tlv320aic3263evm-u user guide - ti
TRANSCRIPT
TLV320AIC3263EVM-U Evaluation Module
User's Guide
Literature Number: SLAU528
June 2013
Contents
1 EVM Overview .................................................................................................................... 41.1 Features ...................................................................................................................... 41.2 Introduction .................................................................................................................. 41.3 Getting Started .............................................................................................................. 4
2 AIC3263 CC Software ........................................................................................................... 52.1 Installation .................................................................................................................... 52.2 Graphical User Interface (GUI) ............................................................................................ 6
2.2.1 Main panel window ................................................................................................ 62.2.2 Typical Configuration .............................................................................................. 62.2.3 Command Line Interface Panel .................................................................................. 82.2.4 Register Inspector .................................................................................................. 9
A TLV320AIC3263EVM-U Default Jumper Locations .................................................................. 11
B TLV320AIC3263EVM-U EVM Schematics .............................................................................. 13
C TLV320AIC3263EVM-U EVM Layout Views ............................................................................ 19
D TLV320AIC3263EVM-U Bill of Materials ................................................................................ 22
E Writing Scripts .................................................................................................................. 28
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www.ti.com
List of Figures
2-1. Main Panel ................................................................................................................... 6
2-2. Example Configurations Window ......................................................................................... 7
2-3. Analog Outputs Window ................................................................................................... 7
2-4. Command Line Window.................................................................................................... 8
2-5. Command Line Window.................................................................................................... 9
2-6. Register Inspector Window ................................................................................................ 9
B-1. TLV320AIC3263YZF ...................................................................................................... 13
B-2. TAS1020B USB Controller ............................................................................................... 14
B-3. Data, Sample Rate Converter ........................................................................................... 14
B-4. Data and Clocks ........................................................................................................... 15
B-5. LDO Supplies, Analog Supplies, Digital Supplies, and Analog Inputs.............................................. 16
B-6. Headphone Amplifier, Class D Amplifier, and Receiver Amplifier................................................... 17
B-7. Digital ....................................................................................................................... 18
B-8. Analog and Digital Interface Connectors ............................................................................... 18
C-1. Silkscreen Top ............................................................................................................. 19
C-2. Silkscreen Bottom ......................................................................................................... 20
C-3. Routing...................................................................................................................... 21
PurePath is a trademark of Texas Instruments.Windows is a registered trademark of Microsoft Corporation.I2C is a trademark of Philips Semiconductor Corp.
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Chapter 1SLAU528–June 2013
EVM Overview
This user’s guide describes the operation, use, features and characteristics of the TLV320AIC3263EVM-U.
1.1 Features
• Full featured EVM with the TLV320AIC3263 Audio Codec
• USB connection to PC provides power, control and streaming audio for quick evaluation
• Easy-to-use AIC3263 Codec Control (CC) software provides graphical user interface to configure andcontrol AIC3263
1.2 Introduction
This specific evaluation module (EVM) is a programmable USB audio device that features theTLV320AIC3263 Audio Codec with miniDSP.
1.3 Getting Started
1. Download the CC software located in the EVM product folder on the web.
2. Connect the EVM to USB port, LED lights LED1 and LED2 should illuminate once the EVM is detectedby Windows® PC. Also, in the Windows Device Manager, the EVM should be recognized as a USBcomposite device, a USB audio device and an HID-compliant device.
3. Connect the headphones to jack J14.
4. Open CodecControl.exe and click View → Example Configurations…
5. Select HP Playback and click ProgramCodec.
• The list of I2C™ commands for this configuration is available in the Script tab.
6. Play audio through any media tool. Make sure that the playback (and recording) device is USB-miniEVM in the Windows control panel.
• To adjust playback volume, open Sound in control panel, select the USB-miniEVM device and clickproperties.
• Similarly, the other example configurations can be tried and sound can be recorded using themicrophone available on the board.
7. Install jumpers on the EVM as per the requirements to make the right signal connections.
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Chapter 2SLAU528–June 2013
AIC3263 CC Software
This section provides setup instructions for the AIC3262 EVM control software.
2.1 Installation
1. Download the AIC3263 EVM control software located in the TLV320AIC3263 product folder.
2. Open the self-extracting installation file, and extract contents to a known folder.
3. Install the software by double clicking the CodecControl.exe and follow the directions.
4. Connect the EVM to a USB port using a cable and open up the control software. If prompted, selectthe appropriate EVM name.
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Refresh button
Status
Graphical User Interface (GUI) www.ti.com
2.2 Graphical User Interface (GUI)
2.2.1 Main panel window
Figure 2-1. Main Panel
The main panel, shown in Figure 2-1, provides a high-level block diagram of AIC3263. On the main panel,users can configure the analog input and output routings by simply clicking on the switches. The analogsetup, digital setup, audio inputs, audio outputs, DRC, AGC, SAR and headset detection provideadditional control of many registers and other features of the AIC3263. The user can click on the coloredblocks on the main panel to gain access to these categories (intended for advanced users). Left ADC andRight ADC blocks provide the detailed settings for device analog input, whereas Left DAC and Right DACblocks provide the detailed settings for device analog output. The yellow block in the middle providessettings for the digital interface.
The Refresh button on the top reads the current state of the AIC3263 register settings and reflects it onthe user interface. The EVM status, which reflects the hardware connection of the EVM, is shown on thebottom of the main panel. USB Fs reflects the current sample rate of the EVM.
2.2.2 Typical Configuration
The AIC3263 control software provides example scripts for typical playback and record applications.These configurations can be accessed by choosing Example Configurations… under View. Once thetypical configuration is selected, click ProgramCodec to download the script into the EVM.
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www.ti.com Graphical User Interface (GUI)
Figure 2-2. Example Configurations Window
In Figure 2-3, the checked boxes show enabled functions after programming the HP Playback from theabove example configurations. Similarly, if the device is programmed using PurePath™ Studio (a tool forprogramming TI miniDSP enabled devices), these window controls can be updated by pressing theRefresh button in the control software.
Figure 2-3. Analog Outputs Window
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Graphical User Interface (GUI) www.ti.com
2.2.3 Command Line Interface Panel
Figure 2-4. Command Line Window
The command-line interface allows users to communicate with the TLV320AIC3263 using a simplescripting language (described in Appendix E). The TAS1020B USB controller handles all communicationbetween the PC and the codec. A script is loaded into the command buffer, either by loading a script fileusing the Open button or by pasting text from the clipboard. Click Run to execute the command buffer.
All controls update their status with respect to the register contents in the following conditions:
• Whenever a panel is open by selecting from View menu
• The Run button in the command-line interface is pressed
• The Refresh button on the main panel window is pressed
The Decode function is a feature in the command-line interface. When the Decode button is clicked, thescript is decoded line by line, and the decoded content can be cleared by clicking ClearDecoded. Thisdecode feature provides users an easy method of understanding the script without referring to the registermap.
The Record function is another feature in the command-line interface. The command window records allregister writes sent to the codec when the Record box is checked. The recorded register values along withtheir page numbers are displayed in the command buffer. The recorded register values can also bedecoded by clicking the Decode button on the command-line interface window. Pressing the Clear buttonclears the content of the command buffer.
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www.ti.com Graphical User Interface (GUI)
Figure 2-5. Command Line Window
2.2.4 Register Inspector
Figure 2-6. Register Inspector Window
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Graphical User Interface (GUI) www.ti.com
The contents of the TLV320AIC3263 register map can be accessed through the Register Inspector. ThePage number control selects the page to be displayed in the register table. The register table containsinformation such as register name, current register value and the bit field of the current register value.Specify the page number when using the register inspector table. Once the page is specified, the registervalue can then be inspected or changed by either entering the hex value of the register or changing thecorresponding bits for that register.
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Appendix ASLAU528–June 2013
TLV320AIC3263EVM-U Default Jumper Locations
Jumper Color Position
W1 Red Shorted
W2 Red Shorted
W4 Red Shorted
W5 Red Shorted
W6 Red Shorted
W7 Red Shorted
W8 Red Not_Installed
W9 Red Shorted
JP1 Black Not_Shorted
JP2 Black Not_Shorted
JP7 Black Not_Shorted
JP8 Black Not_Shorted
JP9 Black Not_Shorted
W10 Red Shorted
W12 Red Shorted
W13 Red Shorted
JP10 Blue Shorted
JP15 Blue Not_Shorted
JP19 Black Not_Shorted
JP20 Black Shorted
JP24 Black Not_Shorted
JP25 Black Not_Shorted
JP26 Black Not_Shorted
JP27 Black Shorted
JP39 Black Shorted
JP40 Black Shorted
JP51 Black Shorted
JP52 Black Not_Shorted
JP60 Black Shorted
JP61 Blue Shorted
JP62 Blue Not_Shorted
J1 Black 1-2
J2 Black 1-2
J17 Blue 2-3
J18 Blue 2-3
J19 Blue 2-3
J20 Blue 2-3
JP28 Blue 2-3
JP29 Blue 2-3
JP30 Blue 2-3
JP31 Blue 2-3
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Appendix A www.ti.com
Jumper Color Position
JP32 Red 1-2
JP33 Black Not_Shorted
JP34 Black Not_Shorted
JP35 Blue 1-2
JP36 Blue 1-2
JP37 Red 1-2
JP38 Red 2-3
JP41 Blue 2-3
JP42 Blue 2-3
JP43 Blue 2-3
JP44 Blue 2-3
JP45 Blue 2-3
JP46 Blue 2-3
JP47 Blue 2-3
JP49 Blue 2-3
JP50 Red 1-2
JP53 Black 1-2
JP54 Black 1-2
JP55 Red 2-3
JP57 Red 1-2
JP58 Red 2-3
12 TLV320AIC3263EVM-U Default Jumper Locations SLAU528–June 2013Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
IOVSS
SCL
HPLHPVDD_18
I2C_ADDR/SCLK
SDA
GPIO5
VNEG
HPVSS_SENSE
AVSS2
GPIO6 GPO1
SPI_SELECT
CPFCM
CPVSS
DOUT3
BCLK3
IOVDD3
CPFCP
CPVDD_18
GPIO3
WCLK3
DIN3
LOL AVDD4_18
DIN2
WCLK2
LOR
AVSS4
SPK_V
VBAT
DOUT2
GPIO4
DVDD
SPKP
SVDD SVSS
SPKM
DVDD DVSS
DVSS
BCLK2
IOVDD2
IOVSS
YZF 81 BALL, Top View
TLV320AIC3263YZF
987654321
A
B
C
D
E
F
G
H
J
ANALOGINPUTS
ASI#3
B
A OPTICALAUDIO OUTPUT
SRC #2
OPTICALAUDIO INPUTI2C
SRC4392
6 WIREAUDIO I/F
TAS1020B
SRC4392ASI#2
ASI#1
I2C & SPI
I2C
AUDIO CONTROL
I2C & SPICONTROL INTERFACE
USB CONTROLLER
ANALOGOUTPUTS
OPTICALAUDIO INPUT
SRC #1 OPTICALAUDIO OUTPUT
I2S #1AUDIO INTERFACE
A
B
DVDD
DVSS
AVSS1
RECVSS
AVDD2_18
HPR
IOVDD1
RESETz
DIN1 WCLK1
DVSS
AVSS AVSS3
RECVDD_33
RECM
GPIO2
DOUT1BCLK1
IN2R
IN3L
IN1L_AUX1VREF_SAR IN4R
AVDD1_18
MBIAS_VDD
RECP
GPIO1MCLK
AVDD_18IN2L
IN3R
IN1R_AUX2VREF_AUDIO
IN4L
MICDET
MBIAS_EXT MBIAS
I2S #2AUDIO INTERFACE
I2S #3AUDIO INTERFACE
Appendix BSLAU528–June 2013
TLV320AIC3263EVM-U EVM Schematics
Figure B-1. TLV320AIC3263YZF
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+3.3VIO
SRC1_RXCXO
SRC2_MCLK
SRC1_RDYz
+1.8VIO
TAS_SCL
TAS_SDA
RESETz
SRC1_MCLK
+3.3VIO
+3.3VIO
WCLK2
BCLK2
IOVD2
DIN2
+3.3VIO
SRC1_LOCKz
I2S2_DOUT_SRC
+3.3VIO
SRC2_RXCXO
SRC1_MCLK
SRC2_RDYz
+1.8VIO
SRC2_MCLK
+3.3VIO
+3.3VIO
DOUT3
WCLK3
BCLK3
IOVD3
DIN3
+3.3VIO
SRC2_LOCKz
+3.3VIO
+3.3VIO
+3.3VIO
+3.3VIO
+3.3VIO
+3.3VIO
+3.3VIO
+3.3VIO
TAS_DIN
TAS_WCLK
TAS_BCLK
DOUT2
WCLK1
BCLK1
IOVD1
DOUT1
+3.3VIO
+3.3VIO
DIN1I2S1_DOUT
I2S3_DOUT_SRC
GN
D
GN
D
GNDGND
GNDGND
GN
D
GND GND GND
GND
GND
GN
D
GN
D
GNDGND
GND
GND
GND
GN
D
GN
D
GN
D
GN
D
GNDGND
GNDGND
GN
D
GND GND
GND
GND
GN
D
GN
D
GNDGND
GND
GNDGND
GND
GN
D
GN
D
0.1ufd/16V
C18
0.1ufd/16V
C9
10ufd/6.3V
C89
0.1ufd/16V
C31
10ufd/6.3V
C94
0.1ufd/16V
C16
0.1ufd/16V
C10
10ufd/6.3V
C88
0.1ufd/16V
C30
0.1ufd/16V
C35
0.1ufd/16V
C39 0.1ufd/16V
C38
10K/5%R43
0
R15
0
R16
0.1ufd/16V
C19
0.1ufd/16V
C11
10ufd/6.3V
C90
0.1ufd/16V
C40
10ufd/6.3V
C100
0.1ufd/16V
C21
0.1ufd/16V
C12
10ufd/6.3V
C91
0.1ufd/16V
C43
0.1ufd/16V
C42
0.1ufd/16V
C45 0.1ufd/16V
C44
10K/5%R115
0
R17
0
R18
4.7
K/5
%R62
10
K/5
%
R25
4.7
K/5
%R60
10ufd/6.3V
C184
GND
10ufd/6.3VC185
1k
R23
1k
R24
GND
GN
D
GN
D
0.1ufd/16V
C186 0.1ufd/16V
C187
10K/5%
R116
13
1
2
3
4
5
6
7
8
9
10
11
12
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
SRC4392IPFBR
U12
1
2
3
TORX147PL(F,T)
U15
OUT
Vcc
GND
SHIELD
3
2
1
U18
TOTX147PL
VCC
INPUT
GND
SHIELD
14
13
12
11
10
9
8 7
6
5
4
3
2
1
U22
TXS0104EPWR
B4
NC
OE GND
NC
A4
B3
B2
B1
VCCB
A1
A2
A3
VCCA
SRC4392IPFBR
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
12
11
10
9
8
7
6
5
4
3
2
1
13
U14
TORX147PL(F,T)
3
2
1
U16
OUT
Vcc
GND
SHIELD
1
2
3
U19
TOTX147PL
VCC
INPUT
GND
SHIELD
1
2
3
4
5
6
78
9
10
11
12
13
14
U23
TXS0104EPWR
B4
NC
OE GND
NC
A4
B3
B2
B1
VCCB
A1
A2
A3
VCCA
U47
1
2
3
4
5
6
78
9
10
11
12
13
14
TXS0104EPWR
B4
NC
OE GND
NC
A4
B3
B2
B1
VCCB
A1
A2
A3
VCCA
RESETz
+3.3VIO
+3.3VIO
+3.3VIO
+3.3VIO
TAS_MCLK
TAS_WCLK
+3.3VIO
TAS_MISO
TAS_MOSI
TAS_SSz
TAS_SCLK
+3.3VIO
I2S_ENABLE
TAS_SDA
TAS_BCLK
TAS_DIN
+3.3VIO
+3.3VIO
TAS_SCL
ASI_S0
+3.3VIO
ASI_S1
I2S3_DOUT_SRC
+3.3VIO
DUT_RESETz
TAS_DOUT
I2S2_DOUT_SRC
I2S1_DOUT
+5V
GN
D
GND GND
GND
GNDGND
GN
DG
ND
GN
D
GND
GND
GND
GN
D
GN
D
GN
D
GN
DG
ND
GND
GN
DG
ND
GND
GND
GN
D
GND
GND
GND
GND
GN
D
GN
D
GN
D
GND GND
GND
GND
GND
GND
1.50K
R1
27.4
R2
27.4
R3
47pfd/50V
C1
47pfd/50V
C2
100KR4
1.0ufd/16V
C7
12
S4
0.1ufd/16V
C23
0.1ufd/16V
C25
6MHz/3.3V
4
3 2
1Y1
SIT8002AI-13-33E-6.00000T
0.1ufd/16V
C24
0.1ufd/16V
C27
0.1ufd/16VC26
21
S1
0.1
ufd
/50V
C85
10K/5%R8
10K/5%R9
1 2
S2
0.1ufd/16V
C29
0.1
ufd
/50V
C86
21
S3
10K/5%R10
Yellow/2.0V
LE
D1
649R58
Yellow/2.0V
LE
D2
649R59
10K/5%R7
120TAIL
JP10
1 2
0.1ufd/16V
C28
0.1ufd/16V
C41
R63
1000pfd/50V
C102
100pfd/50V
C103
10K/5%R28
2.7K/5%
R88
2.7K/5%
R87
120TAIL
JP15
2
1
0.1
ufd
/50V
C84
10K/5%R29
USB MINIB
11
10
9
8
7
6
5
4
3
2
1
J12
UX60-MB-5ST
4.7K/5%
R103
120TAIL
JP61
1
2
GND
4.7K/5%
R121
SN74LVC1G126DBVR
3
5
4
2
1
U9
16
15
14
13
12
11
10
98
7
6
5
4
3
2
1
U35
SN74CBTLV3253DBQR
U2
TAS1020BPFB
2116 23 242220191817151413
7
8
9
10
11
12
6
5
4
3
2
1
25
26
27
28
29
30
31
32
33
34
35
36
38 3739404142434445464748
512K
U44
8
7
6
54
3
2
1
24FC512-I/MF
DUT RESET
APP
PATCH
USB RESET
USB INPUT
Appendix B www.ti.com
Figure B-2. TAS1020B USB Controller
Figure B-3. Data, Sample Rate Converter
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+3.3VIO
SRC1_LOCKz
SRC1_RDYz
+3.3VIO
SRC2_LOCKz
SRC2_RDYz
+3.3VIO
CLK2_DIV_S0 CLK2_DIV_S1
+3.3VIO
SRC2_MCLK_S0
+3.3VIO
CLK1_DIV_S0 CLK1_DIV_S1
+3.3VIO
SRC1_MCLK_S0
SRC1_MCLK
SRC2_MCLK
TAS_MCLK
+3.3VIO
MCLK_S0
IOVD1
MCLK_S1
MCLK_SEL
SRC2_MCLK_S1
SRC1_MCLK_S1
+3.3VIO
+3.3VIO
+3.3VIO
+3.3VIO
+3.3VIO
+3.3VIO
MCLK
SRC1_RXCXO
SRC2_RXCXO
SRC2_MCLK
SRC1_MCLK
TAS_SCL
TAS_SDA
+3.3VIO
RESETz
CLK1_DIV_S0
CLK1_DIV_S1
CLK2_DIV_S0
CLK2_DIV_S1
MCLK_S0
MCLK_S1
MCLK_SEL
SPI_SELECT
6Wire1_EN
I2C_ADDR_SEL
TAS_MCLK
ASI_S0
ASI_S1
SRC1_MCLK_S0
SRC1_MCLK_S1
SRC2_MCLK_S0
SRC2_MCLK_S1
GND
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GN
D
GND GND
GND
GN
D
GN
D
GN
D
GN
D
GN
D
GND GND
GND
GN
D
GN
D
GND GNDGND
GN
D
GN
D
GN
D
GND
GND
357
R69
Green/2.0V
LED8
357
R64
Green/2.0V
LED3
357
R65
Green/2.0V
LED4
357
R66
Green/2.0V
LED5
24.576MHz
1
2 3
OSC1
SM7745HSV-24.576M
4
0.1ufd/16V
C53
10K/5%
R31 10K/5%
R30
10K/5%
R51
0.1ufd/16VC56
0.1ufd/16V
C55
10K/5%
R35 10K/5%
R34
10K/5%
R52
22.5792MHz
1
2 3
4
OSC2
SM7745HSV-22.5792M
0.1ufd/16V
C57
0.1ufd/16V
C64
10K/5%
R41
10K/5%R40
0.1ufd/16V
C63
10K/5%
R39
10K
/5%
R38
10K/5%
R32
10K/5%R33
GND
10K/5%R101
0.1ufd/16V
C52
GND
0.1ufd/16V
C51
0.1ufd/16V
C60
GND
GN
D
1
2
3 4
5
6
U25
SN74LVC2G17DBVR
2A
GND VCC
1A 1Y
2Y
6
5
43
2
1
U27
SN74LVC2G17DBVR
2A
GND VCC
1A 1Y
2Y
8
7
6
54
3
2
1
U29
ICS542
1
2
3
4 5
6
7
8
U28
ICS542
1
2
3
4
5
6
7
8 9
10
11
12
13
14
15
16
U36
SN74CBTLV3253DBQR
16
15
14
13
12
11
10
98
7
6
5
4
3
2
1
U37
SN74CBTLV3253DBQR
16
15
14
13
12
11
10
98
7
6
5
4
3
2
1
U38
SN74CBTLV3253DBQR
8
7
6
5
4
3
2
1
U40
SN74LVC2G157DCTR
U30
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
TCA9539PWR
DATA CLOCKS
www.ti.com Appendix B
Figure B-4. Data and Clocks
15SLAU528–June 2013 TLV320AIC3263EVM-U EVM SchematicsSubmit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
AV_ENABLE
DV_ENABLE
AV_ENABLE
DV_ENABLE
DV_ENABLE
DV_ENABLE
IOVD2
+3.3VIO+3.3VIO
IOVD1
+3.3VIO+1.8VIO
IOVD3
+1.8VIO+1.8VIO
IOVD1
IOVD2
IOVD3
IN1L
IN1R
Vsys_ext
IN3L
IN3R
Headset_Mic
MICBIAS_EXT
IN2R
IN2L
MICBIAS
IN4L
IN4R
Vsys_ext
+5V
GN
D
GNDGNDGND
+1.8VA
+5V
GN
D
GNDGNDGND
+1.8VD
+5V
GN
D
GNDGNDGND
+5V
GN
D
GNDGNDGND
+5V
GN
D
GNDGNDGND
+1.8VIO
+5V
GN
D
GNDGNDGND
GND
+1.8VD
GND GND
GND GND
GND GND
GND GND
GND
GND
GND
0.1ufd/16V
C33
10ufd/6.3V
C93
10K/5%
R12
0.1ufd/16V
C32
10ufd/6.3V
C96
10K/5%
R14
0.1ufd/16V
C34
10ufd/6.3V
C95
10K/5%
R11
0.1ufd/16V
C37
10ufd/6.3V
C98
10K/5%
R22
0.1ufd/16V
C36
10ufd/6.3V
C97
10K/5%
R21
0.1ufd/16V
C46
10ufd/6.3V
C99
10K/5%
R13
47ufd/6.3V
C129
47ufd/6.3V
C131
47ufd/6.3V
C130
47ufd/6.3V
C134
47ufd/6.3V
C133
47ufd/6.3V
C132
2 1
W5
12
W6
12
W7
1.0ufd/16V
C155
0.1ufd/16V
C135
1.0ufd/16V
C154
0.1ufd/16V
C136
1.0ufd/16V
C151
0.1ufd/16V
C138
2 1
W9
0.1ufd/16V
C160
1.8VD
3.3VIO
1.8VIO
0.1ufd/16V
C140
0.1ufd/16V
C142
12
W1
GND
+1.8VA
GND
0.1ufd/16V
C141
2 1
W2
GND
0.1ufd/16V
C161
12
W4
GND
+1.8VIO
GND GND
1.0ufd/16V
C163
0.1ufd/16V
C159
VREF
1ufd
C110
GN
D
2.1k
R111
1 2
JP20
IN1L
IN1R
GND
MIC11
2
WM-63PRT
2
1
JP27
1kR106
MBIAS
100
R98
1.0ufd/16V
C167
GND
GND
GND GND
1.0ufd/16VC166
0.1ufd/16V
C162
100
R107
1kR102
MBIAS_EXT
MICDET
+3.3VA
JP50
321
JP37
1 2 3
JP32
321
10ufd/10V
C165
+1.8VA
W10
12
VREF_SAR
123
JP57
+3.3VA
EXT_AUX1
EXT_AUX2
IN3L
IN3R
1ufd
C105
1ufd
C106
21
JP51
GND
J13
5
6
3
1
4
23 2 1
JP54
123
JP53
R113
R112
0.1ufd/16V
C175
1ufd
C108
1ufd
C109
0.1ufd/16V
C176
GND GND
EXT_IN1R
IN4L
IN4R
2.1
k
R110
JP19
1 2
IN2R
IN2L
1ufd
C177
1ufd
C178
2.1
k
R95
21
JP52
1ufd
C180
1ufd
C179
R114
0.1ufd/16V
C174
GND
120TAIL
12
JP9
+1.8V_CP
+3.3VIO
JP40
2 1
12
JP39
GND5 GND4 GND1 GND7 GND3 GND2 GND6
1 2 3
W8
+1.8VA
1.8VA
1.8V_CP
3.3VA
W13
1
2
U1
TLV320AIC3263YZF
D5
C1
D1
C3
B1
D4
D3
C4
U1
TLV320AIC3263YZF
C5
C2
A1
E4
E6
E5
A8
C7
U1
TLV320AIC3263YZF
F3
E3
D8
D2VREF_SAR
AVSS
VBAT
AVDD_18
IN3LE2
E1IN3R
IN2LF1
F2IN2R
U1
TLV320AIC3263YZF
J9
D9
H3
H9
E7
J3
J4
G8
F4
H6
1.8V/400mA
5
43
2
1
VR3
TPS73618DBVT
3.3V/400mA
5
43
2
1
VR5
TPS73633DBVT
1.8V/400mA
1
2
3 4
5
VR1
TPS73618DBVT
1.8V/400mA
5
43
2
1
VR2
TPS73618DBVT
1.8V/400mA
5
43
2
1
VR4
TPS73618DBVT
3.3V/400mA
VR61
2
3 4
5
TPS73633DBVT
ANALOG INPUTS
DIGITAL SUPPLIESANALOG SUPPLIES
LDO SUPPLIES
Appendix B www.ti.com
Figure B-5. LDO Supplies, Analog Supplies, Digital Supplies, and Analog Inputs
16 TLV320AIC3263EVM-U EVM Schematics SLAU528–June 2013Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Headset_Mic
+1.8V_CP
SPKM
SPKP
Vsys_ext
RLOUT
LLOUT
RECP
RECM
+3.3VA
HPR
HPL
GND GND
GND GND
DNP
C117
DNP
C118
2
1
JP1
R77
2200pfd/50V
C127
1
2
JP2
R78
2200pfd/50V
C128
TP22 TP23
120 OHMS/1.5A
FB1 21
120 OHMS/1.5A
FB2 21
HPL
HPR
VSS_SNS
GNDGNDGND
GNDGNDGND
GND
3 2 1
JP34
123
JP33
J1
1 2 3
J2
1 2 3
R79
R80
16.0
R73
32.4
R70
16.0
R74
2200pfd/50V
C1242200pfd/50V
C123
32.4
R71
J14
5
6
3
1
4
2
GND GND
0.1
ufd
/16
V
C137
10
ufd
/10
V
C156
2 1
W12
GND
10
ufd
/10
V
C168
TP72
TP71
GND
C143
2.2ufd
GND
6A/125V
1
2
J15
1.0ufd/16VC153
FB3
BLM18AG601SN1
6A/125V
2
1
J16
120TAIL
1 2 3
JP38
GND
GND GND
GND
+5V
GND
GND
GND GND
1.0ufd/16V
C5
1.0ufd/16V
C6
LLOUT
RLOUT
1 2
JP24
TP26
21
JP25
TP35R91
1k
2200pfd/50V
C157
R92
1k
2200pfd/50V
C158
GND
GND GND
6A/125V
3
2
1
J7
21
JP7
R81
1k
2200pfd/50V
C121
1 2
JP8
R82
1k
2200pfd/50V
C122
TP
27
TP
28
32.4
R721
2
JP26
SPKM
SPKP
RECP
RECM
GND
10
ufd
/10
V
C169
GND
VNEG
GND
0.1
ufd
/16
V
C173
10ufd/10V
C147
GND
0.1
ufd
/16
V
C172
C145
2.2ufd
123
JP55
+1.8VA
220ohms/2A
21FB4
J6
5
6
3
1
4
2
JP
58
321
+1.8VA
J22SJ-435105
3
2
1
4
5
GND
JP60
12
0.1ufd/16V
C164
DNP
R104
U1
TLV320AIC3263YZF
A4
B5
A7
B4
D6
B6
A5
A6
B7
U1
TLV320AIC3263YZF
B9
C8
C9
B8
A9
U1
TLV320AIC3263YZF
A2
A3
B2
B3
C6
D7
RECEIVER AMPLIFIERCLASS D AMPLIFIER
HEADPHONE AMPLIFIER
www.ti.com Appendix B
Figure B-6. Headphone Amplifier, Class D Amplifier, and Receiver Amplifier
17SLAU528–June 2013 TLV320AIC3263EVM-U EVM SchematicsSubmit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
TAS_SCL
TAS_SDA
MCLK
BCLK1
WCLK1
DOUT1
DIN1
TAS_MISO
TAS_MOSI
TAS_SSz
TAS_SCLK
RESETz
BCLK2
WCLK2
DOUT2
DIN2
BCLK2
WCLK2
DOUT2
DIN2
TAS_BCLK
TAS_WCLK
TAS_DOUT
TAS_DIN
GPIO3
GPIO4
MICBIAS
MICBIAS_EXT Headset_Mic
+1.8V_CP
GPIO5
GPIO6
GPIO1
GPIO2
GND GND
GND GND
GND GND
GND GND
GND GND
GNDGND
GND
GND
GND
GND
GND
HPR
HPL
GND
SPKP
SPKM
SPKP
SPKM
GNDGND
GND
GND
GND
GND
GND
GND
GND
GND
IN1L
IN2L
GND
GND
GND
GND
GND
GND
GND
GND
IN1R+5V +5V
GND
GND
GND
GND
GND
GND
GND
GND
+1.8VD +1.8IO
DV_ENABLE
GND
GND
GND
GND
GND
GND GND
GND
I2S_ENABLE
GND
GND
GND
GND
GND
GND
GNDGND
IN2R
IN3RIN3L
RECP
LLOUT
RECM
IN4RIN4LVARVDVARVD
+3.3IO +3.0IO
RLOUT
+1.8VA
AV_ENABLE
J9
100
98
96
94
92
90
88
86
84
82
80
78
76
74
72
99
97
95
93
91
89
87
85
83
81
79
77
75
73
71
mfg: JSTp/n: 100P-JMDSS-G-1-TF(LF)(SN)
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
100P-JMDSS-G-1-TF(LF)(SN)
J10
100P-JMDSS-G-1-TF(LF)(SN)
J9
100P-JMDSS-G-1-TF(LF)(SN)
J10
82
80
78
81
79
77
75
mfg: JSTp/n: 100P-JMDSS-G-1-TF(LF)(SN)
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
83
85
87
89
91
93
95
97
99
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
84
86
88
90
92
94
96
98
100
100P-JMDSS-G-1-TF(LF)(SN)
0.5in
SO33480
0.5in
SO23480
0.5in
SO53480
0.5in
SO43480
0.5in
SO73480
0.5in
SO13480
0.5in
SO63480
0.5in
SO83480
RESERVED
I2S_2
RESET
SPI
MCLK
RESERVEDSPKGNDSPKGND
SPKVDDSPKVDD
HPVDDHPGND
RESERVED
HPGNDHPVDD
AV_ENABLE
DIGITAL INTERFACE CONNECTOR
BREAK-OUT CONNECTIONS BREAK-OUT CONNECTIONS
+5VAAGND+3.3VA
AGND+1.8VAAGND
AGNDVARVA
AGND+1.8V_CP
AGND
+3.3VAAGND+5VA
STANDOFFS
ANALOG INTERFACE CONNECTOR
BREAK-OUT CONNECTIONS BREAK-OUT CONNECTIONS
VARVAAGND
LINEOUTPUTS
OUT1GNDOUT1-
OUT2-OUT2GNDOUT3-OUT3GND
AGND
HEADSETOUTPUTS
HP1L
OUT4GNDOUT4-
HP1R
HP2RHP2L
AGND
OUT4+OUT4GND
OUT3GNDOUT3+
OUT2GNDOUT2+
OUT1+OUT1GND
LINEOUTPUTS
HPGNDHPGND
HPGNDHPGND
HEADSETGROUND
SPK1+SPK1-SPK2+SPK2-
CLASS-DSPEAKEROUTPUT
CLASS-DSPEAKEROUTPUT
SPK2-SPK2+SPK1-SPK1+
AGNDAGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGNDMICBIAS
IN2+
IN1+
IN3+
IN4+
IN5+
IN6+
IN7+
IN8+
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGNDMICDET
IN2-
IN1-
IN3-
IN4-
IN5-
IN6-
IN7-
IN8-
+5VD +5VDDGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
+3.0IO+3.3IO
+1.8IO+1.8VD
VARVDVARVD
DV_ENABLE
RESERVEDRESERVED
I2C
MCLK
DGND
I2S1
DGND
I2S_ENABLE
DGND
GPIO
I2S_3
I2S_4
RESERVED
RESERVED
BCLK1
WCLK1
DIN1
DOUT1
MCLK
BCLK2
WCLK2
DIN2
DOUT2
BCLK3
WCLK3
DIN3
DOUT3
TAS_SCL
TAS_SDA
IOVD1+3.3VIO
+3.3VIO
+3.3VIO
TAS_MOSI
TAS_SSz
DUT_RESETz
IOVD1
GPIO2
GPIO5
GPIO6
TAS_WCLK
+3.3VIO
IOVD2
TAS_BCLK
GPIO3
GPIO4
AIC_RESETz
TAS_SCLK
TAS_MISO
IOVD1+3.3VIO
+3.3VIO IOVD1
+3.3VIO
I2C_ADDR_SEL AIC_ADDRESS
+3.3VIO
6Wire1_EN
+3.3VIO
SPI_SELECT
IOVD1
AIC_SCLK
AIC_SCLK
AIC_ADDRESS
GPIO1
GNDGND
GND
GND
MCLK
BC
LK
1
WC
LK
1
DIN
1
DO
UT
1
1 2 3
JP44
321
JP28
321
JP45
1 2 3
JP29
DO
UT
2
DIN
2
WC
LK
2
BC
LK
2
GND
GND
GND
GND
GND
GND
GND
GND
321
JP47
1 2 3
JP31
1 2 3
JP46
321
JP30
GND
GND
GNDGND
GNDGND
GND
GND
GND
GND
GND
+5V
GND
GND GND
GN
D
GND
C17
0.1ufd/16V
R85
2.7
K/5
%
R86
2.7
K/5
%
C22
0.1ufd/16V
R89
200K/5%
806k
R90
C66
0.1ufd/16V
C65
0.1ufd/16V
C68
0.1ufd/16V
R49
10K/5%
C67
0.1ufd/16V
C70
0.1ufd/16V
R56
10K/5%
C80
0.1ufd/16V
1 2
3 4
5 6
J21
75869-131LF GND
6
5
4
3
2
1
MIC3
SPM0423HD4H-WB
GND
GNDGND
GNDGNDGND
IOVD1
GND
C79
0.1ufd/16V
C82
0.1ufd/16V
1
2
3
4
5
6MIC2
SPM0423HD4H-WB
123
JP43
3 2 1
JP42
123
JP41
GND
GND
GN
D
C78
0.1ufd/16V
C77
0.1ufd/16V
GP
IO1
GP
IO2
GP
IO5
GP
IO6
BC
LK
3
WC
LK
3
DIN
3
DO
UT
3
SB_CLKSB_DATA
SPI_SELRESET
AD
/SC
LK
SC
L/S
SZ
SD
A/M
OS
I
GP
01/M
ISO
GPIO3GPIO4
GND
GND
GND
GNDGND
C171
0.1ufd/16V
C170
0.1ufd/16V
GND
GN
D
GN
D
C69
0.1ufd/16V
C720.1ufd/16V
R42
10K/5%
GND
JP49
3 2 1
R109
10K/5%
GND
TP110
R5710K/5%
GND
GND GND GND
R1001k
JP35
321
120TAIL
123
JP36
120TAIL
GNDGND
123
J17 J18
3 2 1
J19
3 2 1
J20
3 2 1
GND
1
JP62
2
R117357
LED9
Green/2.0V
GND
GNDGND
GNDGNDGND
IOVD1
GND
C189
0.1ufd/16V
C188
0.1ufd/16V
1
2
3
4
5
6
MIC5
SPM0423HD4H-WB
6
5
4
3
2
1
MIC4SPM0423HD4H-WB
GN
D
GN
D
C190
0.1ufd/16V
GN
D
R118
GND
R120
0
R119
0
8
7
6
5 4
3
2
1
U31
PCA9306DCTR
SDA2
SCL2
VREF2
EN
SDA1
GND
VREF1
SCL1
10
9
8
76
5
4
3
2 1
U32
SN74AVC2T245RSWR
6
5
43
2
1
U33
TXB0101DBVR
OE
VCCB
B
GND
VCCA
A
SN74LVC1G126DBVR
3
5
4
2
1
U6
1 2 3 45678
U41
TXB0102DCUR
B2
A2
VC
CA
GN
D
B1
VC
CB
OE
A1
6
5
4 3
2
1
U45
SN74LVC2G04DBVR
1
2
3
4
5
6
78
9
10
11
12
13
14
U24
TXS0104EPWR
B4
NC
OE GND
NC
A4
B3
B2
B1
VCCB
A1
A2
A3
VCCA
U46
10
9
8
76
5
4
3
2 1
SN74AVC2T245RSWR
U1
TLV320AIC3263YZF
G6
G2
G3
G5
H5
H7
J6
J7
G7
F7
F8
H8
F6
F5
H4
J5
G4
H1
J2
J1
G9
J8
E8
G1
H2
E9
F9
U488
7
6
5
4
3
2
1
SN74LVC2G157DCTR
J23
7
6
5
4
3
2
1
5607-4200-SH
GND
B+
B-
GND
A+
GND
A-
Case
for SPI:
Install JP62
Appendix B www.ti.com
Figure B-7. Digital
Figure B-8. Analog and Digital Interface Connectors
18 TLV320AIC3263EVM-U EVM Schematics SLAU528–June 2013Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
MASTER_RESETAIC_RESET
TLV320AIC3263EVM-U REVB
FOR MEASUREMENT
LINE OUT
MIC INPUT
HEADPHONE OUT
SR
C2
_T
xS
RC
1_
Tx
SR
C1
_R
xS
RC
2_
Rx
APP
PATCH
+
SPKM
SPKP
3.3VIO
GP01/MISO
SB_CLK
SDA/MOSI
C132
LED3
LED5
1.8VD
LED8
AD/SCLK
LED4
JP50
1.8VA
JP44
R120
JP29
JP30
GND1
VSS_SNS
W13
GPIO6
C79
U1RESET
C55
JP55
MBIAS
SCL/SSZ
DIN1 GPIO2
BCLK1
JP9
MBIAS_EXT
JP27
JP1
IN4L
MICDET
JP20
JP51
DOUT1
GND2
C188
1.8V_CP
JP24
JP54EXT_AUX1
JP39
JP38
JP33
TP26
MIC2
R22
VR5
1.8VIO
J23
R65
C82
C3
6
C131
GND3
C5
2C
51
S3
C3
2
U25
U27
GND5
LED1
BCLK2
SPI_SEL
DOUT3
JP37
R117
LED2
GPIO4
DOUT2
DIN3
WCLK2
JP32
LED9
U45
C24
JP36
JP
10
SO4
JP61
JP15
TP110
GP
IO5
C63
U40 R101
RLOUTJP
31
GPIO3
MIC5
W7
W2 W12
VNEG
JP41
GPIO1
R118
J19J18
W5W10
OS
C2
JP26
WCLK1
TP
23
JP
58
MIC4
R52
J20
IN4R
IN2L
C53R51
IN1L IN1R
IN3R
IN2R
VREF_SAR
IN3L
VR
6
C133
3.3VA
JP19
R13
C4
6
JP57
JP53
JP52
JP40
C9
3
VR
2
C129C130
JP25
EXT_IN1R
C3
4
JP60
EXT_AUX2
J2
J1
TP28
TP27
MIC1
TP71
JP34
TP35
HPL
GND4
TP72
HPR
GND7
C189
J15
RECM
J22
SO5
SO6
RECP
U15
U16
SO7
U18
U19
C134
SO8
J12
C3
7MIC3
C9
8
R64
R69
R66
VR4
VR1
C96
R14
C9
7R
21
SB
_D
ATA
DIN2
J21
JP45
C6
5
Y1
S4
R121
R119
W8
JP46
JP28
SO3
WC
LK
3
S2
LLO
UT
BC
LK
3
W4
JP
47
S1
W1
JP
42
JP35
W6W9
JP43
JP62
JP2
JP
49
MCLK
VR
EF
TP
22
J17
SP
KM
SO1
SP
KP
OS
C1
SO2
C9
9
JP7
C3
3V
R3
JP8
R12
C9
5
GND6
R11
J14
J16
J7
J6
J13
Appendix CSLAU528–June 2013
TLV320AIC3263EVM-U EVM Layout Views
Figure C-1. Silkscreen Top
19SLAU528–June 2013 TLV320AIC3263EVM-U EVM Layout ViewsSubmit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
R10C84
C35
R58
U22
C184
C42
R100
U30
C142
C174
C145
C167
C179
R38
R114
C106
C177
R91
C122
C157
C109C175
C108
C123
C124
C10
C31
C94
C88R16
R18
C186
R115
R24
R25
C41
U12
R23
C45
R116
C23
R7
R8
U46
C190
R57
U41
R85
C7
R59
C85
C86R9
C38
C30
C187U47
C44
U6
R86
R63
C80
R2
C27R87
U44
C28
C67C69
C70
R90
C164
C163
C5
C147
C153
C159C161
C136
C72
C118
C160
C60
C168
C140
C173
C169
C172
C165
C64
R35
C128
R107
C178C105
C57 U36
C127
R31
R32
U37
R82
R95
R110
R33
C176
C121
R73
R92
R112
R113
FB3
R104
R71
R74
C89
R17
C90
C9
R15
C11
C91
R28
C100
U14
C40
C12
C39
C18
C19
U35
C16
R43
U23
C21
R29
R62
R60
C77
C78
R4
C171
C43C185
U48
U2
C29
C170
R3
C2
C1
C26
C22
U31
C25
R1
U32
C66
R56
C102
C103
U9
U33
C68
C17
R89
R88
R42
J10
R49
R103
U24
C154
R109
C6
C117
FB1
FB2
C151
C138
R34
R40
C135
R72
C156
C143
C110
C155
U38
R98
C166
C141
C137
C162
R41
U28
R78
C180
R30
R77
U29
J9
R39
R106
R102
C56
R111
R81
R79
R70
FB4
C158
R80
Appendix C www.ti.com
Figure C-2. Silkscreen Bottom
20 TLV320AIC3263EVM-U EVM Layout Views SLAU528–June 2013Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
BOTTOM COPPER
INNER LAYER #2
INNER LAYER#1
TOP COPPER
U14
U12
U48
U2
C137
C140
C110
C162
U
4
1
U
3
1
R90
R103
C142
C174C159
C161
C136
C141
C173
C145
C160
C138
C172
C143
C135
C177
C105
C180
C106
C179
C178
C109
C108
R102
R104
U40 R101
www.ti.com Appendix C
Figure C-3. Routing
21SLAU528–June 2013 TLV320AIC3263EVM-U EVM Layout ViewsSubmit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Appendix DSLAU528–June 2013
TLV320AIC3263EVM-U Bill of Materials
ITEM QTY REFERENCES VALUE PART NUMBER DESCRIPTION COMPANY BAUFORM
1 2 C1, C2 47 pF GRM1885C1H470JA0 CAP, SMD, 0603, CERM, MURATA 0603 COG1D 47 PFD, 50 V, 5%, COG,
ROHS
2 3 C5, C6, C7 1 µF C1608X7R1C105K CAP, SMD, 0603, CERM, TDK 0603 X7R1 UFD, 16 V, 10%, X7R,ROHS
3 62 C9, C10, C11, C12, 0.1 µF GRM155R71C104KA8 CAP, SMD, 0402, CERM, MURATA 0402 X7RC16, C17, C18, 8D 0.1 UFD, 16 V, X7R, 10%,C19, C21, C22, ROHSC23, C24,C25, C26,C27, C28, C29,C30, C31, C32,C33, C34, C35,C36, C37, C38,C39, C40, C41,C42, C43, C44,C45, C46, C51,C52, C53, C55,C56, C57, C60,C63, C64, C65,C66, C67, C68,C69, C70, C72,C77, C78, C79,C80, C82, C170,C171, C186, C187,C188, C189, C190
4 3 C84, C85, C86 0.1 µF C1608X7R1H104K CAP, SMD, 0603, CERM, TDK 0603 X7R0.1 UFD, 50 V, 10%, X7R,ROHS
5 14 C88, C89, C90, 10 µF GRM188R60J106ME4 CAP, SMD, 0603, CERM, MURATA 0603 X5RC91, C93, C94, 7D 10 UFD, 6.3 V, 20%, X5R,C95, C96, C97, ROHSC98, C99, C100,C184, C185
6 1 C102 0.001 µF C1608C0G1H102J CAP, SMD, 0603, CERM, TDK CORP. 0603 COG1000 PFD, 50 V, 5%,COG, ROHS
7 1 C103 100 pF GRM1885C1H101JA0 CAP, SMD, 0603, CERM, MURATA 0603 COG1D 100 PFD, 50 V, 5%, COG,
ROHS
8 9 C105, C106, C108, 1 µF GRM188R60J105KA0 CAPACITOR, SMT, 0603, CAP, SMT,C109, C110, C177, 1D CERAMIC, 1 µF, 10 V, 0603C178, C179, C180 10%, X5R
9 2 C117, C118 C1206_DNP C1206_DNP DNI 1206
10 8 C121, C122, C123, 0.0022 µF GRM188R71H222KA0 CAP, SMD, 0603, CERM, MURATA 0603 X7RC124, C127, C128, 1D 2200 PFD, 50 V, 10%,C157, C158 X7R, ROHS
11 6 C129, C130, C131, 47 µF JMK212BJ476MG-T CAP, SMD, 0805, CERM, TAIYO YUDEN 0805 X5RC132, C133, C134 47 UFD, 6.3 V, 20%, X5R,
ROHS
22 TLV320AIC3263EVM-U Bill of Materials SLAU528–June 2013Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
www.ti.com Appendix D
ITEM QTY REFERENCES VALUE PART NUMBER DESCRIPTION COMPANY BAUFORM
12 17 C135, C136, C137, 0.1 µF GRM188R71C104KA0 CAP, SMD, 0603, CERM, MURATA 0603 X7RC138, C140, C141, 1D 0.1 UFD, 16 V, 10%, X7R,C142, C159, C160, ROHSC161, C162, C164,C172, C173, C174,C175, C176
13 2 C143, C145 2.2 µF GRM188C81A225KE3 CAPACITOR, SMT, 0603, CAP, SMT,4D CERAMIC, 2.2 µF, 10 V, 0603
10%, X6S
14 5 C147, C156, C165, 10 µF GRM21BR71A106KE5 CAP, SMD, 0805, CERM, MURATA 0805 X7RC168, C169 1L 10 UFD, 10 V, 10%, X7R,
ROHS
15 7 C151, C153, C154, 1 µF EMK107B7105KA-T CAP, SMD, 0603, CERM, TAIYO YUDEN 0603 X7RC155, C163, C166, 1 UFD, 16 V, 10%, X7R,C167 ROHS
16 27 DIN1, DIN2, DIN3, 5004 PC TESTPOINT, KEYSTONE YellowBCLK1, BCLK2, YELLOW, ROHS ELECTRONICSBCLK3, DOUT1,DOUT2, DOUT3,GPIO1, GPIO2,GPIO3, GPIO4,GPIO5, GPIO6,TP123, TP124,WCLK1, WCLK2,WCLK3, SB_CLK,AD/SCLK,SB_DATA,SCL/SSZ, SPI_SEL,SDA/MOSI,GP01/MISO
17 2 FB1, FB2 BLM15EG121SN1D FERRITE BEAD, SMD, MURATA 4020402, 120 Ω, 1.5 A, ROHS
18 1 FB3 600 Ω BLM18AG601SN1 FERRITE BEAD, SMT, FERRITE0603, 600 Ω @ 100 MHz, BEAD, SMT,25%, 200 mA 0603
19 1 FB4 220 Ω MPZ1608S221A FERRITE CHIP, 220 Ω, 2 TDK 603A ,100 MHZ, SMD. 0603,ROHS
20 7 GND1, GND2, 5011 PC TESTPOINT, BLACK, KEYSTONE BlackGND3, GND4, 063, HOLE, ROHS ELECTRONICSGND5, GND6,GND7
21 30 IN1L, IN1R, IN2L, 5002 PC TESTPOINT, WHITE, KEYSTONE WhiteIN2R, IN3L, IN3R, ROHS ELECTRONICSIN4L, IN4R, TP22,TP23, TP26, TP27,TP28, TP35, TP71,TP72, TP110,TP111, TP112,TP113, TP114,TP115, TP116,TP117, TP118,TP119, VSS_SNS,EXT_AUX1,EXT_AUX2,EXT_IN1R
22 32 J1, J2, W8, J17, PBC03SAAN HEADER THRU MALE, 3 SULLINS 100LSJ18, J19, J20, JP28, PIN, 100LS, 120 TAIL,JP29, JP30, JP31, GOLD, ROHSJP32, JP33, JP34,JP35, JP36, JP37,JP38, JP41, JP42,JP43, JP44, JP45,JP46, JP47, JP49,JP50, JP53, JP54,JP55, JP57, JP58
23SLAU528–June 2013 TLV320AIC3263EVM-U Bill of MaterialsSubmit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Appendix D www.ti.com
ITEM QTY REFERENCES VALUE PART NUMBER DESCRIPTION COMPANY BAUFORM
23 3 J6, J13, J14 SJ-43516-SMT JACK AUDIO-STEREO CUI STACK 3.5 mmMINI (3.5 mm, 4-CONDSMT-RA ROHS)
24 1 J7 ED555/3DS TERMINAL BLOCK, 3 PIN, ON SHORE GRAY6 A / 125 V, GRAY, 3.5 TECHNOLOGYmm PITCH, 16-28 AWG,ROHS
25 2 J9, J10 100P-JMDSS-G-1- PLUG, SMD, 2x50, JST SMD - 0.5TF(LF)(SN) FEMALE, JMDSERIES, mm
0.5 mm LS, GOLD, ROHS
26 1 J12 UX60-MB-5ST JACK USB, MINIB SMT- HIROSERA, 5 PIN, ROHS
27 2 J15, J16 ED555/2DS TERMINAL BLOCK, 2 PIN, ON SHORE GRAY6 A / 125 V, GRAY, 3.5 TECHNOLOGYmm PITCH, 16-28 AWG,ROHS
28 1 J21 Config build DNI 75869-131LF HEADER SHROUDED, FCIforTLV320AIC3263 100LS, MALE, GOLD, 2x3YZF PINS, ROHS
29 1 J22 SJ-435105 JACK AUDIO MINI (3.5 CUI STACK 3.5 mmmm, 4-COND SMT-RAROHS)
30 1 J23, Config build for DNI 5607-4200-SH CONNECTOR-SATA, 7 3M SATATLV320AIC3263YZ PIN, SMT-RA SERIES,F 5607, ROHS
31 2 LED1, LED2 SML-LXT0805YW-TR LED, YELLOW, 2 V, SMD, LUMEX OPTO 8050805, ROHS
32 5 LED3, LED4, LED5, SML-LXT0805GW-TR LED, GREEN, 2 V, SMD, LUMEX OPTO 805LED8, LED9 0805, ROHS
33 1 MIC1 WM-63PRT MICROPHONE PANASONIC ELECTRETELECTRET,OMNIDIRECTIONALDUAL BAND, 2 PIN,ROHS
34 4 MIC2, MIC3, MIC4, SPM0423HD4H-WB MIC DIGITAL, MIMI- KNOWLES Mini SiSonicMIC5 SISONIC, HALOGEN
FREE, 6 PIN, ROHS
35 1 OSC1 24.576M SM7745HSV-24.576M OSCILLATOR, SMT, 3.3 PLETRONICS SM77HV, SM77H SERIES, 24.576MHz, ROHS
36 1 OSC2 22.5792M SM7745HSV- OSCILLATOR, SMT, 3.3 PLETRONICS SM77H22.5792M V, SM77H SERIES,
22.5792 MHz, ROHS
37 1 R1 1.5 kΩ ERJ-3EKF1501V RESISTOR, SMD, 0603, PANASONIC 6031.50 kΩ, 1%, THICK FILM,1/10 W, ROHS
38 2 R2, R3 27.4 Ω ERJ-3EKF27R4V RESISTOR, SMD, 0603, PANASONIC 60327.4 Ω, 1%, 1/10 W,ROHS
39 1 R4 100 kΩ ERJ-3EKF1003V RESISTOR, SMD, 0603, PANASONIC 603100 kΩ, 1%, THICK FILM,1/10 W, ROHS
40 34 R7, R8, R9, R10, 10 kΩ ERJ-3GEYJ103V RESISTOR, SMD, 0603, PANASONIC 603R11, R12, R13, 10K, 5%, 1/10 W, ROHSR14, R21, R22,R25, R28, R29,R30, R31, R32,R33, R34, R35,R38, R39, R40,R41, R42, R43,R49, R51, R52,R56, R57, R101,R109, R115, R116
24 TLV320AIC3263EVM-U Bill of Materials SLAU528–June 2013Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
www.ti.com Appendix D
ITEM QTY REFERENCES VALUE PART NUMBER DESCRIPTION COMPANY BAUFORM
41 4 R15, R16, R17, R18 0 Ω ERJ-3GEY0R00V RESISTOR, 0 Ω, 1/10 W, PANASONIC 603JUMP, 0603, SMD
42 13 R23, R24, R77, 1 kΩ ERJ-3GSYJ102 RESISTOR, SMT, 0603, RES, SMT,R78, R79, R80, 5%, 1/10 W, 1K 0603R81, R82, R91,R92, R100, R102,R118
43 2 R58, R59 649 Ω RC0603FR-07649RL RESISTOR, SMD, 0603, YAGEO 603THICK FILM, 649 Ω, 1%,1/10 W, ROHS
44 4 R60, R62, R103, 4.7 kΩ ERJ-3GEYJ472V RESISTOR, SMD, 0603, PANASONIC 603R121 4.7 kΩ, 5%, 1/10 W, ROHS
45 1 R63 3.09 kΩ CRCW06033091F RESISTOR, SMT, 0603, RES, SMT,1%, 1/10 W,3.09K 0603
46 5 R64, R65, R66, 357 Ω ERJ-3EKF3570V RESISTOR, SMD, 0603, PANASONIC 603R69, R117 357 Ω, 1%, THICK FILM,
1/10 W, ROHS
47 3 R70, R71, R72 32.4 Ω RC1206FR-0732R4L RESISTOR, SMD, 1206, YAGEO 1206 1/4 W32.4 Ω, 1%, 1/4 W, ROHS
48 2 R73, R74 16 Ω CRCW120616R0JNEA RESISTOR, SMT, 1206, VISHAY 120616 Ω, 5%, 1/4 W,ROHS
49 4 R85, R86, R87, R88 2.7 kΩ ERJ-3GEYJ272V RESISTOR, SMD, 0603, PANASONIC 6032.7 kΩ, 5%, 1/10 W, ROHS
50 1 R89 200 kΩ ERJ-3GEYJ204V RESISTOR, SMD, 0603, PANASONIC 603200 kΩ, 5%, 1/10 W,ROHS
51 1 R90 806 kΩ ERJ-2RKF8063X RESISTOR, SMT, 0402, RES, SMT,806K, 1%, 1/16 W 0402
52 3 R95, R110, R111 2.1 kΩ CRCW06032101F RESISTOR, SMT, 0603, RES, SMT,1%, 1/10 W, 2.10K 0603
53 2 R98, R107 100 Ω ERJ-3EKF1000V RESISTOR, SMD, 0603, PANASONIC 603100, 1%, THICK FILM,1/10 W, ROHS
54 1 R104 R0603_DNP R0603_DNP 603
54A 2 R119, R120, Config 0 Ω ERJ-3GSYJ000 RESISTOR, SMT, 0603, PANASONIC 603build for 5%, 1/10 W, 0 ΩTLV320AIC3263YZF
55 1 R106 1.1 kΩ ERJ-3GSYJ112 RESISTOR, SMT, 0603, RES, SMT,5%, 1/10 W, 1.1K 0603
56 3 R112, R113, R114 200 Ω ERJ-3GSYJ201 RESISTOR, SMT, 0603, RES, SMT,5%, 1/10 W, 200 0603
57 8 SO1, SO2, SO3, 3480 & PMS 440 0025 STANDOFF, 4-40, 0.5 in, KEYSTONESO4, SO5, SO6, PH 0.25 dia, ALUM RND, F-F, ELECTRONICSSO7, SO8 ROHS, & 4-40 PHILLIPS
MACHINE SCREW
58 4 S1, S2, S3, S4 TL1015AF160QG SWITCH, MOM, 160G, E-SWITCHSMT, 4X3 mm, ROHS
59 1 U1 TLV320AIC3263YZF CODEC WCSP81-YZF TEXAS WCSP81-ROHS INSTRUMENTS YZF
60 1 U2 TAS1020BPFB USB STREAMING TEXAS TQFP48-CONTROLLER, TQFP48- INSTRUMENTS PFBPFB, ROHS
61 2 U6, U9 SN74LVC1G126DBVR SINGLE BUS BUFFER TEXAS SOT23-GATE WITH 3-STATE INSTRUMENTS DBV5OUTPUT, SOT23-DBV5,ROHS
62 2 U12, U14 SRC4392IPFBR 2 CHAN, ASYNC, BURR-BROWN TQFP48-SAMPLE RATE CONV PFBW/DIG AUDIOREC/XMTR, ROHS
25SLAU528–June 2013 TLV320AIC3263EVM-U Bill of MaterialsSubmit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Appendix D www.ti.com
ITEM QTY REFERENCES VALUE PART NUMBER DESCRIPTION COMPANY BAUFORM
63 2 U15, U16 TORX147PL(F,T) TOSLINK RECEIVER, 3.3 TOSHIBAV, 15MB SHUTTER,ROHS
64 2 U18, U19 TOTX147PL TOSLINK TRANSMITTER, TOSHIBA3.3 V, 15MB SHUTTER,ROHS
65 4 U22, U23, U24, U47 TXS0104EPWR 4-BIT BIDIR LEVEL TEXAS TSSOP14-TRANSLATOR, TSSOP14- INSTRUMENTS PWPW, ROHS
66 2 U25, U27 SN74LVC2G17DBVR DUAL SCHMITT- TEXAS SOT23-TRIGGER BUFFER, INSTRUMENTS DBV6SOT23-DBV6, ROHS
67 2 U28, U29 ICS542 CLOCK DIVIDER, SOP8- IDT SOP8-DD, ROHS
68 1 U30 TCA9539PWR REMOTE, 16B, I2C TEXAS TSSOP24-SMBUS, LO PWR, IO INSTRUMENTS PWEXPNDR, INT, OUT,TSSOP24-PW, ROHS
69 1 U31 PCA9306DCTR DUAL BIDIR, I2C BUS TEXAS SSOP8-DCTAND SMBUS VOLT INSTRUMENTSLEVEL TRANS, SSOP8-DCT, ROHS
70 2 U32, U46 SN74AVC2T245RSW 2BIT, XCVR, TEXAS QFN10-RSWR CONFIGURABLE INSTRUMENTS
TRANSLATION, 3-STATEOUTS, QFN10-RSW,ROHS
71 1 U33 TXB0101DBVR 1-BIT, BIDIR, LEVEL TEXAS SOT23-TRANSLATOR, SOT23- INSTRUMENTS DBV6DBV6, ROHS
72 4 U35, U36, U37, U38 SN74CBTLV3253DBQ LO VOLT, DUAL 1OF4 TEXAS SSOP16-DBR FET, MUX/DEMUX, INSTRUMENTS
SSOP16-DB, ROHS
73 2 U40, U48 SN74LVC2G157DCTR MUX/DATA SELECTOR, 2 TEXAS SSOP8-DCTTO 1, SSOP8-DCT, ROHS INSTRUMENTS
74 1 U41 TXB0102DCUR 2-BIT, BIDIR, LEVEL TEXAS VSSOP8-TRANSLATOR, VSSOP8- INSTRUMENTS DCUDCU, ROHS
75 1 U44 24FC512-I/MF 512K, I2C SERIAL MICROCHIP DFN8-MFEEPROM, DFN8-MF,ROHS
76 1 U45 SN74LVC2G04DBVR DUAL INVERTER GATE, TEXAS SOT23-SOT23-DBV6, ROHS INSTRUMENTS DBV6
77 4 VR1, VR2, VR3, TPS73618DBVT VOLT REG, 1.8 V, 400 TEXAS SOT230DBVVR4 mA, LDO CAP, FREE INSTRUMENTS 5
NMOS, SOT23-DBV5,ROHS
78 2 VR5, VR6 TPS73633DBVT VOLT REG, 3.3 V, 400 TEXAS SOT230DBVmA, LDO CAP, FREE INSTRUMENTS 5NMOS, SOT23-DBV5,ROHS
79 30 W1, W2, W4, W5, PBC02SAAN HEADER THRU MALE, 2 SULLINS 100LSW6, W7, W9, JP1, PIN, 100LS, 120 TAIL,JP2, JP7, JP8, JP9, GOLD, ROHSW10, W12, W13,JP10, JP15,JP19,JP20, JP24,JP25, JP26, JP27,JP39, JP40, JP51,JP52, JP60, JP61,JP62
80 1 Y1 SIT8002AI-13-33E- OSCILLATOR, SMT, 6 SITIME SMT-80026.00000T MHz, 3.3 V, OUT-
ENABLE, ROHS
26 TLV320AIC3263EVM-U Bill of Materials SLAU528–June 2013Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
www.ti.com Appendix D
ITEM QTY REFERENCES VALUE PART NUMBER DESCRIPTION COMPANY BAUFORM
81 11 1.8VA, 1.8VD, 5000 PC TESTPOINT, RED, KEYSTONE Red3.3VA, TP120, ROHS ELECTRONICSTP121, TP122,1.8VIO, 3.3VIO,1.8V_CP,VREF_SAR,MBIAS_EXT
82 18 See the list for 382811-9 RED No. 382811-9 Shuntlocations
83 22 See the list for 382811-6 BLACK No. 382811-6locations Shunt
84 22 See the list for 382811-2 BLUE No. 382811-2 Shuntlocations
27SLAU528–June 2013 TLV320AIC3263EVM-U Bill of MaterialsSubmit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Appendix ESLAU528–June 2013
Writing Scripts
A script is simply a text file that contains data to send to the serial control buses.
Each line in a script file is one command. No provision is made for extending lines beyond one line, exceptfor the > command. A line is terminated by a carriage return.
The first character of a line is the command. Commands are:
I— Set interface bus to use
r— Read from the serial control bus
w— Write to the serial control bus
>— Extend repeated write commands to lines below a w
#— Comment
b— Break
d— Delay
f— Wait for Flag
The first command, I, sets the interface to use for the commands to follow. This command must befollowed by one of the following parameters:
i2cstd— Standard mode I2C bus
i2cfast— Fast mode I2C bus
spi8— SPI bus with 8-bit register addressing
spi16— SPI bus with 16-bit register addressing
For example, if a fast mode I2C bus is to be used, the script begins with:
I i2cfast— A double-quoted string of characters following the b command can be added to provideinformation to the user about each breakpoint. When the script is executed, the software'scommand handler halts as soon as a breakpoint is detected and displays the string of characterswithin the double quotes.
The Wait for Flag command, f, reads a specified register and verifies if the bitmap provided with thecommand matches the data being read. If the data does not match, the command handler retries for up to200 times. This feature is useful when switching buffers in parts that support the adaptive filtering mode.The command f syntax follows:f [i2c address] [register] [D7][D6][D5][D4][D3][D2][D1][D0]
where 'i2c address' and 'register' are in hexadecimal format
and 'D7' through 'D0' are in binary format with values of 0,
1 or X for don't care.8
Anything following a comment command # is ignored by the parser, provided that it is on the same line.
The delay command d allows the user to specify a time, in milliseconds, that the script pauses beforeproceeding. Note: The delay time is entered in decimal format.
28 Writing Scripts SLAU528–June 2013Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
www.ti.com Appendix E
A series of byte values follows either a read or write command. Each byte value is expressed inhexadecimal, and each byte must be separated by a space. Commands are interpreted and sent to theTAS1020B by the program.
The first byte following an r (read) or w (write) command is the I2C slave address of the device (if I2C isused) or the first data byte to write. (If SPI is used, note that SPI interfaces are not standardized onprotocols, so the meaning of this byte varies with the device being addressed on the SPI bus.) Thesecond byte is the starting register address that data will be written to (again, with I2C; SPI varies).Following these two bytes are data, if writing; if reading, the third byte value is the number of bytes toread, (expressed in hexadecimal).
For example, to write the values 0xAA 0x55 to an I2C device with a slave address of 0x30, starting at aregister address of 0x03, the user writes:#example script
I i2cfast
w 30 03 AA 55
r 30 03 02e
This script begins with a comment, specifies that a fast I2C bus is used, then writes 0xAA 0x55 to the I2Cslave device at address 0x30, writing the values into registers 0x03 and 0x04. The script then reads backtwo bytes from the same device starting at register address 0x03. Note that the slave device value doesnot change. It is unnecessary to set the R/W bit for I2C devices in the script; the read or write commandsdoes that.
If extensive repeated write commands are sent and commenting is desired for a group of bytes, the >command can be used to extend the bytes to other lines that follow. A usage example for the > commandfollows:#example script for '>' command
I i2cfast
# Write AA and BB to registers 3 and 4, respectively
w 30 03 AA BB
# Write CC, DD, EE and FF to registers 5, 6, 7 and 8, respectively
> CC DD EE FF
# Place a commented breakpoint
b "AA BB CC DD EE FF was written, starting at register 3"
# Read back all six registers, starting at register 3
r 30 03 06b
The following example demonstrates usage of the Wait for Flag command, f:#example script for 'wait for flag' command
I i2cfast
# Switch to Page 44
w 30 00 2C
# Switch buffer
w 30 01 05
# Wait for bit D0 to clear. 'x' denotes a don't care.
29SLAU528–June 2013 Writing ScriptsSubmit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Appendix E www.ti.com
f 30 01 xxxxxxx0
Any text editor can be used to write these scripts; jEdit is an editor that is highly recommended for generalusage. For more information, go to: www.jedit.org.
Once the script is written, it can be used in the command window by running the program, and thenselecting Open Script File... from the File menu. Locate the script and open it. The script then is displayedin the command buffer. The user also can edit the script once it is in the buffer and save it by selectingSave Script File... from the File menu.
Once the script is in the command buffer, it can be executed by pressing the Execute Command Bufferbutton. If breakpoints are in the script, the script executes to that point, and the user is presented with adialog box with a button to press to continue executing the script. When ready to proceed, the userpushes that button and the script continues.
30 Writing Scripts SLAU528–June 2013Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.
2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.
3 Regulatory Notices:3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.
FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.
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FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:
• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.
Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.
Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur
3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けていないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社東京都新宿区西新宿6丁目24番1号西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.
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6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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