slide 1susanne kyredoe review, january 20, 2004 wirebonding for tob and tec susanne kyre university...
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Slide 1Susanne KyreDOE review, January 20, 2004
Wirebonding for TOB and TEC
Susanne Kyre
University of California, Santa Barbara
Slide 2Susanne KyreDOE review, January 20, 2004
Wirebonding• Equipment and Personnel• Scale of the project• Bonding times• Bond quality• TEC• Outlook
Slide 3Susanne KyreDOE review, January 20, 2004
Equipment and Personnel
Equipment:• K&S 8090 wirebonder• K&S 8060 wirebonder (receive end
of January)• Dage 3000 pulltester• Stereo microscope• Precision measuring microscope
Personnel:• 1 main wirebond technician (Julie
Stoner)• 1 backup wirebond technician
(Andrea Allen)• In the process of hiring a second
wirebond technician• 1 support technician (David Staszak)
Slide 4Susanne KyreDOE review, January 20, 2004
Scale• UCSB will build ~4000 Modules with about 10 million wirebonds (that
is 3 times the amount of wirebonds done in all of CDF; All of UCSB’s wirebonding for BaBar was 150,000 bonds, we will do that in a week)
• Full production TEC and TOB: • 15 Modules per day• 30 Hybrids per day
Slide 5Susanne KyreDOE review, January 20, 2004
Bonding times
• Starting point: Bond centers had bonding times of up to 40 minutes with about 10 bonds that didn’t stick and needed to be rebonded
• Wirebond programs now bond an entire Module or Hybrid (previously had separate programs for each row of bonds), reduced bonding time by 50%
• Wirebond programs for all Module and Hybrid types now use pattern recognition (bonding time reduction by about 2-3 minutes)
• Pure bonding time for a module < 5min, for a hybrid < 4min (CMS record)
• Additional time (set up, database entry, pull testing):
~11min for a module, ~ 8min for a hybrid
• Total processing time can be reduce by using a support technician
• Actual bonding times during mini production run: • 2.5 hours for 10 modules (one technician)
Slide 6Susanne KyreDOE review, January 20, 2004
Bond quality• CMS wirebonding spec: pull strength > 6g• Extensive pull testing was done to determine a set of standard bonding
parameters for each bonding surface
Hybrids:• We pull test 10 bonds on a test area on each PA• Average pull strength: 10.0 g, std. Deviation: 0.6g
Slide 7Susanne KyreDOE review, January 20, 2004
Bond qualityModules:
• First 20 parts of each type, pull test every 50th bond
• PA to Sensor bonds: • Average pull strength: 9.9g, std. Deviation: 0.7g
• Sensor to Sensor bonds:• Average pull strength: 8.2g, std. Deviation: 0.8g
Slide 8Susanne KyreDOE review, January 20, 2004
Bond quality
• 79 Modules and 92 Hybrids bonded so far• Faults introduced during bonding:
• 1 pinhole (first TEC module) out of ~84000 bonds• Shorts: 1 repaired short on a hybrid• Open channels: 13 on modules, 5 on hybrids• Bad channels introduced in bonding: 0.034% for modules, 0.012% for
hybrids (historically 0.5% – 2%)
Slide 9Susanne KyreDOE review, January 20, 2004
TEC production
• We will do TEC Ring 5 and 6 Module production
• TEC Module and Hybrid wirebonding:• All fixtures for Rings 5 and 6 are designed • TEC Ring 6 module carrier and wirebond fixture were built and tested• Wrote program and wirebonded 4 Ring 6 modules• Wrote program and wirebonded 6 Ring 6 hybrids
Slide 10Susanne KyreDOE review, January 20, 2004
Future plans• Produce hybrid and module carriers and wirebond fixtures
in machine shop• Write remaining wirebond programs for TEC Modules
and Hybrids• Installation and set up of new 8060 Wirebonder (end
January)• Training of new wirebond technician (mid February)• Training of wirebond technician from Mexico• Mini production run
• 2 weeks at full production capacity of 15 Modules per day (start January 26)
• Production bonding!