred areas on four corners of the RPC Mount DAQ for two planes (X & Y) and power supplies (LV,
HV) in these areas Front-ends to be mounted along the planes Issue of pickup-strips to the front-end solved automatically! Modeling and prototyping in progress Industrial dimensions of glass is helping this scheme
14
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
More electrons well come Happy to listen to Samit Mandal’s talk It will be nice to direct and integrate these efforts
towards ICAL Electronics We all must all work in the same “cave” – the
cave where ICAL will be located There are many unclaimed areas that could be
grabbed Slow control and monitoring Signal fan-out, synchronisation and calibration
issues
15
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Documentation and refereeing TDC specifications finalised, thanks for your feedback Specifications of trigger system will be announced very soon Recent work and characterisation done (ref. DRS studies etc.)
helped improve front-end specifications Reflection problem encountered during DRS studies needs
further understanding about impedance matching. Or is there something that we are missing?
Progress towards preparing the ICAL electronics document is not satisfactory. Is the end of this year a reasonable deadline?
The document should be wetted by a panel of external experts (national and international)
16
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Additional tools For effective communication – among the collaborators (not chips
for a change) Anil Prabhakar proposed a package called “Redmine”. Will explore
and setup Improvements to INO Wiki were suggested BTW: If you have not subscribed to HyperNews already, please do
it TODAY – it is a pain to send mass mails, always with a potential danger of missing some key names
Please write to [email protected] with your name, affiliating institute/university, groups to be subscribed to by default etc.
Everybody will be subscribed to “News and Announcements” and “Meetings” groups by default
17
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Questions to the Collaboration Noise rates and trigger rates underground
Noise rate numbers used by SudeshnaTrigger rate numbers in the Blue bookMy proposed experiments with sealed RPCs
Pitch and number of pickup strips Area(s) of RPC gas gaps
18
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
19
Backup slides
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Discussions at the ICAL Electronics Meeting, IIT Madras, August 9-11, 2010 Interconnection between RPC strips and preamp inputs (SINP/TIFR) Problems with FPGA TDC (Hari, Sudeshna) Problem with ASIC TDC (3rd stage interpolation, Pooja) ASIC or FPGA TDC? If FPGA TDC, can we include all other logic (+ data transmitter) into it? Can the 8-in-one FE board have TDC as well? This automatically means we will have TDC data for all channels. FE output in LVDS? Depends on the above Power supplies (LV and HV), distribution and monitoring – indigenous, commercial, semi-commercial, dc-hvdc
(SINP/VECC) Network interface from RPC to the backend: Ethernet, fibre, w/l (IITM)
Controller, n/w controller, Beegle board, Msp430 TI chip 6-9 weeks
Problem regarding FPGA as trigger element (Mandar) Calibration/synchronisation of global signals and data paths Backend standard, alternate to VME Distributed backend? Trigger system – segmentation (James, Mandar, Sudeshna, Pooja) Trigger-less system – any takers, on back foot for now? Supernova trigger? Waveform sampler (Nagendra) GPS based RTC
20
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Discussions at the ICAL Electronics Meeting, IIT Madras, August 9-11, 2010 Interconnection between RPC strips and preamp inputs (SINP/TIFR) Problems with FPGA TDC (Hari, Sudeshna) Problem with ASIC TDC (3rd stage interpolation, Pooja) ASIC or FPGA TDC? If FPGA TDC, can we include all other logic (+ data transmitter) into it? Can the 8-in-one FE board have TDC as well? This automatically means we will have TDC data for all channels. FE output in LVDS? Depends on the above Power supplies (LV and HV), distribution and monitoring – indigenous, commercial, semi-commercial, dc-hvdc
(SINP/VECC) Network interface from RPC to the backend: Ethernet, fibre, w/l (IITM)
Controller, n/w controller, Beegle board, Msp430 TI chip 6-9 weeks
Problem regarding FPGA as trigger element (Mandar) Calibration/synchronisation of global signals and data paths Backend standard, alternate to VME Distributed backend? Trigger system – segmentation (James, Mandar, Sudeshna, Pooja) Trigger-less system – any takers, on back foot for now? Supernova trigger? Waveform sampler (Nagendra) GPS based RTC
21
Discussion meeting on ICAL electronics SINP, Kolkata April 29-30, 2011
Software components RPC-DAQ controller firmware Backend online DAQ system Local and remote shift consoles Data packing and archival Event and monitor display panels Event data quality monitors Slow control and monitor consoles Database standards Plotting and analysis software standards OS and development platforms
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Architecture of front-end ASIC
23
Amp_out
8:1 Analog Multiplexer
Channel-0
Channel-7
Output Buffer
Regulated Cascode
Transimpedance Amplifier
Differential Amplifier Comparator
LVDS output driver
Regulated Cascode Transimpedance
Amplifier
Differential Amplifier Comparator LVDS output
driver
Common threshold
LVDS_out0
LVDS_out7
Ch-0
Ch-7
C 1 2
J 7
I / P 7
1
2
SW
01
2
R 1 7
C 6
SW
11
2
U 1C L C C 4 8
lv d s _ ou t n 32 9
lv d s _ ou t p 32 8
lv d s _ ou t n 42 7
lv d s _ ou t p 42 6
lv d s _ ou t n 52 5
lv d s _ ou t p 52 4
lv d s _ ou t n 62 3
lv d s _ ou t p 62 2
lv d s _ ou t n 72 1
lv d s _ ou t p 72 0
gn d !1 9
vdd!
18
lvds
_cm
_bia
s_in
42
com
p_bi
as_i
n41
diff
_bia
s_in
40
rcm
_bia
s_in
39
vth
38
vcm
37
vss
36
lvds
_out
n135
lvds
_out
p134
lvds
_out
n233
lvds
_out
p232
dvdd
31
d g nd3 0
lv d s _ b ia s _ in43
v d d44
v s s45
in146
in247
in348
in41
in52
in63
in74
in85
v s s 16
vdd1
7
buff
_bia
s8
buff
_out
9
vdd1
10
vss1
11
S0
12
S1
13
S2
14
S3
15
lvds
_out
p816
lvds
_out
n817
R 1
+ 3 . 3V (A )
R 2R 3R 4R 5
SW
212
R 1 8
R 6R 7
P 2
R 8
R10
SW
31
2
AGR 9
C 9 C 1 0
R 19
C 1 1
L 3
AG
+3 .3 V (D )
D 1 D 2
+ 3 . 3V (A )
C 1 3
P 3
D 3 D 4
D 5 D 6
L2
D 1 8
AG
DG
C 14
L 1
10mH
10mH
10mH
C 2 5
1N4148D1-D16
10mH
10mH
AG
C 4
L 5
P 1
C 3
P 8
+3 . 3V (D )
AG
C 2 9
DG
R26
R 1 3
C 2 6
D 7 D 8
AG
D 9
AG
AG
D 10
D 1 1 D 12
D13
AG
D 14
OUT8+
D15
OUT8-
OUT1-OUT1+
OUT7-OUT7+
D 16
OUT3+OUT4-OUT4+OUT5-OUT5+OUT6-OUT6+
OUT2-OUT2+OUT3-
RPC OUTPUT SIGNAL
R 1 4
AG
DIFF
EREN
TIAL
OUT
C 20
R 2 4
C 2 1
DG
TP 6 1
R 2 3
C 2 2
AG AG AG
AG
R 2 2
DG
L4
C24 to C320.1uF
+3 . 3V (A )
R 2 1 R 2 0
C 7
C 2 3
DG
R1 to R818E
AG
+3 .3 V (A )
C 3 0
C 27
DG
AG
R 27
TP 7
1
VSS1 = Analog Ground
10mv , Tr= 10ns , C+100pf ~ 100uA
+ 3 . 3V (A )
VSS = Analog Ground
C 8
ANUSPARSH TEST BOARD
DGND = DigitalGround
AG
R 1 2
AG
AG
C 31
J 1 0L E M O
1
2
AG
+3 . 3 V (A )
D 1 7
R 1 5
P 7
+ 3 . 3V (A )
+3 . 3 V (A )
J 6
I / P 6
1
2
AG+ 3 . 3V (A )
R25
J 5
I / P 5
1
2
C 1 5
J 4
I / P 4
1
2
P 6
J 3
I / P 3
1
2
J 2
I / P 2
1
2
J 1
I / P 1
1
2
J9
J 8
I / P 8
1
2
C 1 6
+ 3 . 3V (I )
P 5
C 2
AG
+3 . 3 V (D )
J 1 1
C O N N F L E X 16
123456789
1 01 11 21 31 41 51 6
D G
P 4
+ 3 . 3V (A )
AG
AG
C 5
C 2 8
C 1 7
C 3 2
C 2 4
D 2 0
C 1 8
+ 3 . 3V (A )
C 1
AG
DG
DG
R 1 6
C 1 9
Testing of front-end board on RPC
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
8-channel front-end board
25
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Features of the front-end board 8 amplifier + discriminator channels Gain = Output voltage/ Input current Typical gain obtained with the test setup 4-5mV/μA The designed gain was 8mV/μA; but reduced on board to contain
instability 0.1μF capacitor is placed at input as RPC strips are terminated
using 50Ω Resistors. Multiplexed buffered analog (inverted) output available
Buffered analog signal = ½ actual output (due to 50Ω termination) Comparator threshold = Voltage@pin38 – Voltage@pin9 Discriminator output in LVDS logic (4mA)
26
Linearity studies of the front-end board
Channel-to-channel gain variation is a concern
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Testing of front-end boards with pulser
FEB - 1
FEB - 2
28
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Work in progress and action plan Study of amplifier gain and buffer output signal linearity using
external pulser Detailed study of threshold adjustment and its stability Try finer threshold adjustment by connecting a 100KΩ resistor to
either side of P2 trim-pot (which is100KΩ) Calibration of threshold for RPC using noise rate and efficiency
parameters Integration of front-end board with RPC stack at TIFR Revision of the chip
Solve instability problem while the multiplexer is turned onSeparate chips for positive and negative inputs as well as amplifier
and discriminator might anyway solve this problem
29
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Role of waveform sampler for ICAL Walk correction of TDC data Leading edge discriminator Time over threshold information Pulse profile, height and width monitoring Remote display of RPC signals
30
8+1 channels, 1024 cells
700MSPS to 6 GSPS
Cascading of channels or chips allows deeper sampling depth
2.5V supply, 140 to 320mW
Multiplexed or parallel output
Differential I/O (950MHz BW)
Maximum readout of 40MHz
Specifications of DRS4 waveform sampler
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7
IN8
STOP SHIFT REGISTER
READ SHIFT REGISTER
WSRO UT
CONFIG REGISTER
RSRLOAD
DENABLE
W SRIN
DW RITE
DSPEED PLLO UT
DOMINO WAVE CIRCUIT
PLL
AGND
DGND
AVDD
DVDD
DTAPREFCLKPLLLCK A0 A1 A2 A3
EN
ABLE
OUT0
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8/M UXOUT
BIASO-O FS
ROFSSROUT
RESETSRCLK
SRIN
F U N C T IO N A L B L O C K D IA G R A M
MUX
WR
ITE
SHIF
T R
EGIS
TER
WR
ITE
CO
NFI
G R
EGIS
TER
CHANNEL 0
CHANNEL 1
CHANNEL 2
CHANNEL 3
CHANNEL 4
CHANNEL 5
CHANNEL 6
CHANNEL 7
CHANNEL 8
MUX
LVDS
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Can be tested today on the RPC stacks Front-end board with the current board’s form-factor, but using ASICs RPC-DAQ board with:
TDC Waveform sampler Strip-hit latch and rate monitor Controller + data transreceiver Firmware for the above Pre-trigger front-end TPH monitoring Pulse width monitoring Front-end control Signal buffering scheme and GP area or ports for accommodating new blocks
VME data concentrator module Result: Complete readout chain is tested Can we use this for RPC QC test stands or what?
Proof of principle effort (RPC-DAQ) D
iscussion meeting on IC
AL E
lectronics S
INP, K
olkata, A
pril 29-30, 2011
32
INO Collaboration Meeting VECC, Kolkata July 11-13, 2011
Prototyping of RPC-DAQ module Using IITM designed MSP430 board Digital logic (rate scalers, latches etc.) in FPGA
on a trainer kit SPI interface between the two Serial interface between the MSP board and the
PC/host Appropriate signal translators for the existing
system Will lead to a pilot RPC-DAQ board design
33