tyan brochure
DESCRIPTION
ÂTRANSCRIPT
INTEL-BASED HPC/GPU PLATFORMS
Processor
Chipset
Memory
Expansion
Storage
Network
VideoManagementForm Factor
‧Dual LGA2011 sockets support Intel® Xeon® E5-2600 series processors (Sandy Bridge-EP)
‧Intel® C602 PCH‧Intel® C602 PCH + TYAN TRK#5 ROM Kit (S7052WGM5NR)‧(12+12) DDR-III DIMM sockets‧Support up to 768GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 384GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 192GB of U-DDR3 1333/1066 w/ ECC memory‧(3) PCI-E (Gen.3) x8 slots‧(1) PCI-E (Gen.3) x4 slot‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s connectors (Intel® RSTe 3.0)‧(8) SAS 3Gb/s ports by (2) mini-SAS conncetors (Intel® RSTe 3.0)
(S7052WGM5NR)‧(5) GbE (via Intel® I350-AM4 and Intel® 82574L)
(S7052GM5NR/S7052WGM5NR)‧(3) GbE (via Intel® I350-AM2 and Intel® 82574L) (S7052GM3NR)‧ASPEED AST2300 Integrated Graphics‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)
Server Board
Server Board
S7012S7012GM4NR / S7012WGM4NR
Processor
ChipsetMemory
Expansion
Storage
NetworkVideoManagementForm Factor
‧Dual LGA1366 sockets support Intel® Xeon® 5500/5600 series processors (Nehalem/ Westmere)
‧Intel® 5520 + ICH10R‧(9+9) DDR-III DIMM sockets‧Support up to 144GB of R-DDR3 1333/1066/800 w/ ECC
memory‧Support up to 48GB of U-DDR3 1333/1066 w/ ECC memory‧(4) PCI-E (Gen.2) x8 slots‧(1) PCI-E x8 slot (w/ x4 link)‧(6) SATA 3Gb/s connectors (Intel® Matrix RAID)‧(8) SAS 3Gb/s ports by (2) mini-SAS connectors (LSI RAID
stack) (S7012WGM4NR)‧(4) GbE (via Intel® 82576EB and 2x Intel® 82574L)‧ASPEED AST2050 Integrated Graphics‧ASPEED AST2050 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)
S7050S7050A2NRF / S7050GM4NR / S7050WGM4NR / S7050GM2NR
Processor
Chipset
Memory
Expansion
Storage
Network
VideoAudioFirewireManagementForm Factor
‧Dual LGA2011 sockets support Intel® Xeon® E5-2600 series processors (Sandy Bridge-EP)
‧Intel® C602 PCH‧Intel® C602 PCH + TYAN TRK#5 ROM Kit (S7050WGM4NR)‧(8+8) DDR-III DIMM sockets‧Support up to 512GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 256GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 128GB of U-DDR3 1333/1066 w/ ECC memory‧(2) PCI-E (Gen.3) x16 slots (w/ x16 or x8 link)‧(2) PCI-E (Gen.3) x8 slots (w/ x0 or x8 link)‧(1) PCI-E (Gen.2) x4 slot‧(1) PCI 32/33MHz slot‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s connectors (Intel® RSTe 3.0)‧(8) SAS 3Gb/s conncetors (Intel® RSTe 3.0) (S7050WGM4NR)‧(4) GbE (via Intel® i350-AM2 and 2x Intel® 82574L)‧(2) GbE (via 2x Intel® 82574L) (S7050GM2NR,S7050A2NRF)‧ASPEED AST2300 Integrated Graphics‧Realtek ALC262 audio CODEC (S7050A2NRF)‧VIA VT6308 1394a controller (S7050A2NRF)‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)
Server Board
Workstation Board
Server Board
Workstation Board
S7010S7010AGM2NRF
Processor
ChipsetMemory
Expansion
StorageNetworkVideoAudioFirewireManagementForm Factor
‧Dual LGA1366 sockets support Intel® Xeon® 5500/5600 series processors (Nehalem/ Westmere)
‧Intel® 5520 + ICH10R‧(6+6) DDR-III DIMM sockets‧Support up to 96GB of R-DDR3 1333/1066/800 w/ ECC
memory‧Support up to 48GB of U-DDR3 1333/1066 w/ ECC memory‧(1) PCI-E (Gen.2) x16 slot‧(2) PCI-E (Gen.2) x8 slots‧(1) PCI-E x4 slot‧(1) PCI 32/33MHz slot‧(6) SATA 3Gb/s connectors (Intel® Matrix RAID)‧(2) GbE (via 2x Intel® 82574L)‧ASPEED AST2050 Integrated Graphics‧Realtek ALC262 audio CODEC‧VIA VT6308 1394a controller‧ASPEED AST2050 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)
Intel® C600Series Chipset
Intel® 5500Series Chipset
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S7052S7052GM3NR / S7052GM5NR / S7052WGM5NR
<HPC> TYAN offers multiple High Performance Computing (HPC) server platforms that support either the newest Intel® Xeon® processor E5-2600 product family or Intel® Xeon® 5600 series processor . Both platforms are designed for high performance in massively parallel computing environments which meet users’ complex workloads requirements while accelerating general computing capability. Ranging from mainstream workloads to the most challenging computing applications, TYAN offers various platforms that support our customers need to build scalable, efficient, flexible, and easily managed datacenters as well as other complicated high performance computing infrastructure.
<GPU> Supporting the latest Intel® Xeon® Processor E5-2600 product families, Intel® Xeon® 5600 Series Processor and Graphic Computing Processors (GPU), TYAN’s GPU platforms offer data accuracy and double precision floating-point performance with uncompromised accuracy. TYAN’s Intel Xeon based GPU platforms range from 1 GPU up to 8 GPUs inside traditional 1U, 2U and 4U rackmount chassis, which help reduce the rack space requirements required for high performance applications. With the right workload, these platforms can offer higher performance and reduce power consumption when compared to traditional CPU centric platforms.
Target Applications:
‧Bio-Informatics, Life Sciences and Computational Chemistry
‧Electronic-Design Automation ‧Computational Finance and
Computational Fluid Dynamics‧Computer Vision and MATLAB
Acceleration‧Data mining, Analytics and
Databases‧Imaging, Molecular Dynamics,
Weather, Climate Modeling and Atmospheric
‧Oil, Gas and Petroleum Exploration ‧Physic and Scientific Research
HPC
/GPU
Platforms -
Intel Based
SMB
Platforms
SM
B Platform
sEm
bedded Platforms
Em
bedded Platforms
Matrix
Matrix
13 14
● TYAN HPC/GPC Platforms │ Intel Based
Cloud Platform
sC
loud Platforms
Server Board
Server Board
S7016S7016GM3NR / S7016WGM3NR
Processor
ChipsetMemory
Expansion
Storage
NetworkVideoManagementForm Factor
‧Dual LGA1366 sockets support Intel® Xeon® 5500/5600 series processors (Nehalem/ Westmere)
‧Intel® 5520 + ICH10R‧(9+9) DDR-III DIMM sockets‧Support up to 144GB of R-DDR3 1333/1066/800 w/ ECC
memory‧Support up to 48GB of U-DDR3 1333/1066 w/ ECC memory‧(1) PCI-E (Gen.2) x16 slot‧(2) PCI-E (Gen.2) x8 slots‧(2) SATA 3Gb/s connectors (Intel® Matrix RAID)‧(4) SATA 3Gb/s ports by (1) mini-SAS connector (Intel®
Matrix RAID)‧(8) SAS 3Gb/s ports by (2) mini-SAS connectors (LSI RAID
stack) (S7016WGM3NR)‧(3) GbE (via Intel® 82576EB and Intel® 82574L)‧ServerEngine Pilot II Integrated Graphics‧ServerEngine Pilot II (IPMI v2.0 compliant w/ iKVM)‧EATX (12" x 13", 305mm x 330mm)
Server Board
Workstation Board
Server Board
Workstation Board
S7025S7025AGM2NR / S7025WAGM2NR
Processor
ChipsetMemory
Expansion
Storage
NetworkVideoAudio ManagementForm Factor
‧Dual LGA1366 sockets support Intel® Xeon® 5500/5600 series processors (Nehalem/ Westmere)
‧Intel® 5520 + 5520 + ICH10R‧(4+4) DDR-III DIMM sockets‧Support up to 64GB of R-DDR3 1333/1066/800 w/ ECC
memory‧Support up to 32GB of U-DDR3 1333/1066 w/ ECC memory‧(4) PCI-E (Gen.2) x16 slots‧(1) PCI-E (Gen.2) x8 slot‧(1) PCI-E (Gen.2) x4 slot‧(1) PCI 32/33MHz slot‧(6) SATA-II connectors running at 3.0 Gb/s w/ RAID 0, 1, 10,
5 support‧(8) SAS ports by (2) mini-SAS connectors w/ RAID 0, 1, 1E
support (S7025WAGM2NR)‧(2) GbE (via two Intel® 82574L)‧ASPEED AST2050 Integrated Graphics‧Realtek ALC262 audio CODEC‧ASPEED AST2050 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)
Intel® 5500Series Chipset
FT77A- B7059B7059F77AV4R (BTO)
Intel® C600Series Chipset
Server Board
Server Board
S7053S7053GM2NR / S7053WGM2NR / S7053GM4NR / S7053WGM4NR
S7066S7066GM3NR / S7066WGM3NR
World’s Only 8 GPU Barebone‧Supporting (2) Intel® Xeon® E5-2600 Processor Series‧Supporting up to (8) GPU cards in a 4U chassis‧(24) DDR-III R/U-DIMM slots‧(8) PCI-E x16 Gen.3 slots‧(4) 2.5” HDDs
Intel® C600Series Chipset
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Processor
Chipset
Memory
Expansion
Storage
Network
VideoManagementForm Factor
‧Dual LGA2011 sockets support Intel® Xeon® E5-2600 series processors (Sandy Bridge-EP)
‧Intel® C602 PCH‧Intel® C602 PCH + LSI SAS2308 (S7053WGM2NR/S7053WGM4NR)‧(8+8) DDR-III DIMM sockets‧Support up to 512GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 256GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 128GB of U-DDR3 1333/1066 w/ ECC memory‧(2) PCI-E (Gen.3) x16 slots‧(4) PCI-E (Gen.3) x8 slots‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s ports by (1) mini-SAS connector (Intel® RSTe 3.0)‧(8) SAS 6Gb/s ports by (2) mini-SAS conncetors (LSI RAID stack)
(S7053WGM2NR/S7053WGM4NR)‧(2) GbE (via Intel® I350-AM2) (S7053GM2NR/S7053WGM2NR)‧(4) GbE (via Intel® I350-AM4) (S7053GM4NR/S7053WGM4NR)‧ASPEED AST2300 Integrated Graphics‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)
Processor
Chipset
Memory
ExpansionStorage
NetworkVideoManagementForm Factor
‧Dual LGA2011 sockets support Intel® Xeon® E5-2600 series processors (Sandy Bridge-EP)
‧Intel® C602 PCH‧Intel® C602 PCH + LSI SAS2308 (S7066WGM3NR)‧(8+8) DDR-III DIMM sockets‧Support up to 512GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 256GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 128GB of U-DDR3 1333/1066 w/ ECC memory‧(2) PCI-E (Gen.3) x16 slots‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s ports by (1) mini-SAS connector (Intel® RSTe 3.0)‧(8) SAS 6Gb/s ports by (2) mini-SAS conncetors (LSI RAID stack)
(S7066WGM3NR)‧(3) GbE (via Intel® I350-AM2 and Intel® 82574L)‧ASPEED AST2300 Integrated Graphics‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧EATX (12" x 13", 305mm x 330mm)
Intel® C600Series Chipset
Intel® C600Series Chipset
Model NumberEnclosure Form FactorSupported CPUChipsetChipset InterconnectionNumber of DIMM SlotMemory Type (max.capacity)Storage ControllerRAID SupportNetworking
PCI Expansion Slots
Standard Model Number of HDD Bay Storage Backplane Power SupplyB7059F77AV4R (BTO) (4) Internal 2.5" N/A (2+1) 2,400W RPSU
Intel® C602 PCHIntel® QPI 8.0/ 7.2/ 6.4GT/s
(8) PCI-E (Gen.3) x16 + (1) PCI-E (Gen.3) x8+ (1) PCI 32/33MHz + (1) PCI-E (Gen.3) x8 Mezzanine slot
24/ 12+12R-DDR3 1600/1333 / 1066 w/ ECC (384GB)U-DDR3 1600/ 1333/ 1066 w/ ECC (192GB)Intel® C602 PCH (SATA 6Gb/s & 3Gb/s)
0, 1, 5, 10 (Intel® RSTe 3.0)(2) GbE (shared IPMI NIC)
FT77A-B70594U (28" in depth)
(2) Intel® Xeon® E5-2600 Series (Sandy Bridge-EP)
S7055S7055AGM3NR / S7055WGM3NR / S7055GM3NR-B / S7055GM3NR-2T-B
Processor
Chipset
Memory
Expansion
Storage
Network
VideoAudioManagementForm Factor
‧Dual LGA2011 sockets support Intel® Xeon® E5-2600 series processors (Sandy Bridge-EP)
‧Intel® C602 PCH‧Intel® C602 PCH + TYAN TRK#5 ROM Kit (S7055WGM3NR)‧(4+4) DDR-III DIMM sockets‧Support up to 256GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 128GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 64GB of U-DDR3 1600/1333/1066 w/ ECC memory‧(4) PCI-E (Gen.3) x16 slots ‧(2) PCI-E (Gen.3) x8 slots (S7055GM3NR-B)‧(1) PCI 32/33MHz slot‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s connectors (Intel® RSTe 3.0)‧(8) SAS 3Gb/s ports by (2) mini-SAS connectors (Intel® RSTe 3.0)
(S7055WGM3NR)‧(3) GbE (via Intel® I350-BT2 and Intel® 82574L)
(S7055AGM3NR / S7055WGM3NR / S7055GM3NR)‧(2) 10GbE (via Intel® X540-AT2) + (1) GbE (Intel® 82574L)
(S7055GM3NR-2T-B)‧ASPEED AST2300 Integrated Graphics‧Realtek ALC262 audio CODEC (S7055AGM3NR)‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧SSI EEB (12" x 13", 305mm x 330mm)
S7056S7056GM3NR / S7056WGM3NR / S7056WGM3NR-2T
Processor
Chipset
Memory
Expansion
Storage
Network
VideoManagementForm Factor
‧Dual LGA2011 sockets support Intel® Xeon® E5-2600 series processors (Sandy Bridge-EP)
‧Intel® C602 PCH‧Intel® C602 PCH + TYAN TRK#5 ROM Kit
(S7056WGM3NR/S7056WGM3NR-2T)‧(8+8) DDR-III DIMM sockets‧Support up to 512GB of LRDIMM 1333/1066 w/ ECC memory‧Support up to 256GB of R-DDR3 1600/1333/1066 w/ ECC memory‧Support up to 128GB of U-DDR3 1333/1066 w/ ECC memory‧(2) PCI-E (Gen.3) x16 slots‧(2) PCI-E (Gen.3) x4 slots in-lined w/ x16 slots & x8 link‧(2) SATA 6Gb/s connectors (Intel® RSTe 3.0)‧(4) SATA 3Gb/s ports by (1) mini-SAS connector (Intel® RSTe 3.0)‧(8) SAS 3Gb/s ports by (2) mini-SAS connectors (Intel® RSTe 3.0)
(S7056WGM3NR/S7056WGM3NR-2T)‧(3) GbE (via Intel® I350-BT2 and Intel® 82574L)
(S7056GM3NR/S7056WGM3NR)‧(2) 10GbE (via Intel® X540-AT2) + (1) GbE (Intel® 82574L)
(S7056WGM3NR-2T)‧ASPEED AST2300 Integrated Graphics‧ASPEED AST2300 (IPMI v2.0 compliant w/ iKVM)‧EATX (12" x 13", 305mm x 330mm)
HPC
/GPU
Platforms -
Intel Based
HPC
/GPU
Platforms -
Intel Based
SMB
Platforms
SM
B Platform
sEm
bedded Platforms
Em
bedded Platforms
Matrix
Matrix
15 16
● TYAN HPC/GPU Platforms │ Intel Based ● TYAN HPC/GPU Platforms │ Intel Based
SMB
Platforms
SM
B Platform
sEm
bedded Platforms
Em
bedded Platforms
Matrix
Matrix
Cloud Platform
sC
loud Platforms
Cloud Platform
sC
loud Platforms
FT48-B7025B7025F48W4H / B7025F48W8HR
GOLD
FT48-B7055B7055F48W8HR
TN70-B7066B7066T70W12HR
GOLD
TN70-B7016B7016T70-077V12HR
GOLD
GN70-B7056B7056G70V8HR / B7056G70V8HR-2T
GOLD
YR292-B7008-X4B7008Y292X4-080V4HR
Model NumberEnclosure Form FactorSupported CPU (per node)Chipset (per node)QuickPath InterconnectNumber of DIMM Slot(per node)Memory Type (max. capacity)(per node)Storage Controller (per node)RAID Support (per node)Networking (per node)PCI Expansion Slots (pernode)
Standard Model Number of HDD Bay Storage Backplane Power SupplyB7008Y292X4-080V4HR (4) Hot-swap 2.5"
(per node)4-port SAS/ SATA
6Gb/s(per node)
(1+1) 800W RPSU
Intel® 5500 + ICH10RIntel® QPI 6.4/ 5.86/ 4.8 GT/s
(1) PCI-E (Gen.2) x16
9
R-DDR3 1333/1066/800 w/ ECC (72GB)U-DDR3 1333/1066 w/ ECC (36GB)
Intel® ICH10R (SATA 3Gb/s)RAID 0, 1, 5, 10 (Intel® Matrix RAID)
(2) GbE + (1) IPMI
YR292-B7008-X42U (28.74" in depth) / 4 Nodes
(1) Intel® Xeon® 5500/5600 Series (Nehalem/ Westmere)
Intel® C600Series Chipset
Intel® 5500Series Chipset
Intel® 5500Series Chipset
Model NumberEnclosure Form FactorSupported CPUChipsetChipset InterconnectionNumber of DIMM SlotMemory Type (max.capacity)Storage ControllerRAID SupportNetworking
PCI Expansion Slots
Standard Model Number of HDD Bay Storage Backplane Power SupplyB7025F48W4H (4) Hot-swap 3.5" 4-port SAS/ SATA
3Gb/s1,300W (2x 650W)
B7025F48W8HR (8) hot-swap 3.5" (2) 4-port SAS/ SATA3Gb/s
(2+1) 1,300W RPSU
Intel® 5520 + 5520 + ICH10RIntel® QPI 6.4/ 5.86/ 4.8 GT/s
(4) PCI-E (Gen.2) x16 + (1) PCI-E (Gen.2) x8 +(1) PCI-E (Gen.2) x4 + (1) PCI 32/33MHz
8/ 4+4R-DDR3 1333/ 1066/ 800 w/ ECC (64GB)
U-DDR3 1333/ 1066 w/ ECC (32GB)LSI SAS1068E (SAS 3Gb/s)
0, 1, 1E (LSI RAID stack)(2) GbE (shared IPMI NIC)
FT48-B70254U (27.5" in depth)
(2) Intel® Xeon® 5500/5600 Series (Nehalem/ Westmere)
GOLD
Model NumberEnclosure Form Factor
Supported CPU
ChipsetQuickPath InterconnectNumber of DIMM SlotMemory Type (max.capacity)
Storage Controller
RAID Support
NetworkingPCI Expansion Slots
Standard Model Number of HDD Bay Storage Backplane Power SupplyB7016T70-077W12HR (12) hot-swap 3.5" 12-port SAS/ SATA (1+1) 770W RPSU
Intel® 5520 + ICH10RIntel® QPI 6.4/ 5.86/ 4.8 GT/s
18/ 9+9R-DDR3 1333/ 1066/ 800 w/ ECC (144GB)
U-DDR3 1333/ 1066 w/ ECC (48GB)LSI SAS1068E (SAS 3Gb/s)Intel® ICH10R (SATA 3Gb/s)
0, 1, 1E (LSI RAID stack)0, 1, 5, 10 (Intel Matrix RAID)(3) GbE (shared IPMI NIC)
(2) PCI-E (Gen.2) x8 + (2) PCI-E (Gen.2) x4
TN70-B70162U (27.56" in depth)
(2) Intel® Xeon® 5500/5600 Series (Nehalem/ Westmere)
Intel® 5500Series Chipset
Intel® C600Series Chipset
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Model NumberEnclosure Form Factor
Supported CPU
ChipsetQuickPath Interconnect
Number of DIMM Slot
Memory Type (max.capacity)
Storage Controller
RAID Support
NetworkingPCI Expansion Slots
Standard Model Number of HDD Bay Storage Backplane Power SupplyB7066T70W12HR (12) hot-swap 3.5" 12-port SAS/ SATA (1+1) 770W RPSU
Intel® C602 PCHIntel® QPI 8.0/ 7.2/ 6.4GT/s
16/ 8+8
R-DDR3 1600/ 1333/ 1066/ 800 w/ ECC (256GB)U-DDR3 1333/ 1066 w/ ECC (128GB)
LSI SAS2308 (SAS 6Gb/s)Intel® C602 PCH (SATA 6Gb/s & 3Gb/s)
0, 1, 1E, 10 (LSI RAID stack)0, 1, 5, 10 (Intel® RSTe 3.0)(3) GbE (shared IPMI NIC)
(4) PCI-E (Gen.3) x8
TN70-B70662U (27.56" in depth)
(2) Intel® Xeon® E5-2600 Series (Sandy Bridge-EP)
SILVER
Intel® C200Series Chipset
Model NumberEnclosure Form FactorSupported CPUChipsetChipset InterconnectionNumber of DIMM SlotMemory Type (max.capacity)Storage ControllerRAID Support
Networking
PCI Expansion Slots
Standard Model Number of HDD Bay Storage Backplane Power Supply
B7055F48W8HR (8) hot-swap 3.5" (2) 4-port SAS/ SATA6Gb/s (2+1) 1,540W RPSU
Intel® C602 PCHIntel® QPI 8.0/ 7.2/ 6.4GT/s
(4) PCI-E (Gen.3) x16 + (2) PCI-E (Gen.3) x8 + (1) PCI 32/33MHz
8/ 4+4R-DDR3 1600/ 1333/ 1066/ 800 w/ ECC (256GB)
U-DDR3 1600/ 1333/ 1066 w/ ECC (64GB)Intel® C602 PCH (SATA 6Gb/s & 3Gb/s)
0, 1, 5, 10 (Intel® RSTe 3.0)(3) GbE (shared IPMI NIC), or
(2) 10GbE + (1) GbE (shared IPMI NIC)
FT48-B70554U (27.5" in depth)
(2) Intel® Xeon® E5-2600 Series (Sandy Bridge-EP)
Model NumberEnclosure Form FactorSupported CPUChipsetQuickPath InterconnectNumber of DIMM SlotMemory Type (max.capacity)Storage ControllerRAID Support
Networking
PCI Expansion Slots
Standard Model Number of HDD Bay Storage Backplane Power SupplyB7056G70V8HR (8) hot-swap 3.5" 8-port SAS/ SATA (1+1) 770W RPSUB7056G70V8HR-2T (8) hot-swap 3.5" 8-port SAS/ SATA (1+1) 770W RPSU
Intel® C602 PCHIntel® QPI 8.0/ 7.2/ 6.4GT/s
GN70-B70562U (27.56" in depth)
(2) Intel® Xeon® E5-2600 Series (Sandy Bridge-EP)
(2) PCI-E (Gen.3) x16 + (2) PCI-E (Gen.3) x8
16/ 8+8R-DDR3 1600/ 1333/ 1066/ 800 w/ ECC (512GB)
U-DDR3 1333/ 1066 w/ ECC (128GB)Intel® C602 PCH (SATA 6Gb/s & 3Gb/s)
0, 1, 5, 10 (Intel® RSTe 3.0)(3) GbE (shared IPMI NIC), or
(2) 10GbE + (1) GbE (shared IPMI NIC)
Model NumberEnclosure Form FactorSupported CPU (per node)Chipset (per node)QuickPath InterconnectNumber of DIMM Slot(per node)Memory Type (max. capacity)(per node)
Storage Controller (per node)
RAID Support (per node)
Networking (per node)PCI Expansion Slots (per node)
Standard Model Number of HDD Bay Storage Backplane Power SupplyB7018Y290D2-045V8H (8) Hot-swap 2.5"
(per node)8-port SAS/ SATA 3Gb/s
(per node)450W PSU(per node)
YR290-B7018-D22U (28.74" in depth) / 4 Nodes
(2) Intel® Xeon® 5500/5600 Series (Nehalem/ Westmere)Intel® 5500 + ICH10R
Intel® QPI 6.4/ 5.86/ 4.8 GT/s
12/ 6+6
R-DDR3 1333/1066/800 w/ ECC (96GB)U-DDR3 1333/1066 w/ ECC (48GB)
LSI SAS1068E on TYAN P3202 HBA (SAS 3Gb/s)Intel® ICH10R (SATA 3Gb/s)
RAID 0, 1, 1E (LSI RAID stack)RAID 0, 1, 5, 10 (Intel® Matrix RAID)
(3) GbE (shared IPMI NIC)
(1) PCI-E (Gen.2) x8 + (2) PCI-E (Gen.2) x4
B7018Y290D2-045W8HR (8) Hot-swap 2.5"(per node)
8-port SAS/ SATA 3Gb/s(per node)
(1+1) 450W RPSU(per node)
YR292-B5518-X4B5518Y292X4-080V4HR
Model NumberEnclosure Form FactorSupported CPU (per node)Chipset (per node)Number of DIMM Slot(per node)Memory Type (max. capacity)(per node)Storage Controller (per node)RAID Support (per node)Networking (per node)PCI Expansion Slots (pernode)
Standard Model Number of HDD Bay Storage Backplane Power Supply
B5518Y292X4-080V4HR (4) Hot-swap 2.5"(per node)
4-port SAS/ SATA6Gb/s
(per node)
(1+1) 800W RPSU
Intel® C204 PCH
YR292-B5518-X42U (28.74" in depth) / 4 Nodes
(1) Intel® Xeon® E3-1200 v2 Series/ Next Gen. Xeon E3-1200 Processor (Sandy Bridge-DT)
4
U-DDR3 1333/1066/ 1600 w/ ECC (32GB)
Intel® C204 PCH (SATA 6Gb/s & 3Gb/s)RAID 0, 1, 5, 10 (Intel® RST 11.x)
(2) GbE + (1) IPMI
(1) PCI-E (Gen.2) x16
YR290-B7018-D2B7008Y292X4-080V4HR
HPC
/GPU
Platforms -
Intel Based
HPC
/GPU
Platforms -
Intel Based
SMB
Platforms
SM
B Platform
sEm
bedded Platforms
Em
bedded Platforms
Matrix
Matrix
17 18
● TYAN HPC/GPU Platforms │ Intel Based ● TYAN HPC/GPU Platforms │ Intel Based
SMB
Platforms
SM
B Platform
sEm
bedded Platforms
Em
bedded Platforms
Matrix
Matrix
Cloud Platform
sC
loud Platforms
Cloud Platform
sC
loud Platforms