SEMICON/JapanIndustry Briefing

December 5, 2012

Executive Summary

• The Program has achieved critical momentum

• Tools selected for program demonstrations– Broad coverage of tool set and Supplier base– Tool optimization added to program scope

• Coordinating across Industry on precompetitive opportunities

Global 450mm Consortium

• A public/private program based at the College of Nanoscale Science and Engineering in Albany, NY

• Driving effective industry 450mm development– Coordinate test wafer capability supporting development– Demonstrate unit process tool performance– Improve tools with Suppliers to ready for customer operations

• G450C Members– CNSE / Research Foundation– GLOBALFOUNDRIES– Intel– IBM– Samsung– TSMC

GM/VP and CoordinatorPaul Farrar, CNSE

G450C Program Organization

Director,Integration (Samsung)

Director, Program Coordination

(Intel)

CVD/PVD/ImplantEngineering Director

(IBM)

Co-directors,Fab Operations

(CNSE/TSMC)

VP/ GM, Internal / OperationsJohn Lin, TSMC

VP/GM, Industry / StrategyFrank Robertson, Intel

LithographyEngineering Director(GLOBALFOUNDRIES)

CMP/Thermal/CleansEngineering Director

(TSMC)

Etch EngineeringDirector

(Samsung)

• Industry consortium coordinated by not-for-profit entity• Leveraging New York State funding, matched by all industry participants• Broadly-shared management of Program execution• >60 staff on board now; >150 by 2014, with ~60 Supplier engineers on site

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Development and Technology Intercept Targets

------ 2010 2011 2012 2013 2014 2015 2016

Early Development of Silicon and factory integration / automation standards, interoperability test beds for component andstandards verification; early tool development

G450C Program

ISMI 32/22nm Equipment Performance Metrics

10nm and beyond

Tools for Consortium Demonstrations (unit process)

Ready for IC Makers

Early 450mm Development

Test Wafers to support development and demo

14nm G450C Demonstrations

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450mm and 300mm tools progress synchronously through technology generations

Full set of process and metrology, automation

Nominal “nm” = ITRS M1 Half Pitch

Supplier Tool DevelopmentTool Demo /Improvement

G450C TW

Cleans, Blanket Films, Etch, etc.

Bare Wafers

Imprint /Spacer doubling, 300mm Coupons 193i on 450mm

Metrology

Increasing scope and complexity of process / metro capability

Manufacturing Execution Systems, Engineering Data Collection and analysis tools, Virtual Fab logistics for globally-distributed tool set

Alpha Beta Pre-production

Wafer pool coordination for multiple use, re-use, reclaim

2011 2012 2013 2014

Test Wafer Support for Tool Development

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Baseline Report

EMA

Gauge Study PDC

MDC

DOE Marathon

Development

Supplier Testing

Demo Tool

Test Plan

Tool Improvements as Indicated by Pareto

Tool Ready for Customers

G450C Demo

Increasing tool maturity and data-based confidence

Demo Report

EMA Report Tech Transfer

Standardized methods and consistency across all tools

2012 2013 2014 2015 2016

Demonstrations Drive Tool Improvement

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450mm Equipment Development

Tool Selection Overview

• Immediate objective: – Select at least one Supplier for Priority 1 and 2 tools for

negotiation of Demo / full flow @ CNSE • Criteria:

– Technical and commercial scores from RFQ– Balance across competitive Supplier base– Benefit to all Members and NY State

• Process:– Research Foundation RFQ– Member selection teams used pre-agreed criteria– Management Council approved recommendation

Closing deals with selected Suppliers10

450mm Cleanroom in CNSE (NFX) Cleanroom ready by January 2013; First tools installed March 2013 450mm OHV is ready, could carry 300mm FOUP in 450mm inter-bay 4 stockers with 1000 bins ready in Feb 2013

G450C

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G450C Test Wafers/ Operations

Wafer Availability

• Initial order for 6000 sc-Si (SEMI M76)– Growing capability to meet 2013 need

• Initial order for 2000 cast wafers (SEMI M74)– Provision for wafer handling needs

• Bring up additional supply in 2013– > 15,000 wafers and progress to prime quality

(SEMI M1) needed next year– Exploring engagement with multiple Suppliers

Establish roadmaps for cost / quality learning13

Wafer Industry Support Model

• Suppliers providing tools for the program get access to test wafers at significant discount to individual purchase

• Program expansion:– Suppliers without tools in the program can also get

discounted cost if they return wafers and provide data– Suppliers may take advantage of program volume

aggregation to procure wafers at consortium cost• Wafer pool managed for budget, allocation to needs• Pass on our costs beyond program capabilities for TWs

Adjust for wafer costs, reuse/regen, scrap rates, etc.14

Wafer Cost Sharing

• To support 450mm development and maintain Consortium budget, wafer cost will be shared with industry

• G450C will be loaning wafers for a given duration, at a shared cost (wafers available for purchase at 100% of G450C cost)

• G450C cost share represents a considerable discount from independent small volume purchases

• Factors for cost share will include usage/needs, reuse/regen, wafer loan duration, scrap, etc.

• Test wafer process/metrology capability ‘Menu Card’ being developed for industry needs

For wafer request/loan discussion, more information available at: http://www.g450c.org/wafer-loan.aspx 15

Wafer Quality Continues to Improve

Most recent ~ 66 @ 38nm sensitivity

August 2012: ~5 defects/wafer

2011: ~ 175defects/wafer

2012: ~50defects/wafer

2010: > 3000defects/wafer

Defects per wafer reduced significantly(@ 90nm sensitivity)

Defects / Wafer

Year-to-year comparison using >90nm defect size recipeMigrating to 40nm and below

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Process Film Tool/service2012 4Q 2013 1Q 2013 2Q 2013 3Q 2013 4Q

10 11 12 1 2 3 4 5 6 7 8 9 10 11 12

FEOL

Oxide

Cleaning tool Supplier

★

Poly ★

SiN ★

PR ★

Wafer Quality Roadmap & Reclaim Capability

Supplier side G450C On-site ★

Wafer quality roadmap

M74 Spec

M76 Spec

2012 2013 2014 2015 2016

1H 2H 1H 2H 1H 2H 1H 2H 1H 2H

M62 Spec

M1 Spec

Q2, 2014

Q1, 2015

Wafers meet SEMI spec

•SFQR meet (~90% area)•Particle (~70% pass rate)

Q2, 2013

FEOL wafer reclaim capability

Mechanical Wafer

Test / Mon Wafer

Prime Wafer

Epi Wafer

Test Wafer Routes (Menu Card)

Route name Route Description5 Oxide film - thermal 110AA Oxide film - thermal 1000AB Oxide film - thermal 5000A4 Oxide film - PECVD 1000AD Implanted wafersE PR wafersF PR wafers + implantG PR wafersI patterned wafersJ Nitride film - LPCVD 1000AK Nitride film - LPCVD 2000AL Poly film (1000A)M Poly film (3000A)O Nitride film - PECVD 200AQ TiN film (1000A)V Bare wafersW Bare wafers Mechanical

Route name Route Description4a Oxide film - PECVD 1000AC Low-K filmN Ni filmP TiN film (600A)R W filmS TaN filmT Cu filmsU Al film

Vbe Bare wafers

Front End Metals

Metrology Readiness

• Metrology capability expanding to support virtual test wafer operations

Tool Type Forecasted Ops Ready In Japan

Forecasted Ops Ready in New York

Supplier Hosted Metro Site

Advanced Bare Wafer Inspect

Operational Operational

Ellipsometer/ Scatterometry

Operational 1st Tool Operational2nd Tool Ready December 2012

4 pt Probe Operational Operational

AFM January 2013 Operational

TXRF January 2013 Operational

Opaque Film Thickness

Operational Operational

Macro Inspection Operational Operational

Defect Review SEM March 2013 May 2013 April 2013

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G450C Operations - CNSE Cleanroom

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11 tools installed in NY cleanroom, 3 in progress

Existing space allows for 3-4

additional metrology tools

incoming 2H’12 / 1H’13

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On Site Equipment Progress - Films

PECVD Uniformity example

Thickness uniformity SiN: 5.06 % 1.46 % Ox: 14.5 % 1.62 %

Throughput Compatible to 300 mm

Q2, 2012

Q3, 2012

SiN

Ox

5.06 %

1.46 %

14.5 %

1.62 %

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Wet Clean and Wafer Recycling

Bar brush Recent optimization

Front side Back side

Recycled oxide wafer:

Wet Cleaning:Optimizing early tool

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On Site Equipment Progress: Defects

• Passed qualification (in July)– Current particle sensitivity 38nm – Continue improving to 30nm

Particle Inspection A: on site

Particle Inspection B: off site • To be moved in soon

– Bare Si wafer particle sensitivity demo < 30nm– Target sensitivity at ~ 25nm

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Summary and Opportunities – Test Wafer Operations

Summary• Silicon supply capability improving across the industry

• G450C operations have resulted in cleaner wafers• Proven logistics in place, continuous improvement underway• Processed wafer loans increasing• Multiple Wafer Carrier suppliers in place and progressing well• G450C expanding equipment base in existing clean room

Your Opportunities• Leverage G450C Wafer Bank to accelerate your equipment

development• Engage G450C for wafer loan requests via website

http://www.g450c.org/wafer-loan.aspx24

Lithography Update

G450C Lithography Tool Roadmap

2012 2013 2014 2015 2016

2H 1H 2H 1H 2H 1H 2H 1H 2H

Coupon + Imprint

193i patterning access at Supplier site Positive

450mm Imprint + Spacer

300mm Imprint

193i Coupon, EUV Coupon

Potential G450C tool @ CNSE

• Imprint solution before optical lithography available

– Imprint + Spacer extends resolution to 14-15 nm (2013 - 2014)

• Pull in early 193i tool to 2H14

• Expect 193i Litho full demo capability 2015 - 2016

Lithography Strategy

Working on an Industry solution to accelerate 450mm scanner development

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Imprint as Interim Patterning Measure

450 mm tool is completed, operational by end of 2012

Explore spacer process to extend ~20nm to 10 nm

Litho, Etch, Films engineering team developing templates and

processes to prepare patterned test wafers

Work with Suppliers to build up complete process

Coupons – 193i / EUVImprint

30nm 1:2 40nm 1:2

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300mm Nano Imprint Performance

Good CDU, LER; Profile OK, Rdl ~15nm

SiN & APF (amorphous carbon) etching

Good CDU, Line edge

Successfully etched SiN & APF

Poly Spacer etch on-going

Coating at Supplier site

Solving particle issues

Working on re-work issue

450mm Nano Imprint Status

450mm tool is ready in Nov, (Austin) –tuning process

Template design: 22nm ok, verify 14nm capability

Poly spacer for pitch doubling – on going

Negotiate 1st phase patterning wafer capacity in Austin

450mmDemonstration Test Methods

(DTM)

Equipment Performance Metrics (EPM)

• “1X nm Range” technology targeted for 2013-14 G450C demonstrations – “ITRS 14 nm Nominal”– Snapshot in continuum of technology progression– Performance of 450 mm and 300 mm tools advances in lock-

step

• Update Process (by end of 2012):– Suppliers propose competitive performance at ‘14 nm” without

revealing sources of guidance or disclosing customer IP – Consortium staff take best Supplier proposals for each tool type

to propose EPMs– Consult with Suppliers for aligned output– Validate EPMs meet Member Companies needs

• Implementation– Ensure Demo test plans allow for full range of tool performance– Report the data for each tool with comparison to Demo EPM

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Updated Equipment Performance Metrics

Attribute Units Metrics

Pulse width (measured at peak-50C) sec 1E-4 ~ 1E-1 (0.1msec to 100msec)

Ramp-up Speed (250 - 1350C) C/sec > 1E+4

Peak temperature Within Wafer uniformity (3σ )

C <10

Mean peak temperature Wafer to wafer uniformity (3σ )

C <5

Center-to-edge variation through ramp range C < 10

Ramp-down Speed (1350C to 650C) C/sec > 100

Overshoot (250C - 1350C) C < 2

Setting Time (250C - 1350C) to within 1% of set point

sec < 1E-5

Slip-free process at maximum temperature C 1300 (1350)

Residual oxygen concentration (400-1100C) ppm < 5

Defects, PWP On bare Si ≥ 30nm, mechanical transfer only #/cm2 < 0.0028

Defects, PWP Backside on Si ≥ 50 nm, mechanical transfer only

#/cm2 < 0.28

Defects, PWP On bare Si ≥ 26nm (with process)

#/cm2 < 0.007

Defects, PWP Backside on Si ≥ 50 nm (with process) #/cm2 < 0.28

14nm targets for demo

Agreed with all Suppliers

Publish update by EOY

Millisecond Anneal Example

Demonstration Test Methods (DTM) Overview

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• Equipment Maturity Assessment (EMA) includes a couple of dozen parameters with clear categorization of the tool characteristics based on defined criteria, as well as compliance with applicable standards; output is a report recommending pre-test actions and testing levels

• Test planning is based on the tool maturity, goals for reliability, throughput of the tool and confidence objectives, combining any Supplier pre-data with demo testing via Bayesian statistics

• Gauge Studies run for all metrology needed for the demo to ensure adequate Precision/Tolerance ratios• Mechanical Dry Cycle (MDC) - nominally 5000 cycles of the wafer movement functions without process for

reliability and mechanical handling defect data• Passive Data Collection (PDC) - a test of process stability on a baseline recipe for each application.• Initial data is analyzed and a Baseline Characterization Report issued; decisions are made about

subsequent testing or reversion to tool development to address any hurdles• Sensitivity Analysis - DOE optimization of the recipe(s) and RSM characterization of the process window(s)• Marathon - 24/7 manufacturing simulation to capture tool productivity and reliability performance using

E10 states over a significant period, running process with sample testing to capture rates/variability, defectivity and tool-specific performances like step coverage, gap fill, LER, etc..

• A final report is drafted, the Supplier has opportunity for comment, recommendations for tool improvement are made and demo is completed with web publication

DTM Components

Demonstration Test Methods (DTM)

Duration 2-6 months

Demonstration Test Methods (DTM)

Standardized Reports

Executive SummaryDemo Test Background• History and previous testing• EMA Report• Test PlanTest Results• Process Capability

Performance− Gauge study− PDC− Sensitivity Analysis (SA)− Marathon Test

• Equipment Performance− MDC− Marathon Test

• Others− CoO, Standards

compliance, software & user interface, factory integration

ConclusionsSupplier Input 38

Compliance with SEMI Standards Required(www.semi.org)

• SEMI E5: SECS II • SEMI E30, E30.1, E30.5: GEM ("Fully GEM Compliant" as well as GEM

Compliant per section 8) • SEMI E37: HSMS • SEMI E37.1: HSMS-SS • SEMI E39, E39.1: Object Services Standard: Concepts, Behavior and Services • SEMI E40, E40.1: Standard for Processing Management (PJM) • SEMI E87, E87.1: Specification for Carrier Management (CMS) • SEMI E84, E84.1: Specification for Enhanced Carrier Handoff Parallel I/O

Interface • SEMI E90, E90.1: Specification for Substrate Tracking (STS) • SEMI E94, E94.1: Specification for Control Job Management (CJM) Stream 7

Process Program Management for recipes (E5, E30)

Definition and measurement of equipment reliability, availability, and maintainability during program testing will conform to SEMI E10-0304

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Self-audit completed and findings released (all medium to high risk non-conformances are to be addressed):• S2-0200: Safety Guidelines for Semiconductor Manufacturing Equipment

including Operational Hazard Analysis covering tool installation, operation and maintenance (per S2-0200) completed for tool install operation / maintenance

• S8-0308: Safety guidelines for ergonomics engineering of semiconductor manufacturing equipment

• Environmental Characterization Data Summary Work Sheet 6 per International Semiconductor Manufacturing Initiative (ISMI) guideline #06124825A-ENG completed and provided electronically prior to shipment

100% Compliance to Safety/Ergo Requirements

It is an absolute requirement that all equipment must be safe to operate and maintain at any stage of maturity

Equipment spare parts and modules must either be small and light enough to handle safely during maintenance, and clearances adequate, or ergonomic

handling aids must be provided40

Further Standards-related Requirements

• Footprint, height and weight dimensions of the Equipment as well as the move-in packages must conform to SEMI E72 specifications

• The Equipment loadport must have a RF ID reader compatible with RFID tags (model numbers TIRIS multipage MicroTag RI-TRP-DR2B) on the FOUP per SEMI E99

• The system must have adequate PGV docking interface exclusion zone per SEMI E64-0600 modified as needed for the SEMI E154 450mm load port

• The Equipment configuration must have a minimum of one load port that confirms to latest revision of SEMI E154

• The Equipment load port must be capable of receiving 450mm FOUPs confirming to SEMI E158.

• The Equipment load port must be capable of receiving lots delivered by 450mm Personnel Guided Vehicles (PGVs)

G450C will require SEMI M74 Mechanical Wafer, M76 Developmental Test Wafer and M1 Prime Wafer Standards and use SEMI-compliant carriers for all

program test wafer pool /demo purposes41

Facilities-Related Standards

• The Equipment must comply with the current versions of the (U.S.) National Electric Code - NFPA 70 and Uniform Fire Code - NFPA 79

• The Equipment must be designed to SEMI F47 “Specification for Semiconductor Processing Equipment Voltage Sag Immunity”

• All Equipment and materials which will come into direct contact with the wafer or FOUP should be grounded per SEMI Spec E78-0706.

• All Equipment enclosures must have an IEC ingress protection rating of IP31 or better• SEMI E6-1296 facilities interface datasheets completed and provided electronically

prior to shipment

It is recommended that the 450mm Equipment is designed to EU regulatory requirements including, but not limited to, Machinery Directive 98/37/EC, Pressure Equipment Directive 97/23/EC, Electromagnetic Compatibility Directive 89/336/EEC, and Low Voltage Directive 73/23/EEC as applicable

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Industry Collaboration and Engagement

Core G450CProgram

Process & Metrology

Wafer Pool

Regional 450mm

Regional Tool Suppliersnot in G450C core program

Tool Suppliers w/G450C

Demos

Wafer Suppliers

Guidelines &Requirements

Global Supply Chain Ecosystem Example: G450C Linkages

Opportunities

Adjunct Tool Demos and CIP projects

EEMI 450

+ R&D entities: FhG IMEC …KSIA

I450Metro

• Component Suppliers• Infrastructure Providers

…

Standardization Opportunities

Guidelines

Global Standards

Compliance testing

Back End (Die Prep) WG

Standardization WG

Facilities Council

TBD: Harmonize microcontamination specs

G450C Groups

G450C ProgramActivities

Regional Cooperation

Equipment optimizationFacilities optimization

EHS optimization

46TBD: Metrology collaboration

Discussion this week with ESG-J

Precompetitive Cooperation

• Identified top facilities project objective with M+W• Identified top standardization focus areas with SEMI• Defined pilot project: tool installation at CNSE with

adaptor plate and consolidated points of connection• F450C membership defined and first meeting with

G450C rolled out project priorities toward proposals• Workshop planned with SEMI, F450C and G450C for

early 1Q13 to explore further work• 14nm EPM update with standards guidance based on

Supplier tool agreements to be published by end of year

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Top Areas for Precompetitive Cooperationwith SEMI and F450C (first targets)

• Top Standardization interest areas– Aisle space / width, ceiling height– General sizing/loading/dimensions– EMO interface, control architecture– Crane, gantry– Templates

• Top facilities project interest areas– Gas interface boxes, VMBs, cooling water manifolds, etc.– Minimize facilities POCs– Standard hookups for power, PCW, CDA, PV, GN2, exhaust, datacom– Improved AMC detection/response– Pumps and pump frames, etc.– He recycling (Backside cooling ), H2 recycling (EUV)

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TEL Facilities Cost Reductions in Albany

Page 50G450C

Summary

• G450C has launched with full industry momentum

• Significant progress towards the 450 mm transition is continuing in all areas of the supply chain

• Collaboration and synchronization remain critical for a cost effective and timely 450 mm transition

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Questions and Discussion

450 mm Reference Materials Location and Contact Information

• Guidelines and other public documents, including Wafer Loan Program Details, Demonstration Test Methods and Equipment Performance Metrics can be found at: http://g450c.org

• For further information or to engage in opportunities with the Global 450 mm Consortium program:

Dave Skilbred

G450C Program Coordination Director

david.skilbred@g450c.org

518.441.7656

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