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S Seminários Técnicos 2003 Prof.: Cícero s Sensores e Rede AS-Interface
S Seminários Técnicos 2003 Prof.: Cícero s Sensores e Rede AS-Interface
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ECE 404 PCB Design Presentation -Binod Pant. Introduction Printed circuit board Mechanical support Electrically connect electronic components using conductive
ECE 404 PCB Design Presentation -Binod Pant. Introduction Printed circuit board Mechanical support Electrically connect electronic components using conductive
220 views
VLSI Design Lecture 3: Parasitics of CMOS Wires Mohammad Arjomand CE Department Sharif Univ. of Tech. Adapted with modifications from Harris’s lecture
VLSI Design Lecture 3: Parasitics of CMOS Wires Mohammad Arjomand CE Department Sharif Univ. of Tech. Adapted with modifications from Harris’s lecture
215 views
A Diagonal-Interconnect Architecture and Its Application to RISC Core Design Mutsunori Igarashi, Takashi Mitsuhashi, Andy Le, Shardul Kazi, Yang-Trung
A Diagonal-Interconnect Architecture and Its Application to RISC Core Design Mutsunori Igarashi, Takashi Mitsuhashi, Andy Le, Shardul Kazi, Yang-Trung
214 views
VLSI Routing. Routing Problem Given a placement, and a fixed number of metal layers, find a valid pattern of horizontal and vertical wires that connect
VLSI Routing. Routing Problem Given a placement, and a fixed number of metal layers, find a valid pattern of horizontal and vertical wires that connect
224 views
Fall 2006EE 5301 - VLSI Design Automation I VI-1 EE 5301 – VLSI Design Automation I Kia Bazargan University of Minnesota Part VI: Routing
Fall 2006EE 5301 - VLSI Design Automation I VI-1 EE 5301 – VLSI Design Automation I Kia Bazargan University of Minnesota Part VI: Routing
224 views
UNIT 4 THE BYZANTINE AND CAROLINGIAN EMPIRES. The Roman Empire
UNIT 4 THE BYZANTINE AND CAROLINGIAN EMPIRES. The Roman Empire
282 views
A L k Into Motherboards By Amy Madden. How It Is Made The progression that a motherboard goes through is composed of three main different processes Design
A L k Into Motherboards By Amy Madden. How It Is Made The progression that a motherboard goes through is composed of three main different processes Design
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Physical Design. This is what we want Are amenable to fabrication with some given target process Logically function as expected in spite of numerous parasitic
Physical Design. This is what we want Are amenable to fabrication with some given target process Logically function as expected in spite of numerous parasitic
216 views
Recent Results for 3D Pixel Integrated Circuits using Copper-Copper and Oxide-Oxide Bonding Ray Yarema, Grzegorz Deptuch, Ron Lipton Fermi National Accelerator
Recent Results for 3D Pixel Integrated Circuits using Copper-Copper and Oxide-Oxide Bonding Ray Yarema, Grzegorz Deptuch, Ron Lipton Fermi National Accelerator
222 views