sllimm™-nano, 2 series ipm, 3 a, 600 v, 3-phase igbt

N2DIP-26L type Lno stand-off

N2DIP-26L type Zno stand-off

Features• IPM 3 A, 600 V, 3-phase IGBT inverter bridge including 3 control ICs for gate

driving and freewheeling diodes• 3.3 V, 5 V, 15 V TTL/CMOS input comparators with hysteresis and pull-down/

pull-up resistors• Internal bootstrap diode• Optimized for low electromagnetic interference• Undervoltage lockout• VCE(SAT) negative temperature coefficient• Shutdown function• Interlocking function• Op-amp for advanced current sensing• Comparator for fault protection against overcurrent• NTC (UL 1434 CA 2 and 4)• Isolation ratings of 1500 Vrms/min.• Up to ±2 kV ESD protection (HBM C = 100 pF, R = 1.5 kΩ)• UL recognition: UL 1557, file E81734

Applications• 3-phase inverters for motor drives• Dish washers, refrigerator compressors, heating systems, air-conditioning fans,

draining and recirculation pumps

DescriptionThis second series of SLLIMM (small low-loss intelligent molded module)-nanoprovides a compact, high-performance AC motor drive in a simple, rugged design. Itis composed of six improved IGBTs with freewheeling diodes and three half-bridgeHVICs for gate driving, providing low electromagnetic interference (EMI)characteristics with optimized switching speed. The package is designed to allow abetter and more easily screwed-on heatsink, and is optimized for thermalperformance and compactness in built-in motor applications or other low powerapplications where assembly space is limited. This IPM includes a completelyuncommitted operational amplifier and a comparator that can be used to design afast and efficient protection circuit. SLLIMM™ is a trademark of STMicroelectronics.

Product status links

STGIPQ3H60T-HLS

STGIPQ3H60T-HZS

Product summary

Order code: STGIPQ3H60T-HLS

Marking GIPQ3H60T-HLS

Package N2DIP-26L type Lno stand-off

Packing Tube

Order code: STGIPQ3H60T-HZS

Marking GIPQ3H60T-HZS

Package N2DIP-26L type Zno stand-off

Packing Tube

SLLIMM™-nano, 2nd series IPM, 3 A, 600 V, 3-phase IGBT inverter bridge

STGIPQ3H60T-HLS, STGIPQ3H60T-HZS

Datasheet

DS11141 - Rev 4 - December 2018For further information contact your local STMicroelectronics sales office.

www.st.com

https://www.st.com/en/product/STGIPQ3H60T-HLS

https://www.st.com/en/product/STGIPQ3H60T-HZS

1 Internal schematic diagram and pin configuration

Figure 1. Internal schematic diagram

OP- (8)

Vcc W (3)

HIN W (4)

T / SD / OD (15)

HIN V (10)

Vcc V (9)

HIN U (14)

Vcc U (13)

LIN W ( 5)

LIN U (16)

V, OUT V (22)

W, OUT W (25)

U, OUT U (19)

P (18)

N W (26)

OPOUT (7)

T/ SD / OD (2)

GND (1)

CIN (12)

OP+ (6)

LIN V (11)

N V (23)

N U (20)

Vboot U (17)

Vboot V (21)

Vboot W (24)

NTC

GND

OPOUT

LIN

VCC

HVG

OP+

OP-

SD/OD

OUT

LVG

Vboot

HIN

GND

LIN

VCC

HVG

CIN

SD/OD

OUT

LVG

Vboot

HIN

GND

LIN

VCC

HVG

SD/OD

OUT

LVG

Vboot

HIN

GIPG300720141542SMD

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSInternal schematic diagram and pin configuration

DS11141 - Rev 4 page 2/26

Table 1. Pin description

Pin Symbol Description

1 GND Ground

2 T/SD/OD NTC thermistor terminal/shutdown logic input (active low)/open-drain(comparator output)

3 VCC W Low-voltage power supply W phase

4 HIN W High-side logic input for W phase

5 LIN W Low-side logic input for W phase

6 OP+ Op-amp non-inverting input

7 OPOUT Op-amp output

8 OP- Op-amp inverting input

9 VCC V Low-voltage power supply V phase

10 HIN V High-side logic input for V phase

11 LIN V Low-side logic input for V phase

12 CIN Comparator input

13 VCC U Low-voltage power supply for V phase

14 HIN U High-side logic input for V phase

15 T/SD/OD NTC thermistor terminal/shutdown logic input (active low)/open-drain(comparator output)

16 LIN U Low-side logic input for U phase

17 Vboot U Bootstrap voltage for U phase

18 P Positive DC input

19 U, OUTU U phase output

20 NU Negative DC input for U phase

21 Vboot V Bootstrap voltage for V phase

22 V, OUTV V phase output

23 NV Negative DC input for V phase

24 Vboot W Bootstrap voltage for W phase

25 W, OUTW W phase output

26 NW Negative DC input for W phase


DS11141 - Rev 4 page 3/26

Figure 2. Pin layout (top view) - N2DIP-26L type L

Exposed pinnot connected

Exposed pin internallyconnected to GND

*

* Dummy pins internally connected to P (positive DC input)

*

PIN 1

PIN 26 PIN 17

PIN 16

GADG181220181209IG

Figure 3. Pin layout (top view) - N2DIP-26L type Z

Exposed pinnot connected

Exposed pin internallyconnected to GND

*

* Dummy pins internally connected to P (positive DC input)

*

PIN 1

PIN 26 PIN 17

PIN 16

GADG181220181216IG


DS11141 - Rev 4 page 4/26

2 Electrical ratings

TJ = 25 °C unless otherwise specified

2.1 Absolute maximum ratings

Table 2. Inverter part

Symbol Parameter Value Unit

VCES Collector-emitter voltage for each IGBT (VIN(1) = 0) 600 V

IC Continuous collector current for each IGBT (TC = 25 °C) 3 A

ICP(2) Peak collector current for each IGBT (less than 1 ms) 6 A

PTOT Total power dissipation for each IGBT (TC = 25 °C) 12 W

1. Applied among HINx, LINx and GND for x = U, V, W

2. Pulse width limited by maximum junction temperature.

Table 3. Control part

Symbol Parameter Min. Max. Unit

VCC Low voltage power supply -0.3 21 V

Vboot Bootstrap voltage -0.3 620 V

VOUTOutput voltage applied among OUTU,OUTV, OUTW - GND Vboot - 21 Vboot + 0.3 V

VCIN Comparator input voltage -0.3 VCC + 0.3 V

Vop+ Op-amp non-inverting input -0.3 VCC + 0.3 V

Vop- Op-amp inverting input -0.3 VCC + 0.3 V

VINLogic input voltage applied among HINx,LINx and GND -0.3 15 V

VT/SD/OD Open-drain voltage -0.3 15 V

dVout/dt Allowed output slew rate 50 V/ns

Table 4. Total system


VISOIsolation withstand voltage applied to each pin and heatsink plate(AC voltage, t = 60 s) 1500 Vrms

TJ Power chip operating junction temperature -40 to 150 °C

TC Module case operation temperature -40 to 125 °C

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSElectrical ratings

DS11141 - Rev 4 page 5/26

2.2 Thermal data

Table 5. Thermal data


Rth(j-c)Thermal resistance junction-case single IGBT 10

°C/WThermal resistance junction-case single diode 15

Rth(j-a) Thermal resistance junction-ambient 44

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSThermal data

DS11141 - Rev 4 page 6/26

3 Electrical characteristics

TJ = 25 °C unless otherwise noted.

3.1 Inverter part

Table 6. Static

Symbol Parameter Test conditions Min. Typ. Max. Unit

ICESCollector cut-off current (VIN(1) =0 “logic state”)

VCE = 550 V, VCC = VBoot = 15 V - 250 μA

VCE(sat)Collector-emitter saturationvoltage

VCC = Vboot = 15 V, VIN(1) = 0 to 5 V,

IC = 1 A- 2.15 2.6 V

VF Diode forward voltage VIN(1) = 0 “logic state”, IC = 1 A - 1.35 1.8 V

1. Applied among HINx, LINx and GND for x = U, V, W.

Table 7. Inductive load switching time and energy


ton(1) Turn-on time

VDD = 300 V,VCC = Vboot = 15 V,

VIN(2) = 0 to 5 V, IC = 1 A

(see Figure 5. Switching timedefinition)

- 275 -

ns

tc(on)(1) Crossover time (on) - 90 -

toff(1) Turn-off time - 890 -

tc(off)(1) Crossover time (off) - 125 -

trr Reverse recovery time - 50 -

Eon Turn-on switching energy - 18 -µJ

Eoff Turn-off switching energy - 13 -

1. tON and tOFF include the propagation delay time of the internal drive. tC(ON) and tC(OFF) are the switching times of the IGBTitself under the internally given gate driving conditions.

2. Applied among HINx, LINx and GND for x = U, V, W.

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSElectrical characteristics

DS11141 - Rev 4 page 7/26

Figure 4. Switching time test circuit

AM06019v2

Figure 5. Switching time definition

VCE IC IC

VIN

t ONt C(ON)

VIN(ON)

(a) turn-on (b) turn-off

t rr

VIN

VCE

t OFFt C(OFF)

VIN(OFF)

AM09223V1

100% IC 100% IC

10% IC 90% IC 10% VCE 10% VCE 10% IC

Figure 5. Switching time definition refers to HIN, LIN inputs (active high).

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSInverter part

DS11141 - Rev 4 page 8/26

3.2 Control part

Table 8. Low-voltage power supply


VCC_hys VCC UV hysteresis 1.2 1.5 1.8 V

VCC_thON VCC UV turn-ON threshold 11.5 12 12.5 V

VCC_thOFF VCC UV turn-OFF threshold 10 10.5 11 V

IqccuUndervoltage quiescent supplycurrent

VCC = 10 V, T/SD/OD = 5 V,LIN = HIN = CIN = 0 V 150 µA

Iqcc Quiescent current VCC = 10 V, T/SD/OD = 5 V,LIN = HIN = CIN = 0 V 1 mA

VrefInternal comparator (CIN)reference voltage 0.51 0.54 0.56 V

Table 9. Bootstrapped voltage


VBS_hys VBS UV hysteresis 1.2 1.5 1.8 V

VBS_thON VBS UV turn-ON threshold 11.1 11.5 12.1 V

VBS_thOFF VBS UV turn-OFF threshold 9.8 10 10.6 V

IQBSUUndervoltage VBS quiescentcurrent

VBS < 9 V, T/SD/OD = 5 V,

LIN = 0 V and HIN = 5 V,

CIN = 0 V

70 110 µA

IQBS VBS quiescent current

VBS = 15 V, T/SD/OD = 5 V,

LIN = 0 V and HIN = 5 V,

CIN = 0

150 210 µA

RDS(on) Bootstrap driver on-resistance LVG ON 120 Ω

Table 10. Logic inputs


Vil Low logic level voltage 0.8 V

Vih High logic level voltage 2.25 V

IHINh HIN logic “1” input bias current HIN = 15 V 20 40 100 µA

IHINl HIN logic “0” input bias current HIN = 0 V 1 µA

ILINl LIN logic “0” input bias current LIN = 0 V 1 µA

ILINh LIN logic “1” input bias current LIN = 15 V 20 40 100 µA

ISDh SD logic “0” input bias current SD = 15 V 210 350 477 µA

ISDl SD logic “1” input bias current SD = 0 V 3 µA

Dt Dead time See Figure 10. Dead time andinterlocking waveform definitions 180 ns

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSControl part

DS11141 - Rev 4 page 9/26

Table 11. Op-amp characteristics


Vio Input offset voltage Vic = 0 V, Vo = 7.5 V 6 mV

Iio Input offset currentVic = 0 V, Vo = 7.5 V

4 40 nA

Iib Input bias current(1) 100 200 nA

VOL Low level output voltage RL = 10 kΩ to VCC 75 150 mV

VOH High level output voltage RL= 10 kΩ to GND 14 14.7 V

Io Output short-circuit currentSource, Vid = + 1 V; Vo = 0 V 16 30 mA

Sink, Vid = -1 V; Vo = VCC 50 80 mA

SR Slew rate Vi = 1 - 4 V; CL = 100 pF; unity gain 2.5 3.8 V/µs

GBWP Gain bandwidth product Vo = 7.5 V 8 12 MHz

Avd Large signal voltage gain RL = 2 kΩ 70 85 dB

SVR Supply voltage rejection ratio vs VCC 60 75 dB

CMRR Common mode rejection ratio 55 70 dB

1. The direction of input current is out of the IC.

Table 12. Sense comparator characteristics


Iib Input bias current VCIN = 1 V - 1 µA

VodOpen-drain low level outputvoltage Iod = 3 mA - 0.5 V

RON_OD Open-drain low level output Iod = 3 mA - 166 Ω

RPD_SD SD pull-down resistor(1) - 125 kΩ

td_comp Comparator delay T/SD/OD pulled to 5 V through100 kΩ resistor - 90 130 ns

SR Slew rate CL = 180 pF, Rpu = 5 kΩ - 60 V/µs

tsdShutdown to high-/low-side driverpropagation delay

VOUT = 0, Vboot = VCC,VIN = 0 to 3.3 V - 125

nstisd

Comparator triggering to high-/low-side driver turn-offpropagation delay

Measured applying a voltage stepfrom 0 V to 3.3 V to pin CIN - 200

1. Equivalent values as a result of the resistances of three drivers in parallel.


DS11141 - Rev 4 page 10/26

Table 13. Truth table

ConditionsLogic input (VI) Output

T/SD/OD LIN HIN LVG HVG

Shutdown enable half-bridge tri-state L X(1) X(1) L L

Interlocking half-bridge tri-state H H H L L

0 “logic state” half-bridge tri-state H L L L L

1 “logic state” low-side direct driving H H L H L

1 “logic state” high-side direct driving H L H L H

1. X: don’t care.

3.2.1 NTC thermistor

Figure 6. Internal structure of SD and NTC

T/SD/ODV

Vbias

RPD_SD

NTC

LIN

HIN

VCC

GND CIN

LVG

OUT

HVG

Vboot

SD/OD

R SD

C SD

RPD_SD: equivalent value as result of resistances of three drivers in parallel.

Figure 7. Equivalent resistance (NTC//RPD_SD)

0

20

40

60

80

100

120

140

-40 -20 0 20 40 60 80 100 120

Equi

vale

ntR

esis

tanc

e (k

Ω)

Temperature (°C)


DS11141 - Rev 4 page 11/26

Figure 8. Equivalent resistance (NTC//RPD_SD) zoom

0

2

4

6

8

10

12

14

70 80 90 100 110 120

Equi

vale

ntR

esis

tanc

e (k

Ω)

Temperature (°C)

Figure 9. Voltage of T/SD/OD pin according to NTC temperature

2.0

2.5

3.0

3.5

4.0

4.5

5.0

25 50 75 100 125

V SD(V

)

Temperature (°C)

VBias = 5 VRSD = 2.2 kΩ

SD/OD: high

VBias = 3.3 VRSD = 1.0 kΩ


DS11141 - Rev 4 page 12/26

3.3 Waveform definitions

Figure 10. Dead time and interlocking waveform definitions

INTE

RLOCK

ING

INTE

RLOCK

ING

INTE

RLOCK

ING

INTE

RLOCK

INGG

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSWaveform definitions

DS11141 - Rev 4 page 13/26

4 Shutdown function

The device is equipped with three half-bridge IC gate drivers and integrates a comparator for fault detection.The comparator has an internal voltage reference VREF connected to the inverting input, while the non-invertinginput pin (CIN) can be connected to an external shunt resistor for current monitoring.Since the comparator is embedded in the U IC gate driver, in case of fault it disables directly the U outputs,whereas the shutdown of V and W IC gate drivers depends on the RC value of the external SD circuitry, whichfixes the disabling time.For an effective design of the shutdown circuit, please refer to Application note AN4966.

Figure 11. Shutdown timing waveforms

∗

∗

∗

∗

≅

∗

_ ∗

RSD and CSD external circuitry must be designed to ensure

Please refer to AN4966 for further details.

* RNTC to be considered only when the NTC is internally connected to the T/SD/OD pin.

HIN or LIN

HVG or LVG

open -drain gate(interna l)

VREF

CI N

PROTECT ION

SD/OD

A B

BA

orT/SD/OD

U V, W

GADG250120171515FSR

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSShutdown function

DS11141 - Rev 4 page 14/26

5 Application circuit example

Figure 12. Application circuit example

OP-

(8)

Vcc

W (3

)

HIN

W (4

)

T / S

D /

OD

(15)

HIN

V (1

0)

Vcc

V (9

)

HIN

U (1

4)

Vcc

U (1

3)

LIN

W (5

)

LIN

U (1

6)

V, O

UT

V (2

2)

W, O

UT

W (2

5)

U, O

UT

U (1

9)

P (1

8)

N W

(26)

OPO

UT

(7)

T / S

D /

OD

(2)

GN

D (1

)

CIN

(12)

OP+

(6)

LIN

V (1

1)

N V

(23)

N U

(20)

Vboo

t U (1

7)

Vboo

t V (2

1)

Vboo

t W (2

4)

RS

RS

ADC

RS

M

PWR

_GN

D

SGN

_GN

D

VCC

Cvc

cC

2

DZ2

DZ2

C3

R3

R S

D

C1

Tem

p.M

onito

ring

HIN

U

LIN

U

LIN

V

HIN

V

LIN

W

HIN

W

SD

ADC

GN

D

LIN

VCC

LVG

SD/O

D

OU

T

HVG

Vboo

t

HIN

C1

C1

Cbo

ot U

Rsh

unt

R1

+ -

R1

C S

D

R1

5V /

3.3V

C3

R4

R1

C1

Cvd

c

GN

D

LIN

VCC

LVG

CIN

SD/O

D

OU

T

HVG

Vboo

t

HIN

+ -VD

C

R S

F

5V /

3.3V

C O

P

R2

R1

GN

D

OPO

UT

LIN

VCC

LVG

OP+

OP-

SD/O

D

OU

T

HVG

Vboo

t

HIN

R5

Cbo

ot V

NTC

R1

C1

C S

F

Cbo

ot W

C1

C4

C3

DZ1

R1

DZ2

MICROCONTROLLER

GAD250720161156FSR

Application designers are free to use a different scheme according to the specifications of the device.

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSApplication circuit example

DS11141 - Rev 4 page 15/26

5.1 Guidelines• Input signals HIN, LIN are active high logic. A 375 kΩ (typ.) pull-down resistor is built-in for each input. To

avoid input signal oscillation, the wiring of each input should be as short as possible, and the use of RCfilters (R1, C1) on each input signal is suggested. The filters should be with a time constant of about 100 nsand placed as close as possible to the IPM input pins.

• The use of a bypass capacitor CVCC (aluminum or tantalum) can reduce the transient circuit demand on thepower supply. Also, to reduce any high-frequency switching noise distributed on the power lines, adecoupling capacitor C2 (100 to 220 nF, with low ESR and low ESL) should be placed as close as possibleto the Vcc pin and in parallel with the bypass capacitor.

• The use of an RC filter (RSF, CSF) is recommended to prevent protection circuit malfunction. The timeconstant (RSF x CSF) should be set to 1 μs and the filter must be placed as close as possible to the CIN pin.

• The SD is an input/output pin (open-drain type if it is used as output). A built-in thermistor NTC is internallyconnected between the SD pin and GND. The voltage VSD-GND decreases as the temperature increases,due to the pull-up resistor RSD. In order to keep the voltage always higher than the high-level logic threshold,the pull-up resistor should be set to 1 kΩ or 2.2 kΩ for 3.3 V or 5 V MCU power supply, respectively. TheCSD capacitor of the filter on SD should be fixed no higher than 3.3 nF in order to assure the SD activationtime τA ≤ 500 ns. Besides, the filter should be placed as close as possible to the SD pin.

• The decoupling capacitor C3 (from 100 to 220 nF, ceramic with low ESR and low ESL), in parallel with eachCboot, filters high-frequency disturbance. Both Cboot and C3 (if present) should be placed as close aspossible to the U, V, W and Vboot pins. Bootstrap negative electrodes should be connected to U, V, Wterminals directly and separated from the main output wires.

• To avoid overvoltage on the Vcc pin, a Zener diode (Dz1) can be used. Similarly on the Vboot pin, a Zenerdiode (Dz2) can be placed in parallel with each Cboot.

• The use of the decoupling capacitor C4 (100 to 220 nF, with low ESR and low ESL) in parallel with theelectrolytic capacitor Cvdc is useful to prevent surge destruction. Both capacitors C4 and Cvdc should beplaced as close as possible to the IPM (C4 has priority over Cvdc).

• By integrating an application-specific type HVIC inside the module, direct coupling to the MCU terminalswithout an optocoupler is possible.

• Low-inductance shunt resistors have to be used for phase leg current sensing.• In order to avoid malfunctions, the wiring on N pins, the shunt resistor and PWR_GND should be as short as

possible.• The connection of SGN_GND to PWR_GND on one point only (close to the shunt resistor terminal) can

reduce the impact of power ground fluctuation.

These guidelines ensure the specifications of the device for application designs. For further details, please refer tothe relevant application note.

Table 14. Recommended operating conditions


VPN Supply voltage Applied among P-Nu, Nv, Nw 300 500 V

VCC Control supply voltage Applied to VCC-GND 13.5 15 18 V

VBS High-side bias voltage Applied to VBOOTx-OUT for x = U,V, W 13 18 V

tdead Blanking time to prevent arm-short For each input signal 1.5 µs

fPWM PWM input signal-40 °C < TC < 100 °C

-40 °C < TJ < 125 °C25 kHz

TC Case operation temperature 100 °C

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSGuidelines

DS11141 - Rev 4 page 16/26

6 Electrical characteristics (curves)

Figure 13. Output characteristics

GADG291020181423OCH

5

4

3

2

1

00 0.4 0.8 1.2 1.6 2.0 2.4 2.8

IC (A)

VCE (V)

VCC = 15 V

Figure 14. Vce(sat) vs collector current

GADG071120181035VCEC

3.0

2.5

2.0

1.5

1.0

0.50 1 2 3 4 5

VCE (V)

IC (A)

TJ = 25 °C

VCC = 15 V

TJ = 150 °C

Figure 15. IC vs case temperature

GADG291020181425CCT

3.0

2.5

2.0

1.5

1.0

0.5

00 25 50 75 100 125

IC (A)

TC (°C)

VCC ≥ 15 V, TJ ≤ 150 °C

Figure 16. Diode VF vs forward current

GADG291020181424DVF

1.8

1.6

1.4

1.2

1.0

0.8

0.60 1 2 3 4 5

VF (V)

IF (A)

TJ = 25 °C

TJ = 150 °C

VCC = 15 V

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSElectrical characteristics (curves)

DS11141 - Rev 4 page 17/26

Figure 17. Eon switching energy vs collector current

GADG291020181425SNC

0.20

0.15

0.10

0.05

00 1 2 3 4 5 IC (A)

VDD = 300 V, VCC = Vboot = 15 V

TJ = 150 °C

TJ = 25 °C

EON(mJ)

Figure 18. Eoff switching energy vs collector current

GADG291020181426SFC

0.20

0.15

0.10

0.05

00 1 2 3 4 5

EOFF (mJ)

IC (A)

VDD = 300 V, VCC = Vboot = 15 V

TJ = 150 °C

TJ = 25 °C

Figure 19. Thermal impedance for IGBT

Zthjc N2DIP-26L

10 -1

10 -2

10 -310 -5 10 -4 10 -3 10 -2 10 -1 10 0

K

tp (s)

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSElectrical characteristics (curves)

DS11141 - Rev 4 page 18/26

7 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®

packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitionsand product status are available at: www.st.com. ECOPACK® is an ST trademark.

7.1 N2DIP-26L type L no stand-off package information

Figure 20. N2DIP-26L type L no stand-off package outline

8558322_3_typeL_NO_stand_off

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSPackage information

DS11141 - Rev 4 page 19/26

https://www.st.com/ecopack

http://www.st.com

Table 15. N2DIP-26L type L no stand-off mechanical data

Dim.mm

Min. Typ. Max.

A 3.80

A1 0.45 0.75 1.05

A2 4.00 4.10 4.20

A3 1.70 1.80 1.90

A4 1.70 1.80 1.90

A5 8.10 8.40 8.70

A6 1.75

b 0.53 0.72

b2 0.83 1.02

c 0.46 0.59

D 32.05 32.15 32.25

D1 2.10

D2 1.85

D3 30.65 30.75 30.85

E 12.35 12.45 12.55

e 1.70 1.80 1.90

e1 2.40 2.50 2.60

eB1 14.25 14.55 14.85

L 0.85 1.05 1.25

Dia 3.10 3.20 3.30

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSN2DIP-26L type L no stand-off package information

DS11141 - Rev 4 page 20/26

7.2 N2DIP-26L type Z no stand-off package information

Figure 21. N2DIP-26L type Z no stand-off package outline

8558322_3_typeZ_NO_stand_off

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSN2DIP-26L type Z no stand-off package information

DS11141 - Rev 4 page 21/26

Table 16. N2DIP-26L type Z no stand-off mechanical data

Dim.mm

Min. Typ. Max.

A 3.80

A1 0.45 0.75 1.05

A2 4.00 4.10 4.20

A3 1.70 1.80 1.90

A4 1.70 1.80 1.90

A5 8.10 8.40 8.70

A6 1.75

b 0.53 0.72

b2 0.83 1.02

c 0.46 0.59

D 32.05 32.15 32.25

D1 2.10

D2 1.85

D3 30.65 30.75 30.85

E 12.35 12.45 12.55

e 1.70 1.80 1.90

e1 2.40 2.50 2.60

eB1 16.10 16.40 16.70

eB2 21.18 21.48 21.78

L 0.85 1.05 1.25

Dia 3.10 3.20 3.30

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSN2DIP-26L type Z no stand-off package information

DS11141 - Rev 4 page 22/26

7.3 N2DIP-26L packing information

Figure 22. N2DIP-26L tube (dimensions are in mm)

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSN2DIP-26L packing information

DS11141 - Rev 4 page 23/26

Revision history

Table 17. Document revision history

Date Revision Changes

08-Jul-2015 1 Initial release.

07-Oct-2015 2 Document status promoted from preliminary data to production data.

24-Mar-2017 3

Modified features on cover page

Modified Figure 4: "Internal structure of SD and NTC"

Minor text changes.

18-Dec-2018 4

Updated package silhouette on cover page.

Updated Section 1 Internal schematic diagram and pin configuration,Section 2.1 Absolute maximum ratings, Section 3.2 Control part,Section 4 Shutdown function and Section 5.1 Guidelines.

Added Section 6 Electrical characteristics (curves).

Updated Section 7 Package information.

Minor text changes


DS11141 - Rev 4 page 24/26

Contents

1 Internal schematic diagram and pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2.1 Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

3.1 Inverter part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.2 Control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.2.1 NTC thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.3 Waveform definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4 Smart shutdown function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

5 Application circuit example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

5.1 Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

7 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

7.1 N2DIP-26L type L no stand-off package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

7.2 N2DIP-26L type Z no stand-off package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.3 N2DIP-26L packing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

STGIPQ3H60T-HLS, STGIPQ3H60T-HZSContents

DS11141 - Rev 4 page 25/26

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to STproducts and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. STproducts are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design ofPurchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2018 STMicroelectronics – All rights reserved


DS11141 - Rev 4 page 26/26

sllimm™-nano, 2 series ipm, 3 a, 600 v, 3-phase igbt

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