tse co.,ltd. automatic probe assembly machineautomatic probe assembly machine author: dave oh ....

Automatic Probe Assembly Automatic Probe Assembly MachineMachine

Author: Dave Oh Kyung-hwan

KIMJung-pyo

Chun (Presenter)

TSE Co.,Ltd.

June 8-11, 2008San Diego, CA USA

IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop

Table of ContentsTable of Contents1st

Section: Conventional Methods of Assembly

•

Introduction CPC •

Conventional Manufacturing Process

2nd

Section: Innovative Methods of Assembly

•

Introduction Automatic Probe Assembly Machine•

Productivity Effects / Quality Effects

3rd

Section: Conclusion

•

Summary•

Future Action Items

2 / 232 / 232 / 23

• High Pin Count -

up to 23,000 Pins (depend on ATE resource)

• Large Probing Area –

12”

1 Touch Down

• Applied to both Hot & Cold Temperature

( -30 ~ 100℃, Pad Size 75umX75um)

-

Stable along with Thermal Deformation

1st

Section. Conventional Methods of Assembly

CPC (Compact Probe Card)CPC (Compact Probe Card)

June 8 to 11, 2008June 8 to 11, 2008June 8 to 11, 2008 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test WorkshopJune 8 to 11, 2008June 8 to 11, 2008June 8 to 11, 2008 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop

1T/D 12”

NAND Flash CPC

3 / 2333 / 23/ 23


1st


CPC Structure (Sectional View)CPC Structure (Sectional View)

Frame

EpoxyProbe

J-PCB

Interposer Capacitor

4 / 2344 / 23/ 23

1st


Conventional Manufacturing Process.Conventional Manufacturing Process.

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2.Positioning 3. Aligning1.Probe Bending

1. Labor & Time Required

2. Less Reliable for Partial Inspection

3. Technicians Demanded

Disadvantages

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2nd

Section. Innovative Methods of Assembly

Automatic Automatic ProbeProbe

Assembly Machine (IMAssembly Machine (IM--800)800)

1.

Objectives

•

Full Probe Inspection

•

Productivity Improvement

•

Quality Consistency

2. Features

•

High Resolution Image Processing

•

Highly Accurate & Repeatable Positioning

1st

Vision

June 8 to 11, 2008June 8 to 11, 2008June 8 to 11, 2008 IEEE SW Test WorkshopIEEE SW Test WorkshopIEEE SW Test Workshop

2nd


IMIM--800 Process Steps800 Process Steps

1. Loading a Pin from Cassette2. Probe Inspection before Bending3. Bending4. Probe

Inspection after Bending

6. Probe Positioning5. Probe Tilt Inspection

Loader

Right Cassette

NG Zone

Bending Zone

Positioning Zone2nd

Vision

Left Cassette

Loading Zone

<Bloc Diagram>

7 / 2377 / 23/ 23

1. Full Inspection & Data Logging

-

Inspect Tip Length, Bending Angle, Probe Tilt-

Record Inspection Data

2. High Precision Repeatability

-

Increased the Uniformity of Tip Length-

Increased the Uniformity of Probe Bending Angle


2nd


AdvantagesAdvantages

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Damage & Bending Angle

Tilt CheckReal-time check

Hole Position Check


2nd


Full InspectionFull Inspection

9 / 2399 / 23/ 23


Probe Bending Angle / Tip Length / Tilt Check


SpecificationsSpecifications

FOV (Field of View) 1.6mm * 1.2mm

Accuracy ±

2㎛

Repeatability ±

2㎛

2nd


High resolution Image processing

10 / 231010 / 23/ 23

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2nd


Repeatability

Tip Length Tolerance Probe Bending Angle Tolerance

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Probe Bending Angle

Tip Length

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2nd


Repeatability

Comparative data of Tip Length Tolerance

368371374377380383386389392

1 12 23 34 45 56 67 78 89100

ManualIM-800

380 380 ±±

44㎛㎛

(IM(IM--800)800)

(pins)(pins)

((㎛㎛))

380 380 ±±

1010㎛㎛

(Manual)(Manual)

12 / 231212 / 23/ 23


2nd


Repeatability

Comparative data of Probe Bending Angle Tolerance

102.2102.4102.6102.8

103103.2103.4103.6103.8

1 12 23 34 45 56 67 78 89 100

ManualIM-800

(pins)(pins)

103 103 ±±

0.60.6°°

(Manual)(Manual)103 103 ±±

0.30.3°°

(IM(IM--800)800)

(Bending Angle)(Bending Angle)

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2nd


EffectsEffects


1.

Productivity

-

Enhanced Throughput

-

Reduced Products Delivery

2. Quality

-

Increased the Accuracy of the Tip Dia. By Precise Bending Angle of the Probe

-

Enhanced Scrub Marks by Full Probe Inspection

14 / 231414 / 23/ 23

2nd


Productivity

Effects


1. Shorten Delivery Time by Automatic Process

- CPCTM

New Product : 5 →

4 weeks

- CPCTM

Repeat Order : 4 →

3 weeks

VS

Skillful Engineer(More than 3 years)

IM-800

2. Compare

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VSIM-800

Time for 1pin 30sec

Working time 24 hours

Total Pins in a day 960

8hours

Comparison 5X

2nd


Productivity

Effects

Technician(With 3 Years Experience)

20 hours * 83%

15 sec

4800

X

16 / 231616 / 23/ 23


=

5 TechniciansIM-800

2nd


Productivity

Effects

17 / 231717 / 23/ 23

• Measuring Equipments


1. WaferWoRx 2. ProbeWoRx

2nd


Quality

Effects

18 / 231818 / 23/ 23

2nd

Section. Innovative Methods

Quality

Effects


•

Reducing Tip Length Gap by Probe Insert Depth Uniformity

0

50

100

150

200

250

10 8 6 4 2 0 -2 -4 -6 -8

Tip Length Gap (㎛)

Num

ber

of P

ins

IM-800 Manual

19 / 231919 / 23/ 23

2nd

Section. Innovative Methods

Quality

Effects


•

Reducing Tip

Dia. Dispersion by Probe Insert Depth Uniformity

050

100150200250300350400450

11 12 13 14 15 16 17 18 19 20 24Tip Diameter (㎛)

Num

ber o

f Pin

s

Manual

IM-800

20 / 232020 / 23/ 23

2nd

Innovative Methods of Assembly

Quality

Effects


a) Before b) AfterMax. Size

X : 29.0㎛

Y : 13.6㎛

X : 18.8㎛

Y : 12.7㎛

GAP

X : 10.2㎛Y : 0.9㎛

Max. Size

X : 22.2㎛

Y : 12.0㎛

X : 17.9㎛

Y : 11.3㎛

GAP

X : 4.3㎛Y : 0.7㎛

• Enhanced Scrub Marks by Full Probe Inspection

Min. Size Min. Size

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• Got Rid of the Manual Drawbacks by Automation

• Improved the Reliability & Accuracy by Q.C & Q.A

-

Automatic Full Inspection

-

Reduce Tolerance of Tip Length and Bending Angle

-

Enhance Scrub Marks Quality

• Shorten the Delivery

-

One Week Faster

3rd

Section. Conclusion

Summary

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3rd

Section. Conclusion

Future Action ItemsFuture Action Items


• Reduce TAT (Total Acting Time)

-

15sec →

12sec

• Enhance the Uniformity

-

Tip Length & Probe Bending Angle

-

Tip Diameter & Scrub Mark

• Increase Automation

23 / 232323 / 23/ 23

Thank You for Kind Attention!

Question?


tse co.,ltd. automatic probe assembly machineautomatic probe assembly machine author: dave oh ....

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