thermal management at the extremes -...

Ken GoodsonRobert Bosch Department Chair

Stanford Mechanical Engineering

Thermal Managementat the Extremes

SF Bay Area Nanotechnology CouncilSeptember 17, 2013

ABC News October 2011

“Hot” electronics are in the news…

NY Daily News 2010March 2012

MacWorld June 2012

transportation defense

energy efficiency

hotspot mitigation

materials integration

appliances

informationHeat & Energy Challenges


appliances


Faculty & StaffProf. Goodson (Stanford), PIProf. Nolas (USF)Dr. Boris Kozinsky (Bosch)Dr. Winnie Wong-Ng, NIST Functional Properties GroupDr. Yongkwan Dong, USF Department of PhysicsStudents:Michael Barako, Saniya Leblanc, Yuan Gao, Amy Marconnet

Bosch

Stanford

DOE-NSF Thermoelectrics Partnership

Vehicle Waste Heat Recovery

Stanford

LogicMemoryMemory

Chip Carrier

3D StackingInterfaces

IBM‐3M Press ReleaseSeptember 2011

Nanostructured materials targeting unique combinations of electrical, thermal, mechanical properties• Mechanically Compliant Thermal & Electrical

Conductors.• Phase Change Energy Storage to Reduce Case

Temperature.• Controllable Anisotropic Electrical and Thermal

Properties.

Underfill Filler

Nano Packaging Materials:From 3D to Portables

AlGaN

Diamond50 nm

DARPA Near Junction Thermal Transport (NJTT)

Extreme Conduction Cooling

400 nm

3D Routing of Liquid and Vapor

100m

Spreading by Etched Diamond Channels

DARPA Convection Limits (ICECool 1 + 2)

Convection Cooling LimitsPhase Separation

by Nanostructured Capping Film

Faculty & StaffProf. Goodson (Stanford), PIProf. Martin Fisher (Stanford)Students:Marc Dunham, Michael Barako, Saniya Leblanc

Analog Devices – Bosch – DOE - NSF

Energy Scavenging Sensorsfor Smart Buildings

Optimization Countours

• Smart Buildings bring multitudes of sensors and wiring.

• TE energy scavenging from heat sources (HVAC, water, windows) allows “truly wireless” sensor networks.

• Low power, low temperature TE conversion demands revolutionary new materials and design.

Lifelink.com

Selected AlumniProf. Dan Fletcher UC Berkeley Dr. Jeremy Rowlette Daylight SolnsProf. Evelyn Wang MIT Dr. Patricia Gharagozloo Sandia LabsProf. Katsuo Kurabayashi U. Michigan Dr. Per Sverdrup IntelProf. Sungtaek Ju UCLA Dr. Chen Fang Exxon-MobileProf. Amy Marconnet Purdue Dr. Milnes David IBMProf. Bill King UIUC Dr. Saniya Leblanc Alphabet En.Prof. Eric Pop UIUC (Stanford) Dr. Roger Flynn IntelProf. Sanjiv Sinha UIUC Dr. Julie Steinbrenner Xerox ParcProf. Xeujiao Hu Wuhan Univ. Dr. John Reifenberg Alphabet En.Prof. Carlos Hidrovo UT Austin Dr. David Fogg CreareProf. Kaustav Banerjee UCSB (EE) Dr. Matthew Panzer KLA-TencorProf. Ankur Jain UT Arlington Dr. Yuan Gao OracleProf. Sarah Parikh Foothill College Dr. Joe Miler ARPA-E

Current Group Ken GoodsonWoosung Park Elah Bozorg-Grayeli Ken LopezMichael Barako Tom Dessault Matt HoffmanShilpi Roy (EE) Sri Lingamneni Dr. Saniya LeBlancJoe Katz (EE) Aditya Sood (MSE) Dr. Takashi KodamaJungwan Cho Marc Dunham Dr. Yoonjin WonJena Barnes Maneeshika Madduri Dr. Damena Agonafer

Consulting Prof. Mehdi Asheghi

Restrict the transport lengthscale using nanofabrication

Restrict the transport lengthscale using high speed optics

Nano Thermal Metrology

Sample Complexity

Rig

Com

plex

ity

How do we “see” nano

thermal transport?

Sample Complexity

Rig

Com

plex

ityNano Thermal Metrology

Students: Yoneoka, Li, KodamaNano Letters (2012b)

Kodama, Jain, Goodson,Nano Letters 9 (2009)


Electrons in Metal NanofilmsYoneoka, Lee, et al., 2012b, "Electrical and Thermal Conduction in ALD

Nanobridges Down to 7-nm Thickness," Nano Letters, 12, 683-686.

Sample Complexity

Rig

Com

plex


Students: Li, Lee, KodamaNano Letters (2012a)


Kodama, Jain, Goodson,Nano Letters 9 (2009)

5 nm

a-Si (2.2 nm)

Poly-Mo (2.6 nm)a-MoSi2 (0.7 nm)

a-MoSi2 (1.3 nm)

10 0

10 1

10 2

10 3

20 40 60 80 100

Ther

mal

con

duct

ivity

(Wm

-1K

-1)

300

ds=1.6 m

100 nm

20 nm

0.42 m

0.8 m

Bulk

Temperature (K)Asheghi, Goodson, et al., Applied Physics Letters 71 (1997)Asheghi, Goodson, et al., J. Heat Transfer 120 (1998)Liu and Asheghi, J. Heat Transfer 120 (2006)

ThermalConductivity

(W m-1 K-1)

Marconnet, Asheghi, Goodson, “From the Casimir Limit to Phononic Crystals: 20 Years of Phonon Transport Studies using SOI Technology,” J. Heat Transfer (2013)

Phonons in Silicon Nanofilms

defect

lattice wave

phonon

dphonon

es

bulk dECvkmod

2

31

,dFbulkfilm

Spectral Fuchs-Sondheimer Model

Spectral Fuchs SondheimerModel

Electrons & Phonons in FinFETS

Intel (2012)

VOL. 94 (2006)

Phonon

tSi

Boundary Scattering

BranchNonequilibrium

Phonon Emission

Intel (2012)

T eff

(K)

finFET position (nm)

g-LO

diffusionall LO

Electrons & Phonons in FinFETS

IEEE TRANS. ELECTRON DEVICES (55) 2008

Coupled Electron Monte Carlo &Phonon BTE in 20 nm finFET

SRC e-Workshop 2013 – Task 2308

<http://www2.imec.be><http://www.intel.com>

SRC Task 2308: Thermal Properties Beyond the 11nm Node

<Device> <Interconnect>

Non‐planarTop/Bottom SideWall

<www.realworldtech.com>

Sample Complexity

Rig

Com

plex


Students: Li, Lee, KodamaNano Letters (2012a)


Student: Marconnet, BarakoACS Nano (2011)

SiC / Diamond

GaN

12 ps pumpdelayed probe

Students: Cho, Bozorg-Grayeli, Rowlette, ReifenbergPhysical Review B (2009)Electron Device Letters (2010,2011,2012)

CNT Forest

Metal

Metal CNT Catalyst

TransparentSubstrate

Nanotube FilmsStudents: Panzer,

Gao, Marconnet

Rev. Modern Physics (2013)ACS Nano (2011)

Nanoletters (2010)

Thermal Pump-Probe Sample Design

Electron-Phonon Interfaces

NanoPhotonicCrystals

Students: Rowlette, Kekatpure,Marconnet

Physical Review B (2009)diamond

Si

Dual-SidedTDTR

Diamond FilmsStudents: Bozorg-Grayeli, Sood, Cho

Applied Physics Letters (2013) J. Applied Physics (1996)

With Brongersma Group, MSE

Students: Lee,Chen,Jeyasingh,

Bozorg-Grayeli, Li, Reifenberg

Electron Device Letters (2008, 2010, 2011)

Proc. IEEE (2010)

Diamonds: 150 nm Ge2Sb2Te5

Triangles: 30 nmfcc

0.00 50 100 150 200 250 300 350

0

50

100

150

200

250

300

Boundary Resistance [m2K/G

W]

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Thermal Con

ductivity

[W/m

K]

Annealed Temperature [°C]

amorphous

kmin

kelectrons(WFL)

Electrons & Phonons in GeSbTeLee, Wong, Goodson, et al., Applied Physics Letters 2013

hcp

Electrons, Phonons, and Neurons:Conversion with Chalcogenides

Thermoelectric conversion in a phase change cell1,2,5

Phase distributions in a phase change memory cell2,3

1Lee, Asheghi, Goodson NANOTECHNOLOGY (2012)2Li, Wong, Goodson, et al., TRANS. ELECTRON DEVICES (2012)3Kuzum, Jeyasingh, Wong, et al. NANO LETTERS (2012)4Kuzum, Jeyasingh, Wong, et al. TRANS. ELECTRON DEVICES (2012)5Wong, Asheghi, Goodson, et al. PROCEEDINGS OF THE IEEE (2010)6Acharya et al., MECHANICAL ENGINEERING (2013)

NanoThermal Synapse3-4

Philip Wong, Stanford EE

0.01

0.1

1

10

100

1,000

1,000 10,000

Mass Density (kg m-3)

diamond

silicon

amorphoussilicon dioxide

polyimideporousxerogel

Crystalline

Disordered

copperSiC

Thermal Conductivity

(W m-1 K-1)

available materials

Layered 2DWSe2 Crystals [2]

multilayeramorphous [1]

1. Costescu et al., Science 303 (2004)2. Chiritescu et al., Science 315 (2007)

Extreme Property CombinationsGoodson, Science 315 (2007)

??

Thermal Properties of Aligned Carbon Nanotube Films

Thermal Conductivity

1 W/mK

100 W/mK

Volume fraction

Marconnet, Panzer, Goodson, Reviews of Modern Physics (2013)

Amy Marconnet

Molecular Simulation,with Prof. Wei Cai,Student: Yoonjin Won, Stanford ME

In Search of “Radically NewProperty Combinations” Goodson, Science 315 (2007)

Mechanical & Thermal Properties of Aligned CNT Films

750 µm

50 µm

Thermal MechanicalPump Laser Doppler

Vibrometer (LDV)

Piezoelectric Shaker

Probe

Si substratePolysiliconOxideAl2O3FeCNT

Students: Yoonjin Won, Yuan Gao, Matt Panzer, Amy Marconnet,PIs: Profs. Kenny & Goodson, Carbon (2012)

MEMS Resonator

Substrate

Drain

Gate

Source

Towards 30kW/cm2 for GaN HEMT Radar

Special Thanks to Avi Bar-Cohen and Joe Maurer,

DARPA MTO

What are the extreme limits

of thermal management?

INDIUM-PHOSPHATE EPITAXIAL

LIFT-OFF THIN FILM

100 µm

1.5 µm

100 µm

100 - 600 µm

ACTIVE REGION

CVD DIAMOND MICROCHANNEL

HEAT SINK

GaInAsP/InP LASER DIODE ARRAY

4 mm2 µm 100 µm

100 µm

= 2 = 2

=

=

AW XL

2d

1d

= cH

= cw = ww

THIN METALLIC BACK CONTACT

Stanford Compact Heat Exchanger History

Fabian Pease

Goodson, Kurabayashi, and Pease,Trans. Components Packaging,

Manufacturing Technology B20 (1997)

Lou London

Bill Kays

David Tuckerman

400 nm

3D Routing of Liquid and Vapor

100m

Spreading by Etched Diamond Channels

DARPA Convection Limits (ICECool 1 + 2)

Nanostructured Heat SinksPhase Separation

by Nanostructured Capping Film

2000 2002 2004

DARPA fundingIntel

AppleAMD

Research Background

Trajectory of a Startup (Cooligy)

Zhou et al., Proc. SEMITHERM 2004, Proc. ITHERM 2004

Si chip

Fluidinlet

Outlet Thermalattach3D

CooligyStartup(VC funding)

Apple G5 Production run100K+ Units

MicroCoolers for Computers

AcquisitionBy Emerson

2006 2008

~600W total~ 1kW/cm2

LiquidCoolingChallenge

Vapor Escape Microfluidic HXPrototype

Vapor-transmitting membrane reduces pressure drop and instabilities along two-phase micro HX.

Latest data show 60% pressure drop and nearly 50% drop in excess temperature over inlet saturation.

2 ml/min, G = 103 kg/s/m2

0

5

10

15

20

25

0 10 20 30 40 50 60 70Eff. Heat Flux [W/cm2]

Ptot / P lo

ControlVentSIM ControlSIM Vent

International Journal of Heat and Mass Transfer (2011)

International Journal of Multiphase Flow (2011)

Students: Milnes David, Roger Flynn, Julie Steinbrenner, Chen Fang, Joe Miler

Video slowed 2000XAir injectionV = 1.78 m/s

LiquidV = 0.63 m/s

0

0.10.2

0.30.4

0.5

0.60.7

0.80.9

1

0 2 4 6 8 10

V liq[m

/s]

Vair [m/s]

Annular

Stratified

Slug‐Annular

Bubbly& Wavy

Wavy‐Stratified

Vapor Escape I (2001-2010): Challenges .David, Miler, Steinbrenner, Goodson, et al., "Hydraulic and Thermal Characteristics of a Vapor Venting Two-phase

Microchannel Heat Exchanger," International Journal of Heat and Mass Transfer (2011)

Vapor Escape II 2012 – Strict, Nanostructured Phase Separation

vapor escape

Micro Porous Copper Liquid

Delivery

diamond wall

NanoporousLiquid Burst

Cap

400nm

Langmuir‐Blodgett Spheres

Outreach to K‐12 and Undergraduates

Jena BarnesMaterials Science & Engineering ‘13Synthesis and Characterization of ZnO Nanowire Films• Presented at national materials

science conference• Accepted fellowship to pursue

PhD in materials science at Duke University

Maneeshika MadduriElectrical Engineering ‘13Thermal Characterization of ZnONanowire Films• Accepted into Sandia National

Laboratory Master’s Fellowship Program

Undergraduates: K‐12 students & teachers:

Partnering with public highschool to provide materials and mentors for design lab.

Last-Minute VC Demo, 2001Microchannel Chip

Electroosmotic Pump

Heat Rejecter Coil & Plate

Sony VAIO Laptop Demo

Shulin Zeng with help from Evelyn Wang, Linan Jiang, and Abdullahel Bari (Stanford)


appliances


Selected AlumniProf. Dan Fletcher UC Berkeley Dr. Jeremy Rowlette Daylight SolnsProf. Evelyn Wang MIT Dr. Patricia Gharagozloo Sandia LabsProf. Katsuo Kurabayashi U. Michigan Dr. Per Sverdrup IntelProf. Sungtaek Ju UCLA Dr. Chen Fang Exxon-MobileProf. Amy Marconnet Purdue Dr. Milnes David IBMProf. Bill King UIUC Dr. Saniya Leblanc Alphabet En.Prof. Eric Pop UIUC (Stanford) Dr. Roger Flynn IntelProf. Sanjiv Sinha UIUC Dr. Julie Steinbrenner Xerox ParcProf. Xeujiao Hu Wuhan Univ. Dr. John Reifenberg Alphabet En.Prof. Carlos Hidrovo UT Austin Dr. David Fogg CreareProf. Kaustav Banerjee UCSB (EE) Dr. Matthew Panzer KLA-TencorProf. Ankur Jain UT Arlington Dr. Yuan Gao OracleProf. Sarah Parikh Foothill College Dr. Joe Miler ARPA-E

Current Group Ken GoodsonWoosung Park Elah Bozorg-Grayeli Ken LopezMichael Barako Tom Dessault Matt HoffmanShilpi Roy (EE) Sri Lingamneni Dr. Saniya LeBlancJoe Katz (EE) Aditya Sood (MSE) Dr. Takashi KodamaJungwan Cho Marc Dunham Dr. Yoonjin WonJena Barnes Maneeshika Madduri Dr. Damena Agonafer

Consulting Prof. Mehdi Asheghi

thermal management at the extremes -...

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