tower electronics module and tower power supply em tower electronics module (tem) before...
Post on 19-Dec-2015
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Tower Electronics Module and Tower Power Supply
EM Tower Electronics Module (TEM) before coating/staking
TEM & TPS assembly
• Close to 60 TEM & TPS assemblies in the field used as EGSE for CAL, TKR, DAQ, FSW, I&T
• All flight drawings released
• Flight PCB’s fabricated
• All enclosures fabricated
• One flight PCB loaded at SLAC with flight-lot components for testing; passed tests
• Flight assembly contract in place
• All components kitted, will be sent to assembler 9/22/04
GASU (Global Trigger, ACD, Signal-Distribution Unit)
EM GASU (before harness routing)
GASU Assembly
• 15 GASU assemblies in the field used as EGSE for ACD, DAQ, FSW, I&T
• All flight drawings submitted for review/release
• Flight PCB’s contract in procurement
• SOW for GASU assembly in progress
• All components ordered
• Components to be kitted end of September
PDU (Power Distribution Unit)
EM PDU (before harness routing)
PDU Assembly
• 5 PDU assemblies in the field used as EGSE for DAQ, FSW, I&T
• All flight drawings submitted for review/release
• Flight PCB’s requisition in progress
• SOW for PDU assembly in progress
• All components ordered
• Components to be kitted end of September
PDU (Power Distribution Unit)
EM SIB
SIU/EPU Crate Assembly
• 5 cPCI SIU/PDU assemblies in the field for DAQ, FSW, I&T
– Enclosure– PCI Backplane– Crate Power Supply Board– Storage Interface Board (SIB)– LAT Communication Board (LCB)– BAE Processor Board
• Mechanical flight drawings submitted for review/release
• Electrical flight drawings almost ready for review/release
• All components ordered
• Components to be kitted by end of October