talosnext generation

automating your microchip engineering test procedures

reliable and easy-to-use device handling system

-60 °C to +175 °C (-76 °F to +347 °F) device testing temperature with active thermal control system (ATC)

multiple test cycles at different test temperatures without user interaction

in combination with esmo phoenix cart, lowest test cell footprint in the market

modular system configurations as per your individual requirements

easily moveable, even by one person

docking interface for all testers

remote control via Ethernet

high MTBF values, low maintenance efforts

The talos platform, basing on a 4-axis portal, may be adapted to a virtually unlimited variety of customer demands – we will be pleased to design a concept for you, customized to your individual requirements.

workflowstep 1loadingdevice pick-up from assigned input tray/tube

step 2pre-alignmentdevice placement in and re-pick from pre-centering unit

step 3placingz1-axis places device in contact socket

step 4contactingz2-axis with active temperature control plunger presses device into contact socket and adjusts it to test temperature

step 5unloading after device testing, separation in assigned output trays/tubes, depending on test results (bin class)

handling key features

highly accurate and reliable 4+1-axis portal pick-and-place robot system

manual tray or tube loading and unloading options

free pin1 orientation

high contact force of 450 N – higher contact force available on request

15.6” widescreen HMI with multi-touch capability

integrated camera system for pick/place position teaching

FIFO or bin sort mode with free tray/tube assignment

RS232 or optional GPIB tester interfaces

tray loading/unloading option

tube loading/unloading option

The conversion kit consists of three modules, facilitating easy and quick replacement.

temperature control key featuresactive thermal control (ATC) option

closed loop temperature control with sensor integrated in temperature head

highest accuracy due to direct temperature measurement at heatsink in conductive contact with device

high IC power dissipation controllable during electrical test

software-operated air flow control system with HMI feedback included

change of set temperature from tester via GPIB or RS232

> fine adjustment during testing possible

> single-insertion at multiple test temperatures possible

> multiple tests at different set temperatures without user interaction possible

fully integrated, handler-software-controlled cooling unit offering choice of two configuration options:

> electrical air chiller -40 °C (-40 °F) DUT junction temperature system specification

> LN2 heat exchanger -60 °C (-76 °F) DUT junction temperature system specification

system interior sealed and purged to prevent icing

modular, expandable temperature system

various optional featuresdual ionizer

barcode reader

vacuum generator

air dryer unit

and more

thermo plunger conductive temperature transfer to device

convective temperature transfer to socket/board

-60 ⁰C-76 ⁰F

+175 ⁰C+347 ⁰F

Plant I, RosenheimPlant II, Raubling

esmo AG · HQ Germany

esmo USASacramento, California

esmo SingaporeSingapore

esmo ChinaShanghai, China

worldwide sales and service network –we are where you are

esmo Germany esmo USA esmo Singapore esmo ChinaRosenheim Sacramento Shanghai

esmo AG esmo USA Corp. esmo Asia Pte. Ltd. esmo Asia North Co. Ltd.Brueckenstrasse 1 1020 Winding Creek Road 25 International Business Park Building 2, No. 388 Xinrun Road83022 Rosenheim Suite #120 03-01/02 German Centre Xin Qiao Industrial ZoneGermany Roseville, California 95678 Singapore 609916 Song Jiang District

USA Singapore 201612 ShanghaiChina

Phone +49 (8031) 233 88 0 Phone +1 (916) 307 6345 Phone +65 (656) 288 57 Phone +86 (21) 5768 7228 + ext. 216Fax +49 (8031) 233 88 10 Fax +1 (916) 307 6341 Fax +65 (656) 288 60 Fax +86 (21) 5768 7132sales@esmo-ag.com sales@esmo-usa.com sales@esmo-asia.com info@esmo-ag.com.cn

www.esmo-group.com/semicon