_________________________________________________

RFP for

Fabrication, Assembly and Testing of

Tile Control Units (TCU)

__________________________________________________

This document contains proprietary information of SAC/ISRO, Ahmedabad and is protected by copyright laws and international treaties.

Unauthorized copy or reproduction of this document in whole or in part without the prior written consent of SAC/ISRO is strictly forbidden

and constitutes a copyright infringement.

SAC/ISRO reserves the right to alter this information at any time without notice.

© Copyright 2016, by SAC/ISRO, Ahmedabad

Contents

1.0 Introduction ............................................................................................................................ 4

1.1 General overview ................................................................................................................... 5

1.2 Scope of Work ........................................................................................................................ 6

1.2 SAC Responsibilities .............................................................................................................. 13

1.3 Vendor’s Responsibilities ..................................................................................................... 13

1.4 Deliverables by the vendor ................................................................................................... 16

1.6 Details to be provided with the proposal ................................................................................ 16

1.7 Inspection of Vendor’s Facilities by SAC Team ..................................................................... 18

1.8 Other Terms and Conditions / Important Guidelines ........................................................... 18

ANNEXURE A1: Product Assurance Requirements ............................................................................... 21

ANA1-1.0 Introduction .................................................................................................................. 21

ANA1-2.0 Applicable Documents .................................................................................................. 21

ANA1-3.0 Reliability .................................................................................................................. 21

ANA1-4.0 Environmental Specifications ....................................................................................... 22

ANA1-5.0 Parts .............................................................................................................................. 23

ANA1-6.0 Materials ....................................................................................................................... 27

ANA1-7.0 Storage of Hardware, Parts, & Materials ..................................................................... 28

ANA1-8.0 Processes ...................................................................................................................... 28

ANA1-8.1 Verification of Process Quality (VOPQ) ........................................................................ 29

ANA1-9.0 Process Identification Document (PID) ........................................................................ 29

ANA1-9.1 Fabrication Documentation .......................................................................................... 29

ANA1-9.1 Fabrication Sequence ................................................................................................... 29

ANA1-10.0 QUALITY CONTROL (QC) ................................................................................................. 30

ANA1-11.0 QA AUDIT .................................................................................................................. 30

ANA1-12.0 MARKING AND IDENTIFICATION .............................................................................. 31

ANA1-13.0 TRANSPORTATION .................................................................................................... 32

ANA1-14.0 TEST PROGRAMME ................................................................................................... 33

ANA1-14.2 TEST PLAN: ................................................................................................................ 34

ANA1-15.0 TESTS......................................................................................................................... 36

ANA1-16.2 MINOR NC: ..................................................................................................................... 46

Annexure A2 : Technical Details of TCU ............................................................................................... 55

AN A2.0 Introduction to Tile Control Unit . .................................................................................. 55

AN A2.1 Bill of Materials for TCU..................................................................................................... 55

AN A2.3 Power Supply Requirement of EPC of TCU module .......................................................... 57

AN A2.4 TCU Interface Signals ........................................................................................................ 57

AN A2.5 Typical test set for TCU ..................................................................................................... 60

Scope of Work and General Guidelines

1.0 Introduction

Indian Space Research Organization (ISRO) is currently engaged in the development of a number of

remote sensing satellites for various land and ocean applications. A number of digital electronic sub-

systems are under various stages of development for the payloads of these satellites. It has been

ISRO’s policy to involve Indian Industries for the production of existing proven designs and fabrication

technology as per project requirements and realize the space qualified systems, components and

hardware, indigenously.

For the Flight Model production, ISRO proposes to involve qualified vendors from the industry for

fabrication and testing of these sub-systems. The selected vendor will have to assume full

responsibility for the delivery of Flight Worthy modules after qualification, ready for integration with

the other units of the payload on a turn-key basis. In this context, the Indian Space Research

Organization requests the Indian industries having the capability and experience in the above field

with past heritage, to submit a detailed proposal for the Hi-Rel Space grade component procurement,

Fabrication, Assembly, Testing and Qualification of Hi-Rel Space Qualified Sub-systems.

This Request For Proposal (RFP) document provides the details of the work involved, delivery schedule

etc. apart from the relevant product assurance details. The details identified may undergo some

changes due to the on-going refinement of the requirements. The process and flow given in this

document are also indicative in nature and may undergo revision after the preliminary review with

the vendor.

It is very important for our evaluation of your offer that your proposal should include sufficient

technical details of the proposed approach. It should be clearly understood that these are on-board

systems for space usage, where highest quality and reliability are expected to be built in to the system.

For this purpose, the vendor shall follow all necessary guidelines for on-board fabrication practiced

by ISRO / MIL. The quality assurance requirements are provided in the annexure to this RFP and

further details will be provided at appropriate time during the execution of the contract. It shall be

the objective of the vendor to ensure the fabrication and delivery of reliable sub-systems / modules

for Space Application.

The terms supplier, vendor and Contractor have been used interchangeably throughout this

document and they all mean one and the same.

This RFP consists of:

1. General overview

2. Technical specifications

3. Scope of Work

4. Responsibilities of Vendor / SAC

5. Deliverables, Time Schedule

6. Terms & Conditions

7. Typical sequence of events & guidelines to vendors for submitting the offer.

8. Reliability & Quality Assurance requirements

1.1 General overview

The RISAT-1A antenna has a distributed hierarchically control system. Payload controller (PLC) is at

the first level followed by Tile control unit and then TR module controller (TRC). Tile Control Unit (TCU)

is at 2nd level of controller hierarchy of RISAT-1A, it gets inputs from PLC and generates serial

commands for TRC.

Major Specifications of the Tile Control Unit (TCU)

Reference Clock 3.90625MHz ( input )

Serial Interface with PLC Dual RS-485 serial interface with PLC

(10172 baud rate, 8 data bits, 1 stop bit, no parity)

EPC Clock 200 KHz Frequency and 10% duty cycle

PCPU On/ Off signals 100 ms pulse width

24 On and 24 OFF pulses generation in staggered way (without overlap)

Timing Signals for TRC RS422 Interface

PCB Details 380 mm X 75 mm X 2.4 mm , 10 layers

TCU Tray size 395mm X 80mmX 37mm

Weight ~600gms

The block diagram of Tile Control Unit (TCU) is as shown in the figure-1. A TCU package contains both

main and redundant TCU units. The main and redundant units have separate power supply (EPC) and

at any time only one of them is powered ON. The TCU contains custom ASIC, 32KB OTP PROM, RS-422

receivers, RS-422 transmitters, RS-485 Tran receivers etc. TCU receives input control signals over RS

422 interface. The serial data is through half duplex RS-485 interface. The ASIC in the TCU module

uses this serial data information along with the mode of operation, which are available as additional

inputs to do a Look up table search in the data which is stored as a part of code in the PROM. A

readout of the Look up table results in output of 96 words per TRC corresponding to that of Amplitude

and phase for both V and H polarization. The ASIC generates ON/OFF Pulsed signals to control power

supplies of each TRCs. TCU generates output control signals over RS 422 interface which are interfaced

to TRCs. The ASIC of TCU contains an 8051 micro-controller IP core operates at a maximum frequency

of about 4 Mhz. The clock signal for the TCU module is fed as an input from PLC.

1.2 Scope of Work

The sub-systems addressed in this RFP is Tile Control Unit (TCU). This unit is implemented using mostly

digital electronic circuits. This RFP is intended for carrying out the component procurement as per

SAC R & QA requirement listed in Annexure A1, Fabrication, Assembly and Testing / Qualification

Figure 2: Photo of final assembled FM TCU of RISAT-1

395mm X 80mm X 37mm

Figure 1: Block Diagram of TCU

including environmental testing of Tile Control Unit (TCU). The total work quantum described above

in the realization of the unit can be typically divided in following stages,

(A) Mechanical and Electronic Fabrication

(B) Procurement of parts and inspection

(C) Components mounting, assembly and packaging

(D) Functional Testing

(E) Data review by SAC

(F) Acceptance/Qualification level environmental testing

These fabrication activities are to be carried out by vendor as per SAC/ISRO qualified processes and

by SAC approved vendors, with quality control at each step, as per the SAC approved fabrication and

test documents.

Activities in detail are given as below,

A) Mechanical and Electronic Fabrication

SAC will supply PCBs and AutoCAD/Gerber/DXF files of all mechanical Housing.

Mechanical fabrication includes the following:

i) Fabrication of aluminum packages and cover plates.

ii) Black-anodization and Chromatization (Surface Treatment) of aluminum packages

as per ISRO requirements.

iii) Jigs and mounting accessories required for fabrication and testing

iv) Fabrication of Dummy companion package of TCU (i.e. EPC package) for vibration

testing.

Post-fabrication compatibility check is performed to ensure the mechanical compatibility of

package with PCB.

B) Procurement of parts and inspection

i) Procurement of Space grade electronic components as mentioned in Annexure- AN

A2.1

ii) Procurement of mechanical hardware, All components as per the requirements given

in this document

iii) Incoming inspection of parts and materials. Datapack and COC of received

components shall be provided for SAC review.

C) Component mounting, assembly and packaging

Mounting of all components including the components provided by SAC as Free-Issue

Material (FIM).

Following processes are involved,

i) Mounting of through hole components like connectors on PCB

ii) Mounting of discrete SMD components like chip capacitors, resistors, active devices

on PCB

iii) Lead forming, cutting, tinning and soldering of 256 pin CQFP OBC-ASIC.

iv) Dam and fill of 256 pin CQFP ASIC.

Fabrication sequence may be modified depending upon approved fabrication

processes

D) Functional Testing

Unit testing is carried out in following phases:

i) Assembling of TCU with FM EPC (Electronic Power Conditioner) supplied by SAC.

OR

Fabrication of dummy EPC package and assembling with TCU package (in case

of non-availability of FM-EPC units).

ii) Functional Testing using EPC (FM/QM/DVM) supplied by SAC

iii) Verification of performance of the sub-system over given temperature range.

E) Data Review by SAC

Data review for QM will be done as below,

i) All electrical measurement.

F) Acceptance/Qualification level environmental testing

1. Qualification Testing

The QM assembly will go through qualification level test. Qualification testing is a set of tests

carried out on one unit to qualify the fabrication with a given set of part process and material.

This also demonstrates the available performance margins of the unit under given operating

conditions. It includes various tests such as Burn-in, EMI/EMC/ESD tests, vibration/Shock test,

thermal vacuum test, Life test etc as per list and details included in annexure –A1, Tests

section of this RFP.

Acceptance test on FM units shall be started only after review & clearance of Qualification

tests results by SAC.

2. Acceptance Testing

Each FM unit shall go through acceptance level test. Acceptance testing is a set of tests carried

out on each unit to verify the workmanship and performance of the unit under given

operating conditions. It includes various tests such as Burn-in, EMI/EMC tests, vibration test

and thermal vacuum test etc as per list and details included in annexure –A1, Tests section of

this RFP.

The units are required to undergo the above tests successfully, meeting all the specifications, before

delivery to SAC.

Vendor should have capability in terms of fabrication facility, storage facility and test facility as well

as necessary technical expertise to build, optimize, test and deliver the high reliability product.

In order to perform the above mentioned tasks, the various activities to be performed by the vendor

are described in the following paragraphs. The basic flow of activity is given in Fig 3. The detailed

Process Flow is depicted in Figs 4 to 6. The Product Assurance requirements are given in Annexure A1

and Brief Description, Bill of Material and preliminary package details are given Annexure A2.

Tendering Process Leading to award of the

Contract to selected Vendor(s)

Initial Technical Deliberations Leading to a draft

Process Identification Doc for the job

Prototype Production Leading to 1. Finalization of PID 2. Complete Process Acquaintance for the Vendor(s) 3. Clearance for FM fabrication

Qualification Program Leading to Qualification of the Design and Process

FM Production Leading to Supply of Requisite Hardware for Payload Assembly / Integration

Figure. 3 The Basic Flow of Activity

VENDOR RESPONSIBILITIES (DEVELOPMENT PHASE)

Draft PID Generation

Draft PID Review

SAC RESPONSIBILITIES

First Batch Mechanical Housing

Fabrication

Incoming Inspection

(Visual)

Forming & Soldering of

PROM

Dam&Fill and Conformal Coating

Compatibility Checks with

Connectors mounted and

Temporary Assembly

Forming of Components As per ISRO Guidelines

Populating PCBs

Go / No-GoTesting @ Room Temperature

Proto Test

ProgrammeAsPer Annex.

1 and Documentation

Review of Processes and

Prototype Test Results

PID Finalization

Drawing

Finalization

Followed by

Subsequent

Fabrication

G1

Prototype Start

G2

Procurement of Required material

/Component including

consumables

PROM programming by

SAC & Return to Vendor

for Soldering

GCU & EPC

Figure. 4 Detailed Process Flow for the Job (Part-I)

Send unformed

PROMs to SAC for

programming

Placement Diagram and

related information if

any

Award of Contract

Initial Technical Inputs

and Requirements

SAC Participation in PID

Evaluation

Mechanical Package

drawings and

Fabrication Related

Information

Partial Components and

PCBs and Guidelines For

Storage And Handling

Details and Guidelines

for forming of

Components

QA Audit

Monitoring, Quality Audit, Online

Course Corrections; Components

and PCBs

VENDOR RESPONSIBILITIES (QUALIFICATION PHASE) SAC RESPONSIBILITIES

G1 G2

Start of Qualification Phase

Execution of the Qualification

Programme as per the finalized

PID and Test Details of Annexure

1

Review of the Results

Qualification Complete

Mechanical Enclosures Ready for at least the First Batch of FM Production, work in progress for further batches of production.

Fabrication of Mechanical

Housings for Qualification

phase

Figure. 5 Detailed Process Flow for the Job (Part 2)

Review of First Batch Results

Start of FM Production Phase

FM Production as per Details in

Annexure 1 and the finalized PID

Completion of Production Activity

Continued

Mechanical

Fabrication of

Housings for FM

Review of Overall LAT Results

Supply of All Deliverables

Lot Accept-ance Tests

1.2 SAC Responsibilities

The end user (SAC) will provide the following inputs to the Vendor, during different stages of the work

execution:

1. SAC will issue OBC-ASIC (Flight Model) component and flight model PCBs in required nos. for

use in these modules as “Free Issue Material” to the vendor against the Bank Guarantee.

Rest of the components from Bill of Material has to be procured by Vendor as per details given

in Annexure AN A2.1. Strict QA guideline as per Annexure A1 for procurement of components

has to be followed and screening results of these components has to be submitted to SAC for

review.

2. Approved Schematics and Component Placement diagram

3. Programming of OTP PROM.

4. Graphical User Interface (GUI) and Ground Check-out Units (GCUs) for testing of the TCUs will

be provided by SAC.

5. Providing DVM/QM/FM Electronic Power Conditioners (EPC) unit for integrated unit testing.

6. Approved Mechanical package fabrication drawings and list of accessories. Package

dimensions are given in Annexure A2.

7. The fabrication drawings of the companion unit of TCU (of similar to TCU dimensions but

mirrored) necessary for vibration testing will also be provided. The fabrication drawings of

the cover plate.

8. The specifications of the material, methodology, and qualification requirements for performing the “dam and fill” procedure for the CQFP devices.

1.3 Vendor’s Responsibilities

The Vendor will be responsible for carrying out the following activities and also for actions arising out

of non-conformances at various stages.

The major activities include:

1. Procurement of all electronic and mechanical fabrication materials including all the required

consumables (which need to be used for electronics & mechanical realization, and

environmental testing). All electronic components have to be procured by Vendor as

indicated in Annexure AN A2.1 Bill of Material; except OBC-ASIC and PCBs, which is free issue

material against Bank guarantee.

2. Incoming inspection of all components including electronic components, PCBs and fabrication

materials like solder, flux, epoxy etc. as detailed in Annexure A2. Apart from environmental

controls of temperature and humidity, the electronic storage area shall meet class 100,000

cleanliness requirements as a minimum and shall have all the ESD safety precautions

implemented. The work area shall meet the requirements of ISRO-PAX-300.

3. SAC QA approved Fabrication drawing of mechanical housing (trays) will be provided by SAC.

Fabrication of the mechanical housing shall be entrusted to a vendor only after obtaining prior

approval from SAC. For the TCU modules the choice of materials is Aluminum Alloy 6061 for

the enclosure and SS for the fasteners.

4. Surface treatment of the enclosure needs to implemented which includes Black-anodization

and Chromatization as per ISRO requirements. Incoming inspection and quality control of

these packages are also to be performed by qualified and experienced inspectors.

5. Forming of components (wherever necessary especially for the fine pitch 256 pins CQFP

devices) as per the land patterns on the PCB. The vendor should be in possession of the

necessary equipments, tools, jigs etc. The forming process also must have to be qualified.

6. Compatibility checks between the mechanical package and the PCB and mounting of

connectors on the package and soldering of the same.

7. Populating the PCBs with all the other devices as per the layout and placement diagrams

provided. The devices consist of fine pitch CQFP devices of 256 pins (0.5 mm pitch) as well as

flat pack / DIP devices. This activity has to be carried out at a fabrication facility qualified /

approved by ISRO for Flight Model fabrication work.

8. The power supplies to be used for testing during initial bench as well as environmental testing

have to be procured by the vendor. The details of the power supply requirements are given

in annexure A2.3. These supplies have to be very reliable with all in-built protections and

procured from only reputed manufacturers. Set of general purpose test equipment required

for testing of these digital sub-systems e.g. Logic Analyzer, Oscilloscopes, Pattern Generator

etc. are expected to be available with the vendor.

9. Before these packages are subjected to the environmental tests, it is necessary that the CQFP

devices are protected by the “dam and fill” procedure and the PCBs conformally coated. The

vendor should have trained and qualified manpower for performing this activity.

10. Assembly of PCBs in its housing ( “tray” )

11. Testing of the populated boards for compliance with the specifications as per details given.

12. Fabrication of the required handling fixtures, jigs etc. in adequate numbers necessary for

performing all the internal fabrication and environmental testing (e.g. vibration testing). The

fabrication drawings for these have to be generated by the vendor.

13. Fabrication of dummy mechanical package(s) as per the designs provided by SAC, for the

companion units of each TCU (i.e. Dummy EPC) and assembling it with the TCU.

14. Performing full environmental testing including vibration, thermovac, EMI/EMC etc. tests for

TCU. The sequence and the levels for each of these tests for all the phases are provided in

Annexure A1.

15. Generation of PIDs for the above activities as applicable as per ISRO guidelines and getting

approval by SAC Quality Assurance.

16. Fabrication of the containers for transporting these modules outside the vendor’s premises

any time in between or at the end of the contract.

17. Generation and supply of the test data in predefined format.

18. Generation of all the other deliverables identified in this RFP

Sr.

No.

Activity Responsibility Remarks

SAC Vendor

1)

Fabrication document ( SAC approved mechanical

drawings, components list, assembly details and

fabrication sequence)

2) Testing Procedures (To be prepared by Vendor and to be

reviewed and approved by SAC).

3) To get SAC QA approval of procurement of Space grade

electronic components

4)

Procurement of components as per Bill of Material

(Annexure –A2) and their incoming inspection & batch

acceptance tests / COC

5) OBC ASIC and PCB for TCU

6)

Mechanical Hardware Fabrication for TCU and its

companion Unit (i.e. dummy EPC) including all surface

treatments

7) OTP PROM Programming

8) Cutting forming for CQFP 256 pin ASIC, Dam and Fill

9) Electrical Hardware Fabrication and QC (Including DC

harness)

10) Assembly and packaging of TCU

11) R & QA audit at various stages

12) Calibrated Test Equipments & Facilities

13) Issuing Electronic Power Conditioner (FM/QM/DVM)

14) Ground Checkout Unit for testing TCU

15) Functional testing of TCU using GCU

16) Functional testing

17) RTV and araldite application

18) Rework and re-optimisation, if required at any stage

19) T&E

20) Documentation of test results & compliance chart

21) Shipment clearance

22) Delivery of Fabricated units to SAC in ESD safe container

1.4 Deliverables by the vendor

Units and Documentation to be supplied by Vendor for review and approval by SAC at appropriate

stage of execution:

1. Assembled, packaged and qualified units as per the order

2. Documentation as per Annexure- A1

3. All spare unconsumed components

4. Data pack of the all the procured components

1.5 Delivery Schedule

A tentative schedule is provided below :

Acceptance of Purchase Order by Vendor : T0

Finalization of draft PIDs : T0 + 4 months

FM production Phase : T0 + 4 months- T0 + 12

months

The vendor shall provide a detailed Development Plan along with his proposal. This plan should

give the detailed schedule, implementation plan, expected man power deployment, major

milestones etc. The delivery schedule shall be presented in a bar chart form showing sequence

and time of all important activities e.g. fabrication, testing etc. including reviews.

1.6 Details to be provided with the proposal

The prospective vendors should bring out full details of their technical competence for undertaking

project of this nature, in the technical part of their proposal document. A preferable format is

provided in the following table. The vendor is encouraged to provide any relevant additional

information.

Sr. No. DESCRIPTION DETAILS

1 Year Of Establishment

2 Vendor’s Area Of Core Competence / Activities

3 Infrastructure Details (Area, Facilities Etc.)

4 Annual Turnover in the last two financial years

5 Contribution of Hi-Rel fab / testing activity to the annual turnover of the

company Value of major orders currently being executed with client’s

name, Address etc.

6 Value of major orders currently being executed with client’s name,

Address etc.

7 Number Of Technical Manpower with breakup of Engineers,

Technicians, Tradesman etc.

8 Capability of Hi-Rel fabrication and testing in terms of no. of products

completed, manpower experience profile etc.

9 List of in house facilities with qualification Status (Clean room facilities

with area, relevant test equipments and environment test facilities etc.

…….)

10 Any tie-ups with relevant / specialized companies proposed for this

activity and list of their facilities with qualification Status

11 No. of Skilled and ISRO certified technicians for fabrication and

inspection of Hi-Rel assembly work and testing

12 expected man power deployment for this work (including number and

level of experience )

13 Quality Certification (ISO-9000 Etc.) and Internal QC procedures followed

14 Details Of Customer Base In India

15 Details of such major orders executed / currently in progress especially

for organizations like ISRO, DRDO, DAE etc. Sample reports with

customer’s / project details may be attached.

Vendor should submit their offer in two parts

Part1: “Detailed Technical Proposal” giving all details as per RFP.

Part2: “Commercial Details” giving cost, payment terms and other financial details in separate sealed envelope.

Technical proposal should also include all the details given in commercial proposal without prices (Prices should be masked).

The prospective vendors should provide the pricing information with the following break-up in the

price bid part of their proposal document.

Item Charges(in slabs) Remarks

TCU Component

procurement &

Fabrication Charges

TCU Testing charges

including all

environmental tests

Mechanical Housing

(Tray) Fabrication

Charges for TCU and

dummy companion

packages using Al alloy

and SS fasteners

As per

drawing

supplied by

SAC

The vendor should provide Quotation for One QM-TCU and FM TCU for a quantity slab 1-9, 10-14, 15 and above.

1.7 Inspection of Vendor’s Facilities by SAC Team

The vendor should allow inspection of their facilities by a SAC team, if found necessary, for an on the

spot assessment of their capabilities, prior to placement of order or at any later date during execution

of the contract. The vendor should be in a position to present and explain in detail sample products

manufactured earlier at his site to ascertain their capabilities.

1.8 Other Terms and Conditions / Important Guidelines

1. The Vendor is to examine the RFP thoroughly and offer point by point compliance for complete

RFP supported by technical documents. The quotation should be given in Indian rupees only

2. All vendors may be called for a pre-bid meeting / technical discussions and should be prepared to

attend the same at short notice. Vendors should make sure that competent technical personnel

attend the same.

3. Any deviations in any requirement in any of the item must be clearly mentioned along with the

offer

4. The vendor is required to clearly state in his proposal, all the assumptions made while finalizing

the proposal. If the vendor proposes to subcontract any part of the work to other Companies,

then the relevant details must be mentioned in the bid.

5. It is mandatory that the vendor should have their fabrication lines certified by ISRO and should

have prior experience of assembly, testing and qualification of Hi-Rel Digital subsytems.

Accordingly, vendor is required to submit the relevant documents along with their offer, without

which their offer shall not be considered. The criteria for the selection of vendor in terms of their

financial and technical capabilities are as below. a) Should be an Indian company with their design, fabrication and test facilities in India.

b) It is mandatory that the vendor’s PCB assembly lines as well as manpower should have ISRO’s certification, valid at time of bidding. Vendor is required to submit details of the available ISRO certified manpower with their total work experience for ISRO on-board projects.

c) Vendor is required to submit the complete details of contracts executed in last 5 years for the development of space qualified Digital products for on-board usage. Vendor should also provide the details like, customer reference, contact details, value of the contract as well as total time taken in executing each of such project/s from the date of award of the contract.

d) Vendor should have sufficient technical capabilities in terms of fabrication and handling test equipments. Vendor is required to provide the details of the available test equipments like, make, brief specifications, year of procurement, number of equipments, etc.

e) It is preferable that vendor should have all the test facilities required for the environmental testing of mentioned subsystems. Vendor is required to provide the details of the available test facilities like, number of equipments/chambers, capacity, etc. In case any of the facility is not available, please clearly mention the same and provide details of the outside facilities where the testing will be carried out. It is to be noted that SAC will not provide any of the test facilities for environmental testing. However, following special test facilities will be offered without any charge to vendor, executing this contract.

1. Mechanical Shock Test Facility

2. Outgassing Test facility for materials if required, as outlined in QA requirement Annexure ANA1.5.3.2 and ANA1-6.0

The availability of the above test facilities is subject to SAC internal work load. The responsibility of design and fabrication of required fixtures for mechanical shock test lies with Vendor.

f) Based on the details provided by the vendor, SAC will assess the capability of the vendor to take up this work. Decision of SAC will be final in this regard.

6. The vendor has to comply with the specified attached delivery schedule.

7. The vendor should provide schedule break-up in as much detail as possible.

8. The vendor is required to submit undertaking regarding Confidentiality / Non-Disclosure

Agreement (NDA) and Intellectual Property Rights (IPR). The TBD specifications, if any, will be

finalized before placing the order.

9. SAC reserves the right to review the progress of work at any time in addition to milestones

specified by the vendor.

10. The electrical and mechanical specifications mentioned in RFP are tentative and may change. Final

electrical and mechanical specifications shall be provided at the time of ordering. In case of any

modification to be incorporated during development it should be mutually discussed and agreed

upon before implementation.

11. On receiving the proper quotation and details from the vendor, SAC may hold detailed discussions

at SAC and negotiation also at SAC, if required.

ANNEXURE A1: Product Assurance Requirements

ANA1-1.0 Introduction

This document describes the Reliability and Quality Assurance requirements to be followed by Vendor

during fabrication, assembly and testing of ordered subsystems.

ANA1-2.0 Applicable Documents

Following reference documents are applicable during realization of the hardware.

ISRO-PAS-206

Issue-4, Nov 2012

Qualification requirements for Thick Film Hybrid Micro Circuits

ISRO-PAS-207 Storage, Handling and Transportation requirements for Electronic

Hardware

ISRO-PAX-300

Issue-5, Nov 2012

Workmanship Standards for the Fabrication of Electronic

Packages

ISRO-PAX-301

Issue-3, April 2013

Design Requirements for Printed circuit Board Layout

ISRO-PAX-303 Design requirement for Multi Layer Printed Circuit Board Layout and artwork

ISRO-PAS-502 Procurement Specifications for Austenitic stainless steel Bolts and Screws

MIL-STD-202G Test Method Standard Electronic and Electrical Component Parts

MIL-STD-461E Requirements for the control of Electromagnet Interference

Characteristics of Subsystems and Equipment

MIL-STD – 883 Test Method Standard for Microcircuits

ANA1-3.0 Reliability

The unit is designed by SAC, for space use with a minimum design life of 7 years.

ANA1.3.1 Life:

a) The unit shall meet all the fabrication requirements for use onboard spacecraft with a minimum

life of 7 years.

b) Additionally unit shall be capable of meeting all the functional requirements at various stages

of spacecraft assembly and storage as follows:

- 3 years storage and life at various levels of spacecraft assembly

- 5 years in controlled environmental conditions.

The vendor shall inform recommended method for storage and re-test criteria, in case of longer

storage.

ANA1.3.2 Operating condition for Active Components:

The electrical designs are made compliant to the SAC derating requirements for space payloads.

Material selection and packaging shall be such that junction/ channel temperatures of all solid-state

devices shall not exceed +110ºC under worst case environmental conditions.

ANA1-4.0 Environmental Specifications

ANA1.4.1 Non-Operating Environment:

The units shall be capable of withstanding following environmental conditions:

a) Temp. Range : - 30oC to +75oC

b) Pressure : Ambient and hard vacuum better than 10-5torr.

c) Relative Humidity : Max. 95% non condensing at +40oC

(Applicable for storage on ground only)

ANA1.4.2 Operating Environment:

The units shall meet all the performance requirements as given in electrical specifications under the

following environmental conditions:

a) Temp. Range:

i) FM : -10C to +60oC

ii) QM : -15oCto +65oC

b) Pressure: The unit shall be capable of operating and compliant to the specifications at ambient

pressure as well as vacuum level of 10-5torr and hard vacuum of the order of 10 -13torr.

Note: All temperatures are referred to the base plate. Temperature up to +75oC of base plate should

not affect the life, operation and performance of the unit.

ANA1.4.3 EMI / EMC:

Fabricated unit shall meet EMI / EMC requirements of MIL-STD-461E

ANA1.4.4 Space Radiation:

The units shall operate without any degradation in performance or life for the following radiation

environment:

a) 1.0 X 106Rads ionising dose absorbed in silicon (TID).

b) Parts shall be ELDRS free

c) 6.0 X l014 elec./cm2 (3 MeV bulk damage equivalent)

d) Immunity against SEL / SEU (Single Event Effect / Single Event Latch-Up/ Single Event Upset):

LET 80 MeV /mg/cm2

All the parts selected as per SAC supplied parts list for realizing the TCUs meets the radiation

environment requirements.

Localized shielding requirements shall be calculated and submitted for review and approval by

SAC.

ANA1.4.5 VIBRATION / SHOCK / ACCELERATION:

The units shall be designed and fabricated to meet the vibration (Sine and Random) and mechanical

shock requirements as per the test plan given in this exhibit.

ANA1-5.0 Parts

The parts and materials list consisting of following details (as a minimum) shall be submitted to SAC along with deliverables

Part / material name Quality level

Part / material number Name of manufacturer

Package style (applicable for parts) Qualification / approval status

ANA1.5.2 QUALIFICATION (QM) / FLIGHT MODEL (FM) PARTS QUALITY:

For QM/ FM the following criteria shall be applicable for procurement of parts:

Table-1: Parts Quality Level

Device Family Applicable specification and Quality Level of the parts

Microcircuit

Device &

Packaged

(Digital)

- Qualified to MIL-PRF-38535, Class R/V/S or ESCC 9000 Level B3.

The device shall meet;

TID requirements of 100 KRAD(Si) min.

Single Event LatchUp LET 80 Mev/mg/cm2 min.

Microcircuit

Device &

Packaged

( Linear)

- Qualified to MIL-PRF-38535, Class R/V/S or ESCC 9000 Level B3.

- The device shall meet TID requirements of 100 KRAD(Si) min.

- ELDRS Free part with QML R level is preferred.

Discrete

Semiconductor

Device &

Packaged

(Diode /

Transistor )

- Qualified to JANS quality level of applicable MIL-PRF-19500

specification OR Qualified to applicable ESCC specification, Level B3

- Equivalent to JANS quality level of applicable MIL-PRF-19500

specification OR as per applicable ESCC specification, with Lot

Validation Test (only when Device are not JANKC qualified).

- The Device shall be Radiation hardened to 100K Rad(Si).

- ELDRS Free part is preferred.

Discrete

Semiconductor

Device

(MOSFETs)

- Qualified to JANS quality level of applicable MIL-PRF-19500

specification OR Qualified to applicable ESCC specification, Level B3

- Equivalent to JANS quality level of applicable MIL-PRF-19500

specification OR as per applicable ESCC specification, Level.

- The Device shall be Radiation hardened to 100K Rad(Si) and SEE

immunity upto LET of 80 Mev/mg/cm2 min.

Chip Resistors

- Qualified to applicable MIL specification, ER Failure rate level ‘S’

OR Qualified to applicable ESCC specification, Level B3

- Qualified to applicable MIL specification, ER Failure rate level ‘R’

(only when no S failure rate level qualification)

- Manufactured, processed to and tested as per the applicable

MIL/ESCC/GSFC specification with screening & QCI inspections.

(only when neither S nor R failure rate level qualification).

Device Family Applicable specification and Quality Level of the parts

Chip Capacitors

- Qualified to applicable MIL specification, ER Failure rate level ‘S’

OR Qualified to applicable ESCC specification, Level B3

- Qualified to applicable MIL specification, ER Failure rate level ‘R’

(only when no S failure rate level qualification)

- Manufactured, processed to and tested as per the applicable

MIL/ESCC/GSFC specification with screening & QCI inspections.

(only when neither S nor R failure rate level qualification).

All 50 volt rated ceramic capacitors from MIL qualified line shall be

subjected to BMLT test as per MIL-PRF-123

Chip Capacitors

(Tantalum, Solid)

- Qualified to MIL-PRF-55365, Failure rate Weibull ‘C’ & surge

current test option C OR Qualified to applicable ESCC specification,

Level B3

Chip Inductors - Qualified to MIL-PRF-83446 OR Qualified to applicable ESCC

specification, Level B3

Multi-pin

Connectors

- Level-B of relevant ESSC specification

- NASA-GSFC approved.

Micro-D Multi-pin

connectors

- Qualified to MIL-DTL-83513

- NASA-GSFC requirements

- Qualified to ESCC 3401 level-B

Procurement specifications for components shall be generated by the vendor and submitted for

review & approval to SAC. Components shall be procured as per the requirements of SAC approved

procurement specifications. Also the components shall be procured with COC of the manufacturer

and necessary data pack.

Non-standard parts, wherever used, shall also have sufficient space flight history and the quality

level equivalent to the above mentioned parts. Wherever applicable, destructive physical analysis

(DPA) and verification of quality (VOQ) testing shall be carried out by the vendor to gain sufficient

confidence in the parts.

ANA1.5.3 Inspection of parts:

ANA1.5.3.1 Electronic parts:

All the active and passive electronic parts (packaged) shall be subjected to incoming inspection. Traceability shall be maintained for parts, from incoming inspection to the final units including batch acceptance report of PCB / MIC. (Lot No, Batch No, Date code etc). ). All the procured device datapack along with CoC shall be submitted to SAC for review. ANA1.5.3.2 Mechanical parts:

All the mechanical parts & materials procured by the vendor shall undergo Incoming inspection / testing including measurement of critical physical, chemical & mechanical properties including

Outgassing properties of specified materials. Wherever the Outgassing test results with the

compliance certificate are supplied by the manufacturer along with material batch test results, out

gassing test is not required.

The vendor shall carry out the fabrication of mechanical parts as per SAC approved drawings.

Dimensional measurements and visual inspection of packages, boxes, covers, clamps etc. shall be

carried out by the vendor on 100% basis. The mechanical parts shall also be inspected on 100% basis

from plating / thermal painting workmanship point of view. All the bought out mechanical

components including fasteners, spring, plain washers, nuts etc. shall be procured by the vendor in

accordance with procurement specifications approved by SAC. Incoming screening of fasteners shall

include review of Manufacturer’s Test Report (MTR) & Certificate of Compliance (CoC), as well as

inspection on 100% basis GO/NO-GO gauge inspection, and dimension inspection on sampling basis

by the vendor.

Declared Material List (DML) & Declared mechanical parts List (DMPL) used shall be prepared and

sent to SAC for review and acceptance. List shall contain following minimum details.

a) Material designation

b) Material details (i.e Heat Treatment, Finish, Mix ratio, Cure Time etc.)

c) Applied specification, conditions

d) Manufacturer and/or Vendor name,

e) Application area in UNITs

f) Heritage

Following traceability information shall be maintained by the vendor for records & SAC audit purpose.

a) Raw material identification details, relevant in-house incoming inspection & test reports.

b) Materials batch/lot Nos. information

c) Parts identification records

d) QC inspection and clearance reports of the vendor for both bought out & in-house fabricated

hardware.

e) Process documentation like process log, applicable process documents etc.

f) Certificate Of Compliance (CoC) supplied by sub-vendor/manufacturer for bought out items.

ANA1-6.0 Materials

Vendor shall ensure to use of ISRO approved / qualified materials. Procurement of all the mechanical

and electronic fabrication materials shall be in accordance with Approved Materials List (AML) given

in document No. SAC/QACMG/MQAD/GEN/05/ APRIL-2012 followed by incoming inspection. Any

other materials, which are not available in AML shall first be qualified as per SAC test plan & cleared

by SAC prior to their use. All inspection and clearance records for the materials shall be maintained

by the vendor. Only approved and cleared materials shall be used.

Technical specification of other materials to be used in the hardware which are not included in the

above documents shall be submitted to SAC for review and clearance before procurement. Non-

compliance of specifications for any bought out or in-house fabricated materials shall be intimated to

SAC for necessary review and clearance.

Materials list consisting of the name of vendor, shelf life, qualifying agency, location of application in

the sub-systems shall be submitted to SAC for approval. Only Space qualified Printed Circuit Boards

(PCBs), approved photo mask, patterned MICs etc. shall be used during fabrication of hardware. All

PCBs / MICs shall be procured from ISRO qualified vendor.

All the materials shall be used within their shelf life. Life limited materials may be considered for use

only after appropriate re-testing and approval as defined by SAC.

Ferrous and non-ferrous material used shall be of corrosion resistance type or suitably treated to

resist corrosion caused by atmospheric conditions existent in storage or normal operational

conditions. Only non-magnetic materials shall be used; except where use of magnetic materials are

essential. Materials, which are nutrients for fungus, shall not be used.

Organic and inorganic materials shall be stable under atmospheric and high vacuum conditions. These

materials shall have a Total Mass Loss (TML) of less than 1% and Collectable Volatile Condensable

Materials (CVCM) of less than 0.1% when subjected to a test condition of +125ºC and 1x10-06torr

pressure for 24 hours. Only space qualified epoxies, potting materials, etc. shall be used, within their

shelf life and with cure schedule as specified by the vendor. However, their use shall be restricted and

failure due to these shall be recorded and analysed as and when detected. Wherever the Outgassing

test results with the compliance certificate are supplied by the manufacturer along with material

batch test results, out gassing test is not required.

The selection and use of dissimilar materials shall be avoided, wherever it is impractical to avoid

dissimilar materials in direct contact with each other, suitable protection shall be provided by space

proven coatings / plating etc.

ANA1-7.0 Storage of Hardware, Parts, & Materials

Vendor shall ensure that all the parts and fabricated hardware are stored under controlled

environment in a Bonded-Store till their actual use. Storage of fabricated hardware, parts & materials

shall be done as per ISRO-PAS-206. Manufacturer instruction for storage & handling of parts shall

strictly be followed during the storage. Preferably dry Nitrogen purged packaging and storage cabinets

shall be used for storage of bare dice and oxygen sensitive items like PCBs / mechanical hardware.

ANA1-8.0 Processes

Only qualified process shall be used and no new process qualification requirement is addressed for

this programme. The unit shall be built to the standards normally associated with long life satellite

hardware. ISRO-PAX-300 / 305 Workmanship standards for fabrication of electronic packages shall be

followed for the fabrication work. All electronic fabrication processes like Etching of PCB laminates,

Wiring of components, Wiring & assembly of circuits and box, Packaging and assembly etc. shall be

ISRO qualified. Similarly the processes used for surface treatment of the box like plating and coating

in realizing the hardware shall also be ISRO qualified. All the processes shall be carried out in

accordance with PIDs reviewed & approved by SAC.

In case of processes qualified by other agencies, process qualification reports shall be submitted to QA SAC for review. After review of previous qualification plan, SAC will decide for requirement of full qualification / delta qualification of such processes. However, right for decision on feasibility of such a qualification activity will be retained by QA SAC. Particular attention shall be paid, as a minimum, in respect to the following:

a) All the processes used should be qualified for space use

b) All components including torroidal / bead inductors / coils shall be suitably supported on

PCB/Substrate by RTV etc.,

c) All connections through wire (insulated / Cu magnet) from feed-through to circuit shall have

adequate Stress relief loop, maintaining minimum possible length.

d) Wherever wires are attached to casing for grounding etc., a higher melting point solder than that

used for lid soldering, shall be used.

e) The input/output connections on pins shall also be made with high melting point solder to avoid

detachment of these connections while soldering the pins to external system using SN 63 solder.

f) The marking and plating etc. shall be permanent and should not get damaged during normal

cleaning process using Isopropyl alcohol or other recommended cleaning solvents.

g) In case where consistent poor workmanship is observed, Verification of the Process Qualification

(VOQ) shall be carried out at the discretion of SAC-QA.

Vendor should prepare and submit list of processes required for this programme with qualification

status, alongwith technical proposal. Vendor shall also submit the standard process average for

rejections / reworks for major fabrication activities.

ANA1-8.1 Verification of Process Quality (VOPQ)

Witness samples shall be prepared & processed along with each batch of patterned Substrate, PCB (DSB, MLBs) and plated, painted / coated mechanical parts& components as per the requirements defined as part of process qualification certification. This witness samples shall be subjected to Batch acceptance testing, as per the SAC defined acceptance test plan.

Any deviations observed on these samples shall be a cause for rejection of fabricated lot and a final

disposition shall be taken after discussion with SAC regarding their impact on unit functioning and

reliability. Corrective action shall be taken to ensure quality.

Items only from accepted batches will be cleared for use in FM fabrication.

ANA1-9.0 Process Identification Document (PID)

All the activities involved for realisation of space QM/CTQ/PFM/FM units shall be addressed in the

top level PID. Vendor shall prepare such top level document, identifying all the activities, methods /

procedures, inspection check points with reference to applicable documents that will be followed for

realisation and delivery of the units. The copy of PID shall be sent to SAC for review. Only SAC

approved PIDs shall be followed for production of subsequent units.

ANA1-9.1 Fabrication Documentation

For the fabrication activity, a fabrication traveller / fabrication history sheet shall be maintained for

each unit, where-in all the fabrication steps and QC inspection comments are logged. This shall include

any non-conformance reported by QC and its close out. This shall also include the specific serial nos.

of devices used for fabrication of units.

ANA1-9.1 Fabrication Sequence

A generalized fabrication sequence detailing each step of fabrication and QC inspection shall be

worked out and provided to SAC before start of fabrication. SAC approved fabrication sequence shall

only be implemented. This is to ensure smooth flow of the assembly activity and avoiding rework /

rejection. This shall be clearly understood and agreed upon. The assembly flowchart shall include the

following:

a) Flow of fabrication activities

b) Approved drawing nos.

c) Name of processes and PID numbers.

d) Intermediate electrical testing (at module level)

e) Handling instructions

f) Permanent/Temporary torque values.

g) Specific instructions, caution notes etc.

h) Any environmental test which is a part of fabrication process or for electrical performance

check and selection TBD component values

i) Marking & Identification of unit.

ANA1-10.0 QUALITY CONTROL (QC)

Vendor’s in-house Quality Control (QC) shall carry out 100% inspection of all the fabricated /

processed units as well as on-line inspection during the electronic fabrication activity. Non-destructive

bond-pull test (NDT) on wire/ribbon shall be carried out on 100 % basis, prior to sealing / cover closing

of the units.

All fabrication and inspection work shall be carried out by ISRO certified fabricators / inspectors of

vendor. Online inspection of all the fabricated hardware and witness samples shall be carried out by

QC of the vendor. These data can be used to monitor the process health. Required process control

documents are to be generated and maintained by the vendor, which will be reviewed by SAC during

QA audit.

The hardware for Flight shall be inspected by vendor’s QC and shall be accepted after successful

inspections & clearance of witness samples. These include etching of printed circuits on substrates

(PCB, Alumina etc), their soldering and the assembly of the package with fabricated mechanical parts.

The mechanical units shall be inspected for dimensional compliance, finish and surface quality on

100% basis.

ANA1-11.0 QA AUDIT

The purpose of the QA audit is to ensure that all fabrication and assembly activities are carried out as

per approved documents & ISRO guidelines to determine effectiveness of quality systems at vendor’s

facilities. Also compliance to all planned Product Assurance activities is ensured. The QA audit shall

be carried by QA/ SAC from both electronic & mechanical point of view. Following may be noted.

The frequency for QA audit shall be decided by SAC and intimated to the Vendor.

All the fabricated PCBs / Packages shall be first inspected and accepted by QC/QA of the vendor

and proper records shall be generated. Audit by QA/SAC shall be carried out on QC accepted

hardware. Audit by SAC shall cover Electronic & Mechanical aspects for the following,

a) PFT Substrate / PCB

b) Machined package/ cover etc.

c) Surface finishing (plating / painting)

d) Wired Substrate / PCB

e) Packaging & fixing of cards/ substrates/ connectors & internal harness

f) Audit for integrated package level.

g) Test setup and unit level testing.

SAC shall audit/ inspect all related facilities, activities which the vendor will carryout to realise the

hardware. Fabrication processes, cleanliness records, QC inspected hardware, process log

books/history records, overall documentation, parts & material evaluation/test reports, facilities,

procedures followed etc. shall be followed as per ISRO guidelines.

The audit report will be generated by QA/SAC. The Vendor shall generate close outs on the

discrepancies observed during audit by taking appropriate corrective actions and submit the same

to SAC for review and acceptance.

The disposition on the non-conformances on actual hardware, if any, which cannot be closed by

the auditee, shall be closed through vendor’s NCRB, with approval from SAC, after reviewing the

impact of the non-conformance on reliability of the non-conformed hardware for intended use.

The corrective actions implemented by the vendor shall be documented after necessary review

and approval by QA/SAC.

Based on the compliance to ISRO guidelines and closeouts for audit observations by the vendor,

stage wise clearance shall be given by QA/SAC.

Virtual Audit (Photographic): Based on confidence level build-up on fabricated hardware, SAC

may opt for virtual audit of hardware, provided vendor facility, process line, their quality system,

etc found satisfactory. For this, vendor is required to submit related documents like, High

resolution images of the hardware, History sheets, compatibility sheet, box dimensional report,

Torque wrench calibration certificate, NCR details, plating / coating clearance report and other,

if required.

ANA1-12.0 MARKING AND IDENTIFICATION

The units shall be identified by assigning unique serial number (may be assigned by SAC) on the

exterior surface of both package & cover by a suitable process applicable for space use. Marking shall

not degrade the performance and quality of the unit. In addition to functional markings like input /

output, frequency etc. following marking shall appear on each unit.

Unit Name Unit Number

Specification Number / Contract Number Serial Number

Name of the Manufacturer Date of Manufacture

Recommended Part No.: TCU-XX-ZZ-(QM/FM)-WWYY

Where XX: Type, ZZ: Sr. No., WWYY: Week and Year code

The permanency of the marking shall be sufficient to withstand the specified environmental

conditions and normal cleaning operations using Isopropyl Alcohol and other cleaning solvents. The

marking method to demonstrate the same shall be specified by the manufacturer.

ANA1-13.0 TRANSPORTATION

Suitable packing shall be provided for the transportation of the unit by air or road without any

degradation / damage. Each unit shall be packaged in individual ESD protective packaging. This

package shall protect the unit from environmental conditions encountered during transportation, like

heat, humidity & dust. This individual container shall then be placed in a transportation container.

More than one individual unit may be placed in the transportation container. The transportation

container shall protect the units from heat, humidity, dust, mechanical shock & vibrations during

transportation.

The individual unit packages and transportation containers shall be clearly marked with following instructions along with other mandatory markings.

“ESD sensitive units”

“To be opened only under clean environment with ESD precautions”

“High reliability space usage systems”

ANA1-14.0 TEST PROGRAMME

Final production tests shall be carried out just prior to submitting the units for the formal test phase,

to ensure that units meeting the functional requirements. As a part of final production test it is

recommended that Temperature cycling over the acceptance temperature limits should be carried

out.

ANA1-14.1 MODEL PHILOSOPHY:

During the programme following Models shall be fabricated and tested as per the requirements of

this RFP:

Qualification Model (QM)

Flight Model (FM)

Proto Flight Model (PFM), if applicable – see point (d) below.

a) Qualification Model (QM) :

The design of the QM units shall be same as that for the FM units. Materials, parts, and component

to be used shall be as that for FM. Similarly same processes as FM shall be used to realize QM. QM

shall be subjected to the Qualification level tests as per Table-3. After completion of QM unit testing,

the test report shall be submitted to SAC for review. Fabrication of FM units shall commence only

after clearance from SAC of the QM test results.

b) Flight Models (FM) :

The FM units represent the final electrical & mechanical design and configuration using screened Hi-

Rel parts, material and processes of qualified standard and workmanship. All the flight model TCUs

shall be subjected to Flight Acceptance Level Tests.

c) Proto Flight (PFM) level testing :

For this programme, PFM units are not applicable and will not be ordered.

However, In following cases, vendor will be required to conduct PFM level testing on one FM unit

(a) Corrective action implemented based on deviation observed during QM level testing

(b) In case of number of deviations during fabrication and assembly exceeds standard process

average

(c) Performance deviation observed in consistently three units during FM level testing

(d) Depending on the final order quantity and delivery schedule, one unit per year.

Requirement of PFM level testing due to above cases will be decided by SAC after thorough review of

the technical performance details of each of the applicable case.

ANA1-14.2 TEST PLAN:

The vendor shall submit to SAC the detailed test plan document for the functional & environmental

tests to be conducted on QM and FM (including PFM level testing, wherever applicable) units,

whenever applicable, for approval by SAC. This includes the detailed test procedure for conducting

each test consisting of test method, test conditions, test equipments etc. Only approved test plan

shall be implemented. The environmental level severity for the test to be performed on different units

should be as listed in the following Table.

Table – 2 Test Severity Levels

Model Type Levels

QM Qualification

FM Acceptance

PFM Qualification

TCUs shall be tested in accordance with Table 3 given below. The tests shall be performed in the listed

sequence.

Table – 3 : Tests applicability

Sr. No. Test QM PFM FM

1. Physical Measurements X X X

2. Visual Inspection X X X

3. Initial Bench Test (IBT) X X X

4. Burn-in Test (168 Hrs.) X X X

5. Post Burn-in electrical tests X X X

6.

Storage tests

a) Cold Storage test X - -

b) Hot Storage test X - -

c) Humidity Storage test X - -

7. Temp. operational test X X -

8.

EMI / EMC (MIL-STD-461E)

CS114, CS115 & CS116 (DATA LINES), RS103 X - -

RS103 X X

9. Sine Vibration X X -

10. Random Vibration X X X

11. Thermo-Vacuum test X X X

12. Mechanical Shock X - -

13.

ESD test

Radiated Field (7 KV, 1pps, 30 pulses) X - -

Single Point Discharge (5 KV, 30 pulses, 1 pps) X - -

Structural Current (5KV, 1pps, 30 pulses) X - -

14. Life Test X - -

15. Final Bench Tests (FBT) X X X

16. Final Visual inspection X X X

Notes:

1. ‘X’ denotes applicability of test.

2. At the end of each environmental / mechanical test and electrical performance check shall be

carried out.

3. For PFM level testing, burn-in, temp. operational and Thermovac testing shall be carried out at

qualification temperature level.

4. Suitable buffer connectors shall be used to protect input / output connectors of the device from

wear and tear due to mating / de-mating with other connectors during testing. Record of number

of time mating / de-mating of connectors shall be maintained.

ANA1-14.3 Failure :

Deviation from the agreed electrical specifications shall be treated as non-compliance, and may be as

cause to reject the units. Any failure observed at any stage shall be reported to SAC immediately. This

shall be followed by detailed failure analysis by Vendor, clearly identifying the cause of failure as

random or design related. Any modifications required in electrical, mechanical or process related

aspects shall be approved by SAC. In case of mechanical or electrical design related failures; a retest

plan or modification in the test plan may be necessary. Based on the failure analysis, such retest plan

/ modified test plan shall be decided and implemented after approval by SAC. This may include

requalification of process or the unit / Proto flight level testing.

ANA1-15.0 TESTS

All the specification requirements shall be verified by testing. Vendor is required to generate test

procedure, clearly showing test set-up and connection details including groundings. This test

procedure shall be sent to SAC for review & clearance. Testing shall be done as per SAC approved test

procedure using calibrated test & measuring instruments. It is preferred that cable types used by the

vendor for harnessing during testing shall be similar or very close to cable type to be used in

harnessing of FM unit in the Space craft.

Acceptance of the test set-up shall be done jointly by SAC and vendor before the testing of the QM

and FM units. This shall also be audited, during the testing activity. Vendor shall inform the readiness

of the test set-up as well as the schedule well in advance. Representatives from SAC may participate

in the testing.

(a) Test setup calibration and accuracy:

The test instruments used during testing shall have valid calibration status. Test instruments shall have

adequate measurement accuracy. These shall be verified and the shall be stated in the test plan and

procedures document submitted by the vendor.

(c ) Maximum Allowable Tolerance In Test Conditions :

Parameter Tolerance

Temperature

1C Amb. Pressure

3C under vacuum

Atmospheric Pressure

Greater than 0.1 Torr

Below 0.1 Torr

5%

50%

Relative Humidity 5%

Acceleration

10%

Vibration Frequency 2% above 25 Hz

0.5 Hz below 25 Hz

Sine Vibration

Amplitude

Frequency

Sweep rate

Time

10%

± 2% above 25 Hz &

0.5 Hz below 25 Hz

5%

± 1%

Random Vibration

Power Spectral Density

Overall (g-rms)

Duration

± 1.5 dB for 20-300 Hz &

±3 dB for 300-2000 Hz

10%

+ 10% / - 0%

Shock Response Spectrum Test

Amplitude

-3dB / +6dB

ANA1-15.1 Test condition & details:

Following paragraphs give details of various tests to be performed on units. Electrical test shall be

carried out within 96 hours after completion of each environmental test.

The test parameters to be measured during / after each of following test shall be defined in Test plan

document for QM, PFM and FM units.

ANA1-15.1.1 Physical Measurement:

All the units shall be examined for

- Mass, Dimensions & Flatness

ANA1-15.1.2 Visual Inspection :

ANA1-15.1.2.1 Internal Visual Inspection (Pre-Cap) :

After completion of all fabrication activities, internal visual inspection at suitable magnification of the

units shall be carried out to detect any workmanship related deviation and non-conformance w.r.t

respective ISRO standards. SAC may participate / audit the pre-cap visual inspection. Vendor shall

inform the schedule of sealing / cover closing of QM / FM / PFM units.

ANA1-15.1.2.2 External Visual Inspection :

All the units shall be examined visually at 10 X magnification before and after each environmental

test. The units shall be inspected for surface finish, plating, mechanical and workmanship related

defects.

ANA1-15.1.3 Pre Burn-in Electrical Test (IBT) :

This test shall be performed to verify compliance to all the electrical parameters and will be taken as

reference for all subsequent tests. Electrical parameters to be as per approved test plan.

ANA1-15.1.4 Burn-In Test :

Units shall undergo burn-in at maximum Operating Temperature in power ‘ON’ condition. The

duration of Burn-in shall be 168 hrs for all units. Data log for Time-Temperature shall be kept for

verification.

ANA1-15.1.5 Post Burn-in Electrical Test:

This test shall be conducted at ambient temperature. Electrical parameters shall be measured during

Post burn-in functional tests as per approved test plan.

ANA1-15.1.6 Temperature storage test :

Temperature storage test is applicable to QM units only. The units shall be subjected to minimum

storage temperature for 24 hours. After this storage, electrical and visual inspection shall be

performed. The test shall be repeated for maximum storage temperature for 24 hours. Units shall be

in non-operating conditions for the storage duration.

Visual inspection shall be performed after the test. Pre and post electrical measurements shall also

be carried out outside the chamber on the unit.

ANA1-15.1.7 Humidity Test :

This test shall be conducted on QM units as per the following conditions :

Humidity : 95 % RH

Temperature : 40 0C

Duration : 24 Hrs.

After the humidity test, units shall be visually inspected. There shall be no visual defect like,

degradation of plating/coating, discoloration, patches, etc. Parameters shall be measured after the

test.

ANA1-15.1.8 Operational temperature test :

This test shall be performed to check the performance specifications of the units at the specified

Lowest and Highest operating temperatures. The units shall be placed in a suitable thermal chamber,

and connected with the external test set-up. Dwell time at temperature extreme shall be at least 6

hours. Parameters to be measured during this test shall be as per approved test plan.

ANA1-15.1.9 EMI / EMC Test :

The units shall be subjected to EMI / EMC tests as per MIL-STD-461E. Test applicability is shown in

Table-3. Any additional tests, if required by SAC, shall also be carried out by the vendor. Plots taken

during all the tests shall be kept for verification.

ANA1-15.1.10 Vibration Test :

Sine / Random vibration tests shall be carried out on applicable QM / PFM /FM units. Visual &

electrical measurement shall also be performed after each Sine & Random vibration test. Vibration

levels given below are tentative. Levels may change latter, depending upon mechanical configuration.

ANA1-15.1.10.1 Resonance Search :

Pre & Post Vibration, resonance search shall be carried out in all the three axes as per following levels.

Natural resonance frequency (Fn) shall be greater than 100 Hz and drift in pre & post vibration ‘Fn’

shall be within 10%.

Frequency (Hz) Amplitude

10 - 2000 0.5 g

Sweep rate 2 Oct / Minute

ANA1-15.1.10.2 Sine Vibration :

Sine vibration test shall be conducted only on QM and PFM units. The unit shall be in non-operating

condition for the duration of vibration test. One Sweep in each axis shall be performed.

Normal to mounting plane (z-axis) Parallel to mounting plane (x & y axes)

Frequency (Hz) Amplitude Frequency (Hz) Amplitude

5-20 12.4 mm (0 to

peak) 5-20 9.3 mm (0 to peak)

20-50 20g

50-70 15g 20-70 15g

70-100 8g 70-100 8g

Sweep rate

QM

PFM

2 Oct./minute

4 Oct./minute

Sweep rate

QM

PFM

2 Oct./minute

4 Oct./minute

ANA1-15.1.10.3 Random Vibration:

Units shall be subjected to random vibration tests with levels as given below in passive mode.

Frequency verses PSD plots shall be obtained and shall be kept along with the test results for

verification. For QM/ PFM units :

Frequency (Hz)

Power spectral density

Normal to mounting plane

(z-axis)

Parallel to mounting plane

(X & Y axes)

20-100 + 3 dB/octave + 3 dB/octave

100-700 0.30 g2/Hz 0.10 g2/Hz

700-2000 -6 dB/octave -3 dB/octave

Overall RMS 18.1 g 11.8 g

Duration

QM

PFM

120 sec.

60 sec.

120 sec.

60 sec.

For FM units:

Frequency (Hz)

Power spectral density

Normal to mounting plane

(z-axis)

Parallel to mounting plane

(X & Y axes)

20-100 + 3 dB/octave + 3 dB/octave

100-700 0.13 g2/Hz 0.044 g2/Hz

700-2000 -6 dB/octave -3 dB/octave

Overall RMS 12.1 g 7.9 g

Duration 60 sec. 60 sec.

ANA1-15.1.11 Thermo vacuum Test:

QM / FM / PFM units shall be subjected to thermo-vacuum test as per the test profiles shown in

following figure.

Following points shall be considered before starting thermo-vacuum test :

It shall be ensured that the parameters of the thermo vacuum chamber i.e. temperature, air

pressure measuring device, etc are properly calibrated prior to the start of the test.

It should be ensured that the temperature sensors are mounted at pre-determined locations for

monitoring base plate and package temperatures as defined in test plan.

Electrical measurements shall be carried out at the points mentioned in test profiles. Time-

Temperature and Pressure data shall be logged along with electrical results for verification. Crtical

parameters (mutually agreed) shall be logged/monitored continuously during operating temperature

cycles.

ANA1-15.1.11.1 Thermo Vacuum Test Profile:

VACUUM ≤ 1 X 10 -5 TORR

T2 0C

T3 0C

T4 0C

TEM

PER

ATU

RE

2Hrs

2Hrs 2Hrs 2 Hrs

2Hrs

2Hrs

2Hrs 2Hrs 2 Hrs

T1 0C

TIME

AMBIENT

LAB. UNIT ON

T3 0C

24 Hrs

24 Hrs

AMBIENT LAB.

UNIT

ON

UNIT OFF

UNIT OFF

Indicates slot for measurement

Pressure better than 1 10-05torr

T1: MAX STORAGE TEMPERATURE

T2: MIN STORAGE TEMPERATURE

T3: MAX OPERATING TEMPERATURE

2Hrs

T3 0C

T4 0C

T4 0C

UNIT ON

UNIT OFF

ANA1-15.1.12 Mechanical Shock Test:

QM unit shall be subjected to mechanical shock test as per the following test levels in all the 3 axes.

Number of shocks in each axis shall be 2 and Shock levels specified with Q = 10.

Frequency (Hz) SRS

100-1000 +12 dB / Oct.

1000-5000 1000g

(levels are tentative)

ANA1-15.1.13 ESD Test

ESD tests shall be conducted on QM unit. Electrical measurements shall be carried out after ESD tests as

per test plan

ANA1-15.1.13.1 Radiated field Test

The unit (EUT) shall not exhibit any degradation of performance when subjected to the radiated fields of

less than or equal to 7 kV ESD, simulated at 30 cm from all critical points identified by SAC. Discharge rate

shall be 1 discharge per second for a period of 30 seconds at each point. The test set up is as shown in

figure below.

ANA1-15.1.13.2 Single point Discharge Test

The Unit (EUT) shall not exhibit any degradation of performance when subjected to discharges equal to

or less than 5 kV with discharge current return wire in close proximity, applied to subsystem surface

directly at critical points to simulate the discharge and local flowing of arc currents. Discharge rate shall

be 1 discharge per second for a period of 30 seconds at each point. The test set up is as shown in Figure

below.

ANA1-15.1.13.3 Structural current test

The Unit (EUT) shall not exhibit any malfunction, degradation of performance or deviation from the

specifications when subjected to contact discharges of less than or equal 5 kV, simulating structural

current transients, with discharge current return wire at diagonally opposite corners, to simulate blow-

off discharge currents. Discharge rate shall be 1 discharge per second for a period of 30 seconds at each

point.

ANA1-15.1.14 Life test:

Life test shall be carried out during qualification testing. The unit shall be subjected at maximum operating

temperature for 2000 hours, with DC biasing applied at maximum power dissipation condition. During

this test, electrical measurement of critical parameters shall be carried out periodically after 240 hours,

500 hours, 1000 hours, 1500 hours and 2000 hours. The critical parameters of the unit under test shall be

monitored continuously during testing. However, the parameters to be monitored, duration and interval

for monitoring of parameters (typically 24 hours) shall be mutually agreed between SAC and vendor.

Acceptance criteria and parametric drift shall be decided later. For PFM level testing the life test duration

shall be 500 hrs.

ANA1-15.1.15 Final Bench Test (FBT) :

The final bench test shall be conducted for measurement of electrical parameters as given in test matrix.

The test shall be conducted at ambient temperature. All the test results shall be recorded and any

performance deviation with respect to Initial Bench Test shall be evaluated and shall be within specified

limits.

ANA1-15.1.16 Final Visual Inspection :

The unit shall be inspected for plating, surface, finish, mechanical deviations, corrosion and workmanship

related defects. No visual degradation shall be allowed after completion of tests.

ANA1-16.0 NON-CONFORMANCE MANAGEMENT

Effective non-conformance management mechanism shall be established. e.g. a Non-Conformance

Review Board / Material Review Board may be set-up constituting representatives from design,

fabrication, quality, procurement and testing departments. Major non-conformance at any stage, which

affects the quality & reliability or the fabrication process of entire lot, shall be reported to SAC

immediately with photographs, nature of non-conformance observed, etc. However, for all the minor

non-conformances, approval from SAC is not mandatory, and shall be reviewed and discussed by the

vendor’s NCR board. Major and Minor Non-conformances are broadly defined as follows.

ANA1-16.1 MAJOR OR CRITICAL NC :

Major non-conformances are those which have an impact on the contract requirements. These non-

conformances, of the contractual end item which cannot be completely eliminated by rework or repair

using standard repair procedures so that it could be categorised as a major NC. Major non-conformance

at any stage, which affects the quality & reliability or the fabrication process of entire lot, shall be reported

to SAC immediately and further action shall be taken only after clearance from SAC. In general Major NC

is considered when the following properties are adversely affected:

Functional performance

Interchangeability

Interface requirements

Reliability / Maintainability / Availability

Predicted life time

Qualification status of parts, materials and processes

Safety of personnel or equipment

EEE parts failure, in case of :

Lot/batch rejection during manufacturing, screening or testing at the manufacturer’s facilities.

Failures detected during any inspection or test which affect form, fit or function and cannot be

considered as random failures, where no risk for lot-related reliability or quality problem exists.

ANA1-16.2 MINOR NC:

Any non-conformance other than major, are categorized as Minor NCs. Minor NCs shall be compiled and

reported to SAC at agreed intervals.

All minor non-conformances, shall be reviewed and discussed by the NCR board. Non-conformance report

shall be generated by the concerned agency and shall be reviewed and discussed by the NCR board.

Any non-conformance affecting the fabrication and/or inspection procedure shall be reported to SAC.

Changes in related documents shall be implemented and revision number of the document shall be

updated. This shall be followed by updating all the documentation (fabrication, inspection, and test).

All the non-conformances with the disposition given by the NCR board shall be compiled and reported to

SAC periodically. This shall be followed by report of close out action completion, if any. For all the non-

conformance report, SAC representative shall be the focal person.

ANA1-17.0 CONFIGURATION CHANGE CONTROL

The manufacturer shall follow an effective configuration change control procedure during the fabrication

stages. Plans for both non-conformance and configuration change control shall be made for submission

to SAC for review and approval before initiation of manufacturing activities.

ANA1-18.0 DOCUMENT TO BE SUPPLIED

ANA1-18.1 Following document shall be supplied along with quote :

a) Pont by point compliance to all the requirements of this document.

b) Details to be provided as per QA check list given in Annexure- ANA1-18.5.

ANA1-18.2 The following documents shall be supplied during the contract :

a) Parts & Materials List to be used for the fabrication of units, detailing their quality level,

procurement specifications, traceability information, out gassing specifications etc.

b) CoC, screening (at Vendors / sub-vendors) reports, incoming inspection report, batch acceptance

test reports of Parts & Materials.

c) Record of Bias conditions of identifying the channel / junction temperatures of all the active

devices if applicable.

d) Interface control drawing (AutoCAD soft copy)

e) Details of design modifications (wherever applicable) with respect to the given details.

f) Process Identification Documents along with standard process average for rejection rate for major

fabrication activities.

g) Test procedure/plan documents for QM & FM tests with test conditions, procedures, list of

equipments and their calibration status, for review & approval by SAC.

h) All documents, including various Analyses as per the requirements of this document.

i) Non-conformance management plan.

j) Configuration change control plan.

k) Program management plan

ANA1-18.3 Following documents shall be supplied during the programme with respect to relevant

activity.

a) Status report for the fabrication activity and test schedule.

b) Schedule for Cover closing of the units

c) Details of test set-up and readiness

d) Non-conformance report at agreed intervals

e) Failure Report; as and when failure occurs

ANA1-18.4 Following detailed documents shall be supplied for each unit along with deliverables, in

Hard copy as well as in soft copy.

a) T & E report of each unit containing detailed test results, test history, conformance matrix, TBD

values etc.

b) CoC of the deliverable units

c) CoC of parts & materials Including screening report

d) All fabrication details supplied by SAC for fabrication

e) Non- Conformance reports with close-outs

ANA1-18.5 Vendor to provide complete details of following with relevant certificates for

following QA check list.

QA Check List

Sr.

No

Details of information required Vendor response

1 Point by Point compliance provided ? Yes / No

2 List each applicable process (ISRO qualified) at your / sub-

vendor’s facility, their qualification status & attach qualification

certificate.

Process Name Facility Certi. No.

a) Patterned substrates : Alumina

PCB

b) Fabrication facilities : HMC

PCB

c) Component mounting & Assembly process

on, HMC

PCB

d) Plating / Surface treatment (type wise)

e) Details of other ISRO qualified processes

available

6 Details of ISRO certified fabricator and Inspector for both MIC

and PCB work

7 Location of test facilities likely to be used for following tests shall

be provided (whichever applicable). SAC facilities will not be

offered except mechanical shock test facility and outgassing test

facility (If needed and requested), which is offered without charge

a) Physical Measurements

b) Visual Inspection (internal & external)

c) Electrical measurements

d) Burn-in

e) Temperature tests : Storage temperature test, Humidity

Storage and Temp. operational test

f) EMI / EMC & ESD

g) Vibration test (sine & Random)

h) Thermo-Vacuum

i) Mechanical Shock

j) Life Test

TEST MATRIX FOR QM/FM TCU

Sr.

No

.

Parameter

IB

T

B

urn

-in

Po

st

Bu

rn-in

ele

ctr

ica

l

Po

st

co

ld s

tora

ge

Po

st

hot

sto

rag

e

Po

st

Hum

idity s

tora

ge

Tem

p. o

pe

ratio

na

l te

st

EM

I/ E

MC

sin

e v

ibra

tio

n

Ra

nd

om

vib

ratio

n

The

rmo

vac

Po

st m

echa

nic

al sh

ock

ES

D

Life

te

st

FB

T

1 TCU Power On Reset Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

2 Physical ID Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

3 Self ID Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

4 PCPU Power On Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

5 PCPU Power Off Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

6 EPC Sync Clock Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

7 TRC Operation Mode Test √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

8 Configuration Command

Test √ √ √

9 TRC Correction Data Test √ √ √

10 Isolation Command Test √ √ √

11 Timing Signal Verification

Test √ √ √

Note: Temperature limits and vibration/mechanical shock levels mentioned are tentative and final

values would be communicated to vendor during PID finalization.

Annexure A2 : Technical Details of TCU

AN A2.0 Introduction to Tile Control Unit .

The Tile Control Unit (TCU) is required to control, command and coordinate the activities of an individual tile containing 24 nos. of Transmit Receive Controllers (TRCs) and other electronics. This is a full digital implementation. The board receives a number of timing and control signals consisting of various timing windows, a clock etc. (on RS422), and a serial command (on RS485). TCU is a digital subsystem which operates at clock frequency of 4MHz. TCU will utilize the beam configuration related information received from on-board payload controller (PLC) to provide beam forming parameters for the relevant TR module Controllers. The testing of this card involves checking the input-output relations for integrity and conformance to expected patterns. A Ground Checkout Unit (GCU) will be developed as per configuration decided by SAC and it will be delivered to Vendor for testing TCU. Graphical User Interface (GUI) for the GCU will be provided by SAC. GCU will integrate into the testing environment and provide user friendly operator interface.

The unit comprises a single PCB of dimensions 380 X 75 X 2.4mm having all electrical interfaces

through six 51 pin micro-D connectors. This is to be housed in an Aluminium tray or enclosure of the

size 395mm X 80mm X 37mm. The bill of materials of the card and power supply details are given

below.

AN A2.1 Bill of Materials for TCU

Note : For all components, except Sr. No.-2, mentioned in table below, Additional 20% quantity over

and above required quantity has to be procured by vendor. For SR.No.-2 (DATA PROM 197A807-244T)

additional, 35% quantity has to be procured by vendor.

Sr.

No.

TYPE SPACE QLFD PART DETAIL QTY.

PER

PACK

AGE

Free

Issue

Mater

ial

PART NO MANUF. PACKAGE

1 OBC ASIC 5962R99B0109V

4C Aeroflex CQFP-256 2 Yes

2 DATA PROM

32K x 8 (45nS) 197A807-244T BAE Systems

28 LEAD FLAT

PACK 2 No

3 RS-422 CMOS RX 5962F9568901VX

C INTERSIL USA

16 CERPACK Flat

pack 4 No

4 RS-422 CMOS TX 5962F9666301VX

C INTERSIL USA

16 CERPACK Flat

pack 16 No

5 RS-485 TRANS

RECEIVER 5962F8961501V

HA

NATIONAL

SEMICONDUCT

OR

10 pin ceramic

SOIC 4 No

6 Micro-D 51 pin

Socket / FeMale

Connector (Right

Angled PCB

Mount)

Micro-D 51pin

Socket (Rt.)

340102902B-

51S-FR136

ITT CANON Rt.Angle PCB

Mount(FR136) 6 No

7 Mounting

Accessories for

FR136 Rt. Angle

PCB Mount with

Package wall

thickness 1.6mm

mounting

Accessories for

FR136. 3401 032

11B(115366-

9205C) * For

1.6mm Panel

Thickness.

ITT Canon 3401 032 06B

(115366-9205C) 6 Pairs No

8 Mating Male 51-

pin Straight

Harness

Connector

compatible to Sr.

No.6 with

prefabricated 4

mt. pigtail wire

Space Grade

compatible to

Sr. No.6

ITT Canon - 6 No

9 CHIP CAPACITOR

(0.1UF)

0.1uF,

100V

KEMET/AVX CDR-35 18 No

10 CHIP CAPACITOR

(10uF) 10Uf

35V/25V

VISHAY

SPRAGUE

AVX

CWR-09 6 No

11 CHIP CAPACITOR

(0.01UF) 0.01uF/100V KEMET/AVX CDR-31 44 No

12 SWITCHING

DIODE JANS1N6642US

Micro

Semi/Aeroflex CHIP SMD 100 No

13 CHIP RESISTOR 100 (250mW,

5%, 25ppm)

DALE/ IRC

State of Art RM1206 2 No

14 CHIP RESISTOR 120 (250mW,

5%, 25ppm)

DALE/ IRC

State of Art RM1206 105 No

15 CHIP RESISTOR 680 (250mW,

5%, 25ppm)

DALE/ IRC

State of Art RM1206 32 No

16 CHIP RESISTOR 100K (250mW,

5%, 25ppm)

DALE/ IRC

State of Art RM1206 4 No

17 CHIP RESISTOR 4.7k (250mW,

5%, 25ppm)

DALE/ IRC

State of Art RM1206 124 No

18 CHIP RESISTOR 10K (250mW,

5%, 25ppm)

DALE/ IRC

State of Art RM1206 2 No

19 FM PCB - - - 1 Yes

AN A2.3 Power Supply Requirement of EPC of TCU module

Power Supply Requirements

for the EPC unit (EPC Provided

by SAC)

Power per Unit 3 Watt

Supply Voltage +70 V (600mA)

Line regulation ±0.05%(70 V DC)

Load Regulation ±1%

Ripple 20 mV(P-P)

Overshoot at Turn ON 10% max

AN A2.4 TCU Interface Signals

Signal Direction

wrt TCU

Interface

Type

Signal

Type

No. of

Lines Description

Serial_Data Output RS422 UART Data 2 Telecommand

Tx_Pre_Sel Output RS422 Timing Signal 2 Active Low pulse of

58us @PRF of 5KHz

TX_Pulse Output RS422 Timing Signal 2

Active High pulse of

22us-48us @PRF of

5KHz

Data_Win Output RS422 Timing Signal 2

Active High pulse of

40us-110us @PRF of

5KHz

Tx_Beam_Ini Output RS422 Timing Signal 2

Active Low pulse of

58us @n PRF where n is

integer

Tx_beam_Hop Output RS422 Timing Signal 2

Active Low pulse of

58us @m PRF where m

is integer

TR_Reset Output RS422 Reset 2 Active Low pulse of 5us

TRC_Clock_Ref Output RS422 Clock 2 Clock of 3.90625 MHz

PCPU-ON1-24 Output CMOS Pulsed 24 PCPU1-24 On

PCPU-OFF1-24 Output CMOS Pulsed 24 PCPU1-24 OFF

RS485_TC_PLC_A_M Input RS485 UART Data 2 Telecommand-LineA

Main

RS485_TC_PLC_B_M Input RS485 UART Data 2 Telecommand-LineB

Main

RS485_TC_PLC_A_R Input RS485 UART Data 2 Telecommand-LineA

Red.

RS485_TC_PLC_B_R Input RS485 UART Data 2 Telecommand-LineB

Red.

Tx_Pre_Sel_PLC_M Input

RS422 Timing Signal 2 Active Low pulse of

58us @PRF of 5KHz

TX_Pulse_PLC_M

Input

RS422 Timing Signal 2

Active High pulse of

22us-48us @PRF of

5KHz

Data_Win_PLC_M

Input

RS422 Timing Signal 2

Active High pulse of

40us-110us @PRF of

5KHz

Tx_Beam_Ini_PLC_M

Input

RS422 Timing Signal 2

Active Low pulse of

58us @n PRF where n is

integer

Tx_beam_Hop_PLC_M

Input

RS422 Timing Signal 2

Active Low pulse of

58us @m PRF where m

is integer

TCU_Reset_PLC_M Input RS422 Reset 2 Active Low pulse of 5us

TCU_Clock_Ref_PLC_M Input RS422 Clock 2 Clock of 3.90625 MHz

Tx_Pre_Sel_PLC_R Input

RS422 Timing Signal 2 Active Low pulse of

58us @PRF of 5KHz

TX_Pulse_PLC_R

Input

RS422 Timing Signal 2

Active High pulse of

22us-48us @PRF of

5KHz

Data_Win_PLC_R

Input

RS422 Timing Signal 2

Active High pulse of

40us-110us @PRF of

5KHz

Tx_Beam_Ini_PLC_R

Input

RS422 Timing Signal 2

Active Low pulse of

58us @n PRF where n is

integer

Tx_beam_Hop_PLC_R

Input

RS422 Timing Signal 2

Active Low pulse of

58us @m PRF where m

is integer

TCU_Reset_PLC_R Input RS422 Reset 2 Active Low pulse of 5us

TCU_Clock_Ref_PLC_R Input RS422 Clock 2 Clock of 3.90625 MHz

EPC_Clock_M Output CMOS Pulsed 1 Clock 195KHz 10% Duty

Cycle

EPC_Clock_R Output CMOS Pulsed 1 Clock 195KHz 10% Duty

Cycle

+5V Supply Main Input DC Supply 1 +5V DC

+5V Supply Red. Input DC Supply 1 +5V DC

AN A2.5 Typical test set for TCU

cPCI based Ground Checkout Unit (GCU) will be provided by SAC for testing TCU. Ground Checkout

Unit (GCU) has capability of testing 4 numbers of TCU simultaneously. Either of main and redundant

section of TCU has to be powered ON at a time.

Figure 2: Block Diagram of TCU and TCU-GCU Interconnection

Figure 3: Photo of TCU and TCU-GCU Interconnection