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Page 1: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements
Page 2: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

The RZ/A overview Presentation

Changing the way we think about the GUI design

Page 3: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

What is the RZ family?• The RZ family is an ARM embedded MPU solution

• Renesas has selected (Cortex A and R) ARM cores for applications where these cores are required:

• Human Machine Interface• Cortex A9 with 400MHz• Up to 10MB of integrated SRAM• Low BOM cost HMI solution• Changing the way you look at MPUs

• Networking / Communications• Highest performance Realtime DSP.

• The RZ family delivers the “Zenith” of performance which is not possible from a standard MCU today.

Page 4: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Advantage of the Concept

Page 5: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

MCU Architectures vs. Hybrid SystemsSpeed of MCU is limited by access time of Flash MemoryFlash size restricted by Flash size on MCU

Conventional Microcontroller

Serial flash

Renesas RZ/A with large-capacity RAM

On-chip RAMFlash RAM

Almost unlimited Flash MemoryPerformance up to 400MHz

Page 6: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

NOR flash

Conventional Microprocessor

SDRAM Serial flash

Renesas RZ/A with large-capacity RAM

On-chip RAM

MPU Architectures vs. Hybrid SystemsThrough a combination of large-capacity SRAM and serial flash memory, Renesas can provide economical system configuration vs Conventional MPU architecture.Serial flash memory is lower cost and requires less mounting area than NOR flash memory.

Only ROM is externalRAM is on-chip

ROM/RAM are external

Page 7: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Advantages of SDRAM Reduction

NOR Flash

Large-capacity on-chip RAM

Download

Serial Flash

Work area

Program

On-chip RAM

Display data

LCD panel

CPU

SDRAM

Display control

External bus

Conventional

LCD panelDisplay control

External bus

SDRAM

Display data

High throughput data such as display data does not go via external bus, which reduces load of bus.Lower latency, higher throughput due to wider internal bus

External bus capacity decreasesfor the volume of display data

Page 8: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

128bit x 133MHz

128bit x 133MHz128bit x 133MHz

128bit x 133MHz128bit x 133MHz

Strong Bus Architecture RZ/A1 AXI bus has a multi layer structure to connect each bus slave No bottleneck if bus access from different slaves

Page 9: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Competition

Regulator3.3V

5V/12V

3 PCB layers for 1.2V, 3.3V, 1.8V(DDR2)

Regulator1.2V

Regulator1.8V

DDR2NOR Flash

Competitive Solution

RZ/A

Regulator3.3V

5V/12V

2 PCB layers for 1.2V, 3.3V

Regulator1.2V

SPI Flash

Renesas Solution

BOM Comparison

Page 10: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

BOM Cost Comparison (standard MPU)

Total cost = Multi layer PCB + MPU + 5.35€

Page 11: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

BOM Cost Comparison (RZ)

Total cost = Dual layer PCB + RZ + 1.00€ -> save 4.35€

Page 12: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Block Diagrom of RZ/A1H High Efficient 32-Bit CPU Core (Cortex A9)

400 MHz CPU Clock Frequency

Single and Double Floating Point Unit compliant with IEEE754

2D-Graphics Engine OpenVG 1.1 Full support for Khronos OpnVG1.1 API Rendering, Animation and Acceleration OpenVG w/o CPU

Support for Booting from QSPI Flash Memory and NAND Flash Memory External SPI serial flash is extremely cheap compared to on-

chip Flash Very flexible: 128Kbit - 512Mbit serial Flash Execute In Place

LCD Controller XGA (1024x768) with 24 bit interface 4 layer overlay 2ch video input, 2ch display out with 1ch LVDS Dot and window Alpha Blending Chroma Keying

Bus Interface Controller for glue less connection of SRAM, SDRAM, NOR, NAND, eMMC Flash Memory 128KB cache

Page 13: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Modules or Complete Board Designs and the Role of the Distributor

Page 14: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Make or Buy – the Major DecisionReasons for a full custom Design‐ the Size of the Board‐ the Position, Quantity and Type of Connectors‐ Solution related Processor Technology and Performance‐ custom Interfaces‐ Solution related custom Power Supply‐ optimized Price

Requirements‐ Experience with CPU‘s, Interfaces and High Clocking Signals‐ Layout Tool to handle High Speed Signals (Impedance controlled) and Multi Layer‐ Special Test Equipment like Spectrum‐, USB‐, CAN‐ Analyzer, ARM Ds‐5/Dstream…..‐ Production Line to handle BGA Packages (0.5mm pitch)‐ Experience with CPU Initialization‐ Experience with Boot Loaders and Operating Systems at Source Code Level‐ Experience in Lifetime Management for all Components‐ High Development Costs

Only suitable for high volumes or high 

expensive applications

Page 15: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Make or Buy – the Major DecisionReasons for a Module based Design‐ Higher Flexibilty in case of Performance and Variation‐ faster Time to Market‐ long Product Lifetime with Upgradeability as an Option‐ Demand for Design In Support from an experienced Manufacturer‐ PCN and EOL Handling from an experienced Manufacturer‐ Slightly customized Baseboard Design

Requirements‐ Suitable Market Knowledge to find the best fitting Solution‐ Capability and Experience for Designing a Baseboard‐ Experience with Operating Systems and Drivers at Binary Level‐ Trust in a Partnership with a 3. Party – the Module Manufacturer‐ Less Development Costs

Also suitable forsmaller Quantities and

different optional Setups 

Page 16: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

The Role of a Distributor like Rutronik

Market Knowledge

Experience with manyApplications

Field Support forall Solutions

Guidance for thebest fittingSolution

Accompanimentto Production

Stage

Optimal Customer Solution in Line with Market Requirementsfor a fast ROI and a long term

Profitability

Customer needs:Rutronik offers:

Page 17: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

The Role of a Distributor like RutronikPartners for Chip Level Products

Partners for ARM based Board Level Products

Partners for x86 based Board Level Products

Page 18: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Modules – Standard or ProprietaryRequirements for a Standard Module with x86‐ broad Range of Solutions over the Product Lifetime‐ Possibility for Up‐ and Down‐ Grading to offer more Solution Levels‐ big Market Share, that offers more Reliability and Competence‐ different Sources for Saving Availabilty over the Product Lifetime‐ optimized Price due to the Possibility for Negotiation with different Vendors

Fulfillment of the Requirements with x86‐ Availability of a broad Range of Solutions in COM Express and QSeven‐ big Market Share from COM Express Solutions since many Years‐ Upgradability possible over many Years with always latest Technologies‐ Due to the broad Range of Vendors the Sourcing and Negotiation might be easier‐ PASSED

for x86 Modules –Standards are common and reccommended

Page 19: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Modules – Standard or ProprietaryRequirements for a Standard Module with ARM‐ broad Range of Solutions over the Product Lifetime‐ Possibility for Up‐ and Down‐ Grading to offer more Solution Levels‐ big Market Share, that offers more Reliability and Competence‐ different Sources for Saving Availabilty over the Product Lifetime‐ optimized Price due to the Possibility for Negotiation with different Vendors

Fulfillment of the Requirements with ARM‐ Availability of only several Solutions in Qseven and SMARC‐ different Setups with different driver Sets and BSP‘s‐ mechanical Compatibility between Modules from different Vendors‐ different Levels of Software Support from different Vendors‐ normally only a few different SOC‘s available, means less Flexibility‐ in many Cases, these Solutions comes from former x86 Specialists‐ Slightly PASSED

for ARM Modules –Standards are only 

available and reccommended for few Applications

Page 20: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Modules – Standard or ProprietaryRequirements for a proprietary Module with ARM‐ broad Range of Solutions over the Product Lifetime‐ Possibility for Up‐ and Down‐ Grading to offer more Solution Levels‐ big Market Share, that offers more Reliability and Competence‐ different Sources for Saving Availabilty over the Product Lifetime‐ optimized Price due to the Possibility for Negotiation with different Vendors

Fulfillment of the Requirements with ARM‐ Long Time Experience of the Manufacturers in ARM Solutions (ARM Specialists)‐ Incompatibility between different Vendors, mechanical and electrical‐ Compatibility between Modules within one Vendors Product Family‐ Availability of BSP‘s and Drivers for most of the Embedded Operating Systems‐ best possible Support for Hardware‐ and Software Design‐ Dependence from only one Supplier might be a Risc for a long Lifetime‐ PASSED

for ARM Modules –proprietary Solutions can meet the Project Targets often better

Page 21: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

for ARM and x86 Solutions

ARM vs. x86 Embedded Systems Design

Market Knowledge

Experience with many Applications

Field Support for all Solutions

Guidance for the best fitting Solution

Accompaniment to Production 

Stage

Reliable and Experienced Design‐ and Logistics‐ Partner

for

Optimal Customer Solution in Line with Market Requirements

for a fast ROI and a long term Profitability

Customer needs:Rutronik offers:

Chip Level Products

Standard Modules

Proprietary Modules

Single Board 

Computers

Page 22: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Technical Consulting Commercial Consulting Logistical Consulting Technical Consulting Commercial Consulting Logistical Consulting

Everything you need….Everything you need….

Embedded BoardEmbedded Board

MemoryMemory

SSDSSD

HarddiskHarddisk

WirelessWireless

CablesCables

TFT & TouchTFT & Touch

….to make Ideas become Reality!….to make Ideas become Reality!

SensorsSensors

Power SupplyPower Supply

Page 23: The RZ/A overview Presentationfiles.iccmedia.com/events/armcon/rutronik.pdf · ‐ PCN andEOL Handling from an experiencedManufacturer ‐ Slightlycustomized BaseboardDesign Requirements

Technical Consulting Commercial Consulting Logistical Consulting Technical Consulting Commercial Consulting Logistical Consulting

Thanks for your Attention!