SSCS Meetings Comm.Adcom Review

August 12, 2013

Adcom Agenda

• Financially Sponsored

– ISSCC Chandrakasan

• Summary of Financially Sponsored Meetings

• Summary of Technical Co-sponsored Meetings

• Summary of Actions for Approval

2

SSCS AdCom – August, 12th 2013Tom Andre

CICC’12 Summary & CICC’13 Plans

CICC’12• San Jose, September 9-12 TPC Chair: Philippe Jansen

• Conference Chair: Aurangzeb Khan, General Chair: Tom Andre• Highlights

– Attendance down (-9.1% Tech Program, -24% Ed Sessions)– Forums continue to attract high attendance

• Concerns– Drop in Ed Session attendance

CICC’13• San Jose, September 23-25 TPC Chair: Ramesh Harjani

• Conference Chair: Philippe Jansen, General Chair: Aurangzeb Khan• Planning

– Education Sessions included in Regular Program (Tues-Wed) (+$25 Registration),

– Submissions increased ~6% from 2012, Accepted 78 Lecture (29%)

Paper Submission/Acceptance

5

CICC Financial

‘12 Budget ’12 Actual ‘13 Budget

Attendance Change +2.2% +2.2%

Technical Registration 315 322 329

Educational Session 60 59 -

Income $267,370 $271,260 $260,385

Expenses $255,433 $259,131 $245,580

Surplus $11,937 $12,129 $14,805

Request for $60,000 advance for CICC 2014

2012/13 Symposium on VLSI CircuitsHonolulu HI/Kyoto JapanJune 12-15, 2012 June 11-14, 2013

2012/13 Symposium on VLSI CircuitsHonolulu HI/Kyoto JapanJune 12-15, 2012 June 11-14, 2013

Charlie Sodini/David Scott

VLSI Symposium EXCOM Chair/Treasurer

SSCS Meetings Committee, August 11, 2013 – Boston, MA

Symposium on VLSI Circuits

• 2013 Symposium hosted by JSAP

– Royal Rhiga– Kyoto - June 11-14, 2013

– Leverage Technology/Circuit topics with 2-day overlap

– Paper submission - 396 papers submitted

– Acceptance ratio of ~28% driven to ensure each session has meaningful attendance.

– Attendance is 471.

– General co-Chair – Vivek De, Program co-Chair – Jeff Gealow

– Increased collaboration between the Technology and Circuits symposium in all areas including highlighted papers, short courses and rump sessions.

• 2014 Symposium to be hosted by IEEE– Hilton Hawaiian Village – Honolulu – June 10-13, 2014– Please continue student travel support for 2014.– Please continue SSCS publicity of through email to members.

Attendees, Programs and Short Courses

Year

# of

Atte

ndee

s

0

100

200

300

400

500

600

700

800

900

2004 2005 2006 2007 2007 2009 2010 2011 2012 2013

Tech. program

Circ. program

Tech. short course

Circ. short course

138

471

Symposium on VLSI Circuits Financials

2013 Symposia hosted in Kyoto – Rhiga Royal Hotel

Registration Fee (IEEE) – JPY60K (~$625)

(Finances on odd years sponsored by Japan Society of Applied Physics)

2012 Honolulu – Sponsored by SSCS

Registration: 302 Actual 277 Budget

$26K surplus for Circuits Symposia in 2012

Registration Fee: $575 Member, $725 Non Member (Includes Banquet)

August 2012 requested $50k Advance received from SSCS, same from EDS

REQUEST: $50k Advance for 2014 Symposium

Compiled by Takayasu SakuraiCompiled by Takayasu Sakurai(Chair, Steering Committee)(Chair, Steering Committee)

Makoto IkedaMakoto Ikeda(Secretary, Steering Committee)(Secretary, Steering Committee)

Cambridge, MACambridge, MAAugust 12August 12, 2013, 2013

Asian SolidAsian Solid--State Circuits Conference (A-SSCC)State Circuits Conference (A-SSCC)

A-SSCC 2012 and 2013

• A-SSCC 2012A-SSCC 2012

– Japan, Nov. 12th – 14th, 2012, Kobe Int. Conf. Center, Kobe– 349 attendees (8% up from 2011 Korea conference)– 95 papers among 233 submission (41%)

• A-SSCC 2013A-SSCC 2013

– Singapore, Nov. 11th – 13th, 2013, Resort World Convention Centre– Conference Chairs

• Conference Chair: Mr. Ulf Schneider, Managing Dir., Lantiq Asia Pacific Pte. Ltd., President, Singapore Semiconductor Industry Association

• OC Chair: Prof. Yong Ping Xu, National University of Singapore• TPC Chair: Prof. Zhihua Wang, Tsinghua Univ., China• TPC Vice Chair: Prof. Leibo Liu, Tsinghua Univ., China

– 111 papers accepted among 316 submissions (35%)

– Number of Analog papers is increasing.

Paper Submission/Acceptance

13

A-SSCC 2013 Financial Estimate

14

Income (S$)Conference Registration 179,390.00Publication Sales 4,835.00Exhibits 15,000.00Others 75,700.00Conference Loans 30,000.00Total Income 305,274.00

Expense (S$)Management Servies 5,000.00Registration Expense 2,000.00Promotion 2,400.00Conference Publication 6,000.00Exhibits/Vendors 5,000.00Local Arrangements 42,420.00Social Functions 130,200.00Administration 54,500.00Committee 10,000.00Others 14,421.00Loan repayments 33,333.00Total Expense 305,274.00Balance 0.00

15

Name(thru)

Att.(last)

Papers Acc/Sub

Att./paper%

AttendBudget

k$$/Att.

Surplusk$

Ind./Univ. PostersReg.

(Prev)

ESSCIRC(2014)

9/16-20 2013(571) (110/271) (5.2) N/A $467 N/A N/A (0.38) N/A

$850($980)

DAC ()June 2-6 2013

4063(4707)

158/747 25 38% $3,350 $824 $300 0.43 187$825

($910)VLSI TSA*

(2013)Apr. 22~24

476(435)

51/80 9.33 8.4 N/A N/A N/A 0.21 N/A$425(425)

VLSI DAT*(2013)

Apr. 22~24

270(339)

70/145 3.86 11.5 N/A N/A N/A 0.08 20$425(425)

ISLPED(2014)

Sep. 4-6, 2012(137)

60/167(66/212)

(2.1) (71%) $83.2($84.7)

($618) ($5.7) (0.14) 21(18)

$450($500)

BCTM*(2014)

Oct 1-3, 2013150 45/62 4.4 $175 $1K $20 0.82 0

$800($600)

DATE(2014)

Mar. 18-22, 20131635 206/829 7.9

76%(exhibiti

on)835$ 511$ $41.6 N/A 96 $643

HOTCHIPS(2014)

Aug. 27-29, 2013542 25/54 21.7 N/A $219 $404 $16 11.5 5

$495($395)

Technically Co-Sponsored Conf. - Statistics

16

Name(thru)

Att.(last)

Papers Acc/Sub

Att./paper%

AttendBudget

K$$/Att.

SurplusK$

Ind./Univ. PostersReg.

(Prev.)

CSICS*()

Meeting Date225 68/90 3.3 70% $150 667 $29 0 $725

RFIC(2016)

6/17-19 2012

715(812)

103/202 7.3 60% $200 $267 $45K 0.33 14$230

($230)

ICCAD(2015)

11/5-8, 2012348 338/412 1.02 35% $210 $604 $37k 0.36 No $550

Sensor(?)

10/28-31, 2012646 579/1082 1.12 N/A $360 $557 $87k N/A 313 $750

Technically Co-Sponsored Conf. - Statistics

Financially Sponsored Conf. - Statistics

17

Summary of Recommendations and Approved Motions

•Recommendation– Work with Chapters to see if we can better ensure the chapter sponsored

meetings properly serve the community : Discussions are on-going.

– ISSCC Starbucks Card Program is a hit.

– SSCS publicity using its e-mail list seems to be effective.

– Student Travel Grant Program is useful. – VLSI : 2, A-SSCS: 4, ISSCC: 17, CICC: 0

•Actions with Financial Impact (Adcom vote)– VLSI Advance for 2014 - $50k

– CICC Advance for 2014 - $60k

18