synchrotron and pion beam tests of 3d medipix2 and timepix detectors r. bates a, k. c. akiba h, l....
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Synchrotron and pion beam tests of 3D Medipix2 and TimePix Detectors
R. Batesa, K. C. Akibah, L. Alianellib, M. Artusoj, F. Bayer, J. Buytaerte, P. Collinsd, M. Crossleye, L. Eklunda, C. Fletac, A. Gallase, M. Gandelmani, M. Gersabecka , E.N. Gimenezb, V. Gligorova, T. Husef, M. Johng, L. F. Llina, M. Lozanoc, Aaron Mac Raighnea, D. Maneuskia, J. Marchalb, T. Michelk, M. Nicola, G. Pellegrinic, D. E. Perirae, R. Plackettd, V .O'Sheaa, C. Parkesa, E. Rodriguesa, K.J.S. Sawhneyb, N. Tartonib, P. Vazqueze.
a) University of Glasgow, Department of Physics and Astronomy, Glasgow, UK.b) Diamond Light Source Ltd, Oxfordshire, UK.c) Instituto de Microelectronica de Barcelona, IMB-CNM-CSIC, Barcelona, Spain.d) CERN CH-1211, Genève 23, Switzerland. e) Facultad de Fisica , University of Santiago de Compostela, Santiago de Compostela, Spain.f) Department of Physics, The University of Liverpool, Liverpool, United Kingdom. g) Department of Physics, University of Oxford, UK.h) Nikhef, Science Park 105, 1098 XG Amsterdam, The Netherlands.i) Instituto de Fisica, Univ. Federal do Rio de Janeiro, Brazil.j) Syracuse University, Syracuse, NY 13244, U.S.A.k) Erlangen Centre for Astroparticle Physics, Universität Erlangen-Nürnberg, Erwin-Rommel-Str. 1, 91058 Erlangen, Germany
Richard Bates, RD50, Nov 2009 2
Outline
• Introduction– 3D double sided detectors substrates– Medipix / Timepix description
• Micro-focussed X-ray beam– Set-up– Background subtraction– Efficiency and Charge Sharing
• Pion-beam from SPS– Set-up– Efficiency and Charge Sharing
• Conclusions
Richard Bates, RD50, Nov 2009 3
Detector substrates3D and Planar
• Detectors are fabricated at Centro Nacional de Microelectronica, Barcelona
• Columns are etched from opposite sides of substrate• Column fabrication
» Reactive ion etching
» Partial filing with polysilicon then doping
Radiation Hardness
Reduced Charge Sharing
Charge sharing in double-sided 3D Medipix2 detectors
D. Pennicard, et al. ,NIM A, Vol. 604, Issues 1-2, 1 June 2009, Pages 412-415
Medipix unit cell55µm on the sideMaximum drift length is 38.9µm
Richard Bates, RD50, Nov 2009 4
Medipix and Timepix
• 65k single-photon counting pixel array
• Square pixel size of 55µm
• Electron or hole collection
• Threshold equalisation
• Count rate of ~100kHz
• Readout in 300µs
• High dynamic range
Amplifier
Discriminator
Pixel Counter
Readout
+1
Threshold
Detector substrate
Amplifier
Discriminator
Pixel Counter
Readout
Threshold
N counts
+N
MedipixTimepix
Richard Bates, RD50, Nov 2009 5
X-ray Beamline Set-up
• B16 Test beamline at the Diamond
• Monochromatic X-ray beam of 14.5keV
• Beam size FWHM were measured as
– 4.5±0.3 µm in x
– 6.7±0.3 µm in y
• Six degrees of freedom, 0.1µm translational and 5µrad rotational
• Alignment of 0.3o in x and 0.9o in y
Compound refractive lens
Beam
Beam 3D detector
Detector substrate raster scanned relative to the beam
Richard Bates, RD50, Nov 2009 6
Pixel Maps
• 77.5µm square scans (55µm pixel)
• 2.5µm steps
• Background subtracted
• Interpolated
• THL ~ 50% of beam energy
N-Type
0.2
0.4
0.6
0.8
1
P-Type
0.2
0.4
0.6
0.8
1Planar
0.2
0.4
0.6
0.8
1
Richard Bates, RD50, Nov 2009 7
-200 -100 0 100 2000
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
distance from pixel centre (µm)
Co
un
ts
Cross sectionFitted functionBackground with central pixel
Background Subtraction
-200-100
0100
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-400
-200
0
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0
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µmµm
-200-100
0100
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-400
-200
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µmµm
1. Build up scan
2. Remove central pixel/ micro-focused beam.
3. Perform cross sections to estimate background in central pixel
4. Perform surface fit
-200-100
0100
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-400
-200
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µmµm
1.
2.
3.
4.
Richard Bates, RD50, Nov 2009 8
Detection Efficiencies
55µmNormalisation
Inefficiencies Centre Corners*
Planar 0% 7%
3D N –Type 3% 7%
3D P –Type 4% 7%
*efficiencies at the corners due to electrodes structures and charge sharing
20
30
40
50
60
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80
90
100
55µmCorners
Central electrode
55µm
Richard Bates, RD50, Nov 2009 9
Charge Sharing
4 6 8 10 12 14 16 18 20 22 240.95
1
1.05
1.1
1.15
1.2
1.25
1.3
1.35
1.4
µm
No
rma
lise
d C
ou
nts
Line Sections
THL level
~50% beam energy
THL level
~25% beam energy
0 5 100.4
0.6
0.8
1
1.2
1.4
1.6Cross section at Pixel Boundary
THL~25%
THL~50%THL~75%
P-Type
42.5µm
0 5 100.4
0.6
0.8
1
1.2
1.4
1.6Cross section at Pixel Boundary
THL~25%
THL~50%THL~75%
P-Type
Richard Bates, RD50, Nov 2009 10
Charge Sharing
0 5 100.4
0.6
0.8
1
1.2
1.4
1.6Cross section at Pixel Boundary
THL~25%
THL~50%THL~75%
N-Type
0 5 100.4
0.6
0.8
1
1.2
1.4
1.6Cross section at Pixel Boundary
THL~25%
THL~50%THL~75%
Planar
0 5 100.4
0.6
0.8
1
1.2
1.4
1.6Cross section at Pixel Boundary
THL~25%
THL~50%THL~75%
P-Type
5 10 15
5
10
15
To
p q
ua
ter
of p
ixe
l an
d it
s n
ea
rest
ne
igh
bo
urs
5 10 15
5
10
15
5 10 15
5
10
15
0 5 10 15 20 250.4
0.6
0.8
1
1.2
1.4
1.6Cross section at Pixel Boundary
THL~25%
THL~50%THL~75%
P-Type
5 10 15
5
10
15
To
p q
ua
ter
of p
ixe
l an
d it
s n
ea
rest
ne
igh
bo
urs
5 10 15
5
10
15
5 10 15
5
10
15
0 5 10 15 20 250.4
0.6
0.8
1
1.2
1.4
1.6Cross section at Pixel Boundary
THL~25%
THL~50%THL~75%
N-Type
5 10 15
5
10
15
To
p q
ua
ter
of p
ixe
l an
d it
s n
ea
rest
ne
igh
bo
urs
5 10 15
5
10
15
5 10 15
5
10
15
0 5 10 15 20 250.4
0.6
0.8
1
1.2
1.4
1.6Cross section at Pixel Boundary
THL~25%
THL~50%
THL~75%
Planar
THL~25%
THL~50%
THL~75%
P-Type N-Type Planar
µm µm µm
No
rma
lis
ed
co
un
ts
Reduced level of over counting and under counting in 3D
= Reduced Charge Sharing
Note : at 14.5keV – gets worse for thicker Silicon & higher energy X-rays in Planar device
FWHM
Planar: ~12µm
3D: ~8µm
Double counting
Planar: 0.5 photons
3D: 0.25 photons
Richard Bates, RD50, Nov 2009 11
MIP beam from SPS
• Secondary 120 GeV pion beam from SPS• 4 Timepix, 2 Medipix planes in telescope• DUT: double sided 3D N-type sensor from
CNM/Glasgow• Expected track extrapolation error: < 3 μm
Pion beamIndividual pion tracks
Medipix & LHCb
telescope DUT
Richard Bates, RD50, Nov 2009 12
Cluster width
• Fit to determine perpendicular position:-0.32 degrees
• Flat distribution in y• Ratio ~1 at perpendicular
12
Richard Bates, RD50, Nov 2009 13
Detection Efficiency.Medipix Mode(counts above threshold)
• Averaged result over all pixels
• Drop in efficiency at the electrode positions
• Here: efficient if hit in 3x3 pixel array around intercept point
• MIPs give a much higher efficiency than with x-rays due to track nature of charge deposition
Absolute efficiencies
50
60
70
80
90
100
Centre Corner
Inefficiencies 0.5% 5%
Threshold just above noise level
Richard Bates, RD50, Nov 2009 14
Energy Spectra TOT Mode
ADC hit in pixel ADC hit in 3x3 pixel
average ADCvs
(x,y)
50
60
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80
90
100
50
60
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80
90
100
•Same picture as before:Two column types have different signal size
Richard Bates, RD50, Nov 2009 15
Landaus as function of radius
• ADC counts (ToT) as function of distance from centre of cell
15
Richard Bates, RD50, Nov 2009 16
More landaus
• Just 1D plots of the columns of the plot on the previous slide
• Basically 2 Landaus:MPVs are ~7 and ~30
• Now for some explanation...
centre of cell
corners of cell
1 432
5 876
9 121110
13
16
Richard Bates, RD50, Nov 2009 17
7 ADC 30 ADC 7 ADCshared
17
Signal explanation
Richard Bates, RD50, Nov 2009 18
Charge sharing
fraction of multi-strip clusters
vsradius charge sharing at
edges/corners
18
Radius µm
Richard Bates, RD50, Nov 2009 19
Testbeam to do
• Scans at different bias voltages• Scans at different angles• Scans with different thresholds• Residuals
Richard Bates, RD50, Nov 2009 20
Conclusions
• Pixels successfully mapped
• Efficiencies of the central electrode area found
• 3 - 4% due to central electrode
• Efficiency at corners equivalent to planar device
• Trade-off between efficiency and charge sharing
• Evidence of a decrease in charge sharing in 3D shown
• Pion beam results complement X-ray characterisation
• Higher efficiencies shown
• TOT – spectral evidence of charge sharing and efficiencies
• Trade off in between efficiency and radiation hardness
X-rays
MIPs
Richard Bates, RD50, Nov 2009 21
Thank you for your attention
Richard Bates, RD50, Nov 2009 22
Back-UpLateral and Full depletion
Richard Bates, RD50, Nov 2009 23
Back up SlidesBackground Subtraction
C41 Before Background subtracted
5 10 15 20 25 30
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30
C41 After Background subtracted
5 10 15 20 25 30
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C31 Before Background subtracted
5 10 15 20 25 30
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C31 After Background subtracted
5 10 15 20 25 30
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C22 Before Background subtracted
5 10 15 20 25 30
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C22 After Background subtracted
5 10 15 20 25 30
5
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Planar P-Type N-Type
Richard Bates, RD50, Nov 2009 24
Back up SlidesBackground Subtraction
-200 -100 0 100 2000
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1500
2000
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3000
3500
4000
4500
5000
distance from pixel centre (µm)
Co
un
ts
Cross sectionFitted functionBackground with central pixel
-200 -150 -100 -50 0 50 100 150 2000
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1000
1500
2000
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3000
3500
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4500
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distance from pixel centre (µm)
Co
un
ts
Cross sectionFitted functionBackground with central pixel
Richard Bates, RD50, Nov 2009 25
Back-Up SlidesEdges to find beam width
6.470 6.480 6.490 6.500 6.510 6.520 6.530 6.540
0
70
140
De
riva
tive
of T
ran
smis
sion
sig
nal
[a.u
]
Wire vertical position [mm]
fwhm=4.5m
0.0
0.2
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0.6
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(a)
Tra
nsm
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sig
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Vertical
1.980 1.990 2.000 2.010 2.020 2.030 2.040 2.050 2.060
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riva
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of T
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a.u
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Wire horizontal position [mm]
fwhm=6.7m
0.0
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0.2
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Tra
nsm
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sig
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[a.u
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Horizontal
(b)
Wire scans and their derivatives