toyo ink group toyochem emi shield film for fpc€¦ · this electromagnetic wave shield film for...
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Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Toyo Ink Group
TOYOCHEMEMI shield film for FPC
CONFIDENTIAL
TOYOCHEM CO.,LTD.
Converting material Div.
2012.3
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
TOYO Core-Technologies
CONFIDENTIAL
TOYO Core-Technologies
Polymer Technology
Dispersion Technology
Converting Technology
ISSUE of peculiar FPC
Flexibility, Solder resistance, Chemical resistance …Many confrontation issues.
We can provide the solutions for many confrontation issues,
by POLYMER synthesis, DISPERSION filler , SHEETING techniques.
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
TOYO FPC materials / TOYO urethane resin
CONFIDENTIAL
Aspects of TOYO Urethane resin
TOYO’s Urethane resin
(contains functional moiety)
*Containing urethane binding
Specialty thermo curing resin+
Reaction between inside framework of Urethane resin as functional moiety and reaction of specialty thermo curing resin(Heat curing reaction) form solid cross-bridging structure
⇒
Hard segment
Functional moiety
Resistance to heat and humidity
Specialty urethane series resin contain functional moiety has good Flexibility
Heat curing reaction between specialty thermo curing resin express good resistance to heat and humidity
(Image)
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
2007 2008 2009 2010 2011
TSS product details
CONFIDENTIAL
EMI Shield filmTSS100-18TSS100-22
Ag type, 18um,22um
EMI Shield filmTSS100-12
Ag type, 12umThinner type
Conductive adhesive sheet
TSC110For SUS stiffener
Ag type
Conductive adhesive sheet
TSC200
EMI Shield filmTSS200
TSS Market Shear
New product
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Impedance matching
Eye pattern
Now developing / High frequency EMI shield
CONFIDENTIAL
High Speed DataPower Source Low VoltageLow Electric ConsumptionEMI Regulation Change
High Frequency EMI Shield Required
Controlled TransmissionShielding FPC is a Key
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
EMI Shield filmTSS200
CONFIDENTIAL
TOYOCHEM CO.,LTD.
Converting material Div.
2012.3
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
EMI Shield film TSS200
CONFIDENTIAL
This Electromagnetic Wave Shield Film for FPC has excellent flexibility / excellent
electrical conductivity / excellent humidity resistance
Ideal for Mobile Phone Hinge, which requires less noise / Camera Module
Reinforced filmInsulation layer
Conductive adhesive layerProtection film
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
CONFIDENTIAL
Properties
Product name TSS200White release film 50μm PETShield layer Urethane resin basedRelease film 75μm PET
Thickness of Shield layer 22μm (after press)
Shielding Effect More than 40dB (1GHz)Surface resistance Less than 300mΩ/□Peel Strength (PI) More than 3N/cmTg (DMA) 40℃CTE 200 ppm/℃
UL VTM-0 *TSS/kapton50H/TSS
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Features
CONFIDENTIAL
1.Excellent Flexibility
2.Excellent Electrical conductive reliability
3.Non-halogene and UL type
4.Excellent Chemical resistance
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Structure
Structure material / feature Thickness
Reinforced film White PET one side non-silicone resin coated 50μm
Insulation layer Urethane based14 ±2μm
(16um;Before press)
Conductive adhesive layerUrethane based containing conductive
filler(Isotropic conductive)
8 ±2μm(13um;Before press)
Total Thickness (Insulation layer + Conductive adhesive layer)22 ±4μm
(29um;Before press)
Protection film PET one side silicone resin coated 75μm
Reinforced FilmHeat Durable Fire proofingInsulation Layer
Conductive Adhesive Layer Protection film
CONFIDENTIAL
2 layer structure
Toyo original Urethane based
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Temperature
120℃ 140℃ 150℃ 160℃ 180℃
Pressure
1MPa 21μm 22μm 22μm 22μm
2MPa 22μm 22μm 21μm
3MPa 22μm 21μm 21μm
6MPa 21μm
Shield film : TSS200Substrate : 2CCL(ESPANEX MC18-25-00FRM(43μm)・・・Nippon Steel Chemical)Press time : 30min
TOYOCHEM recommend conditions
TSS200
PI
Cu2CCL
*Press time is 30min.
Thickness after Hot press
CONFIDENTIAL
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Conductivity test circuit
TSS Insulation layer
TSS Conductive layer
Cover-lay land diameter
Cover-lay PI;25um
Cover-lay adhesive ; 35um
CCL Cu;18um (Ni-Gold plated)
CCL PI;25um
Cross-section
15mm
CuCu
TSS
CONFIDENTIAL
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
CONFIDENTIAL
Ground connected resistance
Initial 23℃50%RH
Cu:18um
Surface: Ni/Gold Plate
Cover-lay : PI25um,Adhesive 35um
Distance of pole : 4mm
Width of EMI : 15mm
Press conditions
TSS:150℃-2MPa-30min.
SF-PC:170℃-2MPa-30min.
Cu
Cu
Cover-lay(60um)
TSS
Ground connected resistance-1
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Ground connected resistance-2 / 40℃90%RH
CONFIDENTIAL
40℃90%RH
Cu:18um
Surface: Ni/Gold Plate
Cover-lay : PI25um,Adhesive 35um
Land diameter : 1.2mmφ
Distance of pole : 4mm
Width of EMI : 15mm
Press conditions
TSS:150℃-2MPa-30min.
SF-PC:170℃-2MPa-30min.
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
0
200
400
600
800
1000
1200
1400
0 10 20 30 40 50times
Res
ista
nce
[mΩ
]Bending test-1
CONFIDENTIAL
Cu:18um
Surface: Ni/Gold Plate
Cover-lay : PI25um,Adhesive 35um
Cover-lay Land diameter : 1.2mmφ
Distance of pole : 4mm
Width of EMI : 15mm
Press conditions
TSS:150℃-2MPa-30min.
SF-PC:170℃-2MPa-30min.
Cu
Cu
Cover-lay(60um)TSS
Bending test at 360°
SF-PC5500
TSS200
SF-PC6000
Cleave bend
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Bending test-2 / Appearance
CONFIDENTIAL
TSS200 SF-PC6000
Shield film
Cover-lay
CCLTest piece structure (Cross-section)
Bending test at 360°
Cleave bend
after 10 times bended
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Sliding test
CONFIDENTIAL
Conditions : 23℃,50%RHRadios : R=1.0mmSpeed : 30 cpmStroke : 35mmPattern : L/S=0.75mm/0.75mm , 40line
R=1.0[Structure]EMI shield filmCover-lay (PI:12um,Adhesive:15um,Arisawa)2CCL(Cu:12um,PI base:20um,Arisawa)EMI shield film
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Embedment / Appearance
CONFIDENTIAL
Gap scale TSS200 SF-PC5500 SF-PC6000
250um
○ × ○
300um
○ × ○
350um
○ × ×
Gap ; 250um,300um,350umPress conditions
TSS:150℃-2MPa-30min.
SF-PC:170℃-2MPa-30min.Test piece cross-section image
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
No air gap
Embedment / Cross-section image
CONFIDENTIAL
60um embedment
200um embedment
Small air gap
air gap
TSS200 SF-PC5500
60um or 200umEMI Shield film
CCL(60um) or FR-4 (200um)
PI(125um)
Large air gap
Press conditions
TSS:150℃-2MPa-30min.
SF-PC:170℃-2MPa-30min.
60um embedment
200um embedment
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Embedment / Conductivity
CONFIDENTIAL
200μm
Cu
PI
20mm 15mm
10mm10mm
EMIShieldfilm
EMI Shield film20mm15mm
200μm
Cu
PI
20mm 15mm
10mm10mm
EMIShieldfilm
EMI Shield film20mm15mm
200μm
Cu
PI
20mm 15mm
10mm10mm
EMIShieldfilm
EMI Shield film20mm15mm
200μm
Cu
PI
200~300um
Cu
PI
20mm 15mm
10mm10mm
EMIShieldfilm
EMI Shield film20mm15mm
Press conditions
TSS:150℃-2MPa-30min.
SF-PC:170℃-2MPa-30min.
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Shielding performance-1 / Advantest method
CONFIDENTIAL
Electromagnetic wave
Test piece
Support board (plastic)
Grounding
0
10
20
30
40
50
60
0 500 1000 1500 2000
Frequency [MHz]
SE [d
B]
SFPC5500SFPC6000TSS200
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Shield film
PI base film (25μm)
Cu Ni/Au plated (18μm)Cover layer (37.5μm)
Shied film
*Laminate condition : 150℃-2MPa-30min
Ground
Test Piece
CONFIDENTIAL
0
20
40
60
80
100
3 5 7 9 11 13 15
Frequency [GHz]
SE
[dB
]
Competitor TS200
*Competitor ; SF-PC5500
0
20
40
60
80
100
0.1 1 10 100 1000
Frequency [MHz]
SE
[dB
]
Competitor TSS200
Shielding performance-2 / KEC method
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Shielding performance-3 / ASTM method
CONFIDENTIAL
Frequency:500MHz~18GHzASTM D4935Network-analyzer E8361ACondition:28℃60%RH
Electromagnetic waveTest piece
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Adhesive test
Kapton200ENShield film
ADHkapton200EN
90°peel
[Material and Test conditions]Shield film : TSS100-22,TSS200, PC5500,PC6000(TATSUTA)Substrate1 : Kapton200EN *Laminate conditions of Shield film and Kapton200EN : (TSS)150℃-2MPa-30min (TATSUTA)170℃-2MPa-30min.Substrate2 : Kapton200EN *Laminate conditions of ADH and Stiffener : press160℃-2MPa-1hPeel Test : 90°peel, 50mm/min
[Pb free reflow profile]
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Adhesive test-1
CONFIDENTIAL
TSS200 SF-PC5500 SF-PC6000Ref.
Kapton200EN
Bonding Sheet
TSU0041SI-35DL(TOYOCHEM)
11 N/cmInsulation layer of Shield film
11 N/cmBetween Shield and ADH
11 N/cmBetween Shield and ADH
43 N/cmCohesion failure of ADH
D3450(SONYCHEMICAL)
11 N/cmInsulation layer of Shield film
9 N/cmConductive layer of Shield film
10 N/cmCohesion failure of ADH
16 N/cmCohesion failure of ADH
LF0200(Dupont)
6 N/cmInsulation layer of Shield film
4 N/cmBetween Shield and ADH
4 N/cmBetween Shield and ADH
8 N/cmCohesion failure of ADH
Conductive Bonding Sheet
TSC200(TOYOCHEM)
11 N/cmInsulation layer of Shield film
10 N/cmBetween Shield and ADH
10 N/cmCohesion failure of ADH
10 N/cmCohesion failure of ADH
CBF300(TATSUTA)
8 N/cmInsulation layer of Shield film
3 N/cmBetween Shield and ADH
5 N/cmBetween Shield and ADH
16 N/cmBetween ADH and PI
Kapton200ENShield film
ADHkapton200EN
90°peel
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Adhesive test-2 40℃90%RH48hr + Pb free reflow
CONFIDENTIAL
TSS200 SF-PC5500 SF-PC6000Ref.
Kapton200EN
Bonding Sheet
TSU0041SI-35DL(TOYOCHEM)
10 N/cmInsulation layer of Shield film
10 N/cmBetween Shield and ADH
10 N/cmBetween Shield and ADH
24 N/cmBetween ADH and PI
D3450(SONYCHEMICAL)
Delaminate at Reflow
Delaminate at Reflow
Delaminate at Reflow
14 N/cmBetween ADH and PI
LF0200(Dupont)
Delaminate at Reflow
Delaminate at Reflow
Delaminate at Reflow
3 N/cmCohesion failure of ADH
Conductive Bonding Sheet
TSC200(TOYOCHEM)
10 N/cmInsulation layer of Shield film
9 N/cmCohesion failure of ADH
9 N/cmCohesion failure of ADH
10 N/cmCohesion failure of ADH
CBF300(TATSUTA)
5N/cmInsulation layer of Shield film
2 N/cmBetween Shield and ADH
2 N/cmBetween Shield and ADH
16 N/cmBetween ADH and PI
CONFIDENTIAL
Kapton200ENShield film
ADHkapton200EN
90°peel
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Polyimide:kapton200H(50um)・・・Toray-DupontADH:TSU0041SI-35DL(35um) ・・・ToyoChem
[Press condition]TSS200;150℃ 2Mpa 30min , PC6000;170℃2MPa 30minTSU0041SI-35DL;150℃ 2MPa 30min
Polyimide90°peel
Shield film
Ni-Gold plated CCL
ADH
[Test condition]Sample width:10mmPeel speed:50mm/minPeel angle:90°
Adhesive test-3 Ni-Gold plate / peel test
CONFIDENTIAL
2CCL (F30VC125RC1 1/2 Nikkan Kogyo)PI 25um / Cu 18um
Nickel Plate 1um Made by electroplating Gold Plate 0.03μm Made by electroplating
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
TSS200 SF-PC6000
Peel Strength
11 N/cmInsulation layer
6 N/cmBetween Conductive layer and Au plate
Picture after peel
test
Adhesive test-3 Ni-Gold plate / peel test
90°peel
CONFIDENTIAL
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
1mm×1mm, Total 100
10mm
10mm
2CCL:ESPANEX MC18-25-00FRM(43um);Nippon Steel Chemical[Press condition]TSS200;150℃ 2Mpa 30min , SF-PC6000;170℃ 2MPa 30min
Shield film
Ni-Gold plated CCL
[Test method]
1)Laminate shield film for Au plated CCL
2)Cross cutting Shield film
3)Laminate and peel off tape for shield film
4)Counte the number of shield film
Adhesive test-4 Ni-Gold plate / Cross cut test
Cut
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Adhesive test-4 Ni-Gold plate / Cross cut test
CONFIDENTIAL
Before tape test After tape test
TSS200
100/100 OK
SF-PC6000
68/100 OK
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Polyimide
90°peel
Shield film
CCL
ADH
Resist
Polyimide:kapton200H(50μm)・・・Toray DupontADH:TSU35DL(35μm) ・・・Toyo ChemResist:CF-30G K-20/Hardener B K-1(24μm)・・・Taiyo ink2CCL:ESPANEX MC18-25-00FRM(43μm)・・・Nippon Steel Chemical
Adhesive test-5 Resist ink/ peel test
CONFIDENTIAL
[Press condition]TSS200;150℃ 2Mpa 30min , PC6000;170℃2MPa 30minTSU0041SI-35DL;150℃ 2MPa 30min
[Test condition]Sample width:10mmPeel speed:50mm/minPeel angle:90°
2CCL (F30VC125RC1 1/2 Nikkan Kogyo)PI 25um / Cu 18um
Resist (CF-300GK-20/Hardner BK-1 Taiyo ink) 20um
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Adhesive test-5 Resist ink / peel test
CONFIDENTIAL
TSS200 SF-PC6000
Peel Strength
10 N/cmInsulation layer
10 N/cmBetween Insulation layer and adhesive
Picture after peel
test
90°peel
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
1mm×1mm, Total 100
10mm
10mm
2CCL:ESPANEX MC18-25-00FRM(43um);Nippon Steel Chemical[Press condition]TSS200;150℃ 2Mpa 30min , SF-PC6000;170℃ 2MPa 30min
Shield film
Resist/ CCL
[Test method]
1)Laminate shield film for resist on CCL
2)Cross cutting Shield film
3)Laminate and peel off tape for shield film
4)Counte the number of shield film
Adhesive test-6 Resist ink / Cross cut test
Cut
CONFIDENTIAL
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Adhesive test-6 Resist ink / Cross cut test
Before tape test After tape test
TSS200
100/100 OK
SF-PC6000
100/100 OK
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
UL compliant
CONFIDENTIAL
TSS200 has excellent flame resistance (UL94 VTM-0).
UL File No; E316830
[Test piece structure]
TSS200/12.5μmPI(Kapton50H)/TSS200
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Surface abrasion-1 / Rub films each other
CONFIDENTIAL
SF-PC5500TSS200
Appearance After Friction Test 30,000 times
【Test Methods】Using left side pictured Friction Equipment
Load below weight and rub film surfaces each other・Friction :Rub films each other・Load : 200gf・Abrasive Times : 30,000times
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Surface abrasion-2 / Scratch by Tweezers
CONFIDENTIAL
TSS200 SF-PC6000
Scratched insulation layer by TWEEZERS
Striking a mark and refuses
No striking a mark
And no refuses
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Chemical resistance / Cross-cut test
CONFIDENTIAL
[Press condition]TSS200;150℃ 2Mpa 30minSF-PC;170℃ 2MPa 30min.
[Test method]
1)Laminate shield film for Polyimide film (Kapton300H)
2)Cross cutting Shield film
3)Soaked sheet into Solution (Acid / Base)
4)Laminate and peel off tape for shield film
5)Counte the number of shield film
Cut
1mm×1mm, Total 100
10mm
10mm
Shield film
Polyimide
Shield film
Ni-Gold plated CCL
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
10wt% HCl solution / to PI
CONFIDENTIAL
TSS200 SF-PC5500 SF-PC6000
Initial
10wt% HCl solution 20min.
+Tape test
OK NG OK
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
10wt% HCl solution / to Ni-Gold plate
CONFIDENTIAL
TSS200 SF-PC5500 SF-PC6000
Initial
10wt% HCl solution 20min.
+Tape test
OK NG NG
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
10wt% NaOH solution / to PI
CONFIDENTIAL
TSS200 SF-PC5500 SF-PC6000
Initial
10wt% NaOH solution 20min.
+Tape test
OK NG OK
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
10wt% NaOH solution / to Ni-Gold plate
CONFIDENTIAL
TSS200 SF-PC5500 SF-PC6000
Initial
10wt% NaOH solution 20min.
+Tape test
OK OK NG
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
OSP / to PI
CONFIDENTIAL
TSS200 SF-PC5500 SF-PC6000
Initial
OSP 40℃,3min.
+Tape test
OK OK OK
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
OSP / to Ni-Gold plate
CONFIDENTIAL
TSS200 SF-PC5500 SF-PC6000
Initial
10wt% NaOH solution 20min.
+Tape test
OK OK NG
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
CONFIDENTIAL
Reinforced film peel strength
TSS200 SF-PC5500 SF-PC6000
Before Hot press 20 gf/50mm N/A N/A
After Hot press 20 gf/50mm 250 gf/50mm 200 gf/50mm
[Peel test]
Peel angle;180°
Peel speed;300mm/min.
[Press condition]
TSS ; 150℃,2MPa,30min.
SF-PC;170℃,2MPa,30min.
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Comparison
CONFIDENTIAL
Properties TSS200 SF-PC5500 SF-PC6000
Shield property (Advantest method (1GHz) ○ ○ ○
Ground connected resistance ◎ △ ○
Embedment of the gap ◎ × ○
Heat resistance (solder re-flow at 260℃) ○ ○ ○
Peel Strength (PI) ○ ○ ○
Peel Strength (Ni-Au Plate) ○ △ ×
UL-94 VTM-0 ○ ○ ○
Chemical Resistance (Acid / Base) ○ × ×
Sliding test ◎ × ×
Abrasion Durability ○ × ×
Peel Strength of Reinforced film ◎ × ×
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
How to use
CONFIDENTIAL
Flow chart
① Remove the clear protection film.
②Laminate onFPC
③Heat press under vacuumed condition.
Then, post cure.⑤ Post cure
*Lamination using heated rollers at 40℃~80℃ is recommended.
④Remove the reinforced film
Reinforced film (White)
* If pressing time is over 30min,post cure is unnecessary.
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
How to use
CONFIDENTIAL
Press condition
● Recommended Lamination Conditions
Press Condition Post Cure
Temperature Pressure Time Temperature Time
Quick Press & Post Cure
150±10℃ 1~3MPa Over 3min 160±10℃ Over 60min
Press Only 150±10℃ 1~3MPa Over 30min - -
★To avoid remains of air, pressing under vacuumed conditions is recommended.
★TSS200 can be heat-cured using the same equipments under the same processes as for the current reinforcement adhesive sheets.
※The conditions may vary depending on the conditions of the press machine and/ cushioning material. Please check your preferred conditions before starting mass production.
Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.
Storage
CONFIDENTIAL
■TSS200 should be stored under 10℃ / 70%RH
*Storage at room temperature may cause the adhesive layer to stiffen, thusleading to the loss of conductivity.
Please restore TSS200 back to room temperature before usage.
Recommended restoration time is 7 hours.
If there is significant time between the cut-process and the heat-press process, storage under refrigerated conditions is recommended.
【Shelf Life after the Cut-Process】a) under Refrigerated condition(under 10℃): less than 30daysb) under Room Temperature (23℃): less than 14days