riding on the next big wave acquisitions of nexx and

April 3, 2018

RIDING ON THE NEXT BIG WAVE

Acquisitions of NEXX and AMICRA

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Acquisition of NEXX - Transaction Overview

1 Fiscal Year end Mar2 Including CFIUS: Committee on Foreign Investment in the United States

Deal Summary

• Acquisition of NEXX for an upfront cash payment of

US$90m upon closing

• Contingent payment by ASMPT of up to additional US$8m

dependent on FY2019/201 financial performance

• Subject to working capital adjustments

Financing• The Group has sufficient internal resources and banking

facilities to fund the Consideration

Closing• Subject to final regulatory approvals2

• Expect to close in late 2018


Products Deposition systems for Advanced Packaging (ECD & PVD)

Target Markets Advanced packaging market

TAM ~ US$300M – 400M

Installed Base ~ 250 systems | ~ 50 customers

Location Billerica, Massachusetts: ~120 employees

Regional TeamChina, Taiwan, Korea, Japan, Singapore, Europe: ~50 worldwide

NEXX Overview

Applications

Pillar Bump Backside metalFan Out RDLTSV Under bump


Acquisition of AMICRA

Market Focus

• AMICRA has a leading position in the photonics market,

which ASMPT believes has a high growth potential

• AMICRA’s sub-micron ultra-high precision die-attach

equipment is complementary to ASMPT’S existing product

portfolio

TAM • ~ US$80M – 100M with high growth potential


Products• High accuracy die bonding (down to 0.3 microns)• Leading manufacturer of highly functional advanced

packaging and high precision assembly equipment

Target Markets

• Silicon photonics• Fiber Optics (e.g. optoelectronic interconnect)• MEMS• Semiconductor (TSV, 3DIC, FO WLP)

Installed Base • > 150 systems

Location • Regensburg, Germany (HQ)

Worldwide Offices• Regensburg Germany, Silicon Valley, and Singapore• ~120 employees

AMICRA Overview


Huge Amounts of Data will Spur Semiconductor Demand

Collect

TransmitAnalyse

Store

IIOT

Camera

3D Sensing

Sensor

5G

LiFiWiFi

CPU / GPU

Big Data

Centre

Memory

AI

Silicon Photonics

Advanced Packaging

CloudComputing

IOT

LIDAR

Data Analytics

Display

LASER GROOVING

WLFO

TCB

Advanced Packaging

WLFO

WB

Active Alignment

CIS

LASER Dicing

Silicon

Photonics

TCB

PLFO

WB

PrecisionDie Attach

Precision

Die Attach

AR

VR

Micro LED

Mini LED

PLFO

TCB

PrecisionDie Attach


How many Data Centers will there be in the FUTURE ?

Data Center of Google

in Eemshaven, Netherlands0

50

100

150

200

250

300

350

2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027

Ma

rke

t Siz

e (

US$

B)

CAGR: 15%(between 2017 – 2027)

Source: Market Research Future, Mar 2018

Global Cloud Computing Market Forecast

(2017 – 2027)

Photonics is the enabling technology for 100G / 400G

data communication within data centers.


Advanced Packaging is a High Growth Area

Value Add in Semiconductor

Shifting to

Advanced Packaging

Moore’s Law

Slowing Down !

Advanced Packages

Golden period for

Advanced Packaging

for next 10 years

Source: Quora


NUCLEUS/ NOVA

Plus Fan Out2

ORCAS

SUNBIRD

Laser

CA

PVD1

ECD1

Covering All Interconnection Technologies

Source: Prismark Wafer Starts, 2017

Wire Bonding

Die Bonding

Wire Bond Flip Chip Fan Out 3D TSVTotal Semi.

Wafers

Flip Chip/

NOVA Plus/

AFC Plus2

TCB

PVD1

ECD1

TCB

Laser

PVD1

ECD1

1 NEXX Product2 AMICRA Product


An Unparalleled Product Portfolio for Advanced Packaging

Invest Ahead of the Curve

SUNBIRD(WLP Test & Pack)

FIREBIRD(TCB)

ORCAS(Fan-out Molding)

NUCLEUS(FO WLP & PLP – Pick & Place)

LASER 1205(Singulation )

SIPLACE CA(SiP Pick & Place)

NEXX Conductor

FO/FI (PVD)

NEXX StratusTM

P500 (ECD)AMICRA NOVA Plus / Fan Out AMICRA AFC Plus


NEXX PVD | ECD Serving Wafer Level & Panel Fan Out

PVD Equipment Market ECD Market for Bumping

Conductor FO/FI

Apollo Power Devices

Apollo EMI Shielding

Apollo UBM

StratusTM P500 (Panel)

StratusTM P300

StratusTM S300

StratusTM S200

1 NEXX Internal bottom-up analysis for 2017

• No 2 in the market

• Estimated market share1: 18%

• Major competitors: Lam Research,

AMAT, Ebara

• No 3 in the market

• Estimated market share1: 14%

• Major competitors: SPTS, AMAT


Established Leader in Advanced

Packaging

Recognized leader in advanced

packaging process technology

Competitive Advantages of NEXX

Industry Leading Technological

Capabilities & Competitive Products

Continue to introduce cutting edge IP

and new products to the market

Strong, Diverse and

Large Customer Base

Established presence across the

OSATs, IDMs and foundries

Experienced Management Team

Agile technical team driven by

innovation and opportunity


NEXX TAM Forecast by Product

$169 $179 $196 $198 $200

$11 $16

$28 $67

$104 $118

$125

$137

$138

$140

$298 $319

$361

$403

$444

$0

$100

$200

$300

$400

$500

FY 2018 FY 2019 FY 2020 FY 2021 FY 2022

Rev

enu

e ($

Mill

ion

s)

Year

PVD

Panel

ECD

October 2017

Source: Gartner (December 2016) for ECD and PVDWorldwide Semiconductor Wafer-Level Packaging Equipment Forecast (Millions of Dollars)

Source: Yole (May 2017) for PanelEquipment and Materials for Fan Out Packaging


Highly technical systematic, approved,

repeatable and delivers superior performance

100+ man years of R&D developments

Protected IP core

Patents and industrial know-how

Uniformity of height and ultra placement accuracy

enabling improved performance and yield

AMICRA Technology Platform

Industry proven product families to trigger

targeted market verticalsExecution

Platform extensible for future market verticalsOutlook

Hardware

Mechanics

and

Software

Solutions

Platform

Optics / Communications

market

Hyper datacenter (Internet

Gorillas)

IoT

Industry 4.0

Silicon Photonics

On Chip Optical Network

Automotive

MEMS sensor / IoT

Solid State LiDAR

Consumer Market

AR and VR

Semiconductor / Middle End

FO-WLP, 2.5 / 3DC

HIGH PRECISION PLATFORM (HPP)

HIGH PRECISION PLATFORMAdvanced Packaging Market

Enabler


Competitive Advantages of AMICRA

Market Leader - Ultra High Precision

Equipment

• Roots lie in optical industry

• Strong IP base & extensive R&D capability

• Proprietary technology platform delivering accuracy

• Market leader for optoelectronics interconnect in

communications, silicon photonics and advanced

packaging verticals

Dominates Rapidly Growing Market

• Addressable core market segments at average 25%

annual growth

• Increasing demand by data generated and transferred

between & within datacenters

• These trends are driven even faster by growing data

consumption and generation of onboard intelligence of

consumer and industrial peripherals and Industry 4.0

Strong Market Position

• Growth rapidly between 2006 and 2017 with a revenue

CAGR of 31% and transitioned to attractive EBITDA

margins

Tier-1 Existing or Target Customers


Application Markets for Silicon Photonics

Source: Yole Development Jan 2018


Advanced Optoelectronic & Silicon Photonics Market


Synergies 1 + 1 > 2

Targets

Leading

Technologies

Strong Market

Position

ASMPT

Technology

Financial

Resources

Enabling

Technologies

Sales/ Marketing/

Support Networks

Supply Chain


Executing Key Strategies for Sustainable Growth & Profitability

GAIN

MARKET

SHARE

INVEST IN

NEW

GROWTH

AREAS

STRATEGIC

M&A

Continue to Fine-Tune

Organization Structure & Business Strategies

Wire bonding

Die bonding

Lead Frames

SMT

CMOS Image Sensor

Automotive

Power Management

Advanced Packaging

Data Communication

Micro / Mini LED

SMT Placement

SMT Printing

LASER Grooving / Dicing

MIS

NEXX

AMICRA

riding on the next big wave acquisitions of nexx and

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