SMARC™The new standard for Computer On Modules (COM) based on

ARM architecture

Dov ShalevKontron Israel

1/5/13

May 1, 2013 2 -2

COM Market 2011 - 2016

• COMs YoY growth is 20%-25%• Expected YoY growth for ARM is 25%+• Why?

• ARM CPU cost 2x-3x less than x86• ARM processing capability has begun to catch up with x86 apps• Mobility, longer battery life and lower profile

• IMS Research projects that 40% of COMs applications will be ARM based by 2016

Source:IMS Research 2012

2011 2016

May 1, 2013 3 -3

beyond x86ARM Computer-on-ModulesPositioning

Positioning

February 2013

May 1, 2013 4 -4

Parallel TFT display bus

MIPI display interface

Camera interfacesMultiple SPI links

Multiple SDIO interfaces

Serial ports

Many USB (8 lanes)Lots of PCI Express (6 lanes)PCI Express graphics (16 lanes)LPC (an x86 only bus)

..…and more

Key Feature DifferencesA

RM

+

X86

+

Designed for mobility

ARM COM Designs requires fewer pins and lower cost power circuitry

May 1, 2013 5 -5

• ARM processors are powerful enough to drive a graphical user interface at very low power consumption, (Smartphone, Tablet)

• ARM delivers exceptional performance/watt ratio– No bulky thermal solution

• Extreme low power consumption at operation (<2W)– ARM better serves Ultra Low-Power market requirements

•Extended temperature selections available

•SOC performance with dual/quad core is comparable with ATOM range– ARM will not replace Intel x86 technology. Rather, it reaches segments that are

currently underserved relative to ARM

•Longevity up to 15 years

ARM Positioning

May 1, 2013 6 -6

Market Trends for ARM based Module

• Technical trends: – PCIe– GbE– Multicore

• Make Vs. Buy trends: – Declining of OEM resources– TTM is getting short– Increasing Silicon “Complexity”

May 1, 2013 7 -7

SGETSMARC™standardized through SGET

SGET

February 2013

May 1, 2013 8 -8

Standardization Group for Embedded Technologies (SGET)

• Manufacturer-independent institution (no Intel, AMD, Tyco etc.)

• A new COMs standard incorporating ARM technology – Form factor – Optimized pinout– Alternative solution to x86 based COM apps

• Ecosystem support

• Layers of support to enable complete solution

May 1, 2013 9 -9

SGET Founding Members - May 2012

Kontron, ADLINK, Advantech, B-plus, Congatec, Data Module, EEPD,

F&S, Fortec, Hectronic, Heitec, IES, Iwavesystems, Micro Consult, MSC,

next System, publish-industry, Seco, speicherguide.de, TQ Group,

www.sget.org

May 1, 2013 10 -10

• Mobile / Portable application requirements– Enclosure constraints– Thermal limits– Power / battery life

• Features not typically found on COM Express– MIPI I/F– Camera I/F– Multiple SPI and SDIO

• COM Express is optimized for x86 features– Many USB– Multiple PCI Express– PEG graphics support

Why a New Form Factor?SMARC compared with COM Express

SMARC Requires fewer pins and lower cost power circuitry

May 1, 2013 11 -11

5.7 mm

1.5 mm

Why a New Form Factor?

• Ultra Low-Power-COM meets application needs– Enclosure constraints

• Limited x, y & z dimensions– Small surface area 41 cm2– Height < 6mm – top and bottom– Well matched with SOC silicon– Connector style enables low profile insertion

– Thermal limits• < 5W TDP - eliminate need for thermal solution

– Shock & Vibration • Connector is approved for Automotive

MXM3.0 connector

May 1, 2013 12 -12

New COM Standard: SMARCScalability via two form factors

May 1, 2013 13 -13

New COM StandardLow Power Embedded Architecture Platform

• MXM 3.0 gold-finger-card-edge connector– 314 total pins available– Low profile options available– Used in high end laptops– Allows durable, slim designs– Shock-/vibration proof option for automotive applications

May 1, 2013 14 -14

Kontron SMARC™ Architecture -Supported Interfaces

February 2013

May 1, 2013 15 -15

User Requirement

GUI / User Interface

Application

Operating System

Driver (own/3rd party)

Inte

rfac

e re

quire

men

ts

Prod

uct r

equi

rem

ents

sizeLCD

USB

ETN

COMMs

Voltage

shape

color

certifications

regulatory

Firmware (Bootloader/BIOS)

Hardware

The product - Layer Model

May 1, 2013 16 -16

Embedded Operating System support

May 1, 2013 17 -17

• SMARC-sAT30 – nVidia Tegra 3 Quad Core 1.2 GHz ARM Cortex A9

– 1GB memory down

– HD encode/decode MPEG2, dual GPU

– < 3,5 W TDP, Commercial temp 0°C to 60°C

– Medical, Energy, Infotainment , Transportation

• SMARC-sA3874i– Ti AM3874 Single Core ARM Cortex-A8 processor 800MHz/1GHz

– 1GB memory down, PCIe2 w/ integrated PHY

– 2 W TDP, Industrial Temp -40°C to +85°C

– Low cost when Graphics is needed. Harsh environments

• SMARC-sAMX6i– Freescale i.MX6 Single – Dual - Quad Core ARM Cortex-A9 processor

– Full HD 1080P encode/decode, single and dual display support

– On chip LAN and PCIe to connect to external modem, WiFi

– Industrial Temp -40°C to +85°C

– Communications, Military, Industrial, Graphic application

SMARC™ Product examples

www.kontron.com

Munich/Eching   Kaufbeuren   Deggendorf   San Diego   Columbia    Fremont   Montreal   Beijing   Penang   Sydney  

Bangalore  Moscow   Warsaw   Kiev  Tel Aviv   Liberec/Pilsen  Chichester   Copenhagen   Brussels   Toulon   Solothurn

Thank you for your attention