system integration index of products and services
TRANSCRIPT
International Exhibition and Conference for the Printed Electronics Industry
LOPEC exhibition: March 23–24, 2022ICM – Internationales Congress Center München
www.lopec.com
[email protected], Tel. +49 89 949-20224/25, Fax +49 89 949-20226Messe München GmbH, Messegelände, 81823 München, Germany
slairetaM 11.1 Substrates1.1.1 Plastic films1.1.2 Metal foils1.1.3 Paper1.1.4 Glass1.1.5 Textiles1.1.6 Other substrates
srotcudnoC 2.11.2.1 Organic conductors1.2.2 Inorganic conductors1.2.3 Nano materials1.2.4 Carbon nanotubes1.2.5 Graphene1.2.6 Hybrid conductors
srotcudnocimeS 3.11.3.1 Polymer semiconductors1.3.2 Small molecule semiconductors1.3.3 Inorganic semiconductors1.3.4 Nano materials semiconductors1.3.5 Carbon nanotube semiconductors1.3.6 Hybrid semiconductors1.4 Dielectrics1.4.1 Organic dielectrics1.4.2 Inorganic dielectrics1.4.3 Nano materials1.4.4 Hybrid dielectrics
sevisehda dna sniser ,slairetam noitaluspacnE 5.11.5.1 Thin film encapsulation1.5.2 Polymer film encapsulation1.5.3 Metal encapsulation1.5.4 Glass encapsulation1.5.5 Resins and adhesives1.6 Other materials
sessecorp gnirutcafunaM 22.1 Mass patterning techniques2.1.1 Gravure printing2.1.2 Offset printing2.1.3 Flexographic printing2.1.4 Screen printing2.1.5 Other mass patterning techniques
2.2 Digital printing2.2.1 Ink-jet printing2.2.2 Other digital printing2.3 Other printing processes2.3.1 Microcontact printing2.3.2 Nano imprint2.4 Vacuum processes2.4.1 Evaporation2.4.2 Sputtering2.4.3 Organic vapor phase deposition (OVPD)2.4.4 Other vacuum processes2.5 Photolithography2.6 Laser processes2.6.1 Laser ablation2.6.2 Laser transfer2.7 Coating technologies2.7.1 Spin coating2.7.2 Dip coating2.7.3 Blade coating2.7.4 Other coating techniques2.8 Material processing 2.8.1 Dispersion technologies2.8.2 Other material processing2.9 Light induced processing2.9.1 IR drying2.9.2 UV curing2.9.3 Laser processes2.10 Dosing and mixing technology2.10.1 Pumps2.10.2 Other dosing and mixing technologies2.11 Encapsulation2.11.1 Thin film encapsulation2.11.2 Polymer film encapsulation2.11.3 Metal encapsulation2.11.4 Glass encapsulation2.11.5 Other encapsulation processes2.12 Clean room technology2.13 Roll-to-roll processing2.14 Other manufacturing processes
Overview of index of products and services
Index of products and services
slairetaM 1sessecorp gnirutcafunaM 2
,gnigakcap dna ylbmessa scinortcelE 3system integration
smetsys tset dna noitcepsnI 4seciveD 5
6 ApplicationssecivreS 7
save Index of products and services p. 2 back
International Exhibition and Conference for the Printed Electronics Industry
LOPEC exhibition: March 23–24, 2022ICM – Internationales Congress Center München
www.lopec.com
[email protected], Tel. +49 89 949-20224/25, Fax +49 89 949-20226Messe München GmbH, Messegelände, 81823 München, GermanyIndex of products and services
3 Electronics assembly and packaging, system integration
3.1 Electronics assembly and packaging3.1.1 Flip chip3.1.2 Other electrical contacting3.2 Lamination3.3 System integration3.4 Hybrid systems (polytronics)
smetsys tset dna noitcepsnI 4noitaziretcarahc lacirtcelE 1.4
4.2 Physical/optical characterization4.3 Chemical characterization4.4 Simulation/circuit optimization4.5 Lifetime testing4.6 Quality/process control4.7 Environmental testing4.8 Other inspection and test systems
seciveD 55.1 Transistors5.2 Diodes5.3 Passive components5.3.1 Capacitors5.3.2 Resistors5.3.3 Other passives5.4 Integrated circuits5.5 Displays5.5.1 OLED5.5.2 Electrophoretic displays5.5.3 Electrochromic displays5.5.4 Electroluminescent displays5.5.5 LCD5.5.6 Electrowetting5.5.7 Other displays5.6 Photovoltaic cells5.6.1 Organic photovoltaics5.6.2 Hybrid photovoltaics5.6.3 Inorganic photovoltaics
5.7 Sensors5.7.1 Photodiodes5.7.2 Pressure sensors5.7.3 Temperature sensors5.7.4 Biomedical sensors5.7.5 Gas sensors5.7.6 Touch sensors5.7.7 Other sensors5.8 Memory elements5.9 Antennas5.10 Batteries5.11 Components for hybrid systems5.12 Other devices
6 Applications6.1 TFT backplanes6.2 Displays6.3 Sensors6.4 Smart systems 6.5 RFID6.6 Solar cells6.7 Smart textiles6.8 Speakers6.9 Lighting6.10 Other applications
secivreS 77.1 Consulting7.2 R&D funding program management7.3 R&D/Research & Development7.4 Prototyping7.5 Manufacturing7.6 Venture and equity capitalization7.7 Professional and trade associations7.8 Technical books, technical journals,
technical publishers7.9 Other services
save back Terms of Participation B