spd general meeting pixel bus and pilot mcm integration cern october 8, 2002
TRANSCRIPT
SPD general meeting
Pixel bus and Pilot MCMIntegration
CERN October 8, 2002
8/10/2002 Michel Morel EP/ED 2
1. PIXEL BUS AND PILOT MCM CONNECTIONS
2. PIXEL BUS, PILOT MCM and EXTENDERS CONNECTIONS
3. PIXEL BUS PROTOTYPE PRODUCTION
4. BONDING WIRE TESTS
5. STATUS OF PCB
6. CONCLUSION
8/10/2002 Michel Morel EP/ED 3
400µ
240µ
500µ
DETECTOR
PIXEL CHIP
SMDCOMPONENTS
0402
MCM
SMDCOMPONENTS
0402 Digital pilot
LASERDIODE
PIXEL CARRIER
PIXEL CARRIER
EXTENDER 1
EXTENDER 2
GLOB TOP
COOLING TUBE 100µ
1.2mm
350µ
LASER DIODE 500
PIXEL BUS AND PILOT MCM CONNECTIONS
8/10/2002 Michel Morel EP/ED 4
400µ
240µ
500µ
DETECTOR
PIXEL CHIP
SMDCOMPONENTS
0402
MCM
SMDCOMPONENTS
0402 Digital pilot
LASERDIODE
PIXEL CARRIER
PIXEL CARRIER
EXTENDER 1
EXTENDER 2
GLOB TOP
COOLING TUBE 100µ
1.2mm
350µ
LASER DIODE 500
PIXEL BUS AND PILOT MCM CONNECTIONS
8/10/2002 Michel Morel EP/ED 5
Glob top
400µ
240µ
500µ
DETECTOR
PIXEL CHIPMCM
Analog PilotPIXEL CARRIER
COOLING TUBE
PIXEL BUS AND PILOT MCM CONNECTIONS
500µ
SDM comp
LASER DIODE 500
8/10/2002 Michel Morel EP/ED 6
15.0013.00
0.30
PIXEL_BUS
0.30
ANALOGPILOT
PIXEL BUS AND PILOT MCM CONNECTIONS
Top view
LASER DIODE 500
8/10/2002 Michel Morel EP/ED 7
PIXEL BUS, PILOT MCM and EXTENDERS CONNECTIONS
Pixel Bus
Pixel chipLadder Pilot MCM
15.00 50.00 50.00
ladders HVTemperature monitoring
Sense +
Sense -
MCM 2.5VSense +
Sense -
Pixel chips 1.8V
Laser diode
Laser diode
Laser diode
8/10/2002 Michel Morel EP/ED 8
VDD
Copper
Kapton1(top)
PIXEL__EXTENDERS if VDD=VDDA=VTT=VTTA=1.8V
Cross section
Cover-lay
50µm
100µm
~50µm
Top view
Kapton2 (bottom)
GND
Pixel_carrier
Sense+VDD
12
mm
Sense-GND
I=7A DDP=102mVP(half stave) = 715mWP(half detector) = 42.9W
GND VDD=1.8V
8/10/2002 Michel Morel EP/ED 9
EXTENDERS WITH CABLES
1m
Cable AWG 10:• diameter 2.79mm• area 4.6mm²• weight 41.49 g/m• Rmax 0.4/100m
Ddp at 7A = 56mVP(half stave) = 392mWP(half detector) = 24W
8/10/2002 Michel Morel EP/ED 10
Pixel_bus prototype production
EpoxyAl
Cu (base)
LASER DIODE 500
8/10/2002 Michel Morel EP/ED 11
EpoxyAl
Cu (base)
300µm
Pixel_bus prototype production
8/10/2002 Michel Morel EP/ED 12
Epoxy (5)Al
Cu (base)
!
Pixel_bus prototype production
8/10/2002 Michel Morel EP/ED 13
Epoxy
Al
Cu (base)
Kapton
Pixel_bus prototype production
8/10/2002 Michel Morel EP/ED 14
Epoxy
Al
Cu (base)
300µm
Kapton
300µm
Pixel_bus prototype production
8/10/2002 Michel Morel EP/ED 15
Epoxy
Al
Cu (base)
300µm
Kapton
!
Cu xCu y
Pixel_bus prototype production
8/10/2002 Michel Morel EP/ED 16
PIXEL BUS CROSS SECTION
Glue 5µ
Kapton 8µ
Liquid Polyimide 8µm
280µm
Cu 5µ +Ni/Au (1µm)
Cu 10µ + Ni/Au (1µm)1) AGND 50µm
2) VDDA 30µm
3) Horizontal lines
4) vertical lines
5) VDD 15µm
6) GND 50µm
7) Resistors + capacitors pads+ Fastor
Aluminium
8/10/2002 Michel Morel EP/ED 17
Cu (base)
BONDING WIRE TESTS
8/10/2002 Michel Morel EP/ED 18
Cu (base)
9~10g
BONDING WIRE TESTS
8/10/2002 Michel Morel EP/ED 19
Cu (base)
Al
BONDING WIRE TESTS
Al (99%) + Si (1%)
1g!
8/10/2002 Michel Morel EP/ED 20
Status of PCB
• Pixel_carrier_B.
• Pixel carrier interface.
• Pilot MCM.
• Pilot MCM daughter card.
8/10/2002 Michel Morel EP/ED 21
Pilot MCM daughter card
8/10/2002 Michel Morel EP/ED 22
CONCLUSION
• Power supplies modifications should be finalized ASAP.• PIXEL BUS in production: 10 normal, 10 mirror.• First mirror bus mounted on PIXEL interface end of October• PILOT MCM will be assembled this month (October 2002) and mounted on the daughter card interface.