the role of eda in soc design
DESCRIPTION
The Role of EDA in SoC Design. HKSTP International Technology Conference January 14, 2003 Dr. Chi-Foon Chan President and Chief Operating Officer Synopsys, Inc. Agenda. Economic Technical Challenges Methodology. Agenda. Economic Challenges Technical Challenges Methodology. - PowerPoint PPT PresentationTRANSCRIPT
Des
ign The Role of EDA in SoC
Design
HKSTP International Technology ConferenceJanuary 14, 2003
Dr. Chi-Foon ChanPresident and Chief Operating OfficerSynopsys, Inc.
© 2003 Synopsys, Inc. (2) HKSTP International Technology Conference
Agenda
• Economic
• Technical Challenges
• Methodology
© 2003 Synopsys, Inc. (3) HKSTP International Technology Conference
Agenda
• Economic Challenges
• Technical Challenges
• Methodology
© 2003 Synopsys, Inc. (4) HKSTP International Technology Conference
IDM IDM $122B$122B
Various sourcesAprox. Values for 2001
Fabless $10B
IP $0.3BIP $0.3B
DesignDesign
Semiconductor Value Flow in 1996
Systems Systems $851B$851B
Embedded Embedded SW $0.4BSW $0.4B
FoundryFoundry$5.4B$5.4B
MaskMask
DataData
EDA $2.5BEDA $2.5B
Back-EndBack-End$5.9B$5.9B
Front-EndFront-End$22B$22B
Masks $2.1BMasks $2.1B
MaterialsMaterials $4.2B $4.2B
ManufacturingManufacturing
© 2003 Synopsys, Inc. (5) HKSTP International Technology Conference
Various sourcesAprox. Values for 2001
IP $0.9BIP $0.9B
DesignDesign
Semiconductor Value Flow in 2001
Embedded Embedded SW $0.8BSW $0.8B
MaskMask
DataData
EDA $3.6BEDA $3.6B
Back-EndBack-End$5.6B$5.6B
Front-End Front-End $24B$24B
Masks $2.3BMasks $2.3B
MaterialsMaterials $4.0B $4.0B
ManufacturingManufacturing IDM IDM $106B$106B
Fabless $13B
Systems Systems $1050B$1050B
FoundryFoundry$9.1B$9.1B
© 2003 Synopsys, Inc. (6) HKSTP International Technology Conference
IDM IDM $122B $122B
Various sourcesAprox. Values for 2001
IP $1.8BIP $1.8B
DesignDesign
Semiconductor Value Flow in 2006
Embedded Embedded SW $1.7BSW $1.7B
FoundryFoundry$31B$31B
MaskMask
DataData
EDA $6.1BEDA $6.1B
Back-EndBack-End$10B$10B
Front-EndFront-End$31B$31B
Masks $3.7BMasks $3.7B
MaterialsMaterials $6.7B $6.7B
ManufacturingManufacturing
Fabless $52B
Systems Systems $1429B$1429B
© 2003 Synopsys, Inc. (7) HKSTP International Technology Conference
50%
60%
70%
80%
90%
100%
110%
Peak Peak +3 Peak +6 Peak +9 Peak +12 Peak +15 Peak +18 Peak +21 Peak +24
Semiconductor Sales Downturn
Source: SIA WSTS 3-mos average, Synopsys
October 2002
1996
1985
1998
1989
9/01
1996
1985
1998
1989
2002
© 2003 Synopsys, Inc. (8) HKSTP International Technology Conference
50%
60%
70%
80%
90%
100%
110%
Peak Peak +3 Peak +6 Peak +9 Peak +12 Peak +15 Peak +18 Peak +21 Peak +24
Semiconductor Sales Downturn
Source: SIA WSTS 3-mos average, Synopsys
1996
1985
1998
1989
2002
9/01
© 2003 Synopsys, Inc. (9) HKSTP International Technology Conference
50%
60%
70%
80%
90%
100%
110%
Peak Peak +3 Peak +6 Peak +9 Peak +12 Peak +15 Peak +18 Peak +21 Peak +24
Semiconductor Sales Downturn
Source: SIA WSTS 3-mos average, Synopsys
October 2002
1996
1985
1998
1989
© 2003 Synopsys, Inc. (10) HKSTP International Technology Conference
Semiconductor Sales Downturn
Source: SIA WSTS, Synopsys
Worldwide
Asia Pacific
Per
cent
of P
eak
Mon
th S
ales
50%
60%
70%
80%
90%
100%
Oct 2001 Feb 2001 June 2001 Oct 2001 Feb 2002 June 2002 Oct 2002
© 2003 Synopsys, Inc. (11) HKSTP International Technology Conference
ApplicationApplication Graphics Wireless Networking Networking Wireless
GeometryGeometry 0.13µ 0.13µ 0.13µ 0.13µ 0.13µ
TransistorsTransistors 30M 12M 12M 24M 12M
CostCost $10.7M $9.0M $5.7M $10.9M $16.3M
Staff-monthsStaff-months 346 326 161 333 483
Escalating Development Costs and Time
Source: International Business Strategies, 2002
Sample (Actual) VDSM Projects
Average: $10M+, 300+ Staff-months!Average: $10M+, 300+ Staff-months!
© 2003 Synopsys, Inc. (12) HKSTP International Technology Conference
Process Sophistication Leads to Complex Alliances
FabFab
ProcessProcess
LibrariesLibraries
IP BlocksIP Blocks
ToolsTools
FlowFlow
© 2003 Synopsys, Inc. (13) HKSTP International Technology Conference
Semiconductor Partnerships
© 2003 Synopsys, Inc. (14) HKSTP International Technology Conference
Agenda
• Economic Overview
• Technical Challenges
• Methodology
© 2003 Synopsys, Inc. (15) HKSTP International Technology Conference
Manufacturability •Process antenna effect (PAE)•Minimum area rule (MAE)•Double cut via•End-of-line wire extension•Metal filling / wide wire slotting
Interconnect Delay
Deep Subm Creates Many Problems
In 0.18u Wire-to-Wire Cap Dominates (CW >> CS)
CS
CW
0.25
M1M2
Less Charge
M3
Metal 3 Jumper Reduces Metal 1 L
M1Diode
Drains Charge
Reliability•Electromigration•Hot electron device degradation
Signal Integrity•Crosstalk
• Capacitive coupling• Inductive coupling
• IR (voltage) Drop
© 2003 Synopsys, Inc. (16) HKSTP International Technology Conference
Challenges in Design Implementation
IPIPBus
Interface
MPEG A/D
, D
/A
PL L
Sync
Arbiter
CDI
R A MMem
ory
Con
trol
Large, Complex Chips
Signal Integrity Manufacturability
Timing Closure
© 2003 Synopsys, Inc. (17) HKSTP International Technology Conference
Growing Verification Complexity
> 1M lines of HDL code!
Lin
es
of
Co
de
1980 2002
More Tools and Larger Verification Teams
GatesGates
Sim
ula
tio
n C
yc
les
Sim
ula
tio
n C
yc
les
2007
2001
1M 10M 100M
100M
100B
10T
1995
> 200B Simulation Cycles
70%Verification
Design30%
© 2003 Synopsys, Inc. (18) HKSTP International Technology Conference
Average Gate Counts By Region
0%
10%
20%
30%
1-100K 101K-300K
301K-999K
1M-1.9M 2M-3.9M 4M-5.9M 6M-7.9M 8M+
Gates
North AmericaEuropeJapanAsia
Synopsys SNUG Data 2002
Designs tend to be larger in North America (more mP) and tend to be smaller in Asia (more consumer electronics)
© 2003 Synopsys, Inc. (19) HKSTP International Technology Conference
Most Non-North America Chips Run at <150MHz
0%
20%
40%
60%
1-100MHz 101K-150MHz
151-200MHz 201-400MHz 401-600MHz 601-800MHz 800MHz+
North America
Europe
Japan
Asia
Synopsys SNUG Data 2002
© 2003 Synopsys, Inc. (20) HKSTP International Technology Conference
Design Geometries by Region
0%
20%
40%
60%
<.11 0.11 0.13 0.15 0.18 0.25 >.25
microns
North America
Europe
Japan
Asia
Synopsys SNUG Data 2002
44% of designs in Asia at .25-micron or larger compared to 22% in Japan and 17% in Europe
© 2003 Synopsys, Inc. (21) HKSTP International Technology Conference
Most Non-North America Chips Run at <150MHz
0%
20%
40%
60%
1-100MHz 101K-150MHz
151-200MHz 201-400MHz 401-600MHz 601-800MHz 800MHz+
North America
Europe
Japan
Asia
Synopsys SNUG Data 2002
© 2003 Synopsys, Inc. (22) HKSTP International Technology Conference
Customers Will Increasingly Converge on Platforms
Physical ImplementationPhysical Implementation
Design PlanningDesign Planning
ExtractionExtraction
Physical VerificationPhysical Verification
Mask Synthesis / OPCMask Synthesis / OPC
Lan
gu
ag
esL
ang
ua
ges
Ass
erti
on
s an
d T
estb
ench
esA
sser
tio
ns
and
Tes
tben
ches
Smart VerificationSmart Verification
Architecture DesignArchitecture Design
Mixed Signal / AnalogMixed Signal / Analog
Ver
ific
atio
n I
PV
erif
icat
ion
IP
Des
ign
Dat
ab
ase
Des
ign
Dat
ab
ase
Tim
ing
an
d S
ign
al I
nte
gri
tyT
imin
g a
nd
Sig
nal
In
teg
rity Te
stTe
st Pow
erPo
wer
Phys
ical
Phys
ical SynthesisSynthesis
IPIP
Verification PlatformVerification PlatformImplementation PlatformImplementation Platform
© 2003 Synopsys, Inc. (23) HKSTP International Technology Conference
Agenda
• Economic
• Technical Challenges
• Methodology
© 2003 Synopsys, Inc. (24) HKSTP International Technology Conference
PhysicsPhysics
ComplexityComplexity
Design Pressures
Courtesy of NVIDIA
© 2003 Synopsys, Inc. (25) HKSTP International Technology Conference
Challenge: HW/SW Complexity
100M100MGatesGates
20072007
2000 EY2000 EY
10M10MGatesGates
20012001
200 EY200 EY
1M1MGatesGates
19951995
20 EY20 EY
SolutionsSolutions
1.1. Higher level of abstractionHigher level of abstraction
• System-level toolsSystem-level tools
2.2. IP design reuseIP design reuse
© 2003 Synopsys, Inc. (26) HKSTP International Technology Conference
… 80% of the circuitry in SoCswill be acquired, not designed
Star IPStar IPIn-house IPIn-house IP3rd Party IP3rd Party IP
Customer
Customer
Designed
Designed50%
80%95%
2000 2005 2010
By 2005..
© 2003 Synopsys, Inc. (27) HKSTP International Technology Conference
• IP is at the core of deep
sub-micron SoC design
methodology
• Platforms = IP + SLD (HW)
© 2003 Synopsys, Inc. (28) HKSTP International Technology Conference
IP Reuse: 3 Fundamental Hurdles
Efficiently acquiring
3rd-party IP
Creating &integratingquality IP
Changing the corporate
culture
© 2003 Synopsys, Inc. (29) HKSTP International Technology Conference
IP Reuse: 3 Solutions
Choose solid IP partners
Design using integrated platform of
tools
Start right: Use “top down”
methodology
© 2003 Synopsys, Inc. (30) HKSTP International Technology Conference
Agenda
• Economic
• Technical Challenges
• Methodology
© 2003 Synopsys, Inc. (31) HKSTP International Technology Conference
Current Realities of IC Design
EconomicEconomicStressStress
• Craft advantageous economic ventures
• Partner with EDA to overcome technical challenges
• Use “partnered” tools: platforms and IP deal with shrinking geometries and increasing complexities
SolutionSolution==
SmartSmartPartnershipsPartnerships
DesignDesignChallengeChallenge
IncreasingIncreasingComplexityComplexity
© 2003 Synopsys, Inc. (32) HKSTP International Technology Conference
2002 EE Times Reader EDA Survey
66%66%
47%47%
45%45%
41%41%
34%34%
34%34%
30%30%
22%22%
21%21%
12%12%
Best integration w/ other vendors’ toolsBest integration w/ other vendors’ tools
Technology leader todayTechnology leader today
Technology leader in 3 yearsTechnology leader in 3 years
Clear vision of futureClear vision of future
Most ethical companyMost ethical company
Knowledgeable sales repsKnowledgeable sales reps
Well-managed companyWell-managed company
Best before-sales system supportBest before-sales system support
Offers consulting design servicesOffers consulting design services
Best documentationBest documentation
Best training servicesBest training services
Best Web siteBest Web site
9%9%
20%20%
8%8%
Attribute in selecting vendorAttribute in selecting vendor Importance Importance
Best after-sales support Best after-sales support
Des
ign