thermal properties of copper tungsten with …thermal properties of copper tungsten with copper via...
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THERMAL PROPERTIES OF COPPER TUNGSTEN WITH COPPER VIA COMPOSITE
Junkun Ma1; Adam Parker1, Keng Kuan2 1Southeastern Louisiana University 2 Torrey Hills Technology, LLC. October 14, 2011
Presented at the 2011 COMSOL Conference
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Introduction
CuW has been around for a long time The 1st patent was issued to Paul Schwarzkopf in
1932 (Germany) As product, CuW has been mature in production
for the last 30+ years
Can we improve CuW’s thermal conductivity?
Can we make a ‘SUPER’ CuW?
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Goal
To develop a CuW heat sink material that has higher thermal conductivity (TC)
Control coefficient of thermal expansion (CTE)
Material CuW Cu
Thermal Conductivity 175[W/(m*K)] 400[W/(m*K)]
Coefficient of Thermal Expansion 7.57E-6[1/K] 17.0E-6[1/K]
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Inspiration
Thermal Via
http://nesl.ee.ucla.edu/courses/ee202a/2003f/submissions/hw2/SEYED_TABATABAEI/images/thermal%20VIABGA%202.gif
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Our Approach
CuW Matrix with an array of Cu Via composite
CuW Matrix
Chip
Cu Via
Due to Symmetry, the model can be reduced to a quarter with dimension
of 25.0mm X 25.0mm X1.0mm with 25W power as shown below:
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COMSOL® Model
Flange Material CuW85 Cu
Thermal Conductivity 175 W/(m*K) 400 W/(m*K)
Simulation Environment COMSOL 3.5a on Windows 7
Chip Size & Power Si (50.0mm X 50.0mm X 1.0mm) 100W
Fixing Method Bolt Down
Heat Transfer Coefficient
Between Flange & Heat Sink 3000 W/(m^2*K)
Heat Sink Temperature 348.15 K (75 0C)
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Simulated Effective Thermal Conductivity
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Simulated Effective CTE
7.44 7.77
8.42 9.14
10.43
11.88 12.44
12.85
0
4
8
12
16
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
Eff
ecti
ve
CT
E (
1/K
)
Via Diameter (mm)
Effective CTE vs. Via Diameter
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Experiment
Sample fabrication was done at the manufacturing facility located in Yixing, China of our industrial partner -Torrey Hill Tech., Inc.
TC and CTE tests are done by Netzsch Shanghai
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Experiment – Fabrication Process
Dry Press CuW Powder Pretreatment
Deburring Machining Coarse Lapping Machining
QA Annealing Ni Plating Fine Lapping
Pre-sintering Cu Infiltration
Via machining
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Equipment for Fabrication
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Specimen
CuW with 0.7mm Cu Vias
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Results – TC of Pure CuW
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Results – TC of CuW with 0.7mm Vias
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Results – CTE of CuW with 0.7mm Vias
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Conclusion
For CuW with 0.7mm Cu Vias, TC is approximately 200 W/mK vs. 175 W/mK for pure CuW, which represents14% improvement on TC
CTE of CuW with 0.7mm Cu Vias was measured to be 7.68ppm, which is similar to that of pure CuW 7.57ppm
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Future
CuW with non-uniformly distributed Cu Vias with different size
CuW/Cu multilayer composite with Cu Vias CuW with graphite Vias
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Acknowledgement
Torrey Hills Technologies, LLC. •Equipment
•Furnaces, •Electronics packaging •SMT •Solar cell •Other
•Three roll mills •Components
•CuW, CuMo, W, Mo etc. heat sinks •Various metal parts
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Questions?