bahgat g. sammakia ph binghamton university state ......suny polytechnic institute • december...

3-24-18 Curriculum Vitae

BAHGAT G. SAMMAKIA, PH.D. Binghamton University State University of New YorkResearch Division

PO Box 6000Binghamton, NY13902

Office: 607-777-4818

E-Mail: [email protected]

________________________________________________________________________

EDUCATION:

➢ University of Pennsylvania, Philadelphia, PA Department of Mechanical Engineering and Applied Mechanics,

Post-Doctoral Fellow

1982-1983

➢ University at Buffalo, SUNY, Buffalo, NY Doctor of Philosophy (Ph.D.)

1982

Dissertation: “Transient Natural and Mixed Convection Flows and Transport Adjacent to

an Ice Surface Melting in Saline Water”

➢ University at Buffalo, SUNY, Buffalo, NY Master of Science (M.S.)

1980

Thesis: “A Study of Transient Natural Convection in Air”

➢ Alexandria University, Alexandria, Egypt Bachelor of Science (B.S.), Mechanical Engineering

1977

mailto:[email protected]

Bahgat Sammakia Page 2 3/26/2018

PROFESSIONAL EXPERIENCE

Penn State University 1983-84 Assistant Professor of Mechanical Engineering at the Penn State University at Erie PA, the Behrend College.

IBM CORPORATION, Endicott, NY

1984-1998 Senior Technical Staff Member/Project Manager

Had the responsibility for all research and development for organic packaging in IBM IMD,

Endicott, NY. The organization included six departments, with over 120 scientists, engineers

and technicians and an annual budget totaling over 60 million dollars. The mission of the project

was to research and develop all new organic products (chip carriers, cards and boards, connectors

and new materials) for the IBM Microelectronics division.

SUNY Polytechnic Institute

• December 2016-Present, Interim President of SUNY Polytechnic Institute

Binghamton University, State University of New York, Binghamton, NY September 1998-

December 2016

• October 2012 – Present, Vice President for Research

• July 2010 –October 2012, Interim Vice President for Research

• 2004-2010 Professor of Mechanical and Materials Engineering, State University of New York at Binghamton, 2010

• August 2003-July 200, Interim Vice President for Research, State University of New York at Binghamton

• September 1998-August 2003 Professor of Mechanical Engineering, State University of New York at Binghamton Director of the Integrated Electronics Engineering Center

(IEEC), A New York State Center of Advanced Technology

Awards and Honors:

• 2016 Best Paper Award -- IEEE Transactions on Components, Packaging and Manufacturing Technology – Components Journal (TCPMT): Characterization and

Modeling. "Chip to Facility Ramifications of Containment Solution on IT Airflow

and Uptime," IEEE Transactions on Components, Packaging and Manufacturing

Technology, vol.PP, no.99, pp.1-12, 2016.

• Appointed as a Fellow of the National Academy of Inventors (2016)

• Winner of the Interpack Achievement Award (2015) which is bestowed once every two years at the biannual ASME InterPACK Conference for demonstrated excellence and

international recognition in the area of research and development related to electronic

packaging, as well as service to the technical community at large.

• Elevated to Institute of Electrical and Electronics Engineers (IEEE) Fellow in 2013


• 2012 Significant Contributor Award from Semi-Therm, For contributions furthering the development and validation of thermal simulation and methodologies, advancing the

thermal analysis and control of electronic equipment and promoting an appreciation and

understanding of the importance of thermal management in electronic systems and

assemblies.

• Promoted to Distinguished SUNY Professor in 2011.

• Recognized by the ASME for services in advancing the engineering profession by serving as Program Chair for Interpack 2011.

• 2010 Chancellor’s Award for Excellence in Scholarship and Creative Activities.

• Member of Tau Beta Pi Engineering Honor Society.

• 2010 ITherm (Intersociety (ASME and IEEE) Conference on Thermal and Thermomechanical Phenomena in Electronic Systems) Achievement Award, June 2010.

This award is given once every two years to internationally recognized leaders in the area

of thermal management in electronic systems.

• Best Paper of the Year Award; M. Rayasam, S. Chaparala, D. Farnam, B. G. Sammakia, and G. Subbbarayan, “Thermal Solution Maps: A Strategy for Thermal Design of Three-

Dimensional Packages,” Journal of Electronic Packaging, March 2009, Volume 131,

Issue 1, 011015 (9 pages) DOI:10.1115/1.3077131.

• FlexTech Alliance 2009 “Technology Leadership in Education” Awarded to Bahgat Sammakia, James Sturm (Princeton University), Christopher Ober (Cornell University)

and Mark Poliks (Endicott Interconnect Technologies).

• Outstanding Paper Award; Kanuparthi, S., Subbarayan, G., Sammakia, B., and Siegmund, T. “Microstructural Characteristics Influencing the Effective Thermal

Conductivity of Particulate Thermal Interface Materials”, 11th Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008),

Orlando, FL, May 28-31, 2008.

• Outstanding Researcher Scholar; awarded by the Research Foundation of State University of New York, April 14th 2008.

• Received the 2007 American Society of Mechanical Engineering Division award for the Electronics Packaging and Photonics Division (EPPD) for Excellence in the Area of

Thermal Management of Electronic Systems.

• “Best Paper Award”, EPPD Student Paper Session; Bhopte S., Sammakia B., and Murray B., “Mixing Enhancement of Two-Component Microchannel Flow: Geometric and

Pulsed Flow Effects”, ASME IMECE 2007, Seattle, Washington.

• Outstanding Lecturer, appointed by the IEEE CPMT Division as an outstanding lecturer, 2008.

• Appointed as IEEE CPMT Society Board of Governors, member at large, 2006-07.

• Received the ASME-K16 Committee on Heat Transfer of Electronics and the Electronic and Photonic Packaging Division Clock Award for Outstanding and Continuing

Contributions to the Science and Engineering of Heat Transfer in Electronics, 2004.

• State University of New York Partners in Excellence Award, recognized by the Chancellor for work founding the NY High Technology Commercialization Center in the

area of Small Scale Systems Integration and Packaging, 2004.


• State University of New York Chancellor’s Promising Inventor Award for novel approaches in thermal management-using nano-structured materials and the invention of

thin bilayer coatings for electronics, 2003.

• State University of New York Chancellor’s Award for Outstanding Contributions to Research, 2002.

• Motorola award, “Silver Quill Award,” for joint publication of the Mechanical Engineering Handbook CRCnetBASE, 2001.

• Received IBM stock options, 1997 and 1998 for outstanding management.

• “IBM Blue Chip Award for Top Performers,” 1997.

• Elected as an ASME Fellow, 1997.

• Five IBM awards for publications excellence, 1987 to 1992.

• Seven IBM awards for inventions filed, 1988 to 1996.

• Four IBM awards for invention plateaus reached, 1988 to 1994.

• Formal IBM division award for excellence in technical, people and business management, 1992.

• Two IBM informal awards for excellence in technology development, 1996.

• Post-Doctoral fellowship, University of Pennsylvania; funded by the Samuel Landis Gabel Endowment, 1982 to 1983.

An Overview of Professor Sammakia’ s Research Activities:

Establishment of the Energy Efficient Data Centers (NSF funded)

This NSF IUCRC center is in its 6th year and Binghamton University is the lead institute. Professor

Sammakia is the Founding Director. The focus of the research is on establishing data centers that

are self-sensing and self-regulating and optimized to reduce energy consumption.

http://www.binghamton.edu/es2/

Establishment of the New York State Center of Excellence in Small Scale Systems

Integration and Packaging (S3IP):

Professor Sammakia led a team of faculty and technical staff that worked on establishing

a New York Center for High Technology Commercialization (2004) which was elevated to the

status of New York State’s sixth Center of Excellence (S3IP) in 2007 with Professor Sammakia

as its founding Director.

PUBLICATIONS record (Please note that every effort has been taken to provide an

accurate citation record, however, due to the length of the list, and the fact that parts of the

list have been obtained by accessing Google Scholar, some papers may be missing from the

list, and there is a possibility that some papers may be listed more than once. The citation

formatting may also be inconsistent)

http://www.binghamton.edu/es2/


Refereed Journals

1. Gebhart, B., B. Sammakia. “Transient and Steady State Numerical Solutions in Natural Convection,” Numerical Heat Transfer, Vol. 1, 1978, pages: 529-542.

2. Gebhart, B., Z. Qureshi, and B. Sammakia, “Measurements and Calculations of Transient Natural Convection in Air,” International Journal of Heat and Mass Transfer, Vol. 23,

1979, pages: 571-576.

3. Gebhart, B., B. Sammakia, “Transient Natural Convection Adjacent to a Vertical Flat Surface; The Thermal Capacity Effort,” Numerical Heat Transfer, Vol. 4, 1981, pages:

331-344.

4. Gebhart, B., Z. Qureshi, and B. Sammakia, “Measurements and Calculations of Transient Natural Convection in Water,” Journal of Heat Transfer Transactions of the ASME, Vol.

104, 1982, pages: 644-648.

5. Carey, V.P., B. Gebhart, and B. Sammakia, “Transient Mixed Convection Adjacent to a Vertical Flat Surface,” International Journal of Heat and Mass Transfer, Vol. 25.6, 1982,

pages: 834-845.

6. Gebhart, B., T. Audunson, and B. Sammakia, “Transport Near a Horizontal Ice Surface Melting in Cold Saline Water,” J. Geophysical Research, Vol. 88.C5, 1983, pages: 2935-

2942.

7. Gebhart, B., B. Sammakia, “Transport Near a Vertical Ice Surface Melting in Water of Various Salinity Levels,” International Journal of Heat and Mass Transfer, Vol. 26.10,

1983, pages: 1439-1452.

8. Gebhart, B., B. Sammakia, “Transport Adjacent to Ice Surfaces Melting in Saline Water: Visualization Experiments,” Int. Communications Heat Mass Transfer, Vol.11, 1984,

pages: 25-34.

9. Carey, V.P., B. Gebhart and B. Sammakia, “Measurements and Calculations of Transient Mixed Convection in Air,” International Journal of Heat and Mass Transfer, Vol. 28.10,

1985, pages: 1837-1846.

10. Khalilolahi, A., B. Sammakia, “Unsteady Natural Convection Generated by a Heated Surface within an Enclosure,” Numerical Heat Transfer, Vol. 9, 1986, pages: 715-730.

11. Khalilolahi, A., B. Sammakia, “Transient Natural Convection near a Uniform Flux Surface with Appreciable Thermal Capacity,” International Communications in Heat and

Mass Transfer, Vol.15.3, 1988, pages: 303-313.


12. Homa, T., B. Sammakia, and P. Vadala.,“A Transient Technique to Measure the Temperature Coefficient of Resistance for Thin Film Resistors,” Journal of Electronic

Packaging, Transactions of the ASME, Vol. 111, (1989), pages: 143-148.

13. Khalilolahi, A., B. Sammakia, “The Thermal Capacity Effect upon Transient Natural Convection in a Rectangular Cavity,” Journal of Electronic Packaging, Transactions of

the ASME, Vol. 112.4, (1990), pages: 357-366.

14. Carden, T.F., S.D. Reynolds, and B. Sammakia, “Thermal Enhancements for a Thin Film Chip Carrier,” IEEE Transactions on Components, Hybrids and Manufacturing

Technology, Vol. 15.5, (1992).

15. Ramakrishna, K., G. Subbarayan, and B.G. Sammakia, “Effect of Non-Uniformities and Defects on PTH Strain during Assembly and Accelerated Thermal Cycling,” ASME

Journal of Electronic Packaging, 1997.

16. Sathe, S., B. Sammakia, “Interaction of the System and Module Level Thermal Phenomena: A Flip Chip BGA Example,” Electronics Cooling, Vol. 4.2, (1998), pages:

14-22.

17. Questad, D., S.K. Tran, and B. Sammakia, “Adhesion Issues in Flip Chip on Organic Modules,” IEEE Transactions on Components and Packaging Technology, Vol. 22.4,

(1999), pages: 519-524.

18. Questad, D., S.K. Tran, and B. Sammakia, “Void-Effect Modeling of Flip-Chip Encapsulation on Ceramic Substrate,” IEEE Transactions on Components and Packaging

Technology, Vol. 22.4 (1999): 484-487.

19. Sathe, S., B. Sammakia, “A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package,” Journal of Electronic Packaging, Vol. 122, (2000), pages:

107-114.

20. Sathe, S., B. Sammakia, “A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages,” Journal of Heat Transfer, Transactions of the

ASME, Vol. 120, (1998), pages: 830-839.

21. Constable, J., G. Kendall, C. Sahay, B. Van De Wal, and B. Sammakia, “Acoustic Emission Analysis for Fatigue Prediction of Lap Solder Joints in Mode Two Shear,”

International Journal of Damage Mechanics, (2001), pages: 256-276.

22. Murray, B., S. Watson, and B. Sammakia, “Computational Parameter Study of Chip Scale Package Array Cooling,” IEEE Transactions on Components and Packaging

Technology, Vol. 24.2, (2001), pages: 184-191.

23. Garimella, S.V., Joshi, Y.K., Bar-Cohen, A., Mahajan, R., Toh, K.C., Carey, V.P., Baelmans, M., Lohan, J., Sammakia, B., Andros, F., “Thermal Challenges in next

http://ieeexplore.ieee.org/search/searchresult.jsp?disp=cit&queryText=(garimella%20%20s.%20v.%3cIN%3eau)&valnm=Garimella%2C+S.V.&reqloc%20=others&history=yeshttp://ieeexplore.ieee.org/search/searchresult.jsp?disp=cit&queryText=(%20joshi%20%20y.%20k.%3cIN%3eau)&valnm=+Joshi%2C+Y.K.&reqloc%20=others&history=yeshttp://ieeexplore.ieee.org/search/searchresult.jsp?disp=cit&queryText=(%20bar%20cohen%20%20a.%3cIN%3eau)&valnm=+Bar-Cohen%2C+A.&reqloc%20=others&history=yeshttp://ieeexplore.ieee.org/search/searchresult.jsp?disp=cit&queryText=(%20mahajan%20%20r.%3cIN%3eau)&valnm=+Mahajan%2C+R.&reqloc%20=others&history=yeshttp://ieeexplore.ieee.org/search/searchresult.jsp?disp=cit&queryText=(%20toh%20%20k.%20c.%3cIN%3eau)&valnm=+Toh%2C+K.C.&reqloc%20=others&history=yeshttp://ieeexplore.ieee.org/search/searchresult.jsp?disp=cit&queryText=(%20carey%20%20v.%20p.%3cIN%3eau)&valnm=+Carey%2C+V.P.&reqloc%20=others&history=yeshttp://ieeexplore.ieee.org/search/searchresult.jsp?disp=cit&queryText=(%20baelmans%20%20m.%3cIN%3eau)&valnm=+Baelmans%2C+M.&reqloc%20=others&history=yeshttp://ieeexplore.ieee.org/search/searchresult.jsp?disp=cit&queryText=(%20lohan%20%20j.%3cIN%3eau)&valnm=+Lohan%2C+J.&reqloc%20=others&history=yeshttp://ieeexplore.ieee.org/search/searchresult.jsp?disp=cit&queryText=(%20sammakia%20%20b.%3cIN%3eau)&valnm=+Sammakia%2C+B.&reqloc%20=others&history=yeshttp://ieeexplore.ieee.org/search/searchresult.jsp?disp=cit&queryText=(%20andros%20%20f.%3cIN%3eau)&valnm=+Andros%2C+F.&reqloc%20=others&history=yes


generation electronic systems,” IEEE Transactions on Components and Packaging

Technologies, Vol. 25, Issue 4, December 2002.

24. Ramakrishna, K., A.Shah, K. Srihari, and B. Sammakia, “A Numerical Study of the Thermal Performance of an Impingement Heat Sink-Fin Shape Optimization,” IEEE

Transactions on Components and Packaging Technologies, Vol. 27.4, (2004), pages: 710-

717.

25. Sathe, S., B. Sammakia, “An Analytical Study of the Optimized Performance of an Impingement Heat Sink,” Journal of Electronic Packaging, Transactions of the ASME,

(2004), pages: 528-534.

26. Chaparala, S., C., G. Griffin, J. Jackson, T. McHugh, J. Pitarresi, B. Roggeman, B. Sammakia, “Effect of Geometry and Temperature Cycle on the Reliability of WLCSP

Solder Joints,” IEEE Transactions on Components and Packaging Technologies, Vol.

28.8, (2005), pages: 441-448.

27. Ackler, H. D., P. Arunasalam, and B. Sammakia, “Microfabrication of Ultra-High Density Wafer-Level Thin Film Compliant Interconnects for Thru-Silicon-Via Based

Chip Stacks,” Journal of Vacuum Science and Technology-Part B, Vol. 24.4, (2006).

28. Desai, A., J. Geer and B. Sammakia, “Models of Steady Heat Conduction in Multiple Cylindrical Domains,” Journal of Electronic Packaging, Vol. 128, (2006), pages: 10-17.

29. Desai, A., J. Geer, W. Jones, S. Mahajan, G. Subbarayan, and B. Sammakia, “A Numerical Study of Transport in a Thermal Interface Material Enhanced with Carbon

Nanotubes,” Journal of Electronic Packaging, Vol. 128, (2006), pages: 92-97.

30. Tonapi, S., S. Sathe, and K. Srihari, B. Sammakia, “A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array

Packages,” ASME Journal of Electronic Packaging, Vol. 128, (2006), pages: 305-310.

31. Shah, A., K. Ramakrishna, K. Srihari, and B. Sammakia, “Optimization Study for a Parallel Plate Impingement Heat Sink,” ASME Journal of Electronic Packaging, Vol.

128, (2006), pages: 311-318.

32. Bhopte, S., D. Agonafer, R. Schmidt, and B. Sammakia. “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,” ASME Journal of Electronic

Packaging, Vol. 128, (2006), pages: 380-387.

33. Park, SB., H.C. Lee and B. Sammakia, “Predictive Model for Optimized Parameters in Flip-Chip Packages and Assemblies”, IEEE Transactions on Components and Packaging

Technologies, Vol. 30, No. 2, June 2007, pages: 294-301.

34. Shrivastava, S.K., and B. Sammakia, “Thermal Management of Biomaterials in a Rectangular Cavity Surrounded by a Phase Change Material”, IEEE Transactions on

Advanced Packaging, Vol. 30, No. 4, November 2007, pages: 741-752 .


35. Mahajan, S.S., G. Subbarayan, and B. Sammakia, "Estimating Thermal Conductivity of Amorphous Silica Nanoparticles and Nanowires using Molecular Dynamics

Simulations,” Physical Review E 76, 056701, (2007).

36. Geer, J., A. Desai and B. Sammakia, “Heat Conduction in Multilayered Rectangular Domains,” ASME Journal of Electronic Packaging, Vol. 129, (2007), pages: 440-451.

37. Kanuparthi, S., Ganesh Subbarayan, B. Sammakia, and Thomas Sigmund, “An Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate

Interface Materials,” IEEE Transactions on Components and Packaging Technologies,

Vol. 31, No. 3, (2008), pages: 611-621.

38. Garimella, S.V., A.S. Fleischer, J.Y. Murthi, A. Keshavarzi, R. Prasher, C. Patel, S. H. Bhavnani, R. Venkatasubramanian, R. Mahajan, Y. Joshi, B. Sammakia, B.A. Myers, L.

Chorosinski, M. Baelmans, P. Sathyamurthyand P. E Raad, “Thermal Challenges in Next

Generation Electronic Systems,” IEEE Transactions on Components and Packaging

Technologies, Vol. 31, No.4, December (2008).

39. Bergman, T.L., A. Faghri, and R. Viskanta, “Frontiers in Transport Phenomena Research and Education: Energy Systems, Biological Systems, Security, Information Technology

and Nanotechnology,” Summary article of NSF sponsored workshop, B. Sammakia

chaired the Information Technology session and co-wrote the summary, International

Journal of Heat and Mass Transfer (IJHMT), Vol. 51, (2008), pages: 4599–4613.

40. Kanuparthi, S., M. Rayasam, G. Subbarayan, B. Sammakia, A. Gowda, S. Tonapi, “Hierarchical Field Compositions for Simulations of Near-percolation Thermal Transport

in Particulate Materials,” Comput. Methods Appl. Mech. Engrg. Vol. 198, (2009), pages:

657–668. journal homepage: www.elsevier.com/locate/cma

41. Farnam, D.S., Sammakia, B., Ackler, H., & Ghose, K., “Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint,” Heat Transfer

Engineering, Vol. 30, No. 1-2, February 2009, pages: 43-53.

42. Rayasam, M., S. Chaparala, D. Farnam, B. Sammakia, and G. Subbbarayan, “Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages,” Journal

of Electronic Packaging, March 2009, Vol. 131, Iss. 1, 011015 (9 pages)

DOI:10.1115/1.3077131.

43. Shrivastava, S., M. Iyengar, B. Sammakia, R. Schmidt and J. Van Gilder, “Experimental-Numerical Comparison for a High Density Data Center: Hot Spot Heat Fluxes in Excess

of 500 W/ft2”, IEEE Transactions on Components and Packaging Technologies, Vol. 32,

No.1, March 2009.

44. Kanuparthi, S., G. Subbarayan, T, Siegmund and B. Sammakia, “The Effect Of Polydispersivity On The Thermal Conductivity Of Particulate Thermal Interface

http://www.elsevier.com/locate/cmahttp://scitation.aip.org/vsearch/servlet/VerityServlet?KEY=ASMEDL&possible1=Rayasam%2C+M.&possible1zone=author&maxdisp=25&smode=strresults&pjournals=AMREAD%2CJAMCAV%2CJBENDY%2CJCNDDM%2CJCISB6%2CJDSMAA%2CJEPAE4%2CJERTD2%2CJETPEZ%2CJEMTA8%2CJFEGA4%2CJFCSAU%2CJHTRAO%2CJMSEFK%2CJMDEDB%2CJMDOA4%2CJMOEEX%2CJPVTAS%2CJSEEDO%2CJOTRE9%2CJOTUEI%2CJVACEK&aqs=truehttp://scitation.aip.org/vsearch/servlet/VerityServlet?KEY=ASMEDL&possible1=Chaparala%2C+S.&possible1zone=author&maxdisp=25&smode=strresults&pjournals=AMREAD%2CJAMCAV%2CJBENDY%2CJCNDDM%2CJCISB6%2CJDSMAA%2CJEPAE4%2CJERTD2%2CJETPEZ%2CJEMTA8%2CJFEGA4%2CJFCSAU%2CJHTRAO%2CJMSEFK%2CJMDEDB%2CJMDOA4%2CJMOEEX%2CJPVTAS%2CJSEEDO%2CJOTRE9%2CJOTUEI%2CJVACEK&aqs=truehttp://scitation.aip.org/vsearch/servlet/VerityServlet?KEY=ASMEDL&possible1=Farnam%2C+D.&possible1zone=author&maxdisp=25&smode=strresults&pjournals=AMREAD%2CJAMCAV%2CJBENDY%2CJCNDDM%2CJCISB6%2CJDSMAA%2CJEPAE4%2CJERTD2%2CJETPEZ%2CJEMTA8%2CJFEGA4%2CJFCSAU%2CJHTRAO%2CJMSEFK%2CJMDEDB%2CJMDOA4%2CJMOEEX%2CJPVTAS%2CJSEEDO%2CJOTRE9%2CJOTUEI%2CJVACEK&aqs=truehttp://scitation.aip.org/vsearch/servlet/VerityServlet?KEY=ASMEDL&possible1=Sammakia%2C+B.+G.&possible1zone=author&maxdisp=25&smode=strresults&pjournals=AMREAD%2CJAMCAV%2CJBENDY%2CJCNDDM%2CJCISB6%2CJDSMAA%2CJEPAE4%2CJERTD2%2CJETPEZ%2CJEMTA8%2CJFEGA4%2CJFCSAU%2CJHTRAO%2CJMSEFK%2CJMDEDB%2CJMDOA4%2CJMOEEX%2CJPVTAS%2CJSEEDO%2CJOTRE9%2CJOTUEI%2CJVACEK&aqs=true


Materials,” IEEE Transactions on Components and Packaging Technologies, Vol. 32,

No.2, June (2009).

45. Wang, L., Jin Luo , Jun Yin, Hao Zhang, Jinhui Wu , Xiajing Shi, Elizabeth Crew , Zhe Xu, Qiang Rendeng , Susan Lu , Mark Poliks , Bahgat Sammakia and Chuan-Jian

Zhong,“Flexible Chemiresistor Sensors: Thin Film Assemblies of Nanoparticles on a

Polyethylene Terephthalate Substrate,” Article citation: Lingyan Wang, J. Mater. Chem.,

2010, DOI: 10.1039/b920957c, (2009).

46. Davidson, D., B. Sammakia, “Squeezing Flow of a Power Law Fluid Between Grooved Plates,” Journal of Electronic Packaging, Transactions of the ASME, Vol. 131, Iss. 3,

DOI: 10.1115/1.3144158, March (2009).

47. Zhou, F., B. Murray, and B. Sammakia, “Modeling Heat Transport in Thermal Interface Materials Enhanced with MEMS Based Microconnects”, IEEE Transactions on

Components and Packaging Technologies, Vol. 33, No. 1, March (2010).

48. Farnam, D., B. Sammakia, and K. Ghose, “Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink,” ASME Journal of Thermal

Science and Engineering Applications, Vol.2, Iss.4, (2011).

49. Alzoubi, K., S.Lu, and B.Sammakia, “Experimental and Analytical Studies on the High Cycle Fatigue Of Thin Film Metal on PET Substrate for Flexible Electronics

Applications,” IEEE Transactions on Components and Packaging Technologies, Vol. 1,

No. 1, January (2011).

50. Alzoubi, K., S. Lu, B. Sammakia and M. Poliks, “Factor Effect Study For The High Cycle Bending Fatigue On PET Substrate For Flexible Displays Applications,” IEEE

Journal of Display Technology, Vol. 7, No. 6, June (2011).

51. Pisipati, S., J. Geer, B. Sammakia, and B. Murray, “A Novel Alternate Approach For Multiscale Thermal Transport Using Diffusion In The Boltzmann Transport Equation,”

International Journal for Heat and Mass Transfer, IJHMT, Received 7 October 2010;

revised 5 March 2011; accepted 5 March 2011. Available online 18 April (2011).

http://dx.doi.org/10.1016/j.ijheatmasstransfer.2011.03.046

52. Mahajan, S., G. Subbarayan, and B. Sammakia, “Estimating Kapitza Resistance Between Si-Sio2 Interface Using Molecular Dynamics Simulations,” IEEE Transactions on

Components and Packaging Technologies, Vol. 1, No. 8, August (2011).

http://dx.doi.org/10.1016/j.ijheatmasstransfer.2011.03.046


53. Venkatadri, V., B. Sammakia, K. Srihari and D. Santos, “A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems,”

Journal of Electronic Packaging, Transactions of the ASME, December (2011), Vol. 133

/ 041011-1.

54. Alzoubi, K., M. Hamasha, S. Lu, and B. Sammakia, “Bending Fatigue Study of Sputtered ITO on Flexible Substrate,” IEEE Journal of Display Technology, Vol. 7, No. 11,

November (2011).

55. MA Omole, VA Okello, V Lee, L Zhou, OA Sadik, C Umbach, B Sammakia, “Catalytic Reduction of Hexavalent Chromium Using Flexible Nanostructured Poly (amic acids)”,

ACS Catalysis, Volume 1, pages 139-146, (2011).

56. S Bhopte, B Sammakia, M Iyengar, R Schmidt, “Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance”, Journal of Electronic

Packaging, page 133, 011007, (2011).

57. S Pisipati, J Geer, B Sammakia, B. Murray, “A Novel Alternate Approach For Multiscale Thermal Transport Using Diffusion In The Boltzmann Transport Equation”, International

Journal of Heat and Mass Transfer, (2011).

58. K Alzoubi, S Lu, B Sammakia, and M Poliks, “Factor Effect Study for the High Cyclic

Bending Fatigue of Thin Films on PET Substrate for Flexible Displays Applications”,

Journal of Display Technology, Volume 7 (6), pages 348-355, (2011).

59. H Zhang, MD Poliks, B Sammakia, S Garner, J Miller, and J Lyon, “Micron-Sized

Feature Overlay Alignment on Large Flexible Substrates for Electronic and Display

Systems”, Journal of Display Technology, Volume 7 (6), pages 330-338, (2011).

60. K Alzoubi, MM Hamasha, S Lu, B Sammakia, “Bending Fatigue Study of Sputtered ITO on Flexible Substrate”, Display Technology, Journal of , Volume 7 (11), pages 593-600,

(2011).

61. V Venkatadri, B Sammakia, K Srihari, D Santos, “A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems”,

Journal of Electronic Packaging, Page 133, Volume 041011, (2011).

62. B Dan, JF Geer, BG Sammakia, “Heat Conduction in a Rectangular Tube With Eccentric Hot Spots”, Journal of Thermal Science and Engineering Applications, Volume 3,

041002, (2011).

http://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:VaXvl8Fpj5cChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:VaXvl8Fpj5cChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:hkOj_22Ku90Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:hkOj_22Ku90Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:p__nRnzSRKYChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:p__nRnzSRKYChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:EUQCXRtRnyEChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:EUQCXRtRnyEChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:VLnqNzywnoUChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:VLnqNzywnoUChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:VLnqNzywnoUChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:NhqRSupF_l8Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:NhqRSupF_l8Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:738O_yMBCRsChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:738O_yMBCRsChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:7T2F9Uy0os0Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:7T2F9Uy0os0C


63. M. Ibrahim, S. Bhopte, B. Sammakia, B. Murray, M. Iyengar and R. Schmidt, “Effect of Transient Boundary Conditions and Detailed Thermal Modeling of Data Center Rooms,”

IEEE Transactions on Components and Packaging Technologies, Volume 2, No. 2,

February (2012).

64. S. Madduri, B.G. Sammakia, W. Infantolino, S.C. Chaparala, LC Hughes, JM Harris, “Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture

Condensing Environment”, Journal Of Electronic Packaging, page 134 (1), (2012).

65. S. Madduri, W. Infantolino, and B.G. Sammakia, “An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages”,

Journal Of Electronic Packaging, page 134 (1), (2012).

66. L.Y. Zheng, D.S. Farnam, D. Homentcovschi, B.G. Sammakia, “A Porous Elastic Model for Bacterial Biofilms: Application To The Simulation Of Deformation Of Bacterial

Biofilms Under Microfluidic Jet Impingement”, Journal Of Biomechanical Engineering,

page 134 (5), 051003, (2012).

67. A. Tambat, H.Y. Lin, G. Subbarayan, D.Y. Jung, and B. G. Sammakia, “Simulations of Damage, Crack Initiation, and Propagation in Interlayer Dielectric Structures:

Understanding Assembly-Induced Fracture in Dies”, Device and Materials Reliability,

IEEE Transactions on Volume 12 (2), pages 241-254, (2012)

68. K. Alzoubi, M.M. Hamasha, L. Wang, H. Zhang, J. Yin, J. Luo, S. Lu, B. G. Sammakia, “Stability of Interdigitated Microelectrodes of Flexible Chemiresistor Sensors”, Display

Technology, Journal of , IEEE Transactions Volume 8 (7), pages 377-384, (2012).

69. X. Xu, M. Meyers, B.G. Sammakia, B. Murray and C. Chen, “Performance And Reliability Analysis Of Hybrid Concentrating Photovoltaic Thermal Collectors With Tree

Shaped Channel Nets Cooling System”, IEEE Transactions on Components and

Packaging Technologies, Volume 3, No. 6, June (2013).

70. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "Airflow and temperature distribution optimization in data centers using artificial neural networks." International

Journal of Heat and Mass Transfer 64 (2013): 80-90

71. Zheng, Leo Y., Robert B. Congdon, Omowunmi A. Sadik, Cláudia NH Marques, David G. Davies, Bahgat G. Sammakia, Leann M. Lesperance, and James N. Turner.

"Electrochemical Measurements of Biofilm Development Using Polypyrrole Enhanced

Flexible Sensors." Sensors and Actuators B: Chemical (2013).

http://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:ye4kPcJQO24Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:ye4kPcJQO24Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:TIZ-Mc8IlK0Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:TIZ-Mc8IlK0Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:BrmTIyaxlBUChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:BrmTIyaxlBUChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:BrmTIyaxlBUChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:XiVPGOgt02cChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:XiVPGOgt02cChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:XiVPGOgt02cChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:9vf0nzSNQJEC


72. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "A dynamic compact thermal model for data center analysis and control using the zonal method and artificial neural

networks." Applied Thermal Engineering 62, no. 1 (2014): 48-57.

73. Pisipati, Subbalakshmi, Cheng Chen, James Geer, Bahgat Sammakia, and Bruce T. Murray. "Multiscale thermal device modeling using diffusion in the Boltzmann Transport

Equation." International Journal of Heat and Mass Transfer 64 (2013): 286-303.

74. Xu, Xinqiang, Mark M. Meyers, Bahgat G. Sammakia, and Bruce T. Murray. "Thermal Modeling and Life Prediction of Water-Cooled Hybrid Concentrating

Photovoltaic/Thermal Collectors." Journal of solar energy engineering 135, no. 1 (2013).

75. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "Numerical investigation of inter-zonal boundary conditions for data center thermal analysis." International Journal

of Heat and Mass Transfer 68 (2014): 649-658.

76. Zhou, Siyi, Bahgat G. Sammakia, Bruce White, and Peter Borgesen. "Multiscale modeling of thermoelectric generators for the optimized conversion

performance." International Journal of Heat and Mass Transfer 62 (2013): 435-444.

77. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "A Compact Thermal Model for Data Center Analysis using the Zonal Method." Numerical Heat Transfer, Part A:

Applications 64, no. 5 (2013): 361-377.

78. Alzoubi, Khalid, Gihoon Choi, Mohammad M. Hamasha, Atif S. Alkhazali, John DeFranco, Susan Lu, Bahgat Sammakia, and Charles Westgate. "Comparisons of the

Mechanical Behaviors of Poly (3, 4-ethylenedioxythiophene)(PEDOT) and ITO on

Flexible Substrates." In MRS Proceedings, vol. 1493, pp. mrsf12-1493. Cambridge

University Press, 2013.

79. Batayneh, Wafa, Hala Khalaf, and Bahgat G. Sammakia. "Neural Network Modeling of Parallel-Plain Fin Heat Sink." International Journal of Applied Science and Technology,

no. 3 (2013).

80. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "Numerical investigation of inter-zonal boundary conditions for data center thermal analysis." International Journal

of Heat and Mass Transfer 68 (2014): 649-658.

81. Congdon, Robert B., Alexander S. Feldberg, Natalie Ben-Yakar, Dennis McGee, Christopher Ober, Bahgat Sammakia, and Omowunmi A. Sadik. "Early detection of

Candida albicans biofilms at porous electrodes." Analytical biochemistry 433, no. 2

(2013): 192-201.

82. Zheng, Leo Y., Robert B. Congdon, Omowunmi A. Sadik, Cláudia NH Marques, David G. Davies, Bahgat G. Sammakia, Leann M. Lesperance, and James N. Turner.

"Electrochemical measurements of biofilm development using polypyrrole enhanced

flexible sensors." Sensors and Actuators B: Chemical182 (2013): 725-732.


83. Gao, Tianyi, James Geer, and Bahgat Sammakia. "Nonuniform temperature boundary condition effects on data center cross flow heat exchanger dynamic

performance." International Journal of Heat and Mass Transfer 79 (2014): 1048-1058.

84. Chen, Cheng, James Geer, and Bahgat Sammakia. "Sub-continuum thermal transport modeling using diffusion in the Lattice Boltzmann Transport Equation."International

Journal of Heat and Mass Transfer 79 (2014): 666-675.

85. Gao, Tianyi, Bruce Murray, and Bahgat Sammakia. "Analysis of Transient and Hysteresis Behavior of Cross-flow Heat Exchangers under Variable Fluid Mass Flow

Rate for Data Center Cooling Applications." Applied Thermal Engineering(2015).

86. Gao, Tianyi, Milnes David, James Geer, Roger Schmidt, and Bahgat Sammakia. "Experimental and numerical dynamic investigation of an energy efficient liquid cooled

chiller-less data center test facility." Energy and Buildings91 (2015): 83-96.

87. Gao, Tianyi, Bahgat Sammakia, and James Geer. "Dynamic response and control analysis of cross flow heat exchangers under variable temperature and flow rate

conditions." International Journal of Heat and Mass Transfer 81 (2015): 542-553.

88. Zhou, S., Sammakia, B. G., White, B., Borgesen, P., & Chen, C. (2015). Multiscale modeling of Thermoelectric Generators for conversion performance enhancement. International Journal of Heat and Mass Transfer,81, 639-645.

89. Gao, T., Geer, J., & Sammakia, B. (2015). Development and verification of compact transient heat exchanger models using transient effectiveness methodologies. International Journal of Heat and Mass Transfer, 87, 265-278.

90. Gao, T., Sammakia, B., Samadiani, E., & Schmidt, R. (2015). Steady State and

Transient Experimentally Validated Analysis of Hybrid Data Centers.Journal of Electronic Packaging, 137(2), 021007.

91. Ranade, A. P., Jung, D. Y., Sammakia, B. G., Eilertsen, T., & Davis, T. (2016). Optimization study of Supercapacitor electrode material composition and thickness for enhanced performance of the Supercapacitor. une, 13, 15.

92. Gao, T., Geer, J., & Sammakia, B. (2015). Review and Analysis of Cross Flow Heat Exchanger Transient Modeling for Flow Rate and Temperature Variations. Journal of Thermal Science and Engineering Applications, 7(4), 041017.


93. Alkharabsheh, S. A., Sammakia, B. G., & Shrivastava, S. K. (2015). Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment. Journal of Electronic Packaging,137(2), 021010.

94. Alkharabsheh, S., Fernandes, J., Gebrehiwot, B., Agonafer, D., Ghose, K., Ortega, A., ... & Sammakia, B. (2015). A Brief Overview of Recent Developments in Thermal Management in Data Centers. Journal of Electronic Packaging, 137(4), 040801.

95. Alissa, Husam A., Kourosh Nemati, Udaya LN Puvvadi, Bahgat G. Sammakia, Ken Schneebeli, Mark Seymour, and Tom Gregory. "Analysis of airflow imbalances in an open compute high density storage data center."Applied Thermal Engineering 108 (2016): 937-950

96. Alissa, Husam A., Kourosh Nemati, Bahgat G. Sammakia, Ken Schneebeli, Roger R. Schmidt, and Mark J. Seymour. "Chip to Facility Ramifications of Containment Solution on IT Airflow and Uptime." IEEE Transactions on Components, Packaging and Manufacturing Technology 6, no. 1 (2016): 67-78.

97. Upreti, Kritika, Hung-Yun Lin, Ganesh Subbarayan, Dae Young Jung, and Bahgat G. Sammakia. "An Assessment of Risk of Fracture During Wirebond Over Active Circuits

on ULK Dies." IEEE Transactions on Components, Packaging and Manufacturing

Technology 6, no. 2 (2016): 314-325.

98. Alissa, Husam A., Kourosh Nemati, Bahgat G. Sammakia, Mark J. Seymour, Russell Tipton, David Mendo, Dustin W. Demetriou, and Ken Schneebeli. "Chip to Chiller Experimental Cooling Failure Analysis of Data Centers: The Interaction Between IT and Facility." IEEE Transactions on Components, Packaging and Manufacturing Technology 6, no. 9 (2016): 1361-1378.

99. Nemati, Kourosh, Husam A. Alissa, Bruce T. Murray, Bahgat G. Sammakia, Russell Tipton, and Mark J. Seymour. "Comprehensive Experimental and Computational

Analysis of a Fully Contained Hybrid Server Cabinet." Journal of Heat Transfer 139, no.

8 (2017): 082101.

100. Nemati, Kourosh, Husam A. Alissa, Bruce T. Murray, Ken Schneebeli, and Bahgat Sammakia. "Experimental Failure Analysis of a Rear Door Heat Exchanger With Localized Containment." IEEE Transactions on Components, Packaging and Manufacturing Technology 7, no. 6 (2017): 882-892.

101. Khalili, Sadegh, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, and Bahgat Sammakia. "Impact of Tile Design on the Thermal Performance of Open and

Enclosed Aisles." Journal of Electronic Packaging 140, no. 1 (2018): 010907.


Books

1. Gebhart, B., Y. Jaluria, R. Mahajan and B. Sammakia, Buoyancy Induced Flows and Transport. Washington, DC: Hemisphere Pub. Corporation, 1988 (Translated to Russian

in 1991.) Print.

2. Joshi, Yogendra, Pramod Kumar, B. Sammakia, and M. Patterson. Energy Efficient Thermal Management of Data Centers. New York: Springer, 2012.

3. Iyengar, M., Geisler, K.J.L., and Sammakia, B., “Cooling of Microelectronic and Nanoelectronic Equipment, Advances and Emerging Research”, World Scientific,

WSPCSeries in Advanced Integration and Packaging, Vol. 3, 2014

Book Chapters and edited books

1. Seraphim, D., R. Lasky, Li, C., “Thermal Enhancement,” Principles of Electronic Packaging, New York: McGraw-Hill, 1989, (Co-authored chapter on thermal

management.)

2. Sammakia, B., K. Ramakrishna, “Thermal Management in Electronic Packaging and Systems.” Mechanical Engineering Handbook CRCnetBASE. Boca Raton, FL: CRC

Press, 2001. Frank Kreith (Editor) .

3. Puttlitz, K. and Paul Totta, eds., “Thermal Management,” Area Array Interconnection Handbook, Boston: Kluwer Academic Publishers, 2001. , (Co-

authored chapter on thermal management.)

4. Andros, F.E., B. Sammakia, “Integrated Circuit Packaging,” Encyclopedia of Physical Science and Technology, 3rd ed. Vol. 7, San Diego, CA: Academic Press, 2001. Print.

5. B Sammakia, S Bhopte, M Ibrahim, “Numerical Modeling of Data Center Clusters”,

Energy Efficient Thermal Management of Data Centers, page 335, (2012)

6. Sammakia, B. (Ed.). (2015). Encyclopedia of Thermal Packaging: Thermal Packaging Tools/Ed.-in-chief Avram Bar-Cohen. Energy Optimization and Thermal Management of Data Centers. World Scientific.

7. Sammakia, B., Joshi, Y., Agonafer, D., Samadiani, E., & Bar-Cohen, A. (2015). Containment. In ENCYCLOPEDIA OF THERMAL PACKAGING: Thermal Packaging Tools (pp. 155-196).

Refereed Conference Proceedings (Please note that every effort has been taken to provide an accurate citation record, however, due to the length of the list, and the fact that parts of the list have been obtained by

accessing Google Scholar, some papers may be missing from the list, and there is a possibility that some papers may

be listed more than once. The citation formatting may also be inconsistent)

http://www.wkap.nl/http://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:ZuybSZzF8UAC


1. Gebhart, B., B.G. Sammakia, and T. Audunson, eds., “Transport Near a Horizontal Ice Surface Melting in Cold Saline Water”, International Journal of Heat and Mass

Transfer, 26 (10), pp. 1439-1452. Hamburg, Germany: Federal Republic of Germany,

1983.

2. Sammakia, B.G., “Unsteady Mixed Convection in Air, a Numerical and Experimental Study,” Proceedings of the ASME Winter Annual Meeting, New Orleans, LA, 1984,

pages: 43-45.

3. Sammakia, B.G., “Modeling of Arctic Sea Ice Formation and Dissipation,” Proceedings at an ASME Conference, Arctic and Offshore Mechanics Symposium, New Orleans, LA,

1984.

4. Khalilolahi, A., M. H. Hamza, and B.G. Sammakia, eds. ”Transient Natural Convection Generated by a Hot Vertical Surface within an Enclosure,” Proceedings IASTED

International Conference, Applied identification modeling and simulation, AIMS 84,

ISBN0-88986-070-X, 1984, pages: 141-145.

5. Biber, C. and B.G. Sammakia, eds. “Transport from Discretely Heated Components in a Turbulent Channel Flow,” Proceedings at the ASME Winter Annual Meeting; Anaheim,

CA, 86-WA/HT-68, 1986.

6. Homa, T., B. G. Sammakia, and P. Vadala, eds. “A Transient Technique to Measure the Thermal Coefficient of Resistance for Thin Films,” ASME Winter Annual Meeting;

Boston, MA. 87-WA/EEP-4, 1987.

7. Coleman, M., B. G. Sammakia, and D. Agonafer, “Unsteady Buoyancy Induced Flow in an Enclosure,” ASME Winter Annual Meeting; Boston, MA, 87-WA/EEP-10, 1987.

8. Khalilolahi, A. and B. G. Sammakia, eds. “Transient Mixed Convection In Air Adjacent To Discrete Uniform Flux Heat Sources,” Proceedings of the ASME Symposium on

Numerical Simulation of Convection in Electronic Equipment Cooling; HTD-Vol. 121,

San Francisco, CA, 1989.

9. Khalilolahi, A., and B. G. Sammakia, eds. “Transient Convection Adjacent to Discrete Components in the Presence of a Weak Opposing Pressure Field,” Proceedings of the

ASME Winter Annual Meeting; Dallas, TX, 1990.

10. Subbarayan, G., K. Ramakrishna, B. G. Sammakia and P.C. Chen, eds. “Mechanical Integrity of VIAS in a Thin-Film Package during Manufacturing, Assembly and Stress

Test,” Proceedings of IEEE Electronic Components and Technology Conference

(ECTC); Orlando, FL, 1993.

11. Subbarayan, G., K. Ramakrishna and B.G. Sammakia, “The Impact of Interfacial Adhesion on PTH and VIA Reliability,” Application of Fracture Mechanics in Electronic

Packaging and Materials, ASME, 1995; EEP-vol. 11/MD-vol. 64


12. Ramakrishna K., and B.G. Sammakia, “Analysis of Strains in Plated Through Holes During Current Induced Thermal Cycling of a Printed Wiring Board,” ASME

International Mechanical Engineering Congress and Exposition, San Francisco, CA,

1995; 95-WA/EEP-5.

13. Sathe S., and B.G. Sammakia, “Natural Convection in an Open Ended Horizontally Heated Cavity: A Numerical Study with Applications to Laptop Computers,” National

Heat Transfer Conference, Vol. 1, HTD-Vol. 303, 1995, pages: 81-93.

14. Sathe, S., B.G. Sammakia, A.C. Wong, and V. H. Mahaney, “A Numerical Study of a High Performance Air-cooled Impingement Heat Sink,” National Heat Transfer

Conference-Vol. 1, HTD-Vol. 303, 1995, pages: 43-53.

15. Sathe S. and B. G. Sammakia, “A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) package,” National Heat Transfer Conference, Austin,

TX, August 1996, page 83.

16. Stutzman, R., S. Sathe, and B. G. Sammakia, “Macro and Micro Thermal Model of an Elevated Temperature Dielectric Breakdown in Printed Circuit Boards,” ASM 22nd

International Symposium for Test and Failure Analysis (ISTFA 96), Los Angeles CA,

1996, pages 313-316.

17. Chen, W.T., D. Questad, D. Read, and B.G. Sammakia, “Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry,” ASME WAM,

1997.

18. Niu, T.M., B.G. Sammakia, and S. Sathe, “Void Modeling in Encapsulated Multilayer Ceramic and Multilayer Polyimide Ceramic Flip Chip Packages,” Itherm 98, Seattle,

WA, May 1998.

19. Tran, S.K., D. Questad, and B.G. Sammakia, “Adhesion Issues in Flip Chip on Organic Modules,” Itherm 98 Seattle, WA, May 1998.

20. Sathe, S. and B.G. Sammakia, “Some Thermal Issues that Arise in the Development, Qualification, and Manufacturing of Electronic Packages,” presentation at the

NSF/ASME Workshop in conjunction with the 1998 ASME International Mechanical

Engineering Congress and Exposition, November 18-19, 1998, pages: 8-11.

21. Sammakia, B.G. and S. Sathe, “Thermal Issues that Arise due to Manufacturing Processes; Evaluation and Measurement Techniques,” Electronics Manufacturing Issues,

DE-Vol. 104, ASME 1999, November 14-19, 1999, pages: 121-138.

22. Sathe, S. and B.G. Sammakia, “Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package,” Proceedings of ASME 1998, Manufacturing Science and

Engineering Division, MED-Vol. 8, 1998, pages: 747-756.


23. Watson, S., B. Murray, and B. G. Sammakia, “Computational Parameter Study of Chip Scale Package Array Cooling,” Proc. 2000 InterSociety Conference on Thermal

Phenomena Itherm 2000, Las Vegas, NV, May 23-26, 2000, pages: 37-43.

24. Tonapi, S., K. Srihari, S. Sathe, and B G. Sammakia, “Parametric Studies of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package,” Proceedings of the ASME

Manufacturing in Engineering Division - 2000, Orlando, FL, November 5-10, 2000,

MED-Vol. 11, pages: 425-431.

25. Morris, J. and B. G. Sammakia, “Current and Future Research in Electronics Packaging at Binghamton University,” 2000 Government Microcircuit Applications Conference,

Anaheim, CA, March 20-23, 2000, pages: 396-399.

26. Chouta, P., D. Santos, K. Srihari, and B.G. Sammakia, F. Andros, and M. DiPietro, “A Shear Strength Study of Lead-Free Solder Spheres for BGA Applications on Different

Pad Finishes,” 2001 Proceedings Pan Pacific Microelectronics Symposium, Kauai, HI,

February 13-16, 2001, pages: 11-28.

27. Sathe S. and B. G. Sammakia, “Thermal Model of Buried Resistors and Design Guidelines for Buried Components,” EEP-Vol. 26-1, Advances in Electronic Packaging –

1999, Volume 1, ASME, 1999.

28. Awasthi, A., S. McKeown, C. Sahay, and B.G. Sammakia, “Selection of Method for Fatigue Life Prediction Under Random Loading,” IMECE 2001, session EEP-12,

November, 2001, New York, N.Y.

29. Santos, D., K. Srihari, and B. G. Sammakia, “Industry University Research in Electronics Manufacturing: The Binghamton University Model,” proceedings of the SMTA-Chicago,

October, 2001, pages 672-675.

30. Tonapi, S., S. Sathe, B. G. Sammakia, and K. Srihari, “Parametric Studies of the Thermal Performance of Back-to-Back Tape Ball Grid Array (TBGA) Packages,” 51st

ECTC, Orlando, FL, May 2001, pages: 738-743.

31. Greenfield, P., J. Andresakis and B.G. Sammakia, “An FEA Study of Image Transfer in Printed Wiring Boards,” IPC 2002, pages: S03-2-1 – S03-2-8.

32. Greenfield, P., J. Pitarresi, G. Lehmann, D. Skinner, J. Lee, and B. G. Sammakia, “A Lamination Study of a Composite LCD Flat Panel Display,’ proceedings InterSociety

Conference on Thermal Phenomena (Itherm2002), San Diego, CA, May, 2002, pages:

1001 - 1006.

33. Shah, A., B. G. Sammakia, K. Srihari, and K. Ramakrishna, “A numerical analysis of the performance of a parallel plate heat sink,” proceedings InterSociety Conference on

Thermal Phenomena (Itherm2002), San Diego CA, May, 2002, pages 710-717.


34. Guttikonda S. and B. G. Sammakia, "Comparative Analysis of two heat spreader designs for a Wire Bond TBGA Package,” proceedings InterSociety Conference on Thermal

Phenomena (Itherm2002), San Diego, CA, May, 2002, pages: 559-571.

35. Watson S. and B. G. Sammakia, “A parametric study of the thermal performance of chip scale packages with flat plate heat sinks,” proceedings InterSociety Conference on

Thermal Phenomena (Itherm2002), San Diego, CA, May, 2002, pages: 276-284

36. Chaparala, S., J. Pitarresi, B. G. Sammakia, L. Nguyen, V. Patwardhan, L. Zhang, and N. Kelkar, “A Parametric Predictive Solder Joint Reliability Model for Wafer Level Chip

Scale Package,” Proceedings ECTC 2002, , May 31, 2002, San Diego, CA, pages: 1323 –

1328.

37. Srihari K. and B. G. Sammakia, “Industry - University Partnership in Graduate Research and Education,” Proceedings ECTC 2002. , May 31, 2002, San Diego, CA, pages: 768 –

771.

38. Tonapi, S., R. Fillion, B. G. Sammakia, F.J. Schattenmann, H.S. Cole, and J. D. Evans, "An Overview of Thermal Management of Next Generation Microelectronic Devices,”

Proceedings of the 13th Advanced Semiconductor Manufacturing Conference 2003.

39. Mahajan, S., G. Subbarayan, B. G. Sammakia, and W. Jones, “Molecular Dynamics Simulation of Nanotube-Polymer Composites for use as Thermal Interface Material,”

Proceedings of 2003 ASME, International Mechanical Engineering Congress and

Exposition, Washington, D.C., November 15-21, 2003.

40. Sathe, S. and B. G. Sammakia, “An Analytical Study of the Optimized Performance of An Impingement Heat Sink,” Proceedings of 2003 ASME, International Mechanical

Engineering Congress and Exposition, Washington, DC, November 15-21, 2003.

41. Desai, A., S. Mahajan, G. Subbarayan, W. Jones, J.Geer, and B.G. Sammakia, “An Analytical Study of Transport in a Thermal Interface Material Enhanced with Carbon

Nanotubes,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June

1-4, 2004, pages: 403-409.

42. Chaparala,S.C., B.D. Roggeman, J.M. Pitarresi, B.G. Sammakia, J. Jackson, G. Griffin, and T. McHugh, “Effects of Geometry and Temperature Cycle on the Reliability of

WLCSP Solder Joints,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las

Vegas, NV, June 1-4, 2004, pages: 287-295.

43. Cuddalorepatta, G., J.M. Pitarresi, and B.G. Sammakia, “Mechanical Modeling of Tiled Liquid Crystal on Silicon (LcoS) Microdisplay,” Proceedings of Itherm 2004 (CD), The


Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in

Electronic Systems, pp. 383-390, Las Vegas, NV, June 1-4, 2004.

44. Agonafer, D., J.Markell, B.G. Sammakia, and G.Lehman, “Numerical Investigation of Enclosure Effects on Spot Cooling Devices,” Proceedings of Itherm 2004 (CD), The

Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in

Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 339-343.

45. Park, S.B., B.G. Sammakia, and K. Raghunathan, “Predictive Model for Optimized Design Parameters in Flip-Chip Packages,” Proceedings of Itherm 2004 (CD), The Ninth

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Systems, Las Vegas, NV, June 1-4, 2004, pages: 458-464.

46. Choubey, A., F. Andros, and B.G. Sammakia, “Study of Assembly Processes for Liquid Crystal on Silicon (LcoS) Microdisplays,” Proceedings of Itherm 2004 (CD), The Ninth


Systems, Las Vegas, NV, June 1-4, 2004, pages: 77-84.

47. Bahadur, R., B.G. Sammakia, and F. Andros, “Thermal Management of a Microdisplay Engine Assembly,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference

on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV,

June 1-4, 2004, pages: 381-388.

48. Shrivastava, S., B. G. Sammakia, “Thermal Management of Biomaterials in a Rectangular Cavity Surrounded by a Phase Change Material,” Proceedings of Itherm

2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 108-120.

49. Arunasalam, P., H.D. Ackler, and B.G. Sammakia, “Smart Three Axis Compliant (STAC) Interconnect: An Ultra-High Density MEMS Based Interconnect for Wafer-

Level Ultra-Thin Die Stacking Technology,” ECTC 2005, Lake Buena Vista, FL,

5/31/2005-6/3/2005.

50. Arunasalam, P., H.D. Ackler, S.Makhar, and B.G. Sammakia, “A Novel MEMS Based Ultra-High Density Interconnect for Wafer-Level Ultra-Thin Die Stacking Technology,”

IMAPS 2005, Philadelphia, PA, September 25-29, 2005.

51. Park, S.B., R. Joshi, and B. G. Sammakia, “Thermomechanical behavior of organic and ceramic flip chip ball grid array packages under power cycling,” Semi-Therm 2005, San

Jose, CA, March 15-17/2005.

52. Zhang, X., S. Kanuparthi, G. Subbarayan, B. Sammakia, and S. Tonapi, “Hierarchical Modeling and Trade-off Studies in Design of Thermal Interface Materials,” Proceedings

ASME InterPACK '05, IPACK2005-73259, San Francisco, CA, July 17-22, 2005.

53. Bhopte, S., D. Agonafer, R.Schmidt, and B. G., Sammakia, “Optimization of Data Center


Room Layout to Minimize Rack Inlet Air Temperature,” Proceedings ASME InterPACK

'05, IPACK2005-73027, San Francisco, CA, July 17-22, 2005.

54. Shrivastava, S., B.G., Sammakia, R.Schmidt, and M. Iyengar, “Comparative Analysis of Different Data Center Airflow Management Configurations,” Proceedings ASME

InterPACK '05, IPACK2005-73235, San Francisco, CA, July 17-22, 2005.

55. Shrivastava, S., B. G., Sammakia, “Transient Mixed-Convection with Applications to Cooling of Biomaterials,” Proceedings ASME InterPACK '05, IPACK2005-73235, San

Francisco, CA, July 17-22, 2005.

56. Iyengar, M., R. Schmidt, A. Sharma, G. McVicker, S. Shrivastava, S. S. Yasuo Amemiya, H. Dang, T. Chainer, and B.G. Sammakia, “Thermal Characterization of Non-

raised Floor Air Cooled Data Centers Using Numerical Modeling,” Proceedings ASME

InterPACK '05, IPACK2005-73387, San Francisco, CA, July 17-22, 2005.

57. Chaparala, S.C. F.E. Andros, W. Infantolino, B.G. Sammakia, S.C. Guttikonda, J. Zhao, and D. Sengupta, “Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP),”

Proceedings ASME InterPACK '05, IPACK2005-73085, San Francisco, CA, July 17-22,

2005.

58. Xiao, Q., W.D. Armstrong, J.M. Pitarresi, S.C. Chaparala, B.D. Roggeman, B. G. Sammakia, and L. Nguyen, “Constitutive Relationship Development, Modeling and

Measurement of Heat Stressing of Micro-SMD Assembly with Sn3.9Ag0.6Cu SAC

Alloy,” Proceedings ASME InterPACK '05, IPACK2005-73239, San Francisco, CA, July

17-22, 2005.

59. Shrivastava S. and B.G. Sammakia, “Inclined Cavity Effects with Applications to Cooling of Biomaterials,” Proceedings of IMECE2005, Paper IMECE2005-81633,

Orlando, FL, November 5-11, 2005.

60. Shrivastava, S., B.G. Sammakia, M. Iyengar, and R. Schmidt, “Significance Levels of Factors for Different Airflow Management Configurations of Data Centers,” Proceedings

of IMECE2005, Paper IMECE2005-81607, Orlando, FL, November 5-11, 2005.

61. Desai, A., J. Geer, and B.G. Sammakia, “Analytical Model of Heat Conduction in a Tubular Geometry with Application to a Nano-Structured Thermal Interface,”

Proceedings of IMECE2005, Paper IMECE2005-79732, Orlando, FL, November 5-11,

2005.

62. Desai, A., J. Geer, and B.G. Sammakia, “Heat Conduction in Three Dimensional Stacked Packages,” Proceedings of IMECE2005, Paper IMECE2005-79771, Orlando, FL,

November 5-11, 2005.

63. Kanuparthi, S., X. Zhang, G. Subbarayan, B. G. Sammakia, A. Gowda, and S. Tonapi., “Full-Field Simulations of Particulate Thermal Interface Materials: Separating the Effects


of Random Distribution from Interfacial Resistance,” 10th Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San

Diego, CA, May 30-June 2, 2006.

64. Mahajan, S., G. Subbarayan, and B.G. Sammakia, “Thermal Conductivity of Amorphous Silica Using Non-Equilibrium Molecular Dynamics Simulations,” 10th Intersociety

Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

(ITherm 2006), San Diego, CA, May 30-June2, 2006.

65. Kanuparthi, S., X. Zhang, G. Subbarayan, B.G. Sammakia, T. Siegmund, A. Gowda, and S. Tonapi, “Random Network Percolation Models for Particulate Thermal Interface

Materials,” 10th Intersociety Conference on Thermal and Thermomechanical Phenomena

in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006.

66. Shrivastava, S.K., M. Iyengar, B.G. Sammakia, R. Schmidt, and J.W. VanGilder, “Experimental-Numerical Comparison for a High-Density Data Center: Hot Spot Fluxes

in Excess of 500 W/FT2,” 10th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA,

May 30-June2, 2006.

67. Shrivastava, S.K., J.W. VanGilder, and B.G. Sammakia, “A Statistical Prediction of Cold Aisle End Airflow Boundary Conditions,” 10th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA,

May 30-June2, 2006.

68. Bhopte, S., B.G. Sammakia, R.Schmidt, M.K. Iyengar, and D. Agonafer, “Effect of Under Floor Blockages on Data Center Performance,” 10th Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San

Diego, CA, May 30-June2, 2006.

69. Desai, A., J. Geer, and B. G. Sammakia, “A Statistical Analysis of Thermal Interface Materials Enhanced by Vertically Aligned Carbon Nanotubes,” 10th Intersociety


(ITherm 2006), San Diego, CA, May 30-June2, 2006.

70. Arunasalam, P., H.D. Ackler, and B.G. Sammakia, “Design, Fabrication and Implementation of Smart Three Axis Compliant Interconnects for Ultra-Thin Chip

Stacking Technology,” 56th Electronic Components and Technology Conference

Proceedings, San Diego, CA, May 30-June 2, 2006, pages: 1147-1153.

71. Desai, A., J. Geer and B.G. Sammakia, “A Technical Review of Studies on Temperature Distribution in Three Dimensional Stacked Packages”, Thermes 2007: Thermal

Challenges in Next Generation Electronic Systems, Suresh V. Garimella and Amy, S.

Fleischer (editors), 2007, Millpress, Rotterdam, ISBN 978-90-5966-051-9.


72. Desai, A., J. Geer and B.G. Sammakia, “Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package,” Proceedings of IPACK 2007,

IPACK2007-33045, Vancouver, BC, Canada, July 8-12, 2007.

73. Shrivastava, S.K., J.W. Van Gilder, and B.G. Sammakia, “Data Center Cooling Prediction using Artificial Neural Network,” Proceedings of IPACK 2007, IPACK2007-

33432, Vancouver, BC, Canada, July 8-12, 2007.

74. Bhopte, S., B.G. Sammakia, M.K. Iyengar, and R. Schmidt, “Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell,”

Proceedings of IPACK 2007, IPACK2007-33540, Vancouver, BC, Canada, July 8-12,

2007.

75. Bhopte, S., B.G. Sammakia, and B. Murray, “Mixing Enhancement In Two Component Microchannel Flow-Geometric And Pulsed Flow Effects,” Proceedings of IMECE2007,

ASME International Mechanical Engineering Congress and Exposition, Seattle,

Washington, USA, November 11-15, 2007.

76. Machiraju H., W. Infantolino, B. G. Sammakia, and M. Deeds, “Thermal Analysis Of MEMS Actuator Performance”, Proceedings of IMECE2007, ASME International

Mechanical Engineering Congress and Exposition, Seattle, Washington, USA, November

11-15, 2007.

77. Farnam, D., B.G. Sammakia, H. Ackler, and K. Ghose, (2007), “Comparative Analysis of Microchannel Cooling Schemes Subject to a Pressure Constraint,” Proceedings of the 5th

International Conference on Nanochannels, Microchannels and Minichannels,

ICNMM2007.

78. Bhopte, S., B. G., Sammakia, and B. Murray, “Geometric Modifications to Simple Microchannel Design for Enhanced Mixing,” 11th Intersociety Conference on Thermal

and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL,

May 28-31, 2008.

79. Farnam, D., B. G. Sammakia, and K. Ghose, “Development of a Complete Transient Microchannel Heat Sink Model,” 11th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May

28-31, 2008.

80. Chaparala, S., F. Andros, W. Infantolino, and B.G. Sammakia, “A New Technique for Calibrating Piezoresistive Stress Sensor Chips,” 11th Intersociety Conference on Thermal

and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl,

May 28-31, 2008.

81. Farnam D. and B.G. Sammakia, “Assessment of the Performance of Dielectric Fluids in Microchannel Heat Sinks,” 11th Intersociety Conference on Thermal and


Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL, May

28-31, 2008.

82. Kanuparthi, S., G. Subbarayan, B.G. Sammakia, and T. Siegmund, “Microstructural Characteristics Influencing the Effective Thermal Conductivity of Particulate Thermal

Interface Materials,” 11th Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May 28-31, 2008.

83. Bhopte, S., B.G. Sammakia, and V. Calmidi, “A Study of the Thermal Characterization of a High Performance Flip Chip Package,” 11th Intersociety Conference on Thermal and


28-31, 2008.

84. Shrivastava, S., J. W. VanGilder, and B.G. Sammakia, “Optimization of Cluster Cooling Performance for Data Centers,” 11th Intersociety Conference on Thermal and


28-31, 2008.

85. Gondipalli, S., S. Bhopte, B.G. Sammakia, M.Iyengar, and R.Schmidt, “Effects of Isolating Cold Aisles on Rack Inlet Temperature,” 11th Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008),

Orlando, Fl, May 28-31, 2008.

86. Mahajan, S., G. Subbarayan, and B.G. Sammakia, “Estimating Kapitza Resistance Between Si-SiO2 Interrface Using Molecular Dynamics Simulations,” 11th Intersociety


(ITherm 2008), Orlando, Fl, May 28-31, 2008.

87. Zhou, F., B. Murray, and B.G. Sammakia, “Modeling Heat Transport in Thermal Interface Materials Enhanced with MEMS Based Microconnects,” 11th Intersociety


(ITherm 2008), Orlando, FL, May 28-31, 2008.

88. Madduri, S. W. Infantolino, and B.G. Sammakia, “A Review of Non-Hermetic Optoelectronic Packaging”, 11th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL, May

28-31, 2008.

89. Poranki, S., N. Nagarur, and B.G. Sammakia, “Emerging Technology Evaluation – A Case of Flexible Electronics,” Center for Advanced Microelectronics Manufacturing

(CAMM), State University of New York at Binghamton, 2009 Flexible Electronics and

Displays Conference, Phoenix, Arizona, February 2009.

90. Zhang, H., M.D. Poliks, and B.G. Sammakia, “Precision overlay registration of micron sized features on unsupported flexible films,” Center for Advanced Microelectronics

Manufacturing (CAMM), 2009 Flexible Electronics and Displays Conference, Phoenix,


Arizona, February 2009.

91. Gondipalli, S., B.G. Sammakia, and G.R.,Ahmed, “Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes,” Proceedings of the ASME 2009

InterPACK Conference, IPACK2009-89076, San Francisco, California, USA, July 19-23,

2009.

92. Karajgikar, S., D. Agonafer, K. Ghose, B.G. Sammakia, C. Amon, and G. R. Ahmed “Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both

Thermal and Device Clock Performance,” Proceedings of the ASME 2009 InterPACK

Conference, IPACK2009-89188, San Francisco, CA, USA, July 19-23, 2009.

93. Gondipalli, S., B. G. Sammakia, S.Bhopte, R. Schmidt, M.K. Iyengar, and B.Murray “Optimization of Cold Aisle Isolation Designs for a Data Center with Roofs and Doors

using Slits,”, Proceedings of the ASME 2009 InterPACK Conference, IPACK2009-

89203, San Francisco, CA, USA, July 19-23, 2009.

94. Alzoubi, K., S. Lu, B.G. Sammakia, and M.Poliks, “Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics

Applications,” Proceedings of the ASME 2009 InterPACK Conference, IPACK2009-

89247, San Francisco, California, USA, July 19-23, 2009.

95. Madduri, S., B. G. Sammakia, W. Infantolino, S.C. Chaparala, L.C. Hughes, and J. M. Harris, “Performance Study of a GaAs based Laser Diode Chip in a Condensing

Environment”, Proceedings of the ASME 2009 InterPACK Conference, IPACK2009-

89115, San Francisco, California, USA, July 19-23, 2009.

96. Dan, B., S. Kanuparthi, G. Subbarayan, and B.G. Sammakia, “An Improved Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal

Interface Materials,” Proceedings of the ASME 2009 InterPACK Conference.

IPACK2009-89116, San Francisco, CA, USA, July 19-23, 2009.

97. Ta-Hsuan L., F. Andros, S. Lu, and B.G. Sammakia, “Process and Reliability of Copper Column Flexible Flip Chip Connection (F2C2),” Electronics Packaging Technology

Conference, 2008, EPTC 2008, 10th, Publication Date: 9-12 Dec. 2008, page(s): 1316-

1320, Singapore, ISBN: 978-1-4244-2117-6, INSPEC Accession Number: 10445057,

Digital Object Identifier: 10.1109/EPTC.2008.4763613, Current Version Published:

2009-01-27.

98. Kalkundri, K. F. Andros, and B.G. Sammakia, “An Experimental Setup and Procedure for Thermal Resistance Measurements of a Thermal Interface Material,” 2010 TMS (The

Minerals, Metals and Minerals Society) Annual Meeting, Electronic, Magnetic and

Photonic Materials Division, Seattle WA, February, 2010.


99. An overview of thermal management of electronic systems research at the Small Scale Systems Integration and Packaging Center, (S3IP), 12th Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las

Vegas Nevada, June 2-5, 2010. (Invited paper for Achievement award).

100. Chauhan, A., B.G. Sammakia, K. Ghose, G.R.Ahmed, and D. Agonafer , “Hot Spot Mitigation using Single-Phase Microchannel cooling for Microprocessors,” 12th


Systems (ITherm 2010), Las Vegas Nevada, June 2-5 2010.

101. Chakravorty, S., B.G. Sammakia, K. Srihari, and G. R.Ahmed, “Impingement Heat Sink Optimization for Microprocessors with Significant Hot Spots,” 12th


Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010.

102. Gondipalli, S., S. Bhopte, B.G. Sammakia and V. Calmidi, “Numerical and Experimental study of the Effect of Thermocouple Wire Attachment on Thermal

Characterization of a High Performance Flipchip Package,” 12th Intersociety Conference

on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010),

Las Vegas Nevada, June 2-5, 2010.

103. Ibrahim, M., S. Gondipalli, S. Bhopte, and B.G. Sammakia, “Numerical Modeling Approach to Dynamic Data Center Cooling,” 12th Intersociety Conference on Thermal

and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas

Nevada, June 2-5, 2010.

104. Gondipalli, S., M. Ibrahim, S. Bhopte, B. G., Sammakia, B. Murray, K. Ghose, M.K. Iyengar and R. Schmidt, “Numerical Modeling of Data Center with Transient

Boundary Conditions 12th Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010.

105. Bhopte, S, B.G. Sammakia, and B.Murray, “Numerical Study of a Novel Passive Micromixer Design,” 12th Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010.

106. B. Dan, B.G. Sammakia, and G. Subbarayan, “On Refining the Parameters of a Random Network Model for Determining the Effective Thermal Conductivity of

Particulate Thermal Interface Materials,” 12th Intersociety Conference on Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas

Nevada, June 2-5, 2010.

107. Bhopte, S., S. Desu, and B.G. Sammakia, “An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems”, Proceedings of International Heat


Transfer Conference, IHTC 14, August 8-13, 2010, Washington, DC, USA.

108. Alzoubi, K., A.Qasaimeh, S. Lu, B.G. Sammakia, and M. Poliks, “Resistance Change Modeling of Sputtered Thin Films on Flexible Substrates under Fatigue Test”,

Institute of Industrial Engineers Annual Conference, May 2010,

http://www.iienet2.org/annual2/details.aspx?id=10042 .

109. Zhou, S., and B.G., Sammakia, “Modeling Of Two-Phase Micro-Channel Flow For Thermal Management Of Electronic Systems”, Proceedings of the ASME 2010

International Mechanical Engineering Congress & Exposition, IMECE2010, November

12-18, 2010, Vancouver, British Columbia, Canada, IMECE2010-37219.

110. Dan, B., J.F. Geer, and B.G. Sammakia, “Heat Conduction In A Rectangular Tube With Eccentric Hot Spots”, Proceedings of the ASME 2010 International Mechanical

Engineering Congress & Exposition, IMECE2010, November 12-18, 2010, Vancouver,

British Columbia, Canada, IMECE2010-37554.

111. Raghu, A., S. Karajgikar, D.Agonafer, B.G. Sammakia and G.R. Ahmed, “Thermal-Aware Power Migration In Many-Core Processors”, Proceedings of the ASME

2010 International Mechanical Engineering Congress & Exposition, IMECE2010,

November 12-18, 2010, Vancouver, British Columbia, Canada, IMECE2010-40232.

112. Ibrahim, M., S.Bhopte, B.G. Sammakia, B.Murray, M. Iyengar and R. Schmidt, “Effect Of Thermal Characteristics Of Electronic Enclosures On Dynamic Data Center

Performance”, Proceedings of the ASME 2010 International Mechanical Engineering

Congress & Exposition, IMECE2010, November 12-18, 2010, Vancouver, British

Columbia, Canada, IMECE2010-40914.

113. Xu, X., B.G. Sammakia, D.Y. Jung, and T. Eilertsen, “Multiphysics Approach To Modeling Supercapacitors For Improving Performance”, Proceedings of the ASME 2011

Pacific Rim Technical Conference & Exposition on Packaging and Integration of

Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon,

USA. IPACK2011-52081.

114. Chakravorty, S., B.G. Sammakia, and V. Calmidi, “Thermal Characterization Of Non-Isolated Dc To Dc Convertor”, Proceedings of the ASME 2011 Pacific Rim

Technical Conference & Exposition on Packaging and Integration of Electronic and

Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-

52121

115. Chauhan, A., B.G. Sammakia, K. Ghose, G.R. Ahmed, and D. Agonafer, “Single-Phase Microchannel Cooling For Stacked Single Core Chip And Dram”,

Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on

Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8,

2011, Portland, Oregon, USA. IPACK2011-52137

http://www.iienet2.org/annual2/details.aspx?id=10042


116. Chauhan, C., B.G. Sammakia, F. Afram, K. Ghose, G.R.. Ahmed, and D. Agonafer, “Single-Phase Liquid Cooling Of A Quad-Core Processor”, Proceedings of the

ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and

Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland,

Oregon, USA. IPACK2011-52139

117. Ibrahim, M., F. Afram, B.G. Sammakia, K. Ghose, B. Murray, M. Iyengar, and R. Schmidt, “Characterization Of A Server Thermal Mass Using Experimental

Measurements”, Proceedings of the ASME 2011 Pacific Rim Technical Conference &

Exposition on Packaging and Integration of Electronic and Photonic Systems

InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52165

118. Ibrahim, M., F. Afram, K. Ghose, B.G. Sammakia, S. Bhopte, B. Murray, M. Iyengar, and R. Schmidt, “Numerical Study On The Reduction Of Recirculation Using

Sealed Cold Aisles And Its Effects On The Efficiency Of The Cooling Infrastructure”,

Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on

Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8,

2011, Portland, Oregon, USA. IPACK2011-52166

119. Song, Z., B. Murray, and B.G. Sammakia, “Multivariate Prediction Of Airflow And Temperature Distributions Using Artificial Neural Networks”, Proceedings of the

ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and

Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland,

Oregon, USA. IPACK2011-52167

120. Tambat, A., H.Y. Lin, I. Claydon, G. Subbarayan, D.Y. Jung and B.G. Sammakia, “Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of

Dielectric Material Selection”, Proceedings of the ASME 2011 Pacific Rim Technical

Conference & Exposition on Packaging and Integration of Electronic and Photonic

Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52237

121. Tambat, A., H.Y. Lin, I. Claydon, G. Subbarayan, D.Y. Jung and B.G. Sammakia, “Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric

Stacks”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition

on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July

6-8, 2011, Portland, Oregon, USA. IPACK2011-52258

122. Chen, C., E. Samadiani and B.G. Sammakia “Compact Modeling Of Fractal Tree-Shaped Microchannel Liquid Cooling System” Proceedings of the ASME 2011

International Mechanical Engineering Congress & Exposition, IMECE2011, November

11-17, 2011, Denver, Colorado, US [IMECE2011‑65220]

123. Chauhan, A., B.G. Sammakia, F. Afram, K. Ghose, G. Refai-Ahmed and D. Agonafer “Liquid Cooling Of A Stacked Quad-Core Processor And Dram Using

Laminar Flow In Microchannel” Proceedings of the ASME 2011 International


Mechanical Engineering Congress & Exposition, IMECE2011, November 11-17, 2011,

Denver, Colorado, US [IMECE2011-65866]

124. Xu, X., B. G. Sammakia, B. Murray, D.Y Jung, and T.Eilerston, “ Thermal Modeling

And Heat Management Of Supercapacitor Modules By High Velocity Impinging Fan

Flow” Proceedings of the ASME 2011 International Mechanical Engineering Congress &

Exposition, IMECE2011, November 11-17, 2011, Denver, Colorado, US

[IMECE2011-65676]

125. Alzoubi, K., M.M. Hamasha, M. Schadt, S Lu, B.G. Sammakia, and M. Poliks, “Effect Of Lamination On The Bending Fatigue Life Of Copper Coated PET Substrate”

Proceedings of SPIE 7956, 79560X, 2011.

126. Ibrahim, M., S. Shrivastava, B.G. Sammakia, and K. Ghose, “Thermal Mass Characterization Of A Server At Different Fan Speeds”, Thermal and Thermomechanical

Phenomena in Electronic Systems (ITherm), 2012.

127. Song, Z., B. Murray, B.G. Sammakia, and S. Lu, “Multi-Objective Optimization Of

Temperature Distributions Using Artificial Neural Networks”, Thermal and

Thermomechanical Phenomena in Electronic Systems (ITherm), 2012.

128. Chauhan, A., B.G. Sammakia, F. Afram, K. Ghose, G. Refai-Ahmed, and D. Agonafer, “Analysing Real Time Power Of The Microprocessor To Estimate Thermal

Time Constant Of The Hotspot”, Thermal and Thermomechanical Phenomena in

Electronic Systems (ITherm), 2012.

129. Dan, B., B.G. Sammakia, S. Kanuparthi, G. Subbarayan, and S. Mallampati, “The Study Of The Polydispersivity Effect On The Thermal Conductivity Of Particulate

Thermal Interface Materials To Refine The Random Network Model”, Thermal and


130. Xu, X., M.M. Meyers, B.G. Sammakia, and B. Murray, “Thermal Modeling Of Hybrid Concentrating PV/T Collectors With Tree-Shaped Channel Networks Cooling

System”,

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012.

131. Zhou, S., B.G. Sammakia, B. White, and P. Borgesen, “A Multiscale Modeling Of Thermoelectric Generators For Conversion Efficiency Optimization”, Thermal and


132. Sami Alkharabsheh and B. Sammakia, "Utilizing practical fan curves in CFD modeling of a data center" Semiconductor, Thermal Measurement and Management

Symposium (SEMI-THERM), 2013 29th Annual IEEE

file:///D:/data/pdfs/trk-6/IMECE2011-65866.pdffile:///D:/data/pdfs/trk-10/IMECE2011-65676.pdfhttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:k8Z6L05lTy4Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:kRWSkSYxWN8Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:kRWSkSYxWN8Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:WqliGbK-hY8Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:WqliGbK-hY8Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:WqliGbK-hY8Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:epqYDVWIO7EChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:epqYDVWIO7EChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:ILKRHgRFtOwChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:ILKRHgRFtOwChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:ILKRHgRFtOwChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:hMsQuOkrut0Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:hMsQuOkrut0Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:hMsQuOkrut0Chttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:kuK5TVdYjLIChttp://scholar.google.com/citations?view_op=view_citation&hl=en&user=F-xcn0MAAAAJ&pagesize=100&sortby=pubdate&citation_for_view=F-xcn0MAAAAJ:kuK5TVdYjLIC


133. Zhihang Song, Bruce T. Murray and Bahgat Sammakia, “IMPROVED ZONAL MODEL FOR DATA CENTER ANALYSIS”, Proceedings of the ASME 2013

International Technical Conference and Exhibition on Packaging and Integration of

Electronic and Photonic Microsy

bahgat g. sammakia ph binghamton university state ......suny polytechnic institute • december...

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