service engineeing & optimization level 3, rev.1.0 motorola u9 u9

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Service Engineeing & Optimization Level 3 , Rev.1.0 MOTOROLA U9 U9

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Page 1: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

U9

Page 2: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Generic Overview

Market Name: U9

Manufacturer: Motorola

Form Factor: Clam Bands/Modes: GSM Quad Band 850/ 900/ 1800/ 1900MHz

Memory Internal: 20MB (user)

Memory External: up to 4GB

Expected SA Date : Sep 2007

Displays: 2.0” internal 320x240 - 262k color TFT 1.45” external 128x160 - 65k color OLED

Antenna: Internal

TT/SB Time: BX40 Battery - TT up to 374min, SBT up to 388 hours

Customer Sync. SW: Mobile Phone ToolsAvailable at: Customer Stores

Page 3: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Generic Overview

Service SW: RSD, Repiar Studio, GPGate, Moto TriageAvailable at: http://md-service.corp.mot.com/login.aspx

Connectivity: Micro USBData Cable avail. At: http://62.214.1.200 (Micro USB to USB A, Micro USB Data Cable)

Battery Eliminator: actual new design (BX40)Available at: http://62.214.1.200

Flex Flash File Type: 1FF SuperfileRequired SW: RSD

Required Tools: Torx 5 Size, Tweezer, Plastic disassembly Tool, Hinge Shaft Tool (recommended)

MandatoryRepair Fixture: Lens press FixtureAll Tools available at:http://62.214.1.200

How to update SW: start up RSD, power up Moblie and connect via Micro USB cable, Select required 1FF Superfile and start Flash/Flex process

Page 4: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

KEY FEATURES> Small, curvaceous, seamless form> Combination of metallic gloss finish and soft

feel for a visually and tactile rich experience > Floating graphics on CLI> 2 MP camera> Music player with dedicated touch sensor

buttons> Bluetooth > A2DP for BT stereo headset support> Touch sensor for wake-up (TBD)> Micro SD – up to 4 GB> Internal user memory – 20 MB

SERVER/CARRIER ENABLERS> FOTA> Screen 3> Mega SIM> Branded Services

>Vodafone >CMCC>Orange>MyFaves

SPECIFICATIONSBand / modes: Quad Band /

GPRS Class 12, EDGE Class 12Size: approx. 55-60 ccDisplay: Main: 2.0” QVGA 262K TFT

CLI: 1.45” 128 x 160 65K OLEDAntenna: InternalPlatform: SCM-A11UI Platform: ChameleonBattery: BX40TT/SB Time: Up to 374min TT/ Up to 388hrs SB

ENABLERS> Audio CODECs: MP3, WMA, AAC, AAC+enhanced> DRM: OMA v2, JANUS> Browser: WAP 2.0> Messaging: MMS, WVIM, EMS 5.0, SMS> IM: Embedded - WVIM> Bluetooth: Class 2> J2METM: MIDP 2.0> Connectivity: Bluetooth Class 2, USB 2.0 Full speed> Video: WMV v10, WMV v9, RV v9, H.264, H.263,

MPEG4

One Slider

Page 5: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

U9 Z6

Memory

Display

Antenna

Connectivity

Alert Speaker

Others

RF

Baseband Chipsets

Camera

GSM/Edge Tranceiver IC “TRANSAAM”

PA “RAPTOR”

SCMA11

Atlas V3,5

1GB Flash/ 512MB SDRAM

Micro USB

Navigation keypad

Main 2.0“Color 262K,CLI 1.45” Color 64K

Quad-Band Internal Antenna

2,0 Mega pixel Main Housing mounted

Serializer IC

10 x 16mm oval Polyphonice Speaker

MegaSIM Cardreader

GSM/Edge Tranceiver IC “TRANSAAM”

PA “RAPTOR”

SCMA11

Atlas UL

1GB Flash / 64MB SRAM

Camera Flash

Mini USB

Vibrator Motor

Navigation keypad

2“TFT, 320x240/ 262K Color Display

Quad-Band Internal Antenna

2,0 Mega pixel Main Housing mounted

Serializer IC

10 x 16mm oval Polyphonice Speaker

SIM + T-Flash Cardreader on Daughter Board

Linux/Java platform productLinux/Java platform product

U9 vs. Z6

Vibrator Motor

Page 6: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Top Side

Sidekey MylarKeypad MylarEL film

Page 7: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Bottom Side

J902Micro USB

J1 Ext. Antenna

U903 Vibrator

J650 Flip Con.

J903 Battery Con.

J620 T-Flash Con.

Coin Cell M610 MM-Sim Con.

Page 8: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

U900Atlas

U700Memory

U800SCMA11

U301Bluetooth

U50Raptor (PA)

Bottom Side

Underfilm

U100TransAAM

FL100Saw Filter

U901EL driver

MK900MIC

U650Serializer

U600Light Sens.

Page 9: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Main Chipsets

U50 “PA + Antenna Switch” – (RAPTOR)(RX/TX Switch, PA + Matching)

U100 “GSM /EDGE Tranceiver IC” – (TRANSAM)(Frontend IC, RX/TX VCO)

U800 “SCMA11”(DSP, De/ Modulation, VCO driver, Graphic, Memory Card,

Cam)U700 “Flash”

(1GB (20MB User Memory) plus 512MB SDRAM)

U900 “Atlas 3,5”(Audio Stereo ,Power Supl., over Voltage interface, Charger

interface, Backlight Sink circuit, USB interface)

U650 Serializer(converts the parallel ATI graphic Display Data into serial)

U301 Bluetooth

Page 10: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 RF System Block Diagram

BluetoothTI 6035

Supply LinesControl LinesRF Signal LinesLF Analogue

B+PM (Atlas)

VRFREF(2.775V) VRF1

(2.775V)VRF2(2.775V)

VRFCP(2.775V)

VRDIG(1.875V)

TOUT7

Raptor

TransAAM

Quadband SAW Filter

AntennaSwitch

US_EUROLB_HBTX_ENTX_ANT_ENIPC_BCM

HB_OUTLB_OUT

CELEGSMDCSPCS

VRAMPVDETECT

RESETB

SYSCLKSYSCLKEN

STROBE

RXTXDATARXTXEN

CTRLCLKCTRLDATA

CTRLENDBG_DATA

BTCLKBTCLKEN

DIGRF_TXDDIGRF_TXE

DIGRF_CCLKDIGRF_CDATDIGRF_CEN

BB Processor

SCM-A11

VBTRF

VIOLO

BT_RESET_B

26MHz

XT

AL

EX

TA

L

Page 11: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

Discrete RF main components:•TransAAM from Freescale (pn:5188450M37)

•Raptor from Freescale* (pn:5188995Y01)

•Saw Filter from SAWTEK* (pn:9188668L11)

•LPF filter (pn:9109403K08)

•26MHz crystal (pn:4809612J53)

•Antenna switch* (temp pn:5170200A95)

•BT EDR IC from TI BRF6300* (pn:5103535B06)

*Component to be qualified

RF Main Components

Page 12: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Schematic - Raptor

PA output match Notch filter

Page 13: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

1. PA output match• PA output impedance is sensitive and affect the following RF

performance.

ORFS due to switching (output RF spectrum)

Current drain

Conducted Harmonic

• Optimization is expected between PA and Antenna during bench measurement.

2. Notch filter added at PA output• Possible spurious emitted at LB 3fo and DCS 2fo under radiation mode

due to load impedance change.

Lesson Learn

Page 14: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 U50

GSM PA – Low/ High BandThe Raptor module is a input/output, quad-band, dual-mode, GMSK/8PSK(EDGE) PA module + integrated Antenna swith circuit, intended for 2.75G radio applications. The module consists of a dual line-up power amplifier, harmonic filter, logarithmic power detector, and analog power control circuit. This PA module is used in the final amplification stages in a GSM portable telephone operating in either GMSK or EDGE mode.· EDGE Class 12 operation· GMSK power class 4 operation in the GSM850 and EGSM900 bands· GMSK power class 1 operation in the DCS1800 and PCS1900 bands· EDGE power class E2 operaton

Page 15: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 U500

GSM Tranceiver Circuit „TransAAM“Quad band GSM/EDGE transceiver solution consisting of Fractional-N synthesizer, VLIF (122,7kHz) RX front end, GSM/EDGE TX modulator, power amplifier control circuitry, auto calibration functions, signal processing and auto sequencing functions. The TX modulator functions are completely contained within the module. The RX circuitry includes all circuitry required to convert RF inputs into digital I and Q signals. The baseband interface consists of a serial control and serial data configuration that can function in both full DigRF and Neptune compatible modes. The module requires the Raptor or Ophee PA and Saw filters to complete the RF solution.

Page 16: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

SCMA11

MMSI M/SI M CARD

FlashNAND x16

128MB

SDRAMSDR x16

64MB

Stacked Memory(Toshiba)

J TAG Connector

J TAG Signals

Linux Console (UART2)

EL Driver(SuperTex HV837)

Transflash

1 Enable Signals Base Keypad

((NAV, Center, Send, End, Carrier, Clear,

Soft Left, Soft Right)0- 9,*,#)

Side Keys( PTT, VA,

Vol Up, Vol Down)

BluetoothTI BRF 6300

Camera(2.0 Mpixel

Micron MI2020SOC)

TransAAMv4.2

Raptorv4.3

26MHz

Atlasv3.2

Display(2.0 I nch

18- bit color, Dumb+SPI interface)

Serializer/Deserializer

(Fairchild 668C)

SPI Control

Data

CSI and I2C

IPU

UART1

MI C Speaker Loud Speaker

Vibrator Motor

Power Key

EMU Connector

32KHz

VBUS

D-

D+

ID

CSPI2ASAP(Audio)

MMSAP(Audio)

Main Battery

Backup Coin Cell

5 Row6 Col

OLED Display(1.45 I nch

SPI interface)

Music Button & Touch

LEDs Controller

I2C

Baseband Block Diagram

Page 17: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

Transceiver Board- RF chipset (TranAAM/Raptor)- SCMA11 + Memory- Altas- Micro SD holder- MMSIM/SIM card holder- EMU connector- Battery connector- BT- Keypad- EL circuit- Hall Effect sensor- Ambient Light sensor- Main Display Serilizer- Antenna Switch- Vibrator- Loudspeaker-Mic

50 pin BTB (Flex)

Camera2MP camera on socket

24 pin BTB Receiver flex- Receiver

4 pin ZIF

Side Key flex

- Vol up , Vol Down

- PTT, VA

Pad ACF

Main Display module

39 pin ZIF OLED secondary display

17 pin ZIF

Connection Plan

Flip Board- Main Display Deserilizer- LEDs controller- Music and Activation IC

Page 18: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 OLED Module spec

Display Type Emissive PMOLED Display

Size of Display 1.45”

Module Dimension28.68mmx35.5mmx 1.515mm

Active Area 23.015mm x 28.78mm

Pixel resolution 128(RGB) x 160

Number of colors 262K/ 65K based on software setting

Driver IC LD50T6160 128x160 262K Color PM OLED Driver

Display Interface 4 bit SPI Interface

Connector 17-pins ZIF connector

Backlight Do not need LEDs for backlight

Maximum Brightness ~ 110 cd/mm2

Page 19: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

PM OLED Display128x160

17P

in

Ziff

C

onn

ecto

r

PM OLED Driver LD50T6160

DC/DC Converter MP1541

OLED Module Block DiagramOLED Module Block Diagram

Page 20: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Music and Activation Button

Same as LIDO for Music button but have an extra activation button

VCC

RST (29)

TOUCH (16)

PWM (14)(19) I2C_A0

(22) I2C_A1

GND

SNS3A

SNS3BSNS2A

SNS2B

VIOHI (2.775V)

I2C_DAT

I2C_CLK

TOUCH_INTB

SDA (27)

SCL (28)

<< > / || >>

Si1034X

1 6

25

4 3

VDIG_1.8V

SCMA11

SNS1A

SNS1B

AtmelMega48

UH2_RXDP

AMP EN (13)

VDIG_1.8V

SNS4A

SNS4B

OLEDDisplay

Activation Button

Page 21: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Audio Design Architecture

Right Ch. DAC

Left Ch. DAC

PGAst

PGAst

Mixer, Mono,

Balance

PGArx

Stereo DAC

ArxoutR

Asp

Alsp

PGArx

PGAst

PGAst ArxoutL

ArxoutR

ALSP

ASP

USB XCVR

B+

Amc1R

Atxin

0.1uF

HandsetMicrophone

AccessoryMicrophone

AccessorySpeaker

Loudspeaker

HandsetEarpieceReceiver

LSPL

SPI

UART1

SSI1

SSI2

SAP

StarCore

ARM11

PriSPI

SecSPI

AUDMUX

Output Selector

InputSelector

Voice Codec

TX1

RX1

BCL1

FS1

TX2

RX2

BCL2

FS2

AD1_TXD

AD1_RXD

AD1_TXC

AD1_TXFS

AD2_TXD

AD2_RXD

AD2_TXC

AD2_TXFS

PCM_IN

PCM_OUT

PCM_CLK

PCM_SYNC

Microphone

Speaker

BLUETOOTHMODULE

SCM-A11

ATLAS (Audio)

UART

IPC

1

2

3

4

6

5

7

USB-OTG

PGAtxR

Bluetooth Headset

EMU/MicroUSB Accessory

ASAP Lines

MMSAP Lines

UART2

TX

RX

BCL

FS

DAI Test Points

Page 22: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Power Management System

PICO POWER TREE

VBUS B+

COIN

CELL

ID VATLASVoltage 2.775V

SCMA-11

- DVDD[1:38]

ID SW 1A + BVoltage 1.2 VMax. Load 1000 mA

VCORE

Main Display LCD backlight

Secondary Display OLED

DC-DC

Keypad Backlight EL

DC-AC

ID VUSBVoltage 3.3 VMax. Load 50 mA

ID SW3Voltage 5.0 VMax. Load 350 mA

VBOOSTID SW 2A + BVoltage 1.8 VMax. Load 1000 mA

VDIG_1.8V

IMAGER

-VDD

-VDD_IO

ID VIOHIVoltage 2.775 VMax. Load 200 mA

ID VIOLOVoltage 1.8 VMax. Load 200 mA

Primary and SecondaryDISPLAY

DRIVER IO

FLIP DETECT

CAPACITIVE SENSOR

BT

-VDD_IO

ID VRFDIGVoltage 1.8 VMax. Load 200 mA

TRANSAM

-JVDD

-QVDD_1P8

-VDD_UART2

-VDD_USB2

-VDD_BC

SCMA-11

-VDD_IPU[1:4]

-VDD_L1T

-VDD_BBP[1:6]

-VDD_BC

SERIALIZER / DESERIALIZER

-CKSEL_RT180

-M_S

-VDDP, VDDS,VDDAJ

ID VGENVoltage 2.775 VMax. Load 200 mA

VTFLASH

SCMA-11

- VDD_SDIO1

EXTERNAL TFLASH

Pull up for

-SD1_DATA[0:2]

-SD1_CMD

ATLAS

-PRIVCC

-SECVCC

SCMA-11

-QVDD_FUSEBOX, QVDD_VREG

-VDD_MQSPI, VDDMQSPI1

-VDD_UART[1:2]

-VDD_AUD

-VDD_COM_[1:2]

-URST_B

-VDD_KPP[1:2]

-VDD_CSI[1:2]

-VDD_INT

-GP_AP_C15

-VDD_DDR[1:5]

-VDD_WEIM[1:9]

-VDD_NAND_[1:2]

-I2CLK, I2DAT

FLASH MEMORY

-VCC_N

-VCC_SD[1:3], VCCQ_SD[1:2]

-NC35

IMAGER

-VAA, VAAPIX

-VDDPLL

ID VCAMVoltage 2.80 VMax. Load 150 mA

ID VRFCPVoltage 2.775 VMax. Load 50 mA

SCMA-11

- QVDD

TRANSAM

- VDDA

ID VRF1Voltage 2.7 VMax. Load 350 mA

External Pass Device

External Pass Device

ID VRF2Voltage 2.7 VMax. Load 350 mA

TRANSAM

-VDDA_CP_2P7

-VDDA_ACE_2P7

RAPTOR

-VREG[1:2]

External Pass Device

ID VMMC1Voltage 1.8 / 3.0 VMax. Load 350 mA

MEGA_SIM

-SIM_PWR

TRANSAM

-LVDD

-VDD_TXRX_2P7

ANT_SWITCH

ID VESIMVoltage 1.80VMax. Load 60mA

VBTRF

BT

-VDD_IN

RAPTOR

-VCC_FINAL_HB

-VCC_FINAL_LB

-VCC_DVR_HB

- VCC_DVR_LB

USB INTERFACE

VIBRATOR

LED CONTROLLER

RTC

32 kHZinternal

RC

ID VVIBVoltage 2.0 VMax. Load 200 mA

PICO POWER TREE

VBUS B+

COIN

CELL

ID VATLASVoltage 2.775V

SCMA-11

- DVDD[1:38]

ID SW 1A + BVoltage 1.2 VMax. Load 1000 mA

VCORE

Main Display LCD backlight

Secondary Display OLED

DC-DC

Keypad Backlight EL

DC-AC

ID VUSBVoltage 3.3 VMax. Load 50 mA

ID SW3Voltage 5.0 VMax. Load 350 mA

VBOOSTID SW 2A + BVoltage 1.8 VMax. Load 1000 mA

VDIG_1.8V

IMAGER

-VDD

-VDD_IO

ID VIOHIVoltage 2.775 VMax. Load 200 mA

ID VIOLOVoltage 1.8 VMax. Load 200 mA

Primary and SecondaryDISPLAY

DRIVER IO

FLIP DETECT

CAPACITIVE SENSOR

BT

-VDD_IO

ID VRFDIGVoltage 1.8 VMax. Load 200 mA

TRANSAM

-JVDD

-QVDD_1P8

-VDD_UART2

-VDD_USB2

-VDD_BC

SCMA-11

-VDD_IPU[1:4]

-VDD_L1T

-VDD_BBP[1:6]

-VDD_BC

SERIALIZER / DESERIALIZER

-CKSEL_RT180

-M_S

-VDDP, VDDS,VDDAJ

ID VGENVoltage 2.775 VMax. Load 200 mA

VTFLASH

SCMA-11

- VDD_SDIO1

EXTERNAL TFLASH

Pull up for

-SD1_DATA[0:2]

-SD1_CMD

ATLAS

-PRIVCC

-SECVCC

SCMA-11

-QVDD_FUSEBOX, QVDD_VREG

-VDD_MQSPI, VDDMQSPI1

-VDD_UART[1:2]

-VDD_AUD

-VDD_COM_[1:2]

-URST_B

-VDD_KPP[1:2]

-VDD_CSI[1:2]

-VDD_INT

-GP_AP_C15

-VDD_DDR[1:5]

-VDD_WEIM[1:9]

-VDD_NAND_[1:2]

-I2CLK, I2DAT

FLASH MEMORY

-VCC_N

-VCC_SD[1:3], VCCQ_SD[1:2]

-NC35

IMAGER

-VAA, VAAPIX

-VDDPLL

ID VCAMVoltage 2.80 VMax. Load 150 mA

ID VRFCPVoltage 2.775 VMax. Load 50 mA

SCMA-11

- QVDD

TRANSAM

- VDDA

ID VRF1Voltage 2.7 VMax. Load 350 mA

External Pass Device

External Pass Device

ID VRF2Voltage 2.7 VMax. Load 350 mA

TRANSAM

-VDDA_CP_2P7

-VDDA_ACE_2P7

RAPTOR

-VREG[1:2]

External Pass Device

ID VMMC1Voltage 1.8 / 3.0 VMax. Load 350 mA

MEGA_SIM

-SIM_PWR

TRANSAM

-LVDD

-VDD_TXRX_2P7

ANT_SWITCH

ID VESIMVoltage 1.80VMax. Load 60mA

VBTRF

BT

-VDD_IN

RAPTOR

-VCC_FINAL_HB

-VCC_FINAL_LB

-VCC_DVR_HB

- VCC_DVR_LB

USB INTERFACE

VIBRATOR

LED CONTROLLER

RTC

32 kHZinternal

RC

ID VVIBVoltage 2.0 VMax. Load 200 mA

Page 23: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

ATLAS Block overview

Atlas

Page 24: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 U900

The Atlas is designed as Power Control Audio Power IC used in cellular transceivers.Atlas will handle the audio and power management requirements for the system such like USB, Regulators, Charger Interface, Audio Codec; LED Sink circuit, RTC Interface.The Circuit is in a 247 pin 0.5mm pitch 10x10 Ball Grid Array (BGA) Package.

Atlas 3.5 Power Control - Audio Power

Page 25: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Charger

Charge Control InterfaceBattery ConnectorESD Protection

Dual Charge TransistorCurret Sense ResistorBattery to B+ SwitchVBUS to B+ SwitchESD ProtectionMicro USB Connector

Page 26: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 SCMA11 / MXC91231

ARGON-LVMXC91321

SCMA11MXC91231

• 2.75G baseband processor• Targeted for Single Core Modem Architecture• key additional features include USB high-speed

• ARM1136JFS • 400 MHz / 532 MHz in turbo mode• 16 kB L1 Instruction / 16 kB Data L1 Cache + 128 kB unified L2 cache

• Starcore SC140 • 204MHz / 250MHz in turbo mode. • 16 kB L1 Instruction / 32 kB L1 Data

• SDMA • 133 MHz

CMOS90 15x15 468 MBGA15x15 468 MBGA PoP

Page 27: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 SCMA11 block

Page 28: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 ARM11 platform features

• Industry standard ARM1136JF-S CPU• L1-cache: 16 KByte inst. and 16 KByte data • L2-cache: 128 KByte combined @ 133 MHz• M2 RAM: 16 KByte on-chip @ 133 MHz• M2 ROM: 32 KByte (Boot)• MAX: Multi Advanced High-Performance (AHB)

Crossbar switch• Two clock domains bridged by L2CC

Page 29: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 SC140 platform

SC140e– 208MHz (250MHz in turbo mode)– Interrupt Controller

Cache– 32 kB L1 D cache– 16 kB L2 I cache– 128 kB L2 unified cache– 32 kB M1 RAM

On-chip memory• 32 kB M1 RAM• 1 MB M2 ROM• 640 kB M2 RAM

Page 30: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 U650

Serializer

Low voltage/ Low current High Speed Serial interface• 26 bit dual strobe ultra low power serializer/deserializer• Dual Power Supplies: Core Supply: 2.5 to 3.0V Parallel I/O Supply 1.6 to 3.0V• Single device to operate as serializer or deserializer• Standby Power-Down mode support• Package: 42uBGA 3.5mm x 4.5mm with 0.5mm Ball Grid Pitch

Page 31: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 U300

Bluetooth Class 2.0

The BRF6300 chip is a highly integrated single-chip CMOS (CO27 process) Bluetooth device that formsa complete standalone Bluetooth wireless communication system. The BRF6300 is based on theBRF6150 and is pin-to-pin backwards compatible with the BRF6150 device when VDD_IO of 1.8V isused and not using crystal. The BRF6300 is the third generation of Texas Instruments' single chip BTdevice, succeeding the BRF6150 and the BRF6100 devices.This device implements an advanced solution for the Bluetooth protocol with easy interfacing to a hostsystem.

Page 32: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9 Test requirements

Service Test Issue: RFMD Prime Impact

                             

In 2007 and 2008 Motorola plans to ship 21.5 million EDGE capable phones with the RFMD RF chip globally.  When these phones are returned to Motorola service only two test sets will be capable of EDGE phasing.  After a level 3/4 board repair, all phones must be re-phased to ensure the phone meets factory specifications.   Only supporting two test sets may cause some regions to reroute level 3 or level 4 repairs for phones using RFMD Prime to service centers which have capable test equipment. 

Bulletin: LVCCFSB2007 - 203

Page 33: Service Engineeing & Optimization Level 3, Rev.1.0 MOTOROLA U9 U9

Service Engineeing & Optimization

Level 3 , Rev.1.0

MOTOROLA U9

•1. When will the service solution be available • Right now the project is in the coding phase, which is scheduled from June 1 to July 12.  After testing is finished, deployment should begin around August 23.  The main bottleneck in the process is the web service.  The client tool will most likely be finished well before that date, but the client will not be able to be used in the service centers until the web service is up and accessible.

•2. What phone types are infected by in moment •At the moment the only released phone that supports DBS is the Z6 and V8, and I'm not sure when the next one is scheduled to SA.  The last I had heard, all LinuxJava platform phones will support DBS.

•3. What data will be handled by the process (IMEI, Lock Codes, ...?) •I think the Z6 supports IMEI only, but Subsidy Lock DBS blocks should also be supported soon for new models.  I have seen documentation that mentioned that Factory State, Bootloader, and Secure Test Command may be the next types of DBS data after those two, but I'm not sure of what the status is for those new data types.

•4. What kind of applications will support that? (RadioCom, Repair Studio....?) •As far as I know, the only tool currently developed to use the DBS web service is my own standalone tool.  The RSD team is currently working on adding web service support for the Device Unlock web service, but I don't think they are planning to add support for the DBS web service yet.  Also, any STE framework UIs will have access to the DBS functionality through the framework, so MotoGate or MotoAnalyzer could easily add DBS once my standalone tool is deployed.

•5. Does any Service Centre need a Hardware Token to run a PKI Server?•To do Data Block Signing, a service center needs three things:  a hardware token, a software certificate, and an LDAP account that is registered on the DBS web service.  These are the same as the requirements of the existing secure web services, such as the DRM web service and the Device Unlock web service

Data Block Signing