the 34th european mask and lithography conference emlc...

1

June 18 ndash 20 2018MINATEC Conference CenterGrenoble France

wwwemlc-conferencecom

PROGRAM

THE 34 th EUROPEAN MASK AND L ITHOGRAPHYC O N F E R E N C E

EMLC 2018

2 3

34th European Mask and Lithography Conference EMLC 2018

at the MINATEC Conference Center Grenoble Franceon Monday June 18th to Wednesday June 20th 2018

Welcome to the EMLC 2018 in Grenoble

On behalf of VDEVDI-GMM the EMLC 2018 Sponsors and the EMLC 2018 Organizing Committee we would like to welcome you to the 34th European Mask and Lithography Con-ference EMLC 2018 at the MINATEC Conference Centre in the City of Grenoble France

The conference has annually brought together scientists re-searchers engineers and technologists from research institutes and companies from around the world to present innovations at the forefront of mask lithography and mask technology

The two and a half days conference (starting on Monday June 18th at 0200 PM in the MINATEC Conference Centre with a Tutorial Session (ending at 0500 PM) At 500 PM a short Welcome Reception and the Poster Session will take place till about 600 PM The Poster Session will continue on Tuesday afternoon

The Technical Sessions (including the second part of the Poster Session) of the EMLC2018 Conference starts on Tuesday June 19th from 0900 AM till 0645 PM) and on Wednesday June 20th from 0900 AM till 0615 PMThe EMLC2018 conference is dedicated to the science tech-nology engineering and application of mask and lithography technologies and associated processes giving an overview of the present status in mask and lithography technologies and the future strategy where mask producers and users have the opportunity of becoming acquainted with new developments and results This year the EMLC2018 Program Committee defined the following sessions

ldquoWafer Lithography ndash 193i and EUVrdquo ldquoMask-Less Lithography Nano-Imprint Lithography and Directed Self Assemblyrdquo ldquoMask Patterning Metrology and Processrdquo ldquoNon-IC Applications Plasmonics and Photonicsrdquo ldquoMask2Wafer and Wafer2Wafer Metrologyrdquo and ldquoUsing Big Data Deep Learningrdquo

Of course papers outside these predefined areas of interest were welcome for submission as well

As Welcome Speaker from the City of Grenoble Mme Marie-Joseacute Salat representative of Grenoble-Alpes Meacutetropole will demonstrate the importance of Grenoble as one of the three ldquoHigh Technology Centres in Europerdquo Besides Dresden and LeuvenEindhoven Grenoble Europersquos Smart Valley offers thousands of jobs in computing amp software as well as in Micro-Nanotechnology amp Electronics

Invest in Grenoble - Isegravere

TIC

Computing amp Software

Public research 2000 jobs

Companies 13000 jobs

Total 15000 jobs

Higher education 2200 graduates

Europersquos Smart Valley

Micro-nanotechnology amp Electronics



Total 25000 jobs


ICT in Grenoble ndash Isere 40 000 jobs


AlbanyUSA

Grenoble France

Dresden Germany

Hsinchu Taiwan

DaejeonKorea Tsukuba

Japan

Leuven EindhovenBelgium Netherlands

One of the Worldrsquos Top Microelectronics Ecosystems

SuzhouChina

4 5

Regarding the Tutorial Session on Monday afternoon we asked Paul van Adrichem from ASML Netherlands BV Veldhoven Netherlands to give a ldquoReview of OPC RET SMOrdquo

This tutorial will provide an overview of advanced Optical Proximity Correction Resolution Enhancement Technology as well as Source-Mask-Optimization

As second tutor we asked Aviram Tam from Applied Materials PDC Israel He will explain the ldquoInspection Challenges in the EUV Areardquo

This tutorial will cover the use cases for blank inspection pat-tern inspection outgoing inspection and the possible solution for DUV mask inspection e-Beam MI Actinic blank inspec-tion on-wafer qualification and how those evolve in each of the different scenarios for pellicle (no pellicledetachable135nm only193nm friendly) The tutor will be from the Mask Inspection Product Group of Applied Materials Israel

As first Keynote Speaker we have invited Olivier Noblanc from STMicroelectronics Crolles France He will talk about ldquoTech-nology for Optical Sensorsrdquo

The second Keynote Speaker is Laurent Pain from CEA-LETI Grenoble France His presentation is entitled ldquoThe Battle Field of Lithographyrdquo

The third Keynote Speaker is Freacutedeacuteric Boeuf from STMicro-electronics Crolles France He will present the newest techno-logies on ldquoSilicon Photonics from research to industrial realityrdquo

There are several invited talks on Multi-Beam Mask Writing on Multi-Trigger Resist for Electron Beam and Extreme Ultra-violet Lithography on Photonic Superlattice Multilayers for EUV Lithography Infrastructure on EUV Pellicle Industrialization Pro-gress on Mask-Less Lithography on Wafer-Level UV-Nanoim-print Lithography on Directed Self-Assembly on Lithography Technology and Trends for More than Moore Devices on Reticle Critical Dimension Uniformity Improvement and on Automatic Defect Classification of SEM images using Deep Learning

As every year we have invited the authors of the Best Poster of BACUS (SPIE Photomask Technology) 2017 and we will invite the Best Paper from Photo Mask Japan 2018 to present their papers

Technical ExhibitionParallel to the Conference Presentations a Technical Exhibition will take place on Monday (500 PM to 600 PM) continuing on Tuesday (1000 AM to 0600 PM) and on Wednesday (1000 AM to 0400 PM) where companies (mask suppliers material sup-pliers and equipment suppliers) will exhibit their companies and products

To foster the exchange between the conference attendees and the exhibitors the exhibition area will also be the place for all coffee and lunch breaks

Conference Dinner BanquetFor Tuesday evening June 19th after the Poster Session we have organized the Conference Banquet Dinner at the Bastillerdquo 300 meters above Grenoble with a fantastic view over the City

So please enjoy the Tutorial and the Technical Sessions of the EMLC 2018 as well as the Technical Exhibition but also allow yourself to visit the beautiful city of Grenoble

Uwe BehringerEMLC 2018 Conference Chair

Cable Car to the Bastille ndash we will have the Conference Dinneron Tuesday June 19th 2018 at the Bastille

6 7

The EMLC 2018 International Program Committee

Conference Chairs

Behringer Uwe UBC Microelectronics Ammerbuch Germany

Finders Jo ASML Veldhoven The Netherlands

Co-Conference Chairs

Connolly Brid Toppan Photomasks GmbH Dresden Germany

Gale Chris Applied Materials Dresden Germany

Hayashi Naoya DNP Saitama Japan

Program Chairs

Stolberg Ines Vistec Electron Beam Jena Germany

Erdmann Andreas Fraunhofer IISB Erlangen Germany

Co-Program Chairs

Seltmann Rolf Globalfoundries Dresden Germany

Sarlette Daniel Infineon Dresden Germany

List of Contents

Committee Members 7 8

Organizers 9

Program Overview 10

Monday June 18th 2018 10

Tuesday June 19th 2018 11

Poster Session 10 15

Wednesday June 20th 2018 19

Conference Information 24

Conference Hours 24

Registration Hours 24

Technical Exhibition 24

Information for Authors 25

Presentation and CV 25

Best Poster Award 25

Best Paper Award 25

General Information 26

EMLC 2018 Office 26

Conference Fees 26

Conference Registration 26

Payment 27

Cancellation 27

Conference Venue 27

Transport 27

Hotel Reservation 28

Conference Dinner 29

Insurance 29

Passport and Visa Requirements 29

Cooperating Partners 32

8 9


Other Members

Ehrmann Albrecht Carl Zeiss SMT Oberkochen Germany

Farrar Dave Hoya Corporation London UK

Galler Reinhard EQUIcon Jena Germany

Jonckheere Rik IMEC Leuven Belgium

Kapilevich Izak Applied Materials Inc Santa Clara CA USA

Lauche Barbara Photronics MZD GmbH Dresden Germany

Le Gratiet Bertrand STMicroelectronics Crolles France

Levinson Harry Globalfoundries Santa Clara CA USA

Loeschner Hans IMS Nanofabrication GmbH Vienna Austria

Muehlberger Michael Profactor GmbH Steyr-Gleink Austria

Pain Laurent CEA-LETI Grenoble France

Peters Jan Hendrik bmbg consult Radebeul Germany

Progler Chris Photronics Inc San Jose CA USA

Roeth Klaus-Dieter KLA-Tencor MIE Weilburg Germany

Savari Serap Texas AampM University College Station USA

Scheruebl Thomas Carl Zeiss SMT GmbH Jena Germany

Schnabel Ronald VDEVDI-GMM Frankfurt am Main Germany

Schulze Steffen Mentor Graphics Corp Wilsonville OR USA

Tschinkl Martin AMTC Dresden Germany

Waelpoel Jacques ASML Veldhoven The Netherlands

Wiley Jim ASML US Inc Santa Clara CA USA

Wolf Hermann Photronics MZD GmbH Dresden Germany

Wurm Stefan ATICE LLC Albany NY USA

Yoshitake Shusuke NuFlare Yokohama Japan

Zurbrick Larry Keysight Technologies Santa Clara CA USA

Organizers

VDEVDI-Society Microelectronics Microsystems and Precision Engineering (GMM)

Dr Ronald SchnabelStresemannallee 15D-60596 Frankfurt am Main

Phone +49 69-6308-227Fax +49 69-6308-9828e-Mail gmmvdecom

During the conference Phone +49 171 4695 118

UBC Microelectronics

Dr Uwe BehringerAuf den Beeten 5D-72119 Ammerbuch

Phone +49 171-455-3196Fax +49 7073-50216e-Mail uwebehringerubct-onlinede

10 11

Monday June 18th 2018

1400-1700 The EMLC2018 Tutorial Class

1400 Welcome Uwe Behringer UBC Microelectronics

EMLC2018 Conference Chair

Introduction of the 1st Tutorial Speaker Izak Kapilevic Applied Materials USA

1405-1520 Inspection Challenges in the EUV Area Aviram Tam Applied Materials PDC Israel

This Tutorial will cover the use cases for blank inspection pattern inspection outgoing inspec-tion and the possible solution for DUV mask inspection eBeam MI Actinic blank inspection on-wafer qualification and how those evolve in each of the different scenarios for pellicle (no pellicle detachable 135 nm only 193 nm friendly)

1520-1540 Coffee Break

1540-1545 Introduction of the 2nd Tutorial Speaker Jo Finders ASML Netherlands BV


1545-1700 Review of OPC RET SMO Paul van Adrichem ASML Netherlands BV

Veldhoven Netherlands

This tutorial will provide an overview of advan-ced Optical Proximity Correction Resolution Enhancement Technology as well as Source-Mask-Optimization

1700 Get-Together and 1st Poster Session Uwe Behringer Chair of EMLC2018 welcomes

the participants and invites them to join the Get-Together concurrently with the first Poster Session

1705-1800

1st Part of Poster Presentations

Chair U Behringer UBC Microelectronics Ammerbuch Germany Co-Chair R Seltmann GLOBALFOUNDRIES Dresden Germany

As to the Poster Presentations pls see pages 15 - 18

Tuesday June 19th 2018

0900 Welcome and introduction U Behringer UBC Microelectronics EMLC2018

Conference Chair

0910 City of Grenoble Welcome Grenoble-Alpes Meacutetropole Welcomes You (Invited) M-J Salat Grenoble-Alpes Meacutetropole

Grenoble France

0930-1025

Session 1 ndash 1st Plenary

Chair J Finders ASML Netherlands BV EMLC2018 Conference ChairCo-Chair J Wiley ASML US Inc Santa Clara USA

0930 Technology for Optical Sensors (Keynote) O Noblanc STMicroelectronics Crolles France

1000 Best Poster of BACUS 2017 Transparent and conductive backside coating

of EUV Lithography Masks for ultrashort pulse Laser Correction (Invited)

R A Maniyara1 D S Ghosh1 V Pruneri12

1 ICFO - Institut de Ciegravencies Fotograveniques The Barcelona Institute of Science and Technology Barcelona Spain

2 ICREA - Institucioacute Catalana de Recerca I Estudis Avanccedilats Barcelona Spain


Monday June 18th 2018 Tuesday June 19th 2018

Program Overview

12 13

1050-1210

Session 2 ndash 2nd Plenary

Chair R Galler EQUIcon Jena GermanyCo-Chair U Buttgereit Carl Zeiss SMT Jena Germany

1050 The Battle Field of Lithography (Keynote) L Pain CEA-LETI Minatec Campus Genoble France

1120 Multi-Beam Mask Writer ndash Enabling Tool for EUV Lithography (Invited)

P Mayrhofer C Klein E Platzgummer IMS Nanofabrication GmbH Vienna Austria

1145 Multi-beam mask writer MBM-1000 for advanced

mask making (Invited) H Matsumoto H Yamashita H Matsumoto

N Nakayamada NuFlare Technology Inc Yokohama Kanagawa Japan

1210-1320 Lunch Break

1320-1520

Session 3 ndash Wafer Lithography (193i and EUV)

Chair J Finders ASML Netherlands BV Veldhoven NetherlandsCo-Chair S Wurm ATICE-LLC Albany NY USA

1320 Multi-Trigger Resist for Electron Beam and Extreme Ultraviolet Lithography (Invited)

C Popescu12 A McClelland 3 G Dawson3 J Roth4 APG Robinson23

1 Nanoscale Physics University of Birmingham UK 2 School of Chemical Engineering University of Birmingham UK 3 Irresistible Materials Ltd Birmingham UK 4 Nano-C Westwood MA USA

1345 Photonic superlattice multilayers for EUV lithography infrastructure (Invited)

F Kuchar R Meisels Montanuniversitaumlt Leoben Leoben Austria

1410 EUV Pellicle Update (Invited) J-W van der Horst D Brouns P Broman R Lafarre

T Modderman G Salmaso ASML Netherlands BV Veldhoven Netherlands

1435 NXE3400B imaging performance assessed from a customer perspective

G Schiffelers F Wittebrood C Legein ASLM Netherlands BV Veldhoven Netherlands

1455 Reticle CDU improvement by Zeiss CDC and the impact on real circuit pattern (Invited)

R Seltmann1 T Thamm1 B Geh4 M D Kaufmann2 A Bitensky3 A N Samy1 S Maelzer1 M Sczyrba5

1 GLOBALFOUNDRIES Dresden Germany 2 Carl Zeiss SMT GmbH Oberkochen Germany 3 Carl Zeiss SMS DN Misgav Israel 4 Carl Zeiss SMT Chandler Arizona USA 5 Advanced Mask Technology Center GmbH amp Co KG

Dresden Germany


Tuesday June 19th 2018 Tuesday June 19th 2018

Program Overview

14 15

1545-1740

Session 4 ndash ML2 NIL and DSA

Chair I Stolberg Vistec Electron Beam GmbH Jena GermanyCo-Chair B Connolly TOPPAN Photomask Dresden Germany

1545 Performance Validation of Mapperrsquos FLX-1200 (Invited)

J Pradelles1 Y Blancquaert1 S Landis1 L Pain1 G Rademaker1 I Servin1 G de Boer2 P Brandt2 M Dansberg2 R Jager2 J Peijster2 E Slot2 S Steenbrink2 M Wieland2

1 CEA-LETI Grenoble France 2 MAPPER Lithography Delft The Netherlands

1610 Feasibility of monitoring a multiple e-beam tool using scatterometry and machine learning CD and stitching error detection

G Rademaker12 Y Blancquaert1 T Labbaye1 L Mourier1 N Figueiro3 F Sanchez3 R Koret4 J Pradelles1 S Landis1 S Rey1 R Haupt3 B Bringoltz4 M Shifrin4 D Kandel4 A Ger4 M Sendelbach5 S Wolfling4 L Pain1

1 CEA-LETI Minatec Campus Grenoble France 2 University Grenoble Alpes Grenoble France 3 Nova Measuring Instruments GmbH Dresden

Germany 4 Nova Measuring Instruments LTD Rehovot Israel 5 Nova Measuring Instruments Inc Santa Clara

California USA

1630 Wafer-Level UV-Nanoimprint Lithography for high resolution and complex 3D Structures (Invited)

T Glinsner1 M Eibelhuber1 G Berger1 M Chouiki 1 C Lenk 2 M Hofmann 2 S Lenk 2 T Ivanov 2 I W Rangelow 2 A Ahmad 3 A Reum3 M Holz 3

1 EV Group St Florian am Inn Austria 2 TU Ilmenau Germany 3 Nanoanalytik GmbH lmenau Germany

1655 Application of rules-based corrections for wafer scale nanoimprint processes and evaluation of predictive models

H Teyssedre1 P Quemere1 J Chartoire1 F Delachat12 F Boudaa1 L Perraud1 M May1

1 CEA-LETI Minatec Campus Grenoble France 2 INTITEK Lyon France

1715 Silicon nanowires patterning using UV-assisted graphoepitaxy DSA lithography (Invited)

M Argoud1 G Claveau1 P Pimenta Barros1 Z Chalupa1 G Chamiot-Maitral1 C Navarro2 C Nicolet2 I Cayrefourcq3 R Tiron1

1 CEA-LETI Minatec Campus Grenoble France 2 ARKEMA FRANCE Lacq France 3 ARKEMA FRANCE Colombes France

1745-1845

Session 5 ndash 2nd Part of Poster Presentations

Chair U Behringer UBC Microelectronics Ammerbuch GermanyCo-Chair R Seltmann GLOBALFOUNDRIES Dresden Germany

Poster Wafer Lithography ndash 193i and EUV

P1 Alternative absorber materials for mitigation of mask 3D effects in high NA EUV lithography

FJ Timmermans J Finders J Mcnamara E van Setten ASML Netherlands BV Veldhoven Nether-lands

P2 Advances in multi-layer deposition of EUV mask blanks Current status and roadmap

K Rook S Kohli M Lee B Druz F Cerio A Devasahayam Veeco Plainview NY USA

P3 Revival of grayscale technique in power semi-conductor processing under low-cost manufac-turing constraints

J Schneider D Kaiser N Morgana H Feick Infineon Technologies Dresden GmbH Dresden Germany


Program Overview Poster Session

16 17

P4 Towards Fab Cycle Time Reduction by Machine Learning based Overlay Metrology

F Hasibi1 L van Dijk1 M Larranaga1 A Lam2 Anne Pastol1 R van Haren1

1 ASML Netherlands BV Veldhoven Netherlands 2 STMicroelectronics Crolles Cedex France

Poster ML2 Nano-Imprint Lithography and DSA

P5 Fabrication of nanoparticles for biosensing using UV-NIL and lift-off

T Mitteramskogler1 M Haslinger1 A Shoshi2 H Brueckl2 M Muehlberger1

1 PROFACTOR GmbH Steyr-Gleink Austria 2 Danube University Krems Wiener Neustadt Austria

P6 Dry etching challenges for high-chi block copolymers

P Beacutezard1 X Chevalier2 C Navarro2 C Nicolet2 G Fleury3 I Cayrefourcq2 R Tiron4 M Zelsmann1

1 University Grenoble Alpes Grenoble France 2 ARKEMA Lacq France 3 University of Bordeaux Pessac France 4 CEA-LETI Minatec Campus Grenoble France

Poster Mask Patterning Metrology and Process

P7 Machine learning methods applied to process qualification

M Herrmann S Meuseman C Utzny Advanced Mask Technology Center GmbH amp Co KG Dresden Germany

P8 Deposition Durability of eBeam Mask Repair C Holfeld2 T Goumlhler1 P Nesladek1 T Krome1

1 Advanced Mask Technology Center GmbH amp Co KGDresden Germany

2 GLOBALFOUNDRIES Dresden Module One LLC amp Co KG Dresden Germany

P9 Nikonlsquos Large-Size Photomask Blanks for Production of High Resolution Panels

T Yagami Y Takarada K Hayashi T Ozawa Nikon Corporation Sagamihara Kanagawa Japan

P10 Maximizing Utilization of Large-Scale Mask Data Preparation Clusters

P Gilgenkrantz1 S Kim2 W Han3 M Park2 M Tsao2

1 Mentor Graphics (Ireland) Ltd French Branch St Ismier France

2 Mentor Graphics Corp Fremont California USA 3 Mentor Graphics (Korea) LLC Seongnam-si

Gyeonggi-do Korea

P11 Best Practices Leveling Vibration and for Reducing Reticle Haze in 193nm Reticle Scanner Environments

A Jackson CyberOptics Semiconductor Division Minneapolis MN USA

Poster Non-IC Applications Plasmonics amp Photonics

P12 ElectroHydroDynamic Lithography for complex polymer structures

C Gourgon JH Tortai J Boussey M Panabiegravere S Labau Laboratoire des Technologies de la Micro-eacutelectronique ndash CNRS-UGA-Minatec Grenoble France

P13 Plasmonic Resonances in Metal Covered 2D Hexagonal Gratings Fabricated by Interference Lithography

A A Ushkov M Bichotte I Verrier T Kampe Y Jourlin University Lyon Saint-Etienne France

P14 Electron-Beam Lithography and Two-Photon Polymerization for enhanced nano-channels in network-based biocomputation devices

D Reuter1 S Steenhusen2 C Meinecke3 G Heldt1 M Groszlig2 G Domann2 T Korten4 S E Schulz1

1 Fraunhofer ENAS Chemnitz Germany 2 Fraunhofer ISC Wuumlrzburg Germany 3 Technische Universitaumlt Chemnitz Chemnitz Germany 4 Technische Universitaumlt Dresden Dresden Germany


Poster Session

18 19

Poster Mask2Wafer and Wafer2Wafer Metrology

P15 Limits of model-based CD-SEM metrology J Belissard 1 J Hazart1 S Labbeacute 2 F Triki 2

1 CEA-LETI Grenoble France 2 University Grenoble Alpes Saint Martin drsquoHegraveres

France

P16 Manufacturing of roughness standard samples based on ACFPSD model programming

J Reche12 M Besacier2 P Gergaud1 Y Blancquaert1 1 University Grenoble Alpes CEA-LETI DTSI Grenoble

France 2 University Grenoble Alpes CNRS CEA-LETI Minatec

Grenoble France

Poster Using Big Data Deep Learning

P17 Research on data augmentation for lithography hotspot detection using deep learning

V Borisov J Scheible Robert Bosch Center for Power Electronics Reutlingen University Germany

1845 Street car or walk to the Cable Car Ground Station

The walking distance from MINATEC Conference Center to the Cable Car Ground Station is about 25 minutes

1930-2200 Conference Dinner at the ldquoRestaurant le Teacuteleacutefeacuteriquerdquo on top of the ldquoBastillerdquo (300 m above Grenoble)

after 2200 From Cable Car ground station individual walk or taxi back to your hotel

Wednesday June 20th 2018

0900-1000

Session 6 ndash 3rd Plenary

Chair U Behringer UBC Microelectronics Ammerbuch Germany

0900 Announcements

Uwe Behringer Best Poster EMLC 2018

Jim Wiley Announcement of SPIE Photomask Technology amp EUV Lithography (BACUS) Confe-rence 17-20 Sept Monterey California USA

0905 Silicon Photonics from research to industrial reality (Keynote)

F Bœuf STMicroelectronics Crolles France

0935 Lithography technology and trends for More than Moore devices ndash Advanced Packaging amp MEMS devices (Invited)

A Pizzagalli Yole Deacuteveloppement Lyon France

1000 Best Paper of Photomask Japan 2018 (Invited)Title Development of closed-type EUV pellicle

Yosuke Ono Kazuo Kohmura Atsushi Okubo Daiki Taneichi Hisako Ishikawa Tsuneaki Biyajima Mitsui Chemicals Inc Tokyo Japan


Tuesday June 19th 2018 Wednesday June 20th 2018

Poster Session Program Overview

20 21

1050-1230

Session 7 ndash Mask Patterning Metrology and Process

Chair M Tschinkl AMTC Dresden GermanyCo-Chair K-D Roeth KLA-Tencor MIE Weilburg Germany

1050 Lithographic solution for yield detracting patterning defect signatures caused by Layout and Unit Process Recipe interaction

M Voigt R Gaertner R Seltmann GLOBALFOUNDRIES Dresden Germany

1110 CK-MASK semi-manual tool for mask inspection and blowing

A Leserri U Lessi F Ferrario ST Microelectronics Agrate Italy

1130 The (almost) completely automated 12rdquo-lithography

J Seyfert L Albinus J Arnold S Fritsche S Habel M Mitrach M Stephan Infineon Technologies Dresden GmbH Dresden Germany

1150 Fast local registration measurements for effici-ent e-beam writer qualification and correction

K-D Roeth H Steigerwald R Han O Ache F Laske KLA-Tencor MIE GmbH Weilburg Germany

1210 Failure analysis and prevention of patterning issues using OPC simulation and advanced me-thod of contour analysis

C Beylier F Robert B Vianne STMicroelectronics Crolles France


1340-1500

Session 8 ndash Non-IC Applications Plasmonics amp Photonics

Chair R Tiron CEA-LETI Grenoble FranceCo-Chair T Onanuga Fraunhofer IISB Erlangen Germany

1340 Accurate determination of 3D PSF and resist effects in grayscale laser lithography

T Onanuga123 C Kaspar4 H Sailer4 A Erdmann123

1 Erlangen Graduate School in Advanced Optical Technologies (SAOT) Germany

2 Friedrich-Alexander-Universitaumlt Erlangen-Nuumlrnberg LEB Erlangen Germany

3 Fraunhofer Institute for Integrated Systems and Device Technology Erlangen Germany

4 Institut fuumlr Mikroelektronik Stuttgart (IMS CHIPS) Stuttgart Germany

1400 Photonic IC Lithography Software - Challenges and Solutions

N Uumlnal1 U Hofmann1 J Bolten2 T Wahlbrink2 A-L Giesecke2 M Hornung2 J Bolk3

1 GenISys GmbH Taufkirchen (Munich) Germany 2 AMO GmbH AMICA Aachen Germany 3 Eindhoven University of Technology NanoLabTUe

De Zaale Eindhoven The Netherlands

1420 Curvilinear Data Processing Methods and Verification

C Browning S Postnikov M Milleacutequant S Bayle P Schiavone Aselta Nanographics Grenoble France

1440 A Resist Reflow 3D Compact Model Approach for Imager Microlens Applications

S Beacuterard-Bergery1 J Hazart1 P Queacutemeacutereacute1 C Beylier2 N Allouti1 M Cordeau1 R Eleouet1 F Tomaso1 J-B Henry1 A Ostrovsky2 V Rousset2 V Farys2

1 ) CEA-LETI Minatec Campus Grenoble France 2 STMicroelectronics Crolles France


Wednesday June 20th 2018 Wednesday June 20th 2018

Program Overview

22 23

1525-1645

Session 9 ndash Mask2Wafer and Wafer2Wafer Metrology

Chair J H Peters bmbg consult Radebeul GermanyCo-Chair F Weisbuch GLOBALFOUNDRIES Dresden Germany

1525 Tilted beam SEM a novel approach for industry 3D metrology

C Valade2 J Hazart1 S Beacuterard Bergery1 E Sungauer2 M Besacier3 C Gourgon3

1 University Grenoble Alpes CEA-LETI DTSI Grenoble France

2 STMicroelectronics Crolles France 3 University Grenoble Alpes CNRS CEA-LETI LTM

Grenoble France

1545 On the Road to Automated Production Workflows in the Back End of Line

G Tabbone K Egodage K Schulz A Garetto Carl Zeiss SMT Jena Germany

1605 Measuring inter-layer edge placement error with SEM contour

F Weisbuch J Schatz GLOBALFOUNDRIES Dresden Germany

1625 FEM Simulation of Charging Effect during SEM Methodology

D Duc Nguyen12 J-H Tortai2 M Abaidi1 P Schiavone1

1 ASELTA Nanographics Grenoble France 2 CEA-LETI Grenoble France

1645-1810

Session 10 ndash Using Big Data Deep Learning

Chair B Le Gratiet STMicroelectronics Crolles FranceCo-Chair S A Savari Texas AampM University College Station TX USA

1645 Automatic Defect Classification of SEM images using Deep Learning (Invited)

L Bidault D Mastroeni STMicroelectronics Rousset France

1710 Deep Supervised Learning to Estimate True Rough Line Images from SEM Images

N Chaudhary S A Savari S S Yeddulapalli Texas AampM University College Station TX USA

1730 Microlens under Melt In-Line Monitoring based on application of Neural Network Automatic Defect Classification

J Ducoteacute1 A Lakcher1 L Bidault2 A-R Philipot1 B Le-Gratiet1

1 STMicroelectronics Crolles France 2 STMicroelectronics Rousset France

1750 Machine Learning applications in overlay prediction

A Lam STMicroelectronics Crolles France

1810 Thanks to EMLC2018 participants amp Announcement of EMLC2019

U Behringer UBC Microelectronics Ammerbuch Germany

1815 End of EMCL2018 Conference


Program Overview

24 25

Conference Information

Conference Hours

Monday June 18th 2018 Tutorial 0200 pm to 0600 pmTuesday June 19th 2018 0900 am to 0645 pmWednesday June 20th 2018 0900 am to 0615 pm

Registration Hours


Technical Exhibition

Parallel to the conference presentation ndash on Monday from 0500 to 0600 PM as well as on Tuesday and Wednesday ndash we offer you to take part in the technical exhibition

Monday June 18th 2018 0500 pm to 0600 pmTuesday June 19th 2018 1000 am to 0600 pmWednesday June 20th 2018 1000 am to 0400 pm

If you intend to participate in the technical exhibition as an exhibitor please contact

UBC MicroelectronicsDr Uwe BehringerAuf den Beeten 572119 Ammerbuch Germany

Phone +49 171-4553196Fax +49 7073-50216 e-Mail uwebehringerubct-onlinede

Information for Authors

Your Presentation and CV

The most convenient way for you and the organizers is to provide your slides in the form of MS-Powerpoint format (ppt) on a USB-stick as early as possible but latest during the break before your session You should download and test them on the presentation computer Your Session Chair will surely be glad to assist you You may also use your own laptop compu-ter but experience has shown this to be less reliable

Please send in ndash if not yet done ndash your short CV to the Conference Chairs and to your Session Chair so that he may introduce you appropriately to the audience

Best Poster Award

Members of the EMLC 2018 Program Committee will elect the EMLC 2018 Best Poster

Best Paper Award

All conference attendees will elect the Best Paper of the EMLC 2018 Manuscripts not received until the first day of the confe-rence can not be elected for Best Paper

The Best Paper will be invited to present at BACUS 2018 in San Joseacute CA USA in September 2018 and at PMJ 2019 in Yokohama Japan in April 2019

26 27

General Information

EMLC 2018 Office

For detailed information please contact

VDEVDI-Society Microelectronics Microsystems and Precision Engineering (GMM) Dr Ronald SchnabelStresemannallee 15 60596 Frankfurt am Main Germany



Conference Fees until after(prices are subject to 20 VAT) May 18th 2018 May 18th 2018

Non-Members euro 63000 euro 69000

VDE VDI Members euro 60000 euro 66000

Lecturer euro 49000 euro 57000

Students euro 15000 euro 20000

Participants claiming for the membership fee must attach a copy of their membership card to the registration form

A photocopy of the student card must be attached

The conference fee includes admission to all sessions as well as to the daily coffee-breaks lunches and conference banquet dinner as well as one copy of the CD-ROM-proceedings

Conference Registration

To register for EMLC 2018 please visit the website of the Conference which is wwwemlc-conferencecom

You may either register online or via telefax (would you please download the fax form) To benefit from the ldquoearly-bird- discountrdquo VDE Conference Services must receive the form before May 18 2018

Payment of Conference Fee

Payment for registration including bank charges and proces-sing fees must be made in Euro The conference fee has to be fully paid in advance by credit card Your registration can only be confirmed if VDE-Conference Services has recorded receipt of your full payment

Cancellation

In case of cancellation provided that written notice has been given to VDE-Conference Services before May 18 2018 the registration fee will be fully refunded less a handling fee of EURO 8000 After May 18 2018 no refund will be made Proceedings will then be sent to the registrant after the conference

Conference Venue

Minatec Conference Center Parvis Louis Neacuteel F-38054 Grenoble Cedex 9 France

Transport

In case you arrive by plane

For the conference attendees coming from overseas we re-commend to fly to Paris

- Airport Paris wwwaeroportsdeparisfr

From Airport Paris take the railway TGV Some trains start directly from the airport to Grenoble railway station As others leave from Paris ldquoGare de Lyonrdquo you then would first have to take the RER subway at the Paris airport to ldquoGare de Lyonrdquo station in order to catch the TGV to Grenoble

- Airport Lyon-St Exupeacutery airport wwwlyonaeroportfr

- 1 hour drive by car Taxi costs approx 140 euro Tel +33 (0)687 97 4790

- Airport shuttle bus ldquoOuibusrdquo wwwouibuscom

28 29

If you take the train

- High Speed Train (TGV) Grenoble-Paris 3 hours 7 trains every day (other TGV from Lille Nantes)

- Grenoble Gare SNCF - Tel + 33 (0)8 92 35 35 35 (registration) - wwwsncffr

Hotel Reservation

As to recommendations for hotel bookings please visit the conference homepage wwwemlc-conferencecom and click the website ldquoaccommodationrdquo

Please be sure that you make your reservations in time

All payments related to accommodation have to be made in the hotel before departure

Conference Dinner at the ldquoBastillerdquo (300m above Grenoble) on June 19th 0730 pm ndash 1000 pm

Restaurant Le Teacuteleacuteferique GrenobleTeacutel 0033 4 76 25 72 01 E-Mail contactrestaurant-teleferiquecom

From the hilltop discover the flattest town in France in its mountain setting When the sun sets and the lights go down in the city the view is outstanding

Schedule

0645 pm street car or walk to the Cable Car Ground Station and Cable Car transport to the Conference Dinner

In a few minutes the famous ldquobubblesrdquo of Grenoble take you in the air from the center of the town up to the Bastille fortress

After 1000 pm from Cable Car Ground Station individual walk or taxi back to your hotel

Insurance

The organisers may not be held responsible for any injury to participants or damage theft and loss of personal belongings

Passport and Visa Requirements

Foreign visitors entering France have to present a valid Identity Card or Passport Delegates who need a visa should contact the French consular offices or embassies in their home coun-tries Please note that neither the VDE-Conference Services nor the VDEVDI-Society Micro-electronics Microsystems- and Precision Engineering (GMM) or the supporting bodies are able to extend any bdquoInvitationldquo for application of visa

30 31

Notes Notes

32

The VDEGMM and the members of the EMLC2018 Program Committee of the 34th European Mask and Lithography Conference EMLC 2018 would like to ex-press their sincere appreciation to all the sponsors and coopering partners mentioned below for their support

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2 3

34th European Mask and Lithography Conference EMLC 2018

at the MINATEC Conference Center Grenoble Franceon Monday June 18th to Wednesday June 20th 2018

Welcome to the EMLC 2018 in Grenoble

On behalf of VDEVDI-GMM the EMLC 2018 Sponsors and the EMLC 2018 Organizing Committee we would like to welcome you to the 34th European Mask and Lithography Con-ference EMLC 2018 at the MINATEC Conference Centre in the City of Grenoble France

The conference has annually brought together scientists re-searchers engineers and technologists from research institutes and companies from around the world to present innovations at the forefront of mask lithography and mask technology

The two and a half days conference (starting on Monday June 18th at 0200 PM in the MINATEC Conference Centre with a Tutorial Session (ending at 0500 PM) At 500 PM a short Welcome Reception and the Poster Session will take place till about 600 PM The Poster Session will continue on Tuesday afternoon

The Technical Sessions (including the second part of the Poster Session) of the EMLC2018 Conference starts on Tuesday June 19th from 0900 AM till 0645 PM) and on Wednesday June 20th from 0900 AM till 0615 PMThe EMLC2018 conference is dedicated to the science tech-nology engineering and application of mask and lithography technologies and associated processes giving an overview of the present status in mask and lithography technologies and the future strategy where mask producers and users have the opportunity of becoming acquainted with new developments and results This year the EMLC2018 Program Committee defined the following sessions

ldquoWafer Lithography ndash 193i and EUVrdquo ldquoMask-Less Lithography Nano-Imprint Lithography and Directed Self Assemblyrdquo ldquoMask Patterning Metrology and Processrdquo ldquoNon-IC Applications Plasmonics and Photonicsrdquo ldquoMask2Wafer and Wafer2Wafer Metrologyrdquo and ldquoUsing Big Data Deep Learningrdquo

Of course papers outside these predefined areas of interest were welcome for submission as well

As Welcome Speaker from the City of Grenoble Mme Marie-Joseacute Salat representative of Grenoble-Alpes Meacutetropole will demonstrate the importance of Grenoble as one of the three ldquoHigh Technology Centres in Europerdquo Besides Dresden and LeuvenEindhoven Grenoble Europersquos Smart Valley offers thousands of jobs in computing amp software as well as in Micro-Nanotechnology amp Electronics


TIC

Computing amp Software



Total 15000 jobs


Europersquos Smart Valley

Micro-nanotechnology amp Electronics



Total 25000 jobs


ICT in Grenoble ndash Isere 40 000 jobs


AlbanyUSA

Grenoble France

Dresden Germany

Hsinchu Taiwan

DaejeonKorea Tsukuba

Japan

Leuven EindhovenBelgium Netherlands

One of the Worldrsquos Top Microelectronics Ecosystems

SuzhouChina

4 5
















6 7


Conference Chairs







Program Chairs



Co-Program Chairs



List of Contents


Organizers 9

Program Overview 10






Conference Hours 24






Best Paper Award 25


EMLC 2018 Office 26

Conference Fees 26


Payment 27

Cancellation 27

Conference Venue 27

Transport 27



Insurance 29



8 9


Other Members


























Organizers








10 11
















1705-1800






Conference Chair


Grenoble France

0930-1025











Program Overview

12 13

1050-1210










1320-1520















Dresden Germany



Program Overview

14 15

1545-1740










California USA










1745-1845












16 17























Gyeonggi-do Korea












Poster Session

18 19




France




Grenoble France









0900-1000



0900 Announcements












20 21

1050-1230














1340-1500




















Program Overview

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


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er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

4 5
















6 7


Conference Chairs







Program Chairs



Co-Program Chairs



List of Contents


Organizers 9

Program Overview 10






Conference Hours 24






Best Paper Award 25


EMLC 2018 Office 26

Conference Fees 26


Payment 27

Cancellation 27

Conference Venue 27

Transport 27



Insurance 29



8 9


Other Members


























Organizers








10 11
















1705-1800






Conference Chair


Grenoble France

0930-1025











Program Overview

12 13

1050-1210










1320-1520















Dresden Germany



Program Overview

14 15

1545-1740










California USA










1745-1845












16 17























Gyeonggi-do Korea












Poster Session

18 19




France




Grenoble France









0900-1000



0900 Announcements












20 21

1050-1230














1340-1500




















Program Overview

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

6 7


Conference Chairs







Program Chairs



Co-Program Chairs



List of Contents


Organizers 9

Program Overview 10






Conference Hours 24






Best Paper Award 25


EMLC 2018 Office 26

Conference Fees 26


Payment 27

Cancellation 27

Conference Venue 27

Transport 27



Insurance 29



8 9


Other Members


























Organizers








10 11
















1705-1800






Conference Chair


Grenoble France

0930-1025











Program Overview

12 13

1050-1210










1320-1520















Dresden Germany



Program Overview

14 15

1545-1740










California USA










1745-1845












16 17























Gyeonggi-do Korea












Poster Session

18 19




France




Grenoble France









0900-1000



0900 Announcements












20 21

1050-1230














1340-1500




















Program Overview

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

8 9


Other Members


























Organizers








10 11
















1705-1800






Conference Chair


Grenoble France

0930-1025











Program Overview

12 13

1050-1210










1320-1520















Dresden Germany



Program Overview

14 15

1545-1740










California USA










1745-1845












16 17























Gyeonggi-do Korea












Poster Session

18 19




France




Grenoble France









0900-1000



0900 Announcements












20 21

1050-1230














1340-1500




















Program Overview

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

10 11
















1705-1800






Conference Chair


Grenoble France

0930-1025











Program Overview

12 13

1050-1210










1320-1520















Dresden Germany



Program Overview

14 15

1545-1740










California USA










1745-1845












16 17























Gyeonggi-do Korea












Poster Session

18 19




France




Grenoble France









0900-1000



0900 Announcements












20 21

1050-1230














1340-1500




















Program Overview

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

12 13

1050-1210










1320-1520















Dresden Germany



Program Overview

14 15

1545-1740










California USA










1745-1845












16 17























Gyeonggi-do Korea












Poster Session

18 19




France




Grenoble France









0900-1000



0900 Announcements












20 21

1050-1230














1340-1500




















Program Overview

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

14 15

1545-1740










California USA










1745-1845












16 17























Gyeonggi-do Korea












Poster Session

18 19




France




Grenoble France









0900-1000



0900 Announcements












20 21

1050-1230














1340-1500




















Program Overview

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

16 17























Gyeonggi-do Korea












Poster Session

18 19




France




Grenoble France









0900-1000



0900 Announcements












20 21

1050-1230














1340-1500




















Program Overview

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

18 19




France




Grenoble France









0900-1000



0900 Announcements












20 21

1050-1230














1340-1500




















Program Overview

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

20 21

1050-1230














1340-1500




















Program Overview

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

22 23

1525-1645







Grenoble France








1645-1810
















Program Overview

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

24 25


Conference Hours


Registration Hours












Best Poster Award


Best Paper Award



26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

26 27

General Information

EMLC 2018 Office


















Cancellation


Conference Venue


Transport








28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

28 29




Hotel Reservation







Schedule




Insurance




30 31

Notes Notes

32


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ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

30 31

Notes Notes

32


Cov

er p

ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

32


Cov

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ictu

re C

ourt

esy

of T

oppa

n P

hoto

mas

ks

V8 180605

the 34th european mask and lithography conference emlc...

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