October 2017 DocID029635 Rev 3 1/34

www.st.com

UM2101 User manual

Getting started with the STEVAL-STLKT01V1 SensorTile integrated development platform

Introduction The STEVAL-STLKT01V1 development kit for the STEVAL-STLCS01V1 SensorTile board is a highly integrated development platform with a broad range of functions aimed at improving system design cycles and accelerating the delivery of results.

The tiny SensorTile core system board (13.5 x 13.5 mm) embeds high-accuracy and very-low-power inertial sensors, a barometric pressure sensor and a digital MEMS top-port microphone. The onboard 80-MHz MCU features a dedicated hardware microphone interface and ultra-low-power support. The wireless network processor provides Bluetooth Smart connectivity and the integrated balun maximizes RF performance for minimum size and design effort.

The kit includes a cradle expansion board for software and system architecture design support and a compact cradle host featuring a battery charger and SD card interface for on-field testing and data acquisition; both boards come complete with SWD programming interfaces.

It contains FCC ID: S9NSTILE01 and module IC 8976C-STILE01 certified with PMN: STEVAL-STLKT01V1; HVIN: STEVAL-STLCS01V1; HMN: STEVAL-STLCX01V1; FVIN: bluenrg_7_1_e_Mode_2-32MHz-XO32K_4M.img.

Figure 1: SensorTile functional block diagram

The FP-SNS-ALLMEMS1 firmware provides a complete framework to build wearable applications. The BlueMS™ application based on the BlueST-SDK protocol allows data streaming and a serial console over BLE controls the configuration parameters for the connected boards.

It is recommended to upgrade the SensorTile firmware to the latest available version on www.st.com.

Contents UM2101

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Contents

1 Getting started ................................................................................. 5

1.1 Overview ........................................................................................... 5

1.2 Package components ........................................................................ 5

1.3 Initial setup with pre-loaded demo ..................................................... 6

1.4 System requirements ........................................................................ 8

2 STEVAL-STLCS01V1 hardware description .................................. 9

2.1 Power supply ................................................................................... 10

3 STLCX01V1 hardware description ............................................... 12

3.1 Power supply ................................................................................... 13

3.2 USB device ..................................................................................... 13

3.3 Audio DAC ...................................................................................... 13

3.4 Solder bridge details ....................................................................... 13

4 STLCR01V1 hardware description ............................................... 15

4.1 Power supply ................................................................................... 16

4.2 SensorTile and cradle assembly in form factor case ....................... 17

5 SensorTile programming interface .............................................. 19

6 Sensors and Bluetooth low energy connectivity ........................ 20

6.1 LSM6DSM ....................................................................................... 20

6.2 LSM303AGR ................................................................................... 20

6.3 LPS22HB ........................................................................................ 20

6.4 MP34DT04 ...................................................................................... 21

6.5 BLUENRG-MS ................................................................................ 21

6.6 BALF-NRG-01D3 ............................................................................ 21

7 Board schematic and bill of materials ......................................... 22

7.1 Bill of materials ................................................................................ 22

7.2 Schematic diagrams ........................................................................ 26

8 Formal notices required by the U.S. Federal Communications Commission ("FCC") ............................................................................. 30

9 Formal product notice required by the Industry Canada ("IC") . 31

10 TYPE certification .......................................................................... 32

11 Revision history ............................................................................ 33

UM2101 List of tables

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List of tables

Table 1: STEVAL-STLCS01V1 main components ..................................................................................... 9 Table 2: STEVAL-STLCS01V1 pinout ...................................................................................................... 10 Table 3: STLCX01V1 main components .................................................................................................. 12 Table 4: STLCX01V1 solder bridge details .............................................................................................. 13 Table 5: STLCR01V1 main components .................................................................................................. 15 Table 6: STEVAL-STLCS01V1 bill of materials ........................................................................................ 22 Table 7: STLCX01V1 bill of materials ....................................................................................................... 24 Table 8: STLCR01V1 bill of materials ....................................................................................................... 25 Table 9: Document revision history .......................................................................................................... 33

List of figures UM2101

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List of figures

Figure 1: SensorTile functional block diagram ........................................................................................... 1 Figure 2: SensorTile kit blister .................................................................................................................... 6 Figure 3: Orientation of SensorTile and cradle expansion connectors ....................................................... 7 Figure 4: SensorTile mounted on cradle expansion ................................................................................... 7 Figure 5: STEVAL-STLCS01V1 main components and pinout .................................................................. 9 Figure 6: STEVAL-STLCS01V1 power supply block diagram .................................................................. 11 Figure 7: STEVAL-STLCS01V1 component placement (top side) ........................................................... 11 Figure 8: STLCX01V1 main components ................................................................................................. 12 Figure 9: STLCX01V1 component placement (top side) .......................................................................... 14 Figure 10: STLCR01V1 cradle main components .................................................................................... 15 Figure 11: SensorTile soldered onto cradle board ................................................................................... 16 Figure 12: Battery connection and power switch ...................................................................................... 16 Figure 13: SensorTile and cradle in plastic case ...................................................................................... 17 Figure 14: STEVAL-STLCR01V1 component placement (top side) ......................................................... 18 Figure 15: STEVAL-STLCR01V1 component placement (bottom side) ................................................... 18 Figure 16: STM32 Nucleo board, cradle and cradle expansion SWD connectors ................................... 19 Figure 17: SWD connections with 5-pin flat cable .................................................................................... 19 Figure 18: STEVAL-STLCS01V1 schematic diagram (1 of 2) .................................................................. 26 Figure 19: STEVAL-STLCS01V1 schematic diagram (2 of 2) .................................................................. 27 Figure 20: STLCX01V1 schematic diagram ............................................................................................. 28 Figure 21: STLCR01V1 schematic diagram ............................................................................................. 29

UM2101 Getting started

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1 Getting started

1.1 Overview

STEVAL-STLKT01V1 is the development kit includes everything you need to remotely sense and measure motion, environmental and acoustic parameters. It is designed to support the prototyping phases of new projects and can be used in the contexts below.

An evaluation system

Evaluate high accuracy and very low power ST sensors in an optimized system architecture

Field-test data fusion and embedded signal processing algorithms

Deploy data collection campaigns to support custom algorithm development

Reference design

Compact solution for high-accuracy, low-power motion, environmental and audio sensor data in compact form-factor designs

Complete hardware and software examples form the starting point for new designs with:

hardware: schematics, Gerber, BoM, 3D CAD

software: from basic examples (STSW-STLKT01) to complete function packs (FP-SNS-ALLMEMS1, FP-AUD-BVLINK1)

Embedded software development kit

Source code project examples based on the STM32Cube architecture

Fully compatible with the Open.Software embedded processing libraries, and supported by the STM32 ODE

host board implements the Arduino UNO R3 expansion connector to enable bridging to well-known development ecosystems such as STM32 ODE and Arduino

Fast prototyping tool

Plug or solder onto your prototype motherboard to instantly add its embedded sensing and communication functions to your design

Use the 3D CAD files to integrate the SensorTile in your mechanical design

1.2 Package components

Inside the STEVAL-STLKT01V1 package, you will find all the components needed to experience the demo on this optimized platform and to start developing you application.

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Figure 2: SensorTile kit blister

1.3 Initial setup with pre-loaded demo

The easiest thing to do after unpacking is to run the preloaded software using the SensorTile board together with the cradle expansion (STLCX01V1).

1 Take the SensorTile and plug it on the cradle expansion through the dedicated connector. Take care to match the orientation shown below.

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Figure 3: Orientation of SensorTile and cradle expansion connectors

Figure 4: SensorTile mounted on cradle expansion

2 Connect a USB type A to mini-B USB cable to turn ON the board for the first time, verify that the J2 jumper is in position 2-3 (power supply from USB). If everything works fine then you’ll see the SensorTile LED blinking approximately every 2 seconds.

3 The board is now ready to connect to the “ST BlueMS” mobile App: available on official stores for Android or iOS. For more details on the embedded software and the apps, please refer to the BLUEMICROSYSTEM2 documentation on www.st.com/bluemicrosystem.

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To exploit the newest features, upgrade the default firmware version to the new version of the FP-SNS-ALLMEMS1 function pack available at www.st.com/en/embedded-software/fp-sns-allmems1.html

1.4 System requirements

As the STEVAL-STLKT01V1 is already programmed with BLUEMICROSYSTEM firmware, to run the demo, you only need:

A smartphone or tablet with minimum Android™ 4.4 or iOS™ 8.0 operating systems and minimum BLE technology 4.0

A USB type A to mini-B USB cable for power supply (connected to a PC, AC adapter or any other source)

To start designing your own project, you will need:

A Windows™ PC (ver. 7 or higher) with an IAR, KEIL or AC6 firmware development environment

A USB type A to Micro USB male cable to connect the STEVAL-STLKT01V1 to the PC for power supply

An STM32 Nucleo board with ST-Link V2.1 in-circuit debugger/programmer (preferred) or other compatible device

The ST-LINK Utility for firmware download (latest embedded software version on www.st.com)

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2 STEVAL-STLCS01V1 hardware description

STEVAL-STLCS01V1 (SensorTile) is a highly integrated reference design that can be plugged into form-factor prototypes, adding sensing and connectivity capabilities to new designs through a smart hub solution. It can also easily support development of monitoring and tracking applications as standalone sensor nodes connected to iOS™/Android™ smartphone applications.

The SensorTile occupies a very small 13.5x13.5 mm square outline, with all the electronic components on the top side and small connector on the bottom side to plug it onto the cradle expansion board. The connector pinout is repeated on 18 PCB pads that render the SensorTile a solderable system on module as well.

The figure below and following two tables provide the main board component and pinout details.

Figure 5: STEVAL-STLCS01V1 main components and pinout

Table 1: STEVAL-STLCS01V1 main components

Reference Device Description

A MP34DT04 MEMS audio sensor digital microphone

B LD39115J18R 150 mA low quiescent current low noise LDO 1.8 V

C STM32L476 MCU

ARM Cortex-M4 32-bit microcontroller

D LSM6DSM iNEMO inertial module: low-power 3D accelerometer and 3D gyroscope

E LSM303AGR Ultra-compact high-performance eCompass module: ultra-low power 3D accelerometer and 3D magnetometer

F LPS22HB MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer

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Reference Device Description

G BlueNRG-MS Bluetooth low energy network processor

H BALF-NRG-01D3

50 Ω balun with integrated harmonic filter

Table 2: STEVAL-STLCS01V1 pinout

Board pin

CONN pin

Pin name MCU pin Main functions(1)

1 2 MIC_CLK PC2 DFSDM1_CKOUT, ADC

2 4 VDD_OUT VDD/VBAT 1.8V from onboard LDO

3 6 VIN / Power supply for LDO [2V-5.5V]

4 8 VDDUSB VDDIO2

VDDUSB

Power supply for USB peripheral and VDDIO2 [1.8V-3.3V]

5 10 GND VSS Ground

6 12 RXD/USB_DP PD2/PA12 USART5 RX or USB_OTG_FS DP(2)

7 14 TXD/USB_DM PC12/PA11 USART5 TX or USB_OTG_FS DM 1

8 16 SAI_CLK PG9(3) SAI2_SCK_A, SPI3_SCK

9 15 SAI_FS PG10(3) SAI2_FS_A, SPI3_MISO

10 13 SAI_MCLK PG11(3) SAI2_MCLK_A, SPI3_MOSI

11 11 SAI_SD PG12(3) SAI2_SD_A, SPI3_NSS

12 9 GPIO2 PB8/PB9/PC1 DFSDM_DATIN6, I2C3_SDA

13 7 GPIO3 PC0 DFSDM_DATIN4, I2C3_SCL

14 5 NRST NRST STM32 Reset

15 3 SWD_CLK

SWD Programming interface clock

16 1 SWD_IO

SWD Programming interface IO

17 / GND

Ground

18 / GND

Ground

Notes:

(1)Refer to STM32L476 Datasheet on www.st.com for the complete set of functions of each pin (2)USB_OTG_FS Peripheral is functional for VDDUSB ≥ 3V (3)Logic level of this pins is referred to VDDIO2

2.1 Power supply

The SensorTile board has the following input supply pins:

1. VIN is the input for the onboard voltage regulator generating 1.8 V (150 mA max). 2. VDDUSB is an input for the STM32L4 VDDUSB and VDDIO2 pins (to use the

STM32L4 USB OTG peripheral, VDDUSB must be ≥ 3 V)

VDD is an output for 1.8 V.

If the USB peripheral and other 3.3 V signals are not needed for a particular application, you can connect VDD to VDDUSB so that one power supply can power the whole system.

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This connection can be done externally (e.g., SB8 on STLCX01V1) or by soldering a 0 Ω resistor on R2 (bottom layer).

Figure 6: STEVAL-STLCS01V1 power supply block diagram

Figure 7: STEVAL-STLCS01V1 component placement (top side)

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3 STLCX01V1 hardware description

The SensorTile cradle expansion is an easy-to-use companion board for SensorTile and the SensorTile cradle boards included in the SensorTile Kit. The SensorTile board does not need to be soldered onto the cradle expansion board, but can be plugged onto the dedicated connector (see Figure 3: "Orientation of SensorTile and cradle expansion connectors" and Figure 4: "SensorTile mounted on cradle expansion".

Apart from being a standalone host for the SensorTile board, the cradle expansion board can be connected to an STM32 Nucleo or other expansion board via the Arduino UNO R3 connectors to easily expand functionality.

Figure 8: STLCX01V1 main components

Table 3: STLCX01V1 main components

Reference Device Description

A SensorTile connector and footprint To plug or solder the SensorTile board

B Arduino UNO R3 UNO R3 connector For STM32 Nucleo board compatibility

C ST2378ETTR 8-bit dual supply 1.71 V to 5.5 V level translator

D micro-USB connector, USBLC6-2P6 (U1), LDK120M-R (U4)

micro USB power supply /communication port and 3.3 V voltage regulation

E Audio DAC, phono jack 16-Bit, low-power stereo audio DAC and 3.5 mm stereo phono jack

F SWD connector, Reset button 5-pin SWD connector for programming debugging and board reset button

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3.1 Power supply

The power is either supplied by the host PC via USB or by an external source through the Arduino UNO R3 connector (CN6.5).

Jumper J2 selects the power source for the onboard 3.3 V regulator (U4) and the SensorTile VIN pin:

position 1-2: 5 V external

position 2-3: 5 V via USB (default)

The 3.3 V output of the regulator can be routed to the Arduino UNO R3 connector to power on other external components by soldering SB18 (default OFF).

The VDDUSB pin of the SensorTile can be connected to two different power sources:

3.3 V – SB9 (default ON)

1.8 V (SensorTile VDD) – SB8 (default OFF)

3.2 USB device

The USB connector on the board can be used to supply power and for communication (USB_OTG_FS).

To use the USB peripheral, use the following solder bridge configuration:

SB10, SB11, SB20 and SB21 OFF (disconnect the signals from U5)

SB9 ON (supply 3.3 V to the USB peripheral of the STM32 MCU)

3.3 Audio DAC

The PCM1774 is a low-power stereo DAC designed for portable digital audio applications, and can be driven by the SensorTile to play any kind of Audio stream. A dedicated 3.5 mm audio jack makes it easy to connect headphones or active loudspeakers.

In order to use the onboard audio DAC (U3), the SAI (serial audio interface) and I²C signals must be routed to the component using the following configuration:

SB12, SB13, SB14, SB15, SB16 and SB17 OFF (disconnect the signals from Arduino UNO R3 connector)

SB2, SB3, SB4, SB5, SB6, SB7 ON (connect the signals to the DAC)

3.4 Solder bridge details

Table 4: STLCX01V1 solder bridge details

Solder Bridge SensorTile signal Onboard signal Arduino signal

SB1 Reset

CN8.2

SB2(1) GPIO3 DAC control – I2C SCL (pull-up)

SB3(1) GPIO2 DAC control – I2C SDA (pull-up)

SB4(1) SAI_SD DAC Audio – I2S_SD

SB5(1) SAI_SCK DAC Audio – I2S_SCK

SB6(1) SAI_FS DAC Audio – I2S_WS

SB7(1) SAI_MCLK DAC Audio – I2S_MCLK

SB8 VDDUSB VDD – 1.8V from SensorTile

SB9(1) VDDUSB 3V3 from regulator

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Solder Bridge SensorTile signal Onboard signal Arduino signal

SB10 RXD-USB_DP Level Translator - UART_RX CN9.2

SB11 RXD-USB_DP Level Translator - UART_TX CN9.1

SB12 SAI_SD SPI_CS CN5.3

SB13 SAI_MCLK SPI_MOSI CN5.4

SB14 SAI_FS SPI_MISO CN5.5

SB15 SAI_SCK SPI_SCK CN5.6

SB16(1) GPIO3

CN5.10

SB17(1) GPIO2

CN5.9

SB18 MIC_CLK Level Translator - MIC_CLK_3V3 CN9.5

SB19

3V3 – 3V3_Nucleo CN6.2 CN6.3

SB20 TXD-USB_DM Level Translator - UART_RX CN9.2

SB21 TXD-USB_DM Level Translator - UART_TX CN9.1

SB22 GPIO2 Level Translator - GPIO2_3V3 CN9.6

SB23 GPIO3 Level Translator – GPIO3_3V3 CN9.7

Notes:

(1)closed by default

Figure 9: STLCX01V1 component placement (top side)

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4 STLCR01V1 hardware description

The SensorTile cradle is a small companion board for SensorTile, geared at the development of form factor prototypes. You need to solder the SensorTile board to this board to render the system robust.

The small cradle is ideal for applications requiring small, standalone, battery-powered sensor nodes.

Figure 10: STLCR01V1 cradle main components

Table 5: STLCR01V1 main components

Reference Device Description

A SensorTile footprint To solder the SensorTile board

B HTS221 Capacitive digital sensor for relative humidity and temperature

C STBC08PMR, STC3115, LDK120M-R, USBLC6-2P6

800 mA standalone linear Li-Ion battery charger with thermal regulation, Gas gauge IC, 200 mA low quiescent current very low noise LDO, very low capacitance ESD protection

D Power on/off switch

E SWD connector 5-pin SWD connector for programming and debugging

F Micro USB connector, 3-pin battery connector

micro USB battery charging supply /communication port and connector for Li-Ion battery power supply

G micro-SD card socket

Solder the SensorTile board onto the cradle board as shown in the figure below.

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Figure 11: SensorTile soldered onto cradle board

4.1 Power supply

The main board power supply is the 100 mAh lithium-Ion polymer battery attached to the appropriate connector on the PCB.

Figure 12: Battery connection and power switch

The battery can be recharged via USB connected to a PC or any micro-USB battery charger.

A RED LED indicates the charging status:

steady ON: the USB plug is correctly connected and the board is charging

steady OFF: charging complete

blinking: battery not present

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The onboard STBC08 battery charger IC is configured by default with a maximum charging current of 50 mA. It is possible to modify this current by changing the R5 resistor value.

Equation 1:

𝐼𝑐ℎ𝑟𝑔 =1𝑉

𝑅5∙ 1000

The default 20 kΩ value for R5 hence gives:

1𝑉

20𝐾∙ 1000 = 50𝑚𝐴

During normal usage, the battery needs to be connected to the board for proper operation. When the battery is plugged, the board is turned ON via the SW1 switch. This switch enables LDK120 3V3 voltage regulator pin, which powers all board components.

4.2 SensorTile and cradle assembly in form factor case

Refer to the following image for the orientation of the soldered SensorTile and cradle boards in the dedicated form factor case.

Figure 13: SensorTile and cradle in plastic case

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Figure 14: STEVAL-STLCR01V1 component placement (top side)

Figure 15: STEVAL-STLCR01V1 component placement (bottom side)

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5 SensorTile programming interface

To program the board, connect an external ST-LINK to the SWD connector on the cradle; a 5-pin flat cable is provided in the SensorTile Kit package.

The easiest way to obtain an ST-LINK device is to get an STM32 Nucleo board, which bundles an ST-LINK V2.1 debugger and programmer.

Ensure that CN2 jumpers are OFF and connect your STM32 Nucleo board to the SensorTile cradle via the cable provided, paying attention to the polarity of the connectors. Pin 1 is identified by:

a small circle on the PCB silkscreen – STM32 Nucleo board and SensorTile cradle expansion

the square shape of the soldering pad – connector on the SensorTile cradle.

Figure 16: STM32 Nucleo board, cradle and cradle expansion SWD connectors

Figure 17: SWD connections with 5-pin flat cable

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6 Sensors and Bluetooth low energy connectivity

6.1 LSM6DSM

The LSM6DSM is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSM supports main OS requirements, offering real, virtual and batch sensors with 4 Kbytes for dynamic data batching.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DSM has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps. The LSM6DSM fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI configurable for both gyroscope and accelerometer.

High robustness to mechanical shock makes the LSM6DSM the preferred choice of system designers for the creation and manufacturing of reliable products.

6.2 LSM303AGR

The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. The Device has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.

The LSM303AGR includes an I2C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface. The system can be configured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.

The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.

6.3 LPS22HB

The LPS22HB is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer. The device comprises a sensing element and an IC interface which communicates through I²C or SPI from the sensing element to the application.

The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a dedicated process developed by ST.

The LPS22HB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.

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LPS22HB is factory calibrated but a residual offset could be introduced by the soldering process. This offset can be removed with a one-point calibration.a

6.4 MP34DT04

The MP34DT04 is an ultra-compact, low-power, TOP port, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital output signal in PDM format.

The MP34DT04 has an Acoustic Overload Point of 120 dBSPL with a 64 dB Signal-to-Noise Ratio and –26 dBFS sensitivity.

6.5 BLUENRG-MS

The BlueNRG-MS is a very low power Bluetooth low energy (BLE) single-mode network processor, compliant with Bluetooth specification v4.1. The BlueNRG-MS supports multiple roles simultaneously and can act at the same time as Bluetooth smart sensor and hub device.

The Bluetooth Low Energy stack runs on the embedded ARM Cortex-M0 core. The stack is stored on the on-chip non-volatile Flash memory and can be easily upgraded via SPI.

The device comes pre-programmed with a production-ready stack imageb. A different or more up-to-date stack image can be downloaded from the ST website and programmed on the device through the ST provided software tools.

The BlueNRG-MS allows applications to meet the tight advisable peak current requirements imposed by standard coin cell batteries.

The maximum peak current is only 10 mA at 1 dBm output power. Ultra low-power sleep modes and very short transition times between operating modes allow very low average current consumption, resulting in longer battery life.

The BlueNRG-MS offers the option of interfacing with external microcontrollers via SPI transport layer.

6.6 BALF-NRG-01D3

BALF-NRG-01D3 is a 50 Ω conjugate match to BLUENRG-MS (QFN32 package) that integrates balun transformer and harmonics filtering. It features high RF performances with a very small footprint and a RF BOM reduction. It has been chosen as the best trade-off for costs, area occupation and high radio performances. The layout has been optimized to suit a 4-layer design and a chip antenna.

a For further details, refer to application note AN4833, "Measuring pressure data from ST's LPS22HB digital

pressure sensor", on www.st.com.

b Its version could change at any time without notice

Board schematic and bill of materials UM2101

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7 Board schematic and bill of materials

This section contains the bill of materials and schematics.

7.1 Bill of materials

Table 6: STEVAL-STLCS01V1 bill of materials

Item Q.ty Ref. Value Description Order code Manufacturer

1 1 U1

ARM Cortex-M4 32b MCU Microcontroller

STM32L476JGY6TR ST

2 1 U2 150 mA,

1.8 V

low quiescent current low noise LDO

LD39115J18R ST

3 1 U9

Ultra-low Power Acc + Magn

LSM303AGRTR ST

4 1 U10

Low-Power Accelerometer + Gyroscope

LSM6DSMTR ST

5 1 U6

Bluetooth Low-Energy Chip V4.1 - MS

BlueNRG-MSCSP ST

6 1 U13

Low-Power Pressure sensor

LPS22HBTR ST

7 1 U11

MEMS audio sensor digital microphone

MP34DT04 ST

8 1 U4

Bluetooth Low-Energy Balun Chip

BALF-NRG-01D3 ST

9 1 X2

CRYSTAL 32MHZ 8PF SMD

CX2016DB32000D0FLJCC AVX

10 1 X1 32.7680kHz, 20ppm, 4pF, 60kΩ

Crystal ABS06-107-32.768KHZ-T Abracon

11 2 C2, C20

4pF 25V CAP CER NP0 0201

CBR02C409B3GAC Kemet

12 2 C12, C17

15pF 25V CAP 0201 NP0

02013A150JAT2A AVX

13 1 FT1 10pF 25V CAP CER NP0 0201

250R05L100GV4T Johanson Technology

14 1 R2 0 Ω Resistor SMD R0402

Any

15 1 FT2

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Item Q.ty Ref. Value Description Order code Manufacturer

16 1 MT 0.40pF 25V CAP CER NP0 0201

250R05L0R4AV4T Johanson Technology

17 2 C32, C34

2.2µF 6.3V CAP CERAMIC X5R, 0201

02016D225MAT2A AVX

18 1 C9 0.22µF 6.3V CAP CER X7S 0201

C0603X7S0J224K030BC TDK

19 1 C30 150nF, 10V CAP, MLCC, X5R, 0201

C0603X5R1A154K030BB TDK

20 2 C14, C31

100pF 25V CAP CER NP0 0201

250R05L101JV4T Johanson Technology

21 1 ANT1 2.4GHZ ANTENNA SMD

ANT016008LCS2442MA1 TDK

22 9

C4, C5,

C10, C11, C13, C18, C29, C33, C43

0.1µF 6.3V ±10%

CAP CER X5R 0201

GRM033R60J104KE19D Murata

23 1 R1 560 Ω Resistor SMD

Any

24 9

C1, C3, C6, C7, C8,

C15, C16, C19, C44

1µF 6.3V CAP CER X5R 0201

CL03A105KQ3CSNC Samsung

25 1 LED 605 nm, 2 V, 10 mA, 50 mcd

LED, Low Power, Orange

KPG-0603SEC-TT KINGBRIGHT

26 1 CONN 0.4mm Connector Board-to-Board

BM10NB(0.8)-16DS-0.4V(51)

Hirose

27 1 L1 3.9nH 400mA 300 MΩ

FIXED IND LQP03TN3N9B02D Murata

28 1 SWD Cable

2.54mm, L=15cm

5 pin ribbon cable

Board schematic and bill of materials UM2101

24/34 DocID029635 Rev 3

Table 7: STLCX01V1 bill of materials

Item Q.ty

Ref. Value Description Order code Manufacturer

1 1 CN2

BM10JC-16DP-0.4V(53)

BM10JC-16DP-0.4V(53)

Hirose

2 1 CN5

HEADER 10 SSQ-110-03-L-S Samtec

3 2 CN6,CN9

HEADER 8 SSQ-108-03-L-S Samtec

4 1 CN8

HEADER 6 SSQ-106-03-L-S Samtec

5 5 C1,C5,C10,

C13,C14 100nF X7R

6 2 C4,C6 47µF, 6.3V Tantal

7 4 C8,C9,C11,

C12

4.7µF, >6.3V, <2 Ω ESR

Tantal

8 2 C15,C16 4.7µF, 10V X5R

9 1 J1

PHONOJACK STEREO

35RASMT4BHNTRX

Switchcraft

10 1 J2

Header M 3x1

11 4 J3,J4,J5,J6

PCB Hole

12 1 RESET

SYS_MODE PTS820 J20M SMTR LFS

C&K Components

13 1 R1 47kΩ ±1%

14 1 R2 147kΩ±1%

15 11

SB2,SB3,R3,SB4,R4,SB5,SB6,SB7,SB9,SB16,SB

17

0R

16 2 R5,R6

4K7

17 14

SB1,SB8,SB10,SB11,SB12,SB13,SB14,SB15,SB18,SB19,SB20,SB21,SB

22,SB23

NC

18 1 SWD

CON5

19 1 USB

USB-MICRO USB3075-30-A GCT

20 1 U1

USBLC6-2P6

USBLC6-2P6 ST

21 1 U3

PCM1774RGP

PCM1774RGP TI

22 1 U4

LDK120M-R LDK120M-R ST

23 1 U5

ST2378ETTR

ST2378ETTR ST

UM2101 Board schematic and bill of materials

DocID029635 Rev 3 25/34

Table 8: STLCR01V1 bill of materials

Item Q.ty Ref. Value Description Order code Manufacturer

1 1 BATT

Battery Connector 78171-0003 Molex

2 1 CHRG

LED Red

3 3 C1,C8,C9 100nF X7R

4 4 C2,C3,C6,C7 10V, 4.7µF X5R

6 1 C10 10V, 1µF X5R

7 1 LED1

LED Green

8 1 R1 47kΩ±1%

9 1 R2 147kΩ±1%

10 1 R3 2kΩ

11 2 R4,R8 1kΩ

12 1 R5 20kΩ±1%

13 3 R6,R7,R11

NC

14 1 R10 0 Ω

15 1 R9 50mΩ±1%, >=1/16W

16 1 SD

Micro-SD DM3D-SF Hirose

17 1 SWD

CON5

18 1 SW1

PWR SSAJ120100 Alps Electric Co.

19 1 USB

USB-MICRO USB3075-30-A

GCT

20 1 U1

USBLC6-2P6 USBLC6-2P6 ST

21 1 U2

STBC08PMR STBC08PMR ST

22 1 U3

LDK120M-R LDK120M-R ST

23 1 U4

STC3115IQT STC3115IQT ST

24 1 U5

HTS221 HTS221 ST

25 1 Battery 3.7V 100mAh LiPO-501225 3pin connector

LiPO-501225 Himax electronics

26 1 Plastic Box

Plastic Box

27 2 M2-Nut HEX shape HEX Nut M2 - steel

RS or equivalent

28 1 M2-Screw Pan head - Phillips

10mm M2 Pan head Phillips - steel

RS or equivalent

29 1 M2-Screw Pan head - Phillips

12mm M2 Pan head Phillips - steel

RS or equivalent

Board schematic and bill of materials UM2101

26/34 DocID029635 Rev 3

7.2 Schematic diagrams

Figure 18: STEVAL-STLCS01V1 schematic diagram (1 of 2)

Decoupling Capacitors

LED

1K

PG

-06

03

SE

C-T

T

GND

R1

LE

DS

AI_

SD

1u1u 100n 100n1u

GND GNDGNDGND GND

1u

GND

1u

GND

C1C3 C4 C5C6C8 C15

VD

D

VD

D

VD

D

VD

D

VD

D

VD

D

VD

DU

SB

Crystal

ABS06-107-32.768KHZ-T

4p 4p

GND GND

X1

C2 C20

OS

C3

2_

OU

T

OS

C3

2_

IN

Ultra-low-power DSP STM32L476xx Microcontroller

STM32L476JGY6

VDDUSBA1

PA15A2

PD2A3

PG9A4

PG14A5

PB3A6

PB7A7

VSS1A8

VDDA9

VSS2B1

PA14B2

PC12B3

PG10B4

PG13B5

VDDIO2B6

PB6B7

PC13B8

VBATB9

PA

12

C1

PA

13

C2

PC

11

C3

PG

12

C5

PG

11

C4

PB

4C

6

PB

5C

7

PC

15

C8

PC

14

C9

PA

11

D1

PA

10

D2

PC

10

D3

BO

OT

0D

7

PH

1D

8

PH

0D

9

PC

9E

1

PA

8E

2

PA

9E

3

PB8E7

PB9E8

NRSTE9

PC7F1

PC8F2

PC6F3

PC2F7

PC1F8

PC0F9

PB15G1

PB14G2

PB11G3

PA1G4

PA4G5

PA2G6

PC3G7

VREF+G8

VSSAG9

PB

12

H1

PB

13

H2

PB

10

H3

PA

7H

4P

A6

H5

PA

5H

6P

A3

H7

PA

0H

8V

DD

AH

9V

DD

2J1

VS

S3

J2

PB

2J3

PB

1J4

PB

0J5

PC

5J6

PC

4J7

VD

D3

J8

VS

S4

J9

U1

BLU

E_M

OS

I

BLU

E_S

CK

BLU

E_IR

Q

BLU

E_M

ISO

BLU

E_C

S

BLU

E_R

ST

GN

D

GN

D

GND

GND

GND

GN

D

VD

D

VD

DV

DD

VDD

VDD

VDD

NRST

TXD-USB_DMT

XD

-US

B_D

M

GP

IO6

GPIO5GPIO3GPIO2

GPIO2GPIO2

VDDUSB

VDDUSB

MIC_CLK

RXD-USB_DPR

XD

-US

B_D

PSAI_SCK

SAI_FS

SA

I_M

CLK

SA

I_S

D

INT2

INT2

INT2INT2

INT2INT2

MIC_DATA

OS

C32_O

UT

OS

C32_IN

CS

_A

G

CS

_M

CS

_A

CS

_P

SP

I_C

LK

SPI_SDAT

ES

T1

Low-Drop Out Voltage Regulator

LD39115J18

1u

VD

D

GND GND

100n

GND GND

1u

GND

1u

VD

D

VD

D

VD

D

0

ENA2

GNDA1

INB2

OUTB1

U2

C7

C10 C16C19

R2

VD

D

VIN VD

DU

SB

Hirose bottom connector (optional)

BM10NB(0.8)-16DS-0.4V(51)

P1P1

P2P2

P3P3

P4P4

P5P5

P6P6

P7P7

P8P8

P9P9

P10P10

P11P11

P12P12

P13P13

P14P14

P15P15

P16P16

G2G2

G1G1

G4G4

G3G3

CONN

GND

GND

GND

GND

GND

VDDNRST VIN

TXD-USB_DM

GPIO6GPIO5

GPIO3GPIO2

VDDUSB

MIC_CLK

RXD-USB_DP

SAI_SCKSAI_FSSAI_MCLK

SAI_SD

SWD_GNDSWD_IOSWD_CLK

SWD_VDD

LP_UART_TX, I2C3_SDA, ADC_IN2, DFSDM_CKIN4 (DFSDM_DATIN6)LP_UART_RX, I2C3_SCL, ADC_IN1, DFSDM_DATIN4

ADC_IN3, DFSDM_CKOUT

USART RX or USB DPUSART TX or USB DM

SWD_RST

SPI3_NSS, SAI2_SD_ASPI3_MOSI, SAI2_MCLK_A

SPI3_SCK, SAI2_SCK_ASPI3_MISO, SAI2_FS_A

Moon Pin output

GND

GND

GNDVDD

NRST

VIN

TXD-USB_DM

GPIO6GPIO5

GPIO3GPIO2

VDDUSB

MIC_CLK

RXD-USB_DP

SAI_SCKSAI_FS SAI_MCLK

SAI_SD

+5V supply3.0V - 3.6V supply

UM2101 Board schematic and bill of materials

DocID029635 Rev 3 27/34

Figure 19: STEVAL-STLCS01V1 schematic diagram (2 of 2)

Digital Microphone

MP34DT04GND

CLKB3

DOUTB4

GNDG1*4

LRB2

VDDB1

U11

GNDVDD

MIC_CLK

MIC_DATA

Accelerometer + Gyroscope

100n 100n

C11 C18

GN

D

GN

D

VD

D

VD

D

LSM6DS3H

SDOP1

SDXP2

SCXP3

INT1P4

VD

DIO

P5

GN

D1

P6

GN

D2

P7

VDDP8

INT2P9

OCSP10

NCP11

CS

P1

2S

CL

P1

3S

DA

P1

4

U10

GN

DG

ND

GNDGND

VD

D

VDD

VDD

INT2

CS

_A

GS

PI_

CLK

SP

I_S

DA

Pressure Sensor

LPS22HB

SD

OP

5

VDD_IOP1

SCLP2

CSP6

INT/DRDYP7

GN

D1

P8

GN

D2

P9

VD

DP

10

RE

SP

3

SD

AP

4

U13

GN

D

GN

D

GN

D

VD

D

VDDCS_PSPI_CLK

SP

I_S

DA

Accelerometer + Magnetometer

220n

GND

LSM303AGR

C9

SCLP1

CS_XLP2

CS_MAGP3

SDAP4

DRDYP7

GND2P8

VDDP9

VDD_IOP10

INT

1P

12

INT

2P

11

C1

P5

GN

D1

P6

U9

GND

GN

D

VDDVDD

CS_M

CS_ASPI_CLK

SPI_SDA

BlueNRG - Bluetooth low energy chip

Tuning

Balun + chip antenna

Board schematic and bill of materials UM2101

28/34 DocID029635 Rev 3

Figure 20: STLCX01V1 schematic diagram

15

SH

1

7

OUT

SensorTile

SAI_FS

18

2

5V

12

13

SWDIO

TILE_RESET

1

SensorTile ConnectorUSB, SWD, Power

RXD-USB_DP

SWDCLK

SB8

CN2

BM10B(0.8)-16DP-0.4V(51)

3

1

C15

4.7μF 6

3V3

14

3V3

GN

D

2

6

MIC_CLK

G3

VDDUSB

13

GPIO2

D11

GPIO3

SAI_MCLK

V_USB

G2

4

8

10

V_USB

VIN

RXD-USB_DP

GPIO2

J2

11

3

VIN

3 SB9

16

SAI_MCLK

Max 200mA

SAI_SCK

4

4

C16

4.7μF

2

TXD-USB_DM

5

3EN

SensorTile Footprint

3

7

V_USB

2

VDD

ADJ

11

4

12

SWDCLK

SWDIO

TXD-USB_DMG1

9

D3

TXD-USB_DM

3

VIN

16

5

8

14

GPIO3

D4

TILE_RESET

SH

2

D2

VDD

4

IN

VDDUSB

1

USB-MICRO

1

5

MIC_CLK17

5

VDDUSB

C1

100nF

SAI_SD

2

1

1

1

1

Fixing holesOn the cornersHole: 2.2mmHead: 4mm

STM32 Nucleo

R2

147K

10

RXD-USB_DP

VBUS5

SAI_SCK

VDD

4

1

6

RESET

3

C14

100nF

TILE_RESET2

5

15

R1

47K

9

1

G4

VIN

SAI_FS

6

SAI_SD

GND2

SAI_SCK

3

6

3

I2C_SCL

3V3

2

CN9

SB18

6

UART_TX

SB19 7

GPIO2_3V3

2

CN5

R5

4K7

SPI_CS7

SB15

1

SB14

SB12

4

UART_RX

6

SB16

TILE_RESET

SAI_MCLK

5

3

4

6

5

GPIO3_3V3

SAI_FS

SPI_SCK

8

2

8

CN6

3

1

8

3V3_Nucleo

5

GPIO21

I2C_SDAGPIO3

SB1

2

SPI_MOSI

5

4

R6

4K7

SPI_MISO

3V3

CN8

5V

SB17

10

SAI_SD

1

4

9

MIC_CLK_3V3

7

SB13

SWDCLK3

4

TILE_RESET5

SWD

1

VDD

SWDIO

2

SB10

4

2

C10

100nF

L6

11

UART_RX

6

GPIO3

SB20

SB23L3

RXD-USB_DP

8

19

VC

C

13CC7

20

16

L5

TXD-USB_DM

CC3

14

CC1

U5

ST2378ETTR

UART_TX

L7

MIC_CLK_3V3 3CC2

OE

TXD-USB_DM

L1

17

CC4

MIC_CLK

5

18

VDD

CC515

10

CC67

SB22

GPIO3_3V3

SB11

GPIO2_3V3

1

CC89

VL

VDD

C13

100nF

L8

RXD-USB_DP

L2

GPIO2

12

GN

D

SB21

L4

3V3

U4 LDK120M-R

ADR

1

VC

OM

3

SAI_FS

SC

KI

SAI_MCLK

SB5

R40R

17

19

+

3V3

AG

ND +

SB4 11

P

13

MODE

5

J1

PHONOJACK STEREO

H_L

VD

D7

3V3

14

AIR

VIO

2

1

PAD

C4 47μF

4

LRCK

C114.7μF1

6

SB2PGNDGPIO3

DINSB6

3

4

SB7C5

100nF

VC

C

SAI_SCK

+

12

2

GPIO2

20

6

R30R

18

+

15

BC

K

C9 4.7μF

9

SDA

C124.7μF

SAI_SD

3V3 8D

GN

D

AIL

H_R

+

SB3

10

SCL

C8 4.7μF

VPA

5C6 47μF

+

U3 PCM1774RGP

U1 USBLC6-2P6

UM2101 Board schematic and bill of materials

DocID029635 Rev 3 29/34

Figure 21: STLCR01V1 schematic diagram

3

D2

3V3

5

USBLC6-2P6

6

VBUS

D1RXD-USB_DP

2

RESET

C1

100nF

SWDCLK

D4

5

2

1

3

VDD

3

USB, SWD, Power switch

V_USB

USB-MICRO

4D3

R41K

2

1RXD-USB_DM

5

4

1

SH

2

2

1

SWDIO

SWD

SH

1

LED1

4

SWDCLK

V_USB

GND

SDA

5

2 1

1

DRDY

VDD

C9

100nF

DA

T0

4

SCL

CL

KV

DD

SWB

U5

R7NC

2

I2C_SDA

SD_MISO

DETC

3V3

I2C_SCL

6

SD_SCK

DA

T2

SD_CS

SD

Micro-SD

GND

CD

/DA

T3

CS

8

SW

DA

T1

3

6

57

C8

100nF

GN

D

SWA

4

CM

D

VDD

R6NC

SD_MOSI

3

HTS221

HTS221 sensor

micro-SD card socket

2

SCL

C10

1μF

VBat

3

Vcc

5

SDA

BATT

Battery Connector

SW1

PWR

VIN

R9

50 mΩR8

1K

ADJ

1

4

VCC

VBat

V_USB

9

BAT_NTC

CHRGPWR_ON

6

BATD/CD

VBat

8

5

C7

4.7μF

I2C_SCL

PROG

U4

C2

4.7μFV_USB2

1

4

OUT

10

VPROG = 1V

IBAT=(VPROG/RPROG)x1000

RPROG=1000*VPROG/IBAT

BAT_NTC

PA

D

R11NC

R100R

7

2

1

2

Bat-

VBat

R2147K

Battery Charger

GND

GN

D C3

4.7μF

3

CHRG

C6

4.7μF

1

6

CHRG

BAT

EN3

VBat

NC

R520K

3

U3

I2C_SDAALM

Max 200mA

4

R32K

V_USB

3V3_EN IN1

GN

D

CHRG

5

VBat

R147K

3V3

CG

STBC08PMR

2

7RSTIO

U1

LDK120M-R

U2

STC3115IQT

VDD3V3

SWDCLKSWDIO

RESET

MIC_CLK

RXD-USB_DPRXD-USB_DM

SD_CSSD_MISOSD_SCK

SD_MOSI

I2C_SCLI2C_SDA

SensorTile footprint

123456789 10

14

1615

131211

1718

Formal notices required by the U.S. Federal Communications Commission ("FCC")

UM2101

30/34 DocID029635 Rev 3

8 Formal notices required by the U.S. Federal Communications Commission ("FCC")

Model: STEVAL-STLKT01V1

FCC ID: S9NSTILE01

FCC NOTICE: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.

Additional warnings for FCC

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference's by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and the receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

UM2101 Formal product notice required by the Industry Canada ("IC")

DocID029635 Rev 3 31/34

9 Formal product notice required by the Industry Canada ("IC")

Model: STEVAL-STLKT01V1

IC: 8976C-STILE01

Innovation, Science and Economic Development Canada Compliance - This device complies with Innovation, Science and Economic Development RSS standards. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment.

Conformité à Innovation, Sciences et Développement Économique Canada - Cet appareil est conforme aux normes RSS d'Innovation, Science et Développement économique. L'utilisation est soumise aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférences nuisibles, et (2) cet appareil doit accepter de recevoir tous les types d’interférence, y comprises les interférences susceptibles d'entraîner un fonctionnement indésirable. Les changements ou les modifications non expressément approuvés par le fabricant pourraient annuler le permis d'utiliser l'équipement.

TYPE certification UM2101

32/34 DocID029635 Rev 3

10 TYPE certification

The module has been tested according to the following TYPE certification rules:

Type of specified radio equipment:

radio equipment according to the certification ordinance article 2-1-9

sophisticated low power data communication system in a 2.4 GHz band

Class of emissions, assigned frequency and antenna power:

F1D, 2402 to 2480 MHz, channel separation 2 MHz/40 channels, 0.006 W

Certification number:

006-000482

The design and manufacturing are certified on the basis of the Japan Radio Law 38-24.

UM2101 Revision history

DocID029635 Rev 3 33/34

11 Revision history Table 9: Document revision history

Date Version Changes

17-Aug-2016 1 Initial release.

28-Aug-2017 2

Updated Section "Introduction", Section 1.1: "Overview", Section 1.3: "Initial setup with pre-loaded demo", Section 6.4: "MP34DT04", Section 6.5: "BLUENRG-MS" and Section 9: "Formal product notice required by the Industry Canada ("IC")"

30-Oct-2017 3

Added Figure 7: "STEVAL-STLCS01V1 component placement (top side)", Figure 9: "STLCX01V1 component placement (top side)", Figure 14: "STEVAL-STLCR01V1 component placement (top side)", Figure 15: "STEVAL-STLCR01V1 component placement (bottom side)" and Section 10: "TYPE certification"

Updated Figure 21: "STLCR01V1 schematic diagram"

UM2101

34/34 DocID029635 Rev 3

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