The Center for Advanced Microelectronics Manufacturing

(CAMM)Towards Low-Cost, Mass-Produced Ubiquitous

Electronics Bahgat Sammakia, Mark D. Poliks, Mary Beth Curtin

USDC Flexible Displays and Microelectronics Conference, February, 2007

CAMM Mission

The CAMM will demonstrate the feasibility of roll-to-roll electronics manufacturing by acquiring prototype tools and establishing processes capable of producing low volume test bed products.

Fundamentals

Devices

ProcessEquipment

Novel Packaging

Applications

Sensors & Reliability

Army Flexible Display Center

Center for Advanced Microelectronics Manufacturing

Material & Process Suppliers

• USDC equipment awards - $ 11.5M• New York State

-- “High Tech Commercialization” - $21M with over $4M allocated for CAMM-- New York State Office of Science, Technology and Academic Research (NYSTAR) - $1.7M

• Federal Government -- NASA and DoD: $8M for R2R line infrastructure, prototypes for space and defense applications-- Peer reviewed grants

• Industrial Memberships-- Memberships projected at 8 Full Partners and 12 to 15 Participating Members

• Company specific projects and test-beds

CAMM Revenue Sources

CAMM Organizational Structure

Gerald SonnenfeldBinghamton University Vice President for Research

Bahgat Sammakia -- CAMM Director

Mary Beth CurtinAdmin & Development

Director

M DeGennaroProject

Coordinator

CAMMEconomic Development

Technology Transfer & Licensing

CAMMResearch Funding

DevelopmentTheresa Partell

ECATIEEC Interface

Mark PoliksCAMM Technical

Director

MaterialsCJ Zhong

Howard Wang & Timothy Singler

Tool DevelopmentPaul Wickboldt, Consultant

Sarah LamMohammed Khasawneh

Frank Egitto,EIKim Blackwell, EI

DesignElectrical-Mechanical-Thermal

How Lin, EI

MetrologySurface & interface Science

SB ParkJunghyun Cho

ApplicationsIndustrial Test Vehicles

PrototypesCJ Zhong

Process DevelopmentTool Qualification

Daryl Santos

Wayne JonesEducation & Outreach

Director

Communications & Marketing

Deans of Watson School of Engineering

Harpur CollegeSchool of Management

LaboratoriesL Lehman, Ph.D.

S3IP Laboratory ManagerNew Professional Hire (start 4/15)

Research ScientistChristopher ChaseSenior Technician

P Moschak, EIFacility Manager

Terrence KaneAssociate Director

Economic Development

Cornell UniversityFundamentals

Materials & ProcessesChristopher Ober

Michael ThompsonEmmanuel Giannelis

George Malliaras

New York State Center of Excellence on Small Scale Systems Integration and Packaging Center

at Binghamton University

Expertise resident at the Small Scale Systems Integration and Packaging Center (S3IP), a NYS Center of Excellence. Includes collaborations with the CAMM, the Integrated Electronics Engineering Center (IEEC), a NYS Center of Advanced Technology, the Institute of Materials Research (IMR), and the Center for Advanced Sensors and Environmental Systems (CASE).

Analytical and Diagnostics Laboratory $15M in instrumentation including SEM, TEM, FIB, optical microscopes, metrology tools, mesoscale fabrication, vibrations, and 6” micro fabrication lab.

Facilities will be available to CAMM members and partners

S3IP Analytical and Diagnostics Laboratory Dr. Lawrence Lehman, Lab Manager

FIB

TEMSEM

SEM / AFM & sample prep

X Ray Tools

Mesoscale

Machine Shop

Sample Prep, Metallography

Microscopy, thermal

analysis, laser

vibrometry

S3IP Analytical and Diagnostics Laboratory

EM SuiteSEM: Zeiss Supra 55 VP, Analytical Ultra High Resolution

FESEM, w/ EDAX Pegasus EDS + EBSDSEM: Zeiss EVO50XVP SEMTEM: 200-kV Field Emission Transmission Electron MicroscopeFEI FIB: Dual Beam-SEM/FIB

Surface Analysis LabEllipsometerProfilometer (non contact), Profilometer (Stylus)AFM

X-ray ToolsX-ray Diffraction, Panalytical X'Pert MRD ProX-ray imaging system: Phoenix nanome/x

Real Time X-Ray Analysis System Small Angle Scattering X-ray tool

Thermal Analysis SuiteThermal Analysis Instrument suite;

DSC, TGA, DMA, TMA, Rheometer, TG-MSFlash Thermal Diffuse Tool

Optical / Acoustic Imaging Lab Upright Metallograph: Axioimager M1m Inverted Metallograph: Axiovert microscope Motorized Stereo Microscope w/ 2 cameras: (Stereo Imaging)15 Stereo inspection microscopes: DV4 Stereo Microscope Image processing work stations #1 and #2Heating and Cooling stage

Optical / Acoustic Imaging Lab Micro Particle Imaging VelocimeterUltra-fast Laser Confocal Imaging SystemHigh speed DIC cameraLaser Dopler VibrobrometerCSAM Acoustic Microscope

Miscellaneous equipmentInk Jet Research setupGC-MS

SEM Prep Lab Specimen preparation ion beam tool for SEMDisc Punch, Ultrasonic cutter, Dimple GrinderIon Mill, Plasma CleanerCarbon Evaporator & Metal Sputter coaterTwin Jet Thinner, Wire Saw

Metallographic Prep Lab Automatic PolisherManual PolisherDiamond Saw, 100-4000 RPMLow Speed Diamond Band Saw, 10-500 RPM2 Unmounted specimen polishing systemDiamond Band Saw

Meso-Scale Machining ToolsHardinge HLV LatheLevin Instrument Lathe w/CabinetLevin Microdrilling Machine w/CabinetLevin Micro Drill Press-machine, precision latheHardinge (Bridgeport) CNC/Manual Milling MachineProduction Drill Press 15"ZCorp Spectrum 510+ Rapid Protyping Tool

CAMM Facilities at Endicott Interconnect TechnologiesPeter Moschak, Facility Manager

Panel Microfabrication Laboratory - $1M in tooling- Feature sizes greater than 1 m- Suitable for prototyping and early

development- Initial tool set by May 2007

- Tamarack projection printer- KDF sputter-down system

New CAMM Clean Room- $430K Project- Project completed December, 2006- Ready for Azores tool (first CAMM tool)

delivery in Feb 2007 - and other tools to follow in 2007 and

2008

~ 64,000 square feet per floorLab -- 53,000 sq ft lab & Service Core -- 6500 sq ft

CAMM Facilities at Endicott Interconnect

Clean Room Expansion Completed

Pass through to spray tools Azores tool location (left)

Wall opening for vacuum deposition View toward existing clean room

System SupplierPrecision Lithography Stepper* Azores

Large High Vacuum Coater* CHA

Second High Vacuum Coater In purchase

High Vacuum Coating Services CPI

In-line Defect Inspection* ECD-IV

OLED Evaporation Source* KJL

Cleaning/Wet Process Kraemer Koating

Wet Stripper/DeveloperHöllmüller Siegmund

Precision Wet Coat & Bake Frontier Industrial

Manual Inspection Table TBD

Defined Systems

*USDC supported

Scrub/Rinse

Poly Tank

SSTank

RewindUnwind

Air KnifePoly Tank• Kraemer Koating, 2001

• 6” to 14” width

• Designed for cleaning and/or wet processing

• Recirculation w/ cascading possible

• 0.2 to 10 FPM

• 0.5 PLI to 1.6 PLI

• Tool ready for installation

Cleaning/Wet Processing

• Hollmuller-Siegmund (MacDermid)

• Up to 15” web width

• Designed for develop & strip processing

• Heated tanks: three process and two rinse

• Stripper: all stainless steel (formerly DuPont Riston II S-1100X)

• Developer: all polypropylene (formerly DuPont Riston II D-2000) tool now ready for use

• TMAH/NaOH(aq)

• Air Knife

• New Northfield Automation web handling in place

Wet Stripper/Developer

Azores Corporation

• Based on a proven FPD stepper

• 8” width, can handle up to 24” with new chucks

• g – line (436 nm); 4 m L/S; 230-760 mm/min

• 400 ppm distortion compensation

• Requires hole-punch pattern for pre-alignment

Precision Lithography

Web handlers in test

Time line • July 06: Customer demonstration• Aug 06: Start facilities acceptance tests • Sept 06: Start CAMM staff training at Azores• Oct. 20: FAT started • Jan 07: Complete factory acceptance tests• Mar 07: System arrives at CAMM

• CHA Industries, 2006

• 8’ to 24”web width, ~1000ft of 7mil

• 5 standard PVD stations or flexible configurations, with open bay

• Interleaf capability to be included

• No front surface contact

• ~10-7 Torr vacuum

CHA High Vacuum Coater

Timeline

• Significant delays• CHA re-bid remainder of job• Weekly status review by USDC• Estimated delivery to CAMM: YE07

Second High Vacuum Coater

Timeline: Delivery/Installation 9 months after purchase

HV Coating at CPI

• Potential source of coating services at Centre for Process Innovation, CPI (Wilton, England).

• Bobst Optilab

• Web widths: 20”

• 12 to 250 m

• Roll diameter 16”

• 6” core

• Class 1000 clean room

• Up to four sputter zones:– Single and twin cathodes– Planar and rotatable

• Separate plasma treatment w/cooled drum

ECD-IV Defect Inspection

Timeline: 2Q 2007 -- shipment to CAMM2H 2007 -- ongoing testing program with

ECD support verify performance

• Web scratch identification and defect mapping• Two component system

– web (in-line) inspection “head” – web handling system

• Inspection– Width of 6” (extendable)– Target defect size to detect: (1 to 5) m– Scratch detection algorithm ( 1 x 10 m)– Web location tracking & mapping of defects– Pass/fail sensitivity can be set– minimum defect size: 3 m or less

• Web handling: widths up to 24”– 6” core & roller diameter– 2 to 200 m– Interleaf capable

Frontier Industrial, Towanda, PA

• High precision slot-die coating & bake

• Films down to 0.07 m thickness

• Clean room capability

• Web handling: interleafing and winding

• Contract services by purchase order

Precision Wet Coating & Bake

Start: Outsource

Later: In-House

DynaCoat

Tamarack

• UV projection

• Non-contact projection printer

• NA from 0.07 to 0.14

• 400 x 500 mm expose area

• 2 kW mercury short arc lamp

• > 3000 mW/cm2 BB UV (300-450 nm)

• Filter selectable I, I+H, H+G, G line

• 4 m resolution (NA=0.14)

• Positive & negative resists, 2 to 100 m

• To be delivered May 2007

Scanning Projection Lithography

KDF

• Pallet size 20” x 20” (minimum)

• Single-ended loading

• Dual-level vacuum load lock

• Stainless steel (304) chambers

• Shielded sputter targets (4), DC/RF

— initially Cu (2), Cr, Ti

• Ultimate pressure ≤ 10-7 torr

• Substrate pre-heat

• Plasma etch (Ar or O2) & RIE

• To be delivered June 2007

In-Line Sputter Down, Batch Deposition System

KDF 900 Series

First Year Research Projects

• Photolithography on Flexible Substrates• Roll-to-Roll (R2R) Fabrication of Flexible Sensor

Arrays (FSA) on Polymer Substrates• Materials and Processing for Inkjet Printing

Fabrication of Flexible Electronics• Exploratory Research in Inkjet Printing of Functional

Electronics Materials on Surface Energy-Modified Flexible Substrates

• Adaptive Human-Centered Automation for Control of Advanced Microelectronics Manufacturing Systems

• Wrinkling of the Multi Layered Laminate for Flexible Display During Processing and Thermal Loading

• Oxygen and Moisture Barrier Coatings for Organic Electronics

• NYSTAR / CAMM Supported Research Activities at Cornell University

Photolithography on Flexible SubstratesMark Poliks, Bahgat Sammakia, Daryl Santos

• Three graduate student research assistants: Hao Zhang, Srikanth Poranki and Denisse Yepez.

• Team is working with Azores Corp on the tool acceptance, qualification and training.

• Project established to define the web based photo-lithography process for photoresists, web coating and wet processes needed to create 2 – 10 m features on flexible substrates.

Photolithography on Flexible SubstratesMark Poliks, Bahgat Sammakia, Daryl Santos

• Registration and substrate dimensional stability will be characterized for PET (and PEN, PI) in single and multiple photolithography passes; an analytical model will be developed to characterize the materials and process interactions.

• Team has received additional training at the Web Handling Training course at OSU Web Handling Research Center and at the CNF at Cornell University.

• In 2007 team will develop a process to create a continuous flexible circuit array on PET with variable size test patterns: 2 – 100 m.

• Task Description- Design and R2R fabrication of FSA chips

- Optimization of nanostructured thin films on FSA chips, - Feasibility & characterization of R2R fabrication process. • Deliverables - a method for assembling nanostructured thin films on FSAs

- feasibility for fabricating FSA chips on polymer substrates- feasibility for R2R processing

Roll-to-Roll (R2R) Fabrication of Flexible Sensor Arrays (FSA) on Polymer Substrates

C. J. Zhong, Susan Lu and Jin Luo

Completed the initial design of FSA masks, for both R2R processing and standard microfabrication: ongoing. Tested PET polymer substrate in exposures to different solvents: demonstrated the usability of PET.

Goal by end of 2007: qualification of Azores & wet processing toolsby creation of 10 ft continuous sensor array with micron sized features

This project aims at addressing key materials and processing issues in inkjet printing fabrication of polymeric thin film transistors, and developing printing tools with environmental control and in situ sintering and diagnostic capabilities.

Materials and Processing for Inkjet Printing Fabrication of Flexible Electronics

Howard Wang

• Silver nanoparticle synthesis and characterization• Ink formulation for Dimatix printer• Small angle scattering measurement of regioregular poly(3-alkylthiophene) conformation in solutions

200 nm

SEM: Deposited Ag NPPCB on arbitrary substrate

Exploratory Research in Inkjet Printing of Functional Electronics Materials on Surface Energy-Modified

Flexible Substrates Timothy Singler

• Project will improve deposition methods for delivery of small amounts of functional materials to predefined areas on substrates.

• Goal is to make electronic materials attractive for use with R2R processing. Project will make use of inkjet technology for deposition of these electronic materials.

• Inkjet equipment identified and ordered.

• Collaborations established with -- Endicott Interconnect Technologies (substrate energy modification) and -- Levich Institute at CUNY (theoretical modeling of inkjet printing of colloidal suspensions)

Adaptive Human-Centered Automation for Control of Advanced Microelectronics Manufacturing Systems

Sarah Lam and Mohammed Khasawneh

• Develop a conceptual framework for a computer-based training simulator for the photolithography tool.

• R2R lithography system will be used to test research on intelligent automation. Focus of project is on multiple levels of automation (LOAs) that adapt to the machine operator’s behavioral state.

• Will create a training simulator prototype and structure.

• Completed task analysis, error taxonomy, and software/hardware requirements and structure

Wrinkling of the Multi Layered Laminate for Flexible Display During Processing and Thermal Loading

S.B. Park and Jia Gao

Task Description: The deformation of thin film on flexible substrate under thermal loading. Compressively strained elastic film bonded to substrate can form wrinkles. Compliant substrate technology for flexible display applications requires the films to be flat as formation of wrinkles may dramatically change optical pattern.

• Development of effective finite element model using commercial FEM code for simulating the multi-layered laminate wrinkling as well as the stress analysis (2Q07)

• Development of instrumentation to validate FEM results and identify failure modes. (4Q07)

• Anticipated Results: Establish effective finite element modeling guidelines for predicting the wrinkle formation and growth of various geometries of interest and failure metrics for the composite structure under thermal loading.

• Project awarded in January, 2007.

Oxygen and Moisture Barrier Coatings for Organic Electronics

Junghyun Cho

Project will use self assembled monolayers as a template for the deposition of ceramic barrier coatings on polymer substrates, as well as on OLED. Goal is to provide enabling processes and materials for the barrier coatings on R2R organic devices and structures.

Project awarded in January 2007.Surface Modification

SAM

Surface Group

Bonding Group

Substrate

b a

c

e d

Precursor solution (supersaturated)

Bulk precipitate

Aggregate

Schematic of precipitation processes in supersaturated precursor solution: a) nanocrystals (5-10 nm); b) aggregates (up to 1 m); c) settling of an aggregate; d) uniformly adsorbed nanoparticles at the surface; e) an aggregate formed at the surface.

NYSTAR / CAMM Supported Research Activitiesat Cornell University

Christopher Ober (coordinator), Emmanuel Giannelis, George Malliaras, Michael Thompson

Focused on fundamental research aimed at new processes and materials for flexible electronics. This program is highly complementary and interactive with the Binghamton University and CAMM research programs.

1) Electroluminescence and Photovoltaic Response in Ionic Junctions Made with Soft-Contact Lamination (Malliaras)

2) Laser Transient Annealing of Organic Semiconductors for Flexible Plastic Substrates (Thompson and Malliaras)

3) BaTiO3 Films on Flexible Plastic Substrates via Pulsed Laser Annealing (Giannelis and Thompson)

4) Green Processing for Flexible Electronics using Supercritical CO2

(Ober and Malliaras)

Summary

• Tooling– New CAMM clean room completed.– Azores tool to be delivered in February 2007 and qualification to

begin during 1Q07.– Wet spray process tool equipped with Northfield Automation

handlers. Tool is ready for use.– Tamarack and KDF systems to be delivered by June 2007.– ECD-IV inspection tool to arrive 2Q07.

• Funding– Over $ 30 million in NY State and Federal funds raised in support of

S3IP and CAMM• Research

– Over 11 CAMM funded research projects started since 3Q06• Personnel

– Mr. Peter Moschak named CAMM Facility Manager– Mr. Christopher Chase hired as Senior Technician– Dr. L. Lehman hired as research scientist in S3IP– Second research scientist hired, to start 2Q07

For Further Information

Bahgat Sammakia, DirectorCenter for Advanced

Microelectronics ManufacturingBinghamton University

Binghamton, NY 13902-6000bahgat@binghamton.edu

http://camm.binghamton.edu