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TRANSCRIPT
TOX
ICS
USE
RE
DU
C’IiO
NIN
SI
ITU
TE
TH
EM
AS
SA
CH
US
ET
TS
TO
XIC
SU
SE
RE
DU
CT
ION
INS
TIT
UT
E
CY
AN
IDE
-BA
SE
DE
LEC
TR
OP
LAT
ING
EL
IMIN
AT
ION
NO
RT
HR
OP
GR
UM
MA
NC
OR
PO
RA
TIO
N
TecimicalR
eportNo.
201994
University
ofMassachusetts
Lowell
CY
AN
IDE
-BA
SE
DE
LE
CT
RO
PL
AT
ING
EL
IMIN
AT
ION
NO
RTH
RO
PG
RU
MM
AN
CO
RP
OR
ATIO
NE
LEC
TR
ON
ICS
SY
STE
MS
DIV
ISIO
N-
PR
EC
ISIO
NP
RO
DU
CTS
PLA
NT
Dan
PierceM
anager,E
nvironmental,
Health
&Safety
Cruz
R.
Calderon
-Sr.
ProjectE
ngineerM
arthaL.
Jowett
-Sr.
Materials
Scientist
David
E.
Mahoney
-E
ngineeringA
ssistant
Northrop
Grum
man
Corporation
Norw
ood,M
assachusetts
Decem
ber1994
TheToxics
Use
Reduction
Institu
teM
atchingG
rantsP
rogram
TheToxics
Use
Reduction
InstituteU
niversityo
fMassachusetts
Lowell
TOXIC
SUSE
RED
UC
TION
Ns’rIrU
TE
NA
llrightsto
thisreportbelong
tothe
ToxicsUse
ReductionInstitute.
Them
aterialmay
beduplicated
with
permission
bycontacting
theInstitute.
TheToxics
UseReduction
Instituteis
am
ulti-disciplinaryresearch,education,
andpolicy
centerestablishedby
theM
assachusettsToxics
UseReduction
Actof1989.
TheInstitute
sponsorsand
conductsresearch,organizes
educationand
trainingprogram
s,andprovides
technicalsupporttoprom
otethe
reductionin
theuse
oftoxicchem
icalsorthe
generationoftoxic
chemicalbyproducts
inindustry
andcom
merce.
Furtherinformation
canbe
obtainedby
writing
theToxics
UseReduction
Institute,University
ofMassachusetts
Lowell,One
University
Avenue,Lowell,
Massachusetts
01854.
°ToxicsUse
ReductionInstitute,U
niversityofM
assachusettsLow
ell
Toxics
Use
Reduction
Institu
teM
atch
ing
Grants
Program
TheInstitute
annuallyprovides
directfunding
toM
assachusettsindustries
ona
matching
basisfor
toxicsuse
reduction(TU
R)
feasibilityand
technologystudies.
Them
atchingG
rantsProgram
wasinitiated
inFY
93to
facilitatethe
developmentand
useofinnovative
techniquesthatreduce
theuse
oftoxicchem
icalsorthe
generationoftoxic
byproductsin
Massachusetts
businesses.G
rantsare
awarded
ona
competitive
basisforcom
paniesto
conductTU
Rstudies
attheirfacilities.Recipients
prepareprojectreports
which
assistintransferring
toxicsuse
-ieductiontechnologies
andm
ethodsto
othercompanies.
Notice
Thisreporthas
beenreview
edby
theToxics
UseReduction
Instituteand
approvedfor
publication.Approvaldoes
notsignifythatthe
contentsnecessarily
reflecttheview
sand
policiesofthe
ToxicsUse
Reduction
Institute,nordoes
them
entionoftrade
names
orcom
mercialproducts
constituteendorsem
entorrecomm
endationfor
use.
-A
ckno
wle
dg
em
en
t
Th
aa
uth
ors
wo
uld
like
toth
an
k.th
efo
llow
ing
No
rthro
pe
mp
loye
es
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the
irtim
ely
an
dirr&
alu
ab
lea
ssis
tan
ce
inco
mp
letin
gth
isp
roje
ct.
Fra
nk
Be
llom
oB
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ius
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dg
au
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sE
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on
sa
lve
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enH
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ul
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rtso
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nk
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rrima
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eM
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ch
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oxic
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seR
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stitu
tefo
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er
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ce
.
TA
BL
EO
FC
ON
TE
NT
S
I.E
XE
CU
TIV
ES
UM
MA
RY
1
II.P
RO
JEC
T’S
CO
PE
1
III.
AS
SE
SS
ME
NT
&A
PP
LIC
AT
ION
OF
TE
CH
NO
LOG
IES
2A
.N
orth
rop
Gru
mm
an
Pa
rtD
escrip
tion
s/R
eq
uire
me
nts
2B
.P
ote
ntia
lA
ltern
ativ
eP
roce
sse
s3
a.
Ele
ctro
less
Co
pp
er
Pla
ting
3b
.E
lectro
less
Nic
ke
lP
latin
gS
c.
Acid
Co
pp
er
Ele
ctro
pla
ting
Sd
.A
lka
line
Co
pp
er
Ele
ctro
pla
ting
S
IV.
TE
ST
OR
IMP
LE
ME
NT
AT
ION
RE
SU
LTS
9A
.P
relim
ina
ryE
va
lua
tion
of
E-B
rite3
0/3
0.
..
9B
.S
eco
nd
ary
Co
up
on
Te
stin
g1
0C
.A
lum
inu
mP
art
Te
stin
g1
6D
.K
ova
rP
art
Te
stin
g3
4E
.A
lloy
52P
art
Te
stin
g3
8
V.
TO
XIC
SU
SE
RE
DU
CT
ION
AS
SE
SS
ME
NT
38
VI.
EC
ON
OM
ICA
SS
ES
SM
EN
T3
9
1
LIS
TO
FT
AB
LE
S
Ta
ble
1C
ou
po
nT
yp
es
an
dC
on
figu
ratio
ns
Ta
ble
2R
esu
ltso
fC
op
pe
rP
latin
gB
ath
Co
up
on
Stu
die
s
Ta
ble
3T
hic
kn
ess
Sp
ecific
atio
ns
Ta
ble
4C
om
pa
riso
no
fco
pp
er
Co
atin
gT
hic
kn
esse
s
Ta
ble
5R
esu
ltso
f6
06
1A
lum
inu
mR
ibb
on
Pla
ting
inE
-Brite
30
/30
Co
pp
er
Ba
th
Ta
ble
6C
op
pe
rP
latin
gT
hic
kn
esse
so
n6
06
1A
lum
inu
mR
ibb
on
inE
—B
rite3
0/3
0B
ath
Ta
ble
7C
op
pe
rP
latin
gT
hic
kn
esse
so
n6
06
1A
lum
inu
mR
ibb
on
inco
pp
er
Cya
nid
eB
ath
Ta
ble
SA
dd
ition
al
Co
sts
/Sa
vin
gs
of
E-B
rite3
0/3
0P
roce
ss
Ta
ble
9E
co
no
mic
Co
mp
aris
on
of
Co
pp
er
Cya
nid
eB
ath
toE
—B
rite3
0/3
0
LIS
TO
FF
IGU
RE
S
Fig
ure
1A
lum
inu
mR
ibb
on
on
Pla
ting
Fix
ture
Fig
ure
2P
late
dA
lum
inu
mR
ibb
on
on
Pla
ting
Fix
ture
Fig
ure
3F
ina
lF
lexle
ad
Asse
mb
lyA
fter
Co
pp
er
Strip
pin
gP
roce
ss
Fig
ure
4F
lexle
ad
Asse
mb
lyIn
sta
lled
inG
yro
sco
pe
Fig
ure
5C
arp
en
ter
49
-P
relim
ina
ryC
ou
po
nT
estin
gin
E—B
rite3
0/3
0B
ath
Fig
ure
6IC
ova
r-
Pre
limin
ary
Co
up
on
Te
stin
gin
E-B
rite3
0/3
0B
ath
Fig
ure
7A
lum
inu
m—
Pre
limin
ary
Co
up
on
Te
stin
gin
E-B
rite3
0/3
0B
ath
Fig
ure
SE
-Brite
30
/31
Mm
.%
Re
qu
ired
for
co
pp
er
Le
ve
l
Fig
ure
9D
arke
ne
dA
rea
son
E-B
rite3
0/3
0C
oo
pe
rP
latin
go
nA
lum
inu
m1
10
0R
od
Fig
ure
10D
arke
ne
dA
rea
son
E—
Brite
30
/30
Co
op
er
Pla
ting
on
Alu
min
um
11
00
Rod
ii
Fig
ure
11B
ulk
E—
Brite
30
/30
Co
pp
er
Pla
ting
onA
lum
inu
m1
10
0R
od
Fig
ure
12E
—B
rite3
0/3
0C
op
pe
rP
late
dA
lum
inu
mR
ibb
on
Fig
ure
13E
—B
rite3
0/3
0C
op
pe
rC
oa
ting
on6
06
1A
lum
inu
mR
ibb
on
-G
rou
pA
Fig
ure
14E
—B
rite3
0/3
0C
op
pe
rC
oa
ting
on6
06
1A
lum
inu
mR
ibb
on
-G
rou
pB
Fig
ure
15E
—B
rite3
0/3
0C
op
pe
rC
oa
ting
on6
06
1A
lum
inu
mR
ibb
on
-G
rou
pC
Fig
ure
16C
op
pe
rC
ya
nid
eC
oa
ting
on6
06
1A
lum
inu
mR
ibb
on
Fig
ure
176
06
1A
lum
inu
mR
ibb
on
inE
-Brite
30
/30
Asse
mb
ly—
Afte
r1
Strip
pin
gC
ycle
of
13S
eco
nd
s
Fig
ure
186
06
1A
lum
inu
mR
ibb
on
inE
—B
rite3
0/3
0A
sse
mb
ly-
Afte
r2
Strip
pin
gC
ycle
sfro
m26
to40
Se
con
ds
To
tal
Fig
ure
196
06
1A
lum
inu
mR
ibb
on
inC
op
pe
rC
ya
nid
eA
sse
mb
ly-
Afte
ra
Strip
pin
gC
ycle
of
13to
26S
eco
nd
s
Fig
ure
20K
ova
rF
ee
dth
ruH
ea
de
r
Fig
ure
21F
ee
dth
ruH
ea
de
rw
ithA
lloy
52P
ins
I.E
XE
CU
TIV
ESU
MM
ARY
Elim
ina
ting
cya
nid
ep
roce
sse
sg
en
era
tes
many
be
ne
fits.
Th
e
removal
of
extre
me
lyto
xic
ch
em
ica
lsfro
mth
ew
ork
pla
ce
,a
nd
the
red
uctio
nin
wa
ste
trea
tme
nt
co
sts
are
among
the
mo
stn
ota
ble
.T
his
inve
stig
atio
nd
em
on
stra
tes
the
rep
lace
me
nt
of
co
pp
er
cya
nid
eb
ase
dp
roce
sse
sw
itha
co
mm
erc
ially
ava
ilab
leco
pp
er
ele
ctro
pla
ting
so
lutio
nth
at
co
nta
ins
no
cya
nid
es.
Alte
rna
tive
no
n—
cyan
ide
ele
ctro
pla
ting
pro
ce
sse
sw
ere
eva
lua
ted
for
thre
esu
bstra
tes:
alu
min
um
,K
ova
r,a
nd
an
icke
l—iro
na
lloy.
Aco
mm
erc
ially
ava
ilab
lea
lka
line
co
pp
er
so
lutio
n,
E—
Brite
30
/30
(Ele
ctro
ch
em
ica
lP
rod
ucts
Inc.),
was
se
lecte
da
nd
eva
lua
ted
.T
est
cou
po
ns
an
dp
rod
uctio
np
arts
we
ree
lectro
pla
ted
inth
eE
’-Brite
30
/30
.a
nd
su
bje
cte
dto
an
um
be
ro
fte
sts
.A
dh
esio
n,
so
lde
rab
ility,
vis
ua
la
pp
ea
ran
ce
s,
an
dth
ickn
esse
so
fth
eco
atin
gs
from
the
alte
rna
tive
pro
ce
ss
we
ree
va
lua
ted
with
favo
rab
lere
su
lts.
Pla
ting
onzin
ca
ted
alu
min
um
po
sed
nod
ifficu
lties
with
this
ba
tha
ltho
ug
hth
ep
latin
gra
tew
asslo
we
rth
an
with
co
pp
er
cya
nid
e.
The
E—
Brite
30
/30
pro
vid
ed
ad
rop
-ina
ltern
ativ
ere
qu
iting
noa
ltera
tion
ino
ur
cu
rren
tcle
an
ing
pro
ce
sse
s.
Ho
we
ver,
itis
imp
orta
nt
ton
ote
tha
tth
ism
ayn
ot
be
true
for
all
pro
ce
sse
s.
The
co
pp
er
cya
nid
eb
ath
ism
uchm
ore
tole
ran
to
fsu
rface
co
nta
min
atio
nth
an
the
E—
Brite
30
/30
ba
th.
Wa
stetre
atm
en
to
fE
-Brite
30
/30
rinse
wa
ters
islim
ited
toth
em
eta
lio
ns,
req
uirin
go
nly
pHa
dju
stm
en
ta
nd
pre
cip
itatio
n.
Th
ise
limin
ate
sth
en
ee
dfo
rth
ese
pa
rate
cya
nid
ed
estru
ctio
np
roce
ss
req
uire
don
the
co
pp
er
cya
nid
erin
se
wa
ters
.
An
eco
no
mic
eva
lua
tion
of
the
E—
Brite
30
/30
pro
ce
ss
for
zin
ca
ted
alu
min
um
ribb
on
ve
rsu
sth
eco
pp
er
cya
nid
ep
roce
ss
was
pe
rform
ed
.S
ign
ifica
nt
ind
irect
exp
en
sesa
vin
gs
we
rere
aliz
ed
.H
ow
eve
r,d
irect
lab
or
co
sts
we
reh
igh
er.
Ove
rall,
we
pro
jecte
dto
tal
ad
ditio
na
lco
sts
at
$6
26
pe
rye
ar
for
the
no
n-c
ya
nid
ep
roce
ss.
Inlig
ht
of
the
su
bsta
ntia
lto
xic
use
red
uctio
nb
en
efits
aris
ing
from
elim
ina
ting
the
cya
nid
ep
roce
ss,
the
sm
all
diffe
ren
ce
inp
roje
cte
dco
st
be
twe
en
the
two
pro
ce
sse
sis
inco
nse
qu
en
tial.
Th
ere
fore
,b
ase
don
ou
rfa
vo
rab
lea
na
lysis
of
this
alte
rna
teco
pp
er
ele
ctro
pla
ting
pro
ce
ss,
we
pla
nto
pu
rsu
eth
eco
nve
rsio
no
fo
ur
co
pp
er
-cya
nid
ep
latin
go
pe
ratio
ns.
II.P
RO
JEC
TS
CO
PE
Th
isp
roje
ct
de
mo
nstra
tes
the
use
of
no
n—
cyan
ide
ba
sed
ele
ctro
pla
ting
of
co
pp
er
onA
lum
inu
m,
Ko
va
r,a
nd
Nic
ke
l—Iro
na
lloy
pa
rts.
No
rthro
pG
rumm
anC
orp
ora
tion
—E
lectro
nic
s
1
Syste
ms
Div
isio
n—
Pre
cis
ion
Pro
du
cts
Pla
nt
ma
nu
factu
res
gyro
sco
pe
s,
acce
lero
me
ters
,a
nd
-gu
ida
nce
syste
ms
em
plo
yin
gth
ese
de
vic
es,
for
ava
riety
of
ae
rosp
ace
ap
plic
atio
ns.
--C
urre
ntly
,c-tw
oco
mp
on
en
tse
xp
erie
nce
cyan
ide
—b
ase
dco
pp
er
ele
ctro
pla
ting
.T
he
see
lectro
pla
ted
com
po
ne
nts
pro
vid
ecritic
al
fun
ctio
na
lityfo
ro
ur
pro
du
cts
,th
us
dic
tatin
gth
at
an
ya
ltern
ativ
ep
roce
ss
pro
du
ce
co
nsis
ten
ta
nd
relia
ble
resu
lts.
Th
ep
roje
ct
scop
ein
clu
de
dd
ete
rmin
ing
the
exis
ten
ce
of
su
itab
lea
ltern
ativ
ep
roce
sse
s,
ob
tain
ing
alte
rna
tive
so
lutio
ns,
an
dp
latin
gte
st
cou
po
ns
an
dp
rod
uctio
np
arts
.A
na
lytic
al
testin
go
fb
oth
the
alte
rna
tive
pla
ting
so
lutio
ns
em
plo
yed
an
dth
eco
up
on
sa
nd
pro
du
ctio
np
arts
was
pe
rform
ed
.T
he
so
lutio
nte
stin
gin
vo
lve
dve
rifyin
go
rd
eve
lop
ing
me
tho
ds
for
rou
tine
pla
ting
ba
tha
na
lysis
.T
he
eva
lua
tion
of
the
pa
rtse
nta
iled
vis
ua
la
pp
ea
ran
ce
ap
pra
isa
ls,
thic
kn
ess
me
asu
rem
en
ts,a
dh
esio
na
sse
ssm
en
ts,
so
lde
rab
ilityte
stin
g,
an
de
xa
min
atio
nb
ysca
nn
ing
Ele
ctro
nM
icro
sco
py
(SE
M)
for
the
inte
grity
of
the
pa
rtsa
nd
the
co
atin
g.
An
eco
no
mic
eva
lua
tion
of
the
alte
rna
tive
pro
ce
ss
was
als
oco
nd
ucte
d.
III.A
SS
ES
SM
EN
T&
AP
PL
ICA
TIO
NO
FTE
CH
NO
LOG
IES
A.
No
rthro
pG
rumm
anP
art
De
scrip
tion
s/R
eq
uire
me
nts
Ou
rp
rima
rye
fforts
ce
nte
red
onid
en
tifyin
ga
no
n—
cyan
ide
pla
ting
pro
ce
ss
for
alu
min
um
.W
eu
tilize
a6
06
1a
lum
inu
mrib
bo
na
san
ele
ctric
al
cu
rren
tca
rrier
an
dfle
xe
lem
en
tw
ithin
ou
rp
rod
ucts
.T
he
60
61
alu
min
um
pro
vid
es
bo
thth
en
ece
ssa
ryco
rrosio
nre
sis
tan
ce
an
dm
ech
an
ica
lp
rop
ertie
sre
qu
ired
by
ou
ra
pp
lica
tion
.T
his
ribb
on
,m
ea
su
ring
0.0
00
5in
ch
es
thic
kb
y0
.01
2in
ch
es
wid
e,
isan
extre
me
lyd
elic
ate
pa
rt.T
he
co
pp
er
pla
ting
of
this
ribb
on
pe
rmits
itsso
lde
ring
toclip
sto
form
afle
xle
ad
asse
mb
lyw
hic
his
su
bse
qu
en
tlyb
uilt
into
ag
yro
sco
pe
.
Th
ecu
rren
tp
roce
ss
en
tails
an
um
be
ro
fste
ps.
Firs
t,th
erib
bo
nis
wo
un
do
nto
ah
ea
ttre
at
fixtu
reon
wh
ich
itis
initia
llyh
ea
ttre
ate
da
nd
artific
ially
ag
ed
.T
he
he
at
trea
tme
nt
imp
rove
sth
em
ate
rial’s
me
ch
an
ica
lp
rop
ertie
sa
nd
sha
pe
sth
em
ate
rial
into
the
de
sire
dco
ilco
nfig
ura
tion
.T
he
ribb
on
isth
en
ge
ntly
tran
sfe
rred
toa
pla
ting
fixtu
re.
Ne
xt,
the
su
rface
isp
rep
are
dfo
llow
ing
the
ge
ne
ral
gu
ide
line
so
fA
STM
B253—
79,“P
rep
ara
tion
of
an
dE
lectro
pla
ting
onA
lum
inu
mb
yth
eZ
inca
teP
roce
ss”.
Azin
ca
teim
me
rsio
nste
pfo
llow
ed
by
wa
ter
rinsin
gis
the
fina
lste
pp
rior
toco
pp
er
pla
ting
.T
he
cu
rren
tzin
ca
teu
tilize
dis
Alu
mo
nD
,an
En
tho
ne
pro
du
ct
wh
ich
isp
rima
rilya
mix
ture
-o
fzin
c,
oxid
e.
and.so
diu
mh
yd
roxid
e.
The
co
pp
er
cya
nid
eb
ath
inu
seis
asta
nd
ard
tartra
tety
pe
strik
eb
ath
2
co
nta
inin
gb
oth
sod
ium
an
dco
pp
er
cya
nid
e.
Afte
re
lectre
pla
ting
,a
pp
roxim
ate
lyfiv
etu
rns
of
ribb
on
are
cu
to
ffth
efix
ture
an
dso
lde
red
totw
ob
ery
llium
co
pp
er
clip
s-to
form
the
flexle
ad
asse
mb
ly.
Te
nto
twe
lve
asse
mb
lies
can
be
fab
rica
ted
from
on
efix
ture
.F
ina
lly,
the
rem
ain
ing
exp
ose
dco
pp
er
pla
ting
ise
lectro
lytic
ally
strip
pe
du
sin
ga
ch
rom
ica
cid
so
lutio
n.
Fig
ure
s1
thro
ug
h4
dis
pla
yth
ea
lum
inu
mrib
bo
na
tva
riou
ssta
ge
sd
urin
gits
ma
nu
factu
ring
cycle
.
The
de
ve
lop
me
nt
of
the
no
n-c
ya
nid
ep
roce
ss
dic
tate
dth
ed
ep
ositio
no
fa
so
lde
rab
leco
atin
g,
pre
fera
bly
co
pp
er,
ona
zin
ca
ted
alu
min
um
su
rface
.T
hed
ep
osit
was
req
uire
dto
bea
dh
ere
nt,
free
from
de
fects
,re
ad
ilyso
lde
rab
le,
an
de
asily
strip
pe
dw
itho
ut
damage
toth
eu
nd
erly
ing
su
bstra
teo
rq
om
po
ne
nts
of
the
asse
mb
ly.
The
alte
rna
tive
pro
ce
ss
co
uld
no
ta
lter
the
inte
grity
of
the
thin
alu
min
um
ribb
on
,a
dd
ad
ditio
na
lco
st
toth
ep
rod
uct,
or
incre
ase
he
alth
an
de
nviro
nm
en
tal
risks.
Th
etw
ore
ma
inin
ga
pp
lica
tion
s,
the
Ko
va
r(F
e-N
i-Co
),a
nd
the
Allo
y52
(Fe
—N
i)h
ad
on
lytw
ocrite
ria.
Bo
tho
fth
ese
ma
teria
lsa
reu
sed
ine
lectric
al
fee
dth
rua
pp
lica
tion
sa
nd
co
nta
ing
lass
tom
eta
lse
als
.T
he
refo
re,
the
alte
rna
tive
pla
ting
pro
ce
ss
mu
stm
ain
tain
the
inte
grity
of
the
gla
ss
an
dits
se
als
.A
dd
ition
ally
,in
bo
thin
sta
nce
s,
the
co
pp
er
pla
ting
pro
vid
es
the
ba
sis
for
futu
retin
/lea
dso
lde
re
lectro
pla
ting
.T
he
refo
re,
the
rep
lace
me
nt
pro
ce
ss
mu
sta
lso
pro
du
ce
go
od
ad
he
sio
n.
B.
Po
ten
tial
Alte
rna
tive
Pro
ce
sse
s
Ino
rde
rto
ide
ntify
ap
pro
pria
tea
ltern
ativ
ep
roce
sse
sa
litera
ture
se
arc
hw
asco
nd
ucte
dfo
rco
mm
erc
ially
ava
ilab
len
on
—cya
nid
ep
latin
ga
ltern
ativ
es.
Ge
ne
rally
,th
ere
qu
irem
en
tsfo
rth
ea
lum
inu
me
lectro
pla
ting
we
reth
ep
roh
ibitin
g-
facto
rsin
this
se
arc
h.
Dis
cu
ssio
ns
of
the
po
ten
tial
alte
rna
tive
sfo
llow
;
a.
Ele
ctro
less
Co
pp
er
Pla
ting
Ele
ctro
less
co
pp
er
so
lutio
ns
are
prim
arily
use
dw
ithin
the
prin
ted
circ
uit
bo
ard
ind
ustry
for
the
pla
ting
of
no
nco
nd
uctiv
em
ate
rial.
Th
ey
are
usu
ally
alk
alin
ein
na
ture
an
dre
qu
irea
ca
taly
st
for
the
de
po
sitio
nto
occu
r.T
he
yp
rod
uce
hig
hly
stre
sse
dd
ep
osits
cre
atin
gb
rittle
co
atin
gs.
Sin
ce
this
alu
min
um
ribb
on
isd
esig
ne
dfo
rits
flexib
ility,
ab
rittle
co
atin
gw
ou
ldb
eu
nsu
itab
le.
3
Fig
ure
3F
ina
lF
lexle
ad
Asse
mb
lyA
fter
Co
pp
er
Strip
pin
gP
roce
ss
a.
Ap
pro
x.
Actu
al
Siz
e
b.
4.6
X
6
b.
Ele
ctro
less
Nic
ke
lP
latin
g
Ele
ctro
less
nic
ke
lp
latin
gco
uld
wo
rkw
ell
onth
efe
ed
thru
ap
plic
atio
ns
bu
tw
ou
ldb
ep
rob
lem
atic
with
the
alu
min
um
ribb
on
.In
fact,
the
Allo
y52
ap
plic
atio
nis
•cu
rren
tlyb
ein
gp
rocu
red
as
aco
mp
lete
dfe
ed
thru
with
so
lde
rp
latin
ga
lrea
dy
ap
plie
dan
top
of
nic
ke
l.U
nfo
rtun
ate
ly,
ou
rm
ost
strin
ge
nt
crite
rialie
sw
ithth
ea
lum
inu
mrib
bo
nw
hic
his
so
lde
red
into
an
asse
mb
ly.
Afte
rso
lde
ring
,th
en
icke
lw
ou
ldh
ave
tob
estrip
pe
dw
itho
ut
atta
ckin
ga
ny
po
rtion
of
the
asse
mb
ly.
At
this
time
,n
ote
ch
niq
ue
isre
ad
ilya
va
ilab
lefo
rstrip
pin
ga
nic
ke
lco
atin
go
ffo
fth
efle
xle
ad
asse
mb
lyw
itho
ut
rad
ica
llya
lterin
gth
ea
sse
mb
lyits
elf.
c.
Acid
Co
pp
er
Ele
ctro
pla
ting
Ele
ctro
lytic
acid
co
pp
er
so
lutio
ns
are
typ
ica
llye
mp
loye
dto
de
po
sit
thic
kco
atin
gs.
Th
ey
co
nta
ina
cid
sw
hic
hw
ou
lda
ttack
the
alu
min
um
su
bstra
te.
Due
toth
eth
ickn
ess
of
the
alu
min
um
ribb
on
,a
ny
me
tal
loss
isu
na
cce
pta
ble
.
d.
Alk
alin
eC
op
pe
rE
lectro
pla
ting
Ele
ctro
lytic
no
n—
cyan
ide
alk
alin
eco
pp
er
so
lutio
ns
dis
pla
ye
dth
em
ost
pro
mis
e.
Th
ree
po
ten
tial
co
mm
erc
ial
so
lutio
ns
for
pla
ting
onzin
ca
ted
alu
min
um
we
reid
en
tified
;E
-Brite
30
/30
ma
nu
factu
red
by
Ele
ctro
ch
em
ica
lP
rod
ucts
(EP
I),In
c.
of
New
Be
rlin,
WI,
Cu
pra
lp
rod
uce
db
yE
nthone—O
MI
of
New
Ha
ven
,C
T,
an
dH
CP
-20
0fro
mC
he
mte
chP
rod
ucts
(form
erly
Ha
rsta
n)
of
St.
Lo
uis
,M
O..
Bo
thE
PI’s
an
dE
nth
on
e’s
tech
nic
al
da
tash
ee
tsa
relo
ca
ted
inA
pp
en
dix
A.
We
~d
isco
ve
red
tha
t~-C
he
mte
chh
ad
dis
co
ntin
ue
dm
an
ufa
ctu
ring
the
irp
rod
uct.
Th
ey
cea
sed
fab
rica
ting
this
pro
du
ct
line
du
eto
lack
of
de
ma
nd
.H
ow
eve
r,th
ey
we
rew
illing
tosh
are
the
HC
P-2
00
’sfo
rmu
latio
nw
ithu
sa
slo
ng
as
we
ag
ree
dn
ot
tom
an
ufa
ctu
reit
co
mm
erc
ially
,o
rin
larg
eq
ua
ntitie
s.
Itis
cu
rren
tlyin
use
at
La
wre
nce
Liv
erm
ore
Na
tion
al
La
bo
rato
rya
nd
dis
cu
sse
din
anA
pril,
1992re
po
rte
ntitle
d“E
lectro
pla
ting
Wa
steM
inim
iza
tion
at
La
wre
nce
Liv
erm
ore
Na
tion
al
La
bo
rato
ry”.
No
ne
the
less,
we
de
cid
ed
no
tto
pu
rsu
eth
isp
roce
ss
at
this
time
.T
he
rew
ou
ldh
ave
be
en
min
ima
l,if
an
y,
tech
nic
al
su
pp
ort
for
this
pro
du
ct.
Afte
rte
lep
ho
ne
dis
cu
ssio
ns
with
En
tho
ne
tech
nic
al
pe
rso
nn
el,
Cu
pra
lw
asa
lso
elim
ina
ted
as
avia
ble
8
ca
nd
ida
te.
Th
isp
roce
ss
req
uire
sco
mp
lex
ba
tha
na
lysis
an
da
na
uxilia
ryp
urific
atio
nce
ll.It
isa
lso
se
nsitiv
eto
zin
cco
nta
min
atio
n,
the
refo
rein
co
mp
atib
lew
ith.
ou
rzin
ca
teth
alu
imin
um
pro
ce
ss.
We
su
sp
ecte
dth
at
itco
uld
ad
dco
nsid
era
ble
co
st
too
ur
pla
ting
pro
ce
ss.
Th
eE
PI
pro
du
ct,
E—
Brite
30
/30
rem
ain
ed
as
the
so
leco
nte
nd
er.
Th
isp
rod
uct
ap
pe
are
dto
be
rela
tive
lystra
igh
tfo
rwa
rdw
ithno
co
mp
lica
ted
ba
tha
na
lysis
.C
op
pe
rco
nte
nt,
pH,
an
de
lectro
lyte
co
nce
ntra
tion
eva
lua
tion
sw
ere
the
reco
mm
en
de
da
na
lyse
s.
Ele
ctro
lyte
co
nce
ntra
tion
an
dco
pp
er
co
nte
nt
can
bep
erfo
rme
db
ytitra
tion
s.
An
ele
ctro
nic
pHm
ete
ris
ne
ce
ssa
ryfo
rb
oth
the
ele
ctro
lyte
titratio
na
nd
mo
nito
ring
the
pH.
Th
eb
ath
ism
ore
se
nsitiv
eto
bo
tho
rga
nic
an
dm
eta
llicco
nta
min
atio
nth
an
the
co
pp
er
cya
nid
eb
ath
.T
he
refo
re,
co
ntin
uo
us
ca
rbo
nfiltr
atio
nis
reco
mm
en
de
dfo
rco
ntro
lling
the
org
an
ics.
Mo
nito
ring
the
ino
rga
nic
sb
ysp
ectro
sco
py
or
alte
rna
tem
eansis
als
ore
com
me
nd
ed
.B
ath
pe
rform
an
ce
can
be
eva
lua
ted
by
Hu
llce
llte
sts
.T
his
ba
th’s
wa
ste
trea
tme
nt
islim
ited
toco
pp
er
ion
sth
us
sig
nific
an
tlyre
du
cin
gd
isp
osa
lco
sts
com
pa
red
tocya
nid
eb
ase
dp
roce
ss.
As
are
su
lto
fo
ur
litera
ture
se
arc
h,
we
de
cid
ed
toe
xp
erim
en
tw
ithE
PI’s
E-B
rite3
0/3
0.
IV.
TE
ST
OR
IMP
LE
ME
NT
AT
ION
RE
SU
LTS
A.
Pre
limin
ary
Eva
lua
tion
of
E-B
rite3
0/3
0
CouponS
testin
gin
the
lab
ora
tory
en
com
pa
ssed
the
initia
la
sse
ssm
en
to
fth
eE
—B
rite3
0/3
0co
pp
er
pla
ting
ba
th.
cou
po
np
latin
gb
eg
an
ina
500m
illiliter
pyre
xb
ea
ke
rh
ea
ted
by
ah
ot
pla
te.
Am
ag
ne
ticstirre
rp
rovid
ed
the
ba
tha
gita
tion
.A
the
rmo
me
ter
me
asu
red
the
tem
pe
ratu
re.
Tw
oo
xyge
nfre
eco
pp
er
rod
sha
pe
da
no
de
s(a
pp
roxim
ate
ly3
.1in
ch
es
lon
gb
y0
.3in
ch
es
ind
iam
ete
r)tra
nsfe
rred
the
cu
rren
tto
the
so
lutio
n.
Th
eso
lutio
nco
nsis
ted
of
50%E
-Brite
30
/30
an
d50%
of
de
ion
ize
d(18
megohm
)w
ate
r.A
ltho
ug
hE
n’s
pro
du
ct
litera
ture
allo
ws
the
use
of
tap
wa
ter,
we
utiliz
ed
de
ion
ize
dw
ate
rfo
rb
oth
so
lutio
nm
akeup
an
dsom
erin
sin
gste
ps.
Are
ctifie
r(0
to10
vo
lts,
0to
10a
mp
ere
s)co
nn
ecte
din
se
ries
with
am
ultim
ete
rsu
pp
lied
the
cu
rren
tto
the
ba
th.
The
mu
ltime
ter
pro
vid
ed
me
asu
rem
en
tso
fth
ea
ctu
al
cu
rren
tin
the
millia
mp
ere
ran
ge
.T
hre
ed
iffere
nt
cou
po
nm
ate
rials
we
reu
tilize
d.
Intw
oca
se
s,
sim
ilar
allo
ys
we
resu
bstitu
ted
du
eto
lack
of
su
itab
lein
-ho
use
ma
teria
lfo
rco
up
on
testin
g.
2024a
lum
inu
ma
lloy
was
su
bstitu
ted
for
60
61
alu
min
um
.C
arp
en
ter
49
,a
no
the
riro
n-
nic
ke
la
lloy,
was
em
plo
yed
inlie
uo
fA
lloy
52
.T
ab
le1
de
scrib
es
the
cou
po
nco
nfig
ura
tion
s.
9
Ta
ble
I.C
ou
po
nT
ype
sa
nd
Co
nfig
ura
tion
s
Pa
rtC
ou
po
nA
pp
rox.
Co
up
on
Are
ato
Ma
teria
lM
ate
rial
Dim
en
sio
ns
be
Pla
ted
60
61
Al
•.2024
Al
1”
x4
”fla
tp
late
.02
7sq
.ft.
Allo
y52
Ca
rpe
nte
r49
.5”
dia
.x
.1”
thic
k.0
04
sq
.ft.
Ko
va
rK
ova
r.7
5”
dia
.x
1”
thic
k.0
08
sq
.ft.
The
pre
limin
ary
cou
po
nte
stin
gw
asp
erfo
rme
din
be
ake
rsto
eva
lua
ted
ep
ositio
nra
tes
an
da
pp
rop
riate
cu
rren
td
en
sitie
s.
Th
eco
up
on
sw
ere
cle
an
ed
inth
esam
em
an
ne
ra
sth
ep
arts
the
yre
pre
se
nte
d.
Th
ey
we
reth
en
imm
erse
din
the
E—
Brite
30
/30
pla
ting
ba
tha
t1
20
°F±
5°F
for
3m
inu
tes
±5
se
co
nd
s.
Th
ecu
rren
td
en
sity
was
va
ried
an
dth
ere
su
lting
co
atin
gth
ickn
esse
sm
ea
sure
d.
Fig
ure
s5
thro
ug
h7
pre
se
nt
the
resu
lts.
All
of
the
cou
po
ns,
reg
ard
less
of
ma
teria
lo
rcu
rren
td
en
sity
,e
xh
ibite
dg
oo
da
dh
esio
n.
Mo
std
isp
laye
da
cce
pta
ble
su
rface
ap
pe
ara
nce
sa
t6
tolo
xm
ag
nific
atio
ne
xce
pt
for
the
alu
min
um
wh
ich
exp
erie
nce
dsom
eb
urn
ing
at
40a
mp
ere
sp
er
sq
ua
refo
ot
(AS
F).
B.
Se
co
nd
ary
Co
up
on
Te
stin
g
Ne
xt,
utiliz
ing
ou
rp
relim
ina
ryre
su
lts,
am
inim
um
of
5m
ore
cou
po
ns
of
ea
chm
ate
rial
we
rep
late
din
bo
thth
eco
pp
er
cya
nid
ep
rod
uctio
nb
ath
an
dth
eE
-Brite
30
/30
ba
th.
Fo
rth
eE
—B
ritep
latin
g,
bo
thth
eC
arp
en
ter
49a
nd
Ko
va
rco
up
on
sw
ere
pro
ce
sse
din
the
be
ake
rse
tup
.T
he
alu
min
um
cou
po
ns
we
rep
erfo
rme
din
an11
liter
ba
th.
All
of
the
co
pp
er
cya
nid
ep
latin
gw
asp
erfo
rme
din
the
11lite
rp
rod
uctio
nb
ath
.
Th
e11
liter
ba
ths
are
loca
ted
inp
oly
pro
pyL
en
eta
nks
situ
ate
din
acu
stom
fou
rta
nk
Te
ch
nic
’sP
latin
gM
od
ule
.T
his
mo
du
leis
eq
uip
pe
dw
ith3
(0—12
vo
lt,0—
1a
mp
ere
DC
)re
ctifie
rs.
CA
L7
00
0te
mp
era
ture
co
ntro
llers
reg
ula
teb
ath
tem
pe
ratu
res
by
co
ntro
lling
500w
att
Te
ch
nic
(Mo
de
lH
XL511O
R11)
he
atin
ge
lem
en
ts.
Au
tom
atic
time
rsb
eg
intim
ing
asso
on
as
acu
rren
tis
ap
plie
dw
ithin
the
pla
ting
ba
th.
Se
rfilco
ch
em
ica
lso
lutio
np
um
ps,
(Mo
de
lA
PS
3000A—
ST
T)
with
ca
pa
citie
so
f55
ga
llon
sp
er
ho
ur,
circ
ula
tath
eb
ath
s.
When
inu
se
,th
eE
-Brite
30
/30
so
lutio
npum
psco
ntin
uo
usly
thro
ug
ha
3m
icro
nca
rbo
np
ack
filter
tore
mo
veo
rga
nic
co
nta
min
an
ts.
A15
mic
ron
po
lyp
rop
yle
ne
filter
isu
sed
on
the
co
pp
er
cya
nid
eb
ath
.B
oth
ba
ths
utiliz
eo
xyge
nfre
eco
pp
er
(OFC
)a
no
de
sw
hic
ha
rero
dsh
ap
ed
me
asu
ring
6in
ch
es
10
Fig
ure
5ca
rpe
nte
r49
—P
relim
ina
ryco
up
on
Te
stin
gin
E-B
rite3
0/3
0B
ath
E—Brite
30/30Bath
BethTem
p1
20
Fj
1OF
BathTim
e=
3mm
Estimated
Current
Plating
Density
Current
VisualThickness
RateSam
ple#
ASErn/a
AdhesionAppearance
uinuin/m
mn
115
60pass
ok16.1
54
220
80pass
ok23.5
7.83
25100
passok
31.010.3
430
120pass
ok35.0
11.75
40160
passok
58.419.5
E—
Brite
30
/30
Copper
Bath,
120F
Ca
rpe
nte
r49
Coupons
20.0~18.0
.216.0••
~1
4.0
~
~Q
10
.0~
~‘
8.0
;6
.0.•
E4.0~
.2.00
.0.
II
I10
2030
4050
Current
Density,
ASF
11
Fig
ure
6K
ova
r-
Ere
lintin
ary
Co
up
on
Te
stin
gin
E—
Brite
30
/30
Ba
th
E—Brite
30
/30
BathBath
Temp
=1
20
F~
bE
BathTim
e=
3mm
EsUm
atedC
urrentP
latingD
ensityC
urrentVisual
ThicknessRate
Sample
#ASF
rn/aAdhesion
Appearanceuin/m
in
115
120pass
ok20.8
6.92
20160
passok
28.09.3
325
200pass
ok38.4
12.64
30240
passok
50.917.0
540
320pass
oR60.0
20.0
E—
Brite
30
/30
Copper
Ba
th,
120F
Ko
var
Coupons
20.01
8.0
”•~
16.014.0
~~,
In
nN
‘‘“L
I.
°~
10.0~
8.0
.C
IS4
,0.
2.00
.0.10
2030
4050
Current
Density,
ASF
12
Fig
ure
7A
lum
inu
m—
Pre
limin
ary
Co
up
on
Te
stin
gin
E--B
rite3
0/3
0B
ath
E—
Brite.30/30
BathS
trikeat
3volts
for5
secondsBath
Temp
=1
20
F~
lOP
BethTim
e=
3mm
Estimeted
Current
Plating
Density
Current
VisualThickness
RateSam
ple~
ASPrn/a.
AdhesionAppearance
uinuin/m
in
115
405pass
Ok30.3
10.12
20540
passOk
37.612.5
325
675pass
ok5
Z4
17.54
30810
passok
60.320.1
540
1080pass
burning72.9
24.3
E—
Brite
30
/30
Copper
Bath,
120F
20
24
Alu
min
um
Coupons
25
ii~~10
.-B
E5
.
0-
II
I
1020
3040
50
Current
Density,
ASF
13
TABLE 2: RESULTS OF COPPER PLATING BATH COUPON STUDIES
PLATING PARAMETERS PLATING RESULTSCurrent? Current Average Ave. Plating
No. of Sample Bath Bath sarhple Density Time Visual Thickness Rate SolderabilityMaterial Samples Area, sgft Type Ternp, F rn/a ASF Mm. Adhesion Appearance uin uin/min w/o aging Comments
Carpenter 5 0.004 E—Brlte 30/30 120 00 25 9 pass pass I IC I 2.2 pass Plated individually49 500 ml Beaker
Carpenter 5 0.004 CucN 20 200 50 5 pass pass 84 8.4 pass All samples plated at once49 ii LiterBath 100 25 5
Kovar 5 0.008 E—Brite 30/30 120 200 25 7 pass pass I 12 I 6.0 pass Plated individually500 ml Beaker
Kovar 5 0.008 CuCN 120 400 50 5 pass pass 151 15.1 pass All samples plated at onceI I Liter Bath 200 25 5
Al 2024 6 0.014~ [—Brite 30/30 120 210 to 5 to 17 6 pass pass 74 12.3 pass Plated in PairsII Liter Bath 230
Al 2024 8 0.014 CuCN 120 420 30 0.5 pass pass 69 i9.7 pass Plated In PairsIi LiterBath 210 15 3
Test Methods
Adhesion — A grid was scribed onto the coupon using an exacto blade. Tape was then applied to the grid area. Subsequently, it was rapidly removed. The plating wasexamined for lifting. This Is similar to the method described in ASTM 6571—79 paragraph 13.
Visuai Appearance — The coupon was examined under a microscope at approximately OX. Any evidence of blisters, peeling, or pitting were noted.
Thickness — Thicknesses were measured using X—Ray Fluorescence on a Twintest XRF—PTG utilizing calibration standards.
Solderability — Soiderability was evaluated per the guidelines of ASTM B678 with the exception that the coupons remained in the solder pot for longer periods of time.
lon
gb
y0
.3in
ch
es
ind
iam
ete
r.
Bo
thth
eco
pp
er
cya
nid
ea
nd
E-B
rite3
0/3
0b
ath
sw
ere
ma
inta
ine
da
t1
20
°F±
5°F
.T
he
I(ova
ra
nd
Ca
rpe
nte
r49
cou
po
ns
pla
ted
ind
ivid
ua
llyin
the
500m
lb
ea
ke
ro
fth
eE
Brite
30
/30
ba
th.
All
five
cou
po
ns
(Ko
va
ra
nd
Ca
rpe
nte
r4
9)
we
rep
late
da
to
nce
inth
e11
liter
cya
nid
eb
ath
.T
he
alu
min
um
cou
po
ns
we
rep
late
din
pa
irsin
bo
thth
eE
-Brite
30
/30
an
dco
pp
er
cya
nid
e11
liter
ba
ths.
Ta
ble
2lis
tsb
oth
the
pla
ting
co
nd
ition
sa
nd
the
resu
ltsfo
rth
ese
co
up
on
s.
Th
ech
ose
np
latin
gco
nd
ition
sw
ere
su
fficie
nt
toyie
ldco
atin
gth
ickn
esse
sw
ithin
the
ran
ge
ssp
ecifie
dfo
rth
ein
div
idu
al
pa
rts.
Ta
ble
3co
nta
ins
the
thic
kn
ess
sp
ecific
atio
ns.
Ta
ble
3T
hic
kn
ess
sp
ecific
atio
ns
Co
pp
er
Pa
rtM
ate
rial
Co
up
on
Ma
teria
lT
hic
kn
ess
Sp
ec.,
uin
60
61
Alu
min
um
2024A
lum
inu
m30
to100
Allo
y52
ca
rpe
nte
r49
60to
200
Ko
va
rK
ova
r30
to200
Ad
he
sio
n,
vis
ua
la
pp
ea
ran
ce
,so
lde
rab
ility,
an
dth
ickn
esse
sw
ere
me
asu
red
ona
llo
fth
eco
up
on
s.
Ad
he
sio
nw
ase
va
lua
ted
by
scrib
ing
ag
ridon
the
cou
po
ns
with
an
exa
cto
bla
de
.A
pie
ce
of
tap
ew
asth
en
ap
plie
dto
the
are
aa
nd
rap
idly
lifted
off
at
a9
0°
an
gle
.A
ny
lifting
or
pe
elin
go
fth
eco
atin
gw
asca
use
for
reje
ctio
n.
Th
ism
eth
od
issim
ilar
toth
em
eth
od
de
scrib
ed
inA
STM
B5
7l-7
9,
Pa
rag
rap
h.
13
,“S
tan
da
rdT
est
Me
tho
ds
for
Ad
he
sio
no
fM
eta
llicco
atin
gslT
.A
llo
fth
eco
up
on
sp
asse
da
dh
esio
nte
stin
g.
Vis
ua
la
pp
ea
ran
ce
was
exa
min
ed
un
de
ra
mic
rosco
pe
at
6to
10X
.A
ny
evid
en
ce
of
blis
ters
,p
ee
ling
,o
rp
itting
we
reca
use
sfo
rre
jectio
n.
None
of
the
cou
po
ns
dis
pla
ye
dth
ese
un
de
sira
ble
co
nd
ition
s.
So
lde
rab
ilityw
asa
pp
rais
ed
by
follo
win
gth
eg
uid
elin
es
of
AS
TMB
67
8-8
0,
“Sta
nd
ard
Te
st
Me
tho
dfo
rS
old
era
bility
of
Me
tallic
-Co
ate
dP
rod
ucts
”,w
ithth
efo
llow
ing
exce
ptio
n≤;
The
sam
ple
sw
ere
no
ta
ge
da
nd
the
cou
po
ns
we
reh
eld
inth
eso
lde
rp
ot
for
lon
ge
rth
an
the
sp
ecifie
d5
seco
nd
sd
ue
toth
eir
rela
tive
lyla
rge
ma
sses.
Th
esa
mp
les
we
reco
nsid
ere
da
cce
pta
ble
ifth
eso
lde
rco
atin
gw
asa
dh
ere
nt,
brig
ht,
an
du
nifo
rmo
ve
ra
tle
ast
95%o
fth
ete
ste
dsu
rface
.B
oth
the
E-B
rite3
0/3
0a
nd
the
co
pp
er
cya
nid
ep
iece
sw
hic
hw
ere
15
teste
dfu
lfilled
the
req
uire
me
nts
.
Co
atin
gth
ickn
esse
sw
ere
me
asu
red
usin
gX
—R
ayF
luo
resce
nce
on
aT
win
test
XR
F-P
TG
Mo
de
l6
00
0u
tilizin
ga
pp
rop
riate
ca
libra
tion
sta
nd
ard
s.
Th
ism
eth
od
isd
escrib
ed
inA
STM
A754—
79,“S
tan
da
rdT
est
Me
tho
dfo
rC
oa
ting
Th
ickn
ess
by
X—R
ayF
luo
resce
nce
”.T
he
ave
rag
eth
ickn
ess
are
rep
orte
din
Ta
ble
2.
Ta
ble
4p
rovid
es
the
ave
rag
ein
div
idu
al
cou
po
nth
ickn
esse
s.
Ap
pro
xim
ate
ly10
thic
kn
ess
me
asu
rem
en
tsw
ere
exe
cu
ted
one
ach
cou
po
n.
Fro
mth
em
ea
sure
me
nts,
the
E—
Brite
30
/30
seems
tob
ee
xp
erie
ncin
ga
gre
ate
rra
ng
ein
thic
kn
esse
sth
an
the
co
pp
er
cya
nid
eb
ath
.T
his
ap
pe
ars
tob
ea
tra
ito
fth
eE
-Brite
30
/30
ba
th.
C.
Alu
min
um
Pa
rtT
estin
g
Ba
sed
ono
ur
favo
rab
lere
su
ltsw
ithco
up
on
s,
we
pro
ce
ed
ed
toe
va
lua
tea
ctu
al-
60
61
alu
min
um
ribb
on
.T
he
sete
sts
we
rep
erfo
rme
din
the
11lite
rE
-Brite
30
/30
ba
th.
Prio
rto
pla
ting
the
actu
al
pa
rts,
the
11lite
rb
ath
was
an
aly
ze
dfo
rp
H,
co
pp
er
co
nte
nt,
an
de
lectro
lyte
co
nte
nt
tove
rifyth
ea
na
lysis
me
tho
ds
an
de
nsu
reth
ep
rop
er
ch
em
istry
of
the
ba
th.
Th
epH
was
me
asu
red
with
aC
ole
Pa
rme
rM
od
el
59
85
80
ele
ctro
nic
pHm
ete
rw
itha
uto
ma
ticte
mp
era
ture
co
mp
en
sa
tion
.T
he
me
ter
was
ca
libra
ted
with
NIS
Ttra
ce
ab
lesta
nd
ard
sp
rior
tou
se
.T
he
sta
rting
pHo
fth
eb
ath
was
8.5
,a
littlelo
we
rth
an
EP
I’sre
com
me
nd
ed
ran
ge
of
9to
10
.5.
Th
ete
ch
nic
al
litera
ture
no
tes
tha
tth
epH
will
eve
ntu
ally
incre
ase
with
use
into
the
reco
mm
en
de
do
pe
ratin
gra
ng
e.
AP
erk
inE
lme
rM
od
el
6500In
du
ctiv
ely
Co
up
led
Pla
sma
Ato
mic
Em
issio
ns
Sp
ectro
me
ter
(ICP
—A
ES
)m
ea
sure
dth
eco
pp
er
co
nte
nt
of
the
ba
tha
t1
.05
oz/g
al
(7.9
3g
/l).T
he
an
aly
sis
me
tho
dis
de
scrib
ed
inA
pp
en
dix
B.
Atitra
tion
me
tho
dd
ocu
me
nte
din
-th
e-
EP
Ite
ch
nic
al
litera
ture
orn
Ato
mic
-Ab
so
rptio
nS
pe
ctro
sco
py
may
als
obe
use
dto
eva
lua
teth
eco
pp
er
leve
l.T
his
co
pp
er
co
nce
ntra
tion
me
asu
red
was
with
inS
PIT
Sra
ng
eo
f1
.0to
1.5
oz/g
al.
Atitra
tion
was
exe
cu
ted
tom
ea
sure
the
E-B
rite3
0/3
1e
lectro
lyte
co
nce
ntra
tion
.A
pp
en
dix
Bco
nta
ins
ad
escrip
tion
of
this
tech
niq
ue
.4
2.2
%b
yvo
lum
ee
lectro
lyte
was
me
asu
red
.A
cco
rdin
gto
the
da
tain
the
EP
Ite
ch
nic
al
litera
ture
,p
rese
nte
dg
rap
hic
ally
inF
igu
re8
,th
eco
rresp
on
din
gm
inim
um
%e
lectro
lyte
exp
ecte
dfo
ra
co
pp
er
co
nce
ntra
tion
of
1.0
5o
z./g
al
(7.9
3g
/l)is
42
.4%
.W
ed
idn
ot
co
rrect
for
the
0.2%d
efic
itp
rior
top
latin
go
ur
pa
rts.
At
this
time
we
did
no
tte
st
for
me
tallic
co
nta
min
an
tssin
ce
16
Ta
ble
4:C
om
pa
rison
of
Copper
Co
atin
gT
hickn
esse
s
CouponBath
Sampl.e
ThicknessM
aterialType
No.M
eanStd
Dc’!M
inimum
Maxim
umRange
Carpenter
49E—
BMte
30/301
10714
90123
33S
OO
miB
eaker2
1074
103114
113
998
84108
244
11410
100134
345
1248
110141
31
Carpenter
49Copper
Cyanide1
8910
75105
3011
LiterBath
276
S69
8516
380
672
9119
491
583
10219
583
1165
10136
va’siW~
‘~,4
~4~
~OS
~‘,4
~v~
ç
KovarE—
Brite30/30
197
589
10314
SO
Om
iBeaker
2116
1098
13840
3105
889
11728
4122
16107
15346
5118
10106
13630
KovarCopper
Cyanide1
1557
143168
2511
Lite
rBath
2156
15143
19249
3165
15140
19151
4153
6139
16122
5128
8111
13625
r2024
E—Brite
30/301
655
5672
16A
luminum
11Liter
Bath2
617
5070
203
9016
76131
554
848
72103
315
6318
4195
546
839
76103
27
2024Copper
Cyanide1
665
6075
15A
luminum
11Liter
Bath2
707
6186
253
718
6489
254
718
6489
255
669
5888
306
706
6585
20~
<~
‘~‘~
~P1f:~~
3U~
ou
rb
ath
was
esse
ntia
llyn
ew
.In
the
futu
rew
ew
illp
rob
ab
lych
eck
for
iron
,n
icke
l,a
nd
zin
cb
yIC
P.
Th
isa
na
lysis
will
be
pe
rform
ed
co
ncu
rren
tlyw
ithth
eco
pp
er
co
nte
nt
ICP
an
aly
sis
.A
cco
rdin
gto
EP
I,m
eta
llica
nd
org
an
icim
pu
rities
wo
uld
req
uire
ad
ditio
na
le
lectro
lyte
(E—B
rite3
0/3
1)
ove
ra
nd
ab
ove
tha
tre
qu
ired
for
the
co
pp
er
co
nce
ntra
tion
.T
his
req
uire
da
dd
ition
al
ele
ctro
lyte
ad
ditio
nca
nbe
de
term
ine
du
tilizin
ga
Hu
llce
ll.
Ou
rfir
st
pla
ting
atte
mp
tin
the
E-B
rite3
0/3
0b
ath
resu
lted
ina
fair
loo
kin
grib
bo
nw
ithg
oo
da
dh
esio
n,
an
dth
eco
rrect
thic
kn
ess
bu
tsom
ed
ark
en
ed
are
as.
The
ba
thw
asm
ain
tain
ed
at
12
0°F
an
dth
ep
arts
we
rep
late
da
ta
cu
rren
td
en
sity
of
ap
pro
xim
ate
ly15
am
pe
res
pe
rsq
ua
refo
ot
(AS
F).
Th
ese
da
rke
ne
da
rea
sw
ere
evid
en
ton
bo
thth
erib
bo
nits
elf
an
dits
11
00
allo
ya
lum
inu
mfix
ture
.
Fig
ure
1d
isp
lays
the
ribb
on
co
iled
onits
fixtu
re.
Th
efix
ture
isa
.03
2in
ch
dia
me
ter
1100a
lum
inu
mro
d.
Fig
ure
9p
rese
nts
the
da
rke
ne
da
rea
son
the
fixtu
rea
to
ptic
al
ma
gn
ifica
tion
leve
ls.
Fig
ure
10p
rovid
es
asca
nn
ing
Ele
ctro
nM
icro
sco
pe
(SE
M).
ph
oto
.A
tth
ish
igh
er
ma
gn
ifica
tion
,th
ed
ark
en
ed
are
as
ap
pe
ar
rou
gh
er
an
dco
nta
ina
co
pp
er
oxid
ew
hile
the
bu
lkp
latin
go
fth
ero
dp
ictu
red
inF
igu
re11
ap
pe
ars
un
iform
.
As
are
su
lto
fth
efin
din
gs,
we
de
cid
ed
top
late
dumm
yfix
ture
sto
iso
late
the
cau
seo
fth
ed
ark
en
ed
are
as.
At
first,
we
su
sp
ecte
dth
at
en
trap
me
nt
of
pla
ting
or
cle
an
ing
so
lutio
ns
at
the
su
rface
ind
uce
db
yin
ad
eq
ua
terin
sin
gw
asth
ecu
lprit.
Su
bse
qu
en
tly,
we
imp
rove
do
ur
rinsin
ga
nd
dry
ing
tech
niq
ue
sw
hic
hp
artia
llye
nh
an
ced
the
ap
pe
ara
nce
of
the
rod
bu
td
idn
ot
alle
via
teth
ep
rob
lem
.N
ext,
we
su
rmis
ed
tha
tin
ad
eq
ua
tee
xcha
ng
eo
fth
eso
lutio
nw
aso
ccu
rring
at
the
su
rface
of
the
pa
rts.
As
are
su
ltw
eb
ub
ble
db
ottle
dw
eld
ing
gra
de
nitro
ge
nth
rou
gh
the
ba
th.
Th
ise
limin
ate
d-th
ed
ark
en
ed
are
as.
Afte
rth
esu
cce
ss
of
ou
rfix
ture
pla
ting
exp
erim
en
t,w
ep
late
do
ne
he
at
trea
tb
atc
ho
fth
erib
bo
n.
Th
isco
rresp
on
ds
to3
gro
up
so
ffiv
ero
ds
ea
cho
ra
pp
roxim
ate
ly150
to180
finis
h~
da
sse
mb
lies.
One
gro
up
isp
late
da
ta
time
,so
we
esse
ntia
llyp
erfo
rme
dth
ree
run
s.
We
ma
inta
ine
da
llo
fo
ur
cu
rren
tsu
rface
cle
an
ing
an
dp
rep
ara
tion
op
era
tion
so
nly
alte
ring
the
actu
al
pla
ting
ba
thin
wh
ich
the
pa
rtsa
rep
late
d.
Ta
ble
5p
rese
nts
the
pla
ting
co
nd
ition
sa
nd
the
resu
ltsfo
re
ach
gro
up
of
ribb
on
.
When
exa
min
ed
at
ap
pro
xim
ate
lylo
x,
no
ne
of
the
pa
rtsd
isp
laye
da
ny
evid
en
ce
of
blis
ters
,p
ee
ling
,o
rp
itting
.N
osig
ns
of
damage
toth
ea
lum
inu
mrib
bo
nw
ere
ob
se
rve
d.
Th
ea
dh
esio
nw
ase
va
lua
ted
ono
ne
sam
ple
from
ea
chg
rou
p.
A
18
Fig
ure
8E
-Brite
30
/31
Mm
..%
Re
qu
ired
for
Co
pp
er
Le
ve
l
Copper
Level,g
ram
s/liter
7.508.25
9.009.75
10.5011.25
100
19
0
LU80
—.—
--—
——
1’
10
601.001.50
2.002.50
-C
op
pe
rLe
vel,
ou
nce
s/ga
llon
19
Fig
ure
~D
ark
en
ed
Are
as
on
E—
Brite
30
/30
Co
op
er
Pla
ting
on
Alu
min
um
1100R
od
a.
9.6
z
b.
25
.6X
20
Fig
ure
10D
ark
en
ed
Are
as
on
E—
Brite
30
/30
Co
op
er
Pla
ting
on
Alu
min
um
11
00
Ro
d
a.
44
8X
b.
59
30
X
21
TABLE 5: RESULTS OF 6061 ALUMINUM RIBBON PLATING IN EBRITE 30/30 COPPER BATH
PLATING PARAMETERS PLATING RESULTSCurrent! Current Average
Sample Group Density Time Visual ThicknessGroup Area, sq ft m/a ASF Mm, Adhesion Appearance uin
A 0.027 320 12 5.8 pass pass 675 rods (.0051 per
flex lead)
5 0.027 320 12 6.3 pass pass 79S rods (.0051 per
flexlead)
C 0.027 320 12 5.8 pass pass 64S rods (.0051 per
flex lead)
Test Methods
Adhesion — A piece of masking tape was applied to a sample of aluminum ribbon from each group. Usingtweezers, the ribbon was rapidly removed. The plating was examined for lifting.
Visual Appearance — Every rod of ribbon was examined under a microscope at approximately lOX. Anyevidence of peeling, blisters, or pitting were noted.
Thickness — Thicknesses were measured on all rods using X—Ray Fluorescence on a Twintest XRF—PTGutilizing calibration standards.
TA
BL
E6
:C
OP
PE
RP
LA
TIN
GT
HIC
KN
ES
SE
SO
N6
06
1
AL
UM
INU
MR
IBB
ON
-E
-BR
ITE
30
/30
BA
TH
E-B
rite3
0/3
0B
athT
emperature
=120
FC
urrentper
Group
=320
millia
mp
ere
sC
urrentD
ensity=
12ASF
PLATING
THIC
KNESS
RESU
LTSG
roupID
Thickness,
uinP
latingS
ample
Reading
Reading
Overall
for
Group
Tim
eNo.
12
A1
8266
Average
Thickness
672
6566
Standard
Deviation
12.85.8
mm
.3
5483
Minim
um49
456
85M
aximum
855
6649
Range
37
B1
6393
Average
Thickness
792
9656
Standard
Deviation
16.46.3
mm
.3
9478
Minim
um53
481
87M
aximum
965
9353
Range
43
C1
6878
Average
Thickness
642
7873
Standard
Deviation
12.65.8
mm
.3
5842
Minim
um42
452
59M
aximum
785
7858
Range
36
Thickness
—T
hicknessesw
erem
easuredusing
X—Ray
Fluorescence
ona
Tw
inte
stXRF—
PTGu
tilizing
calib
ratio
nstandards.
TA
BL
E]:
CO
PP
ER
PLA
TIN
GT
HIC
KN
ES
SE
SO
N6
06
1A
LUM
INU
MR
IBB
ON
-C
OP
PE
RC
YA
NID
EB
AT
H
PLATING
THIC
KNESS
RESULTST
hickness,uin
LotID
Sam
pleR
eadingR
eadingO
verallfo
rG
roupNo.
12
9L7U1
8677
Average
Thickness
702
6180
Standard
Deviation
9.53
7466
Minim
um53
466
69M
aximum
865
6553
Range
32
9L7V1
6262
Average
Thickness
632
6959
Standard
Deviation
4.73
6060
Minim
um55
466
68M
aximum
695
6755
Range
14
9L7X1
7269
Average
Thickness
682
7466
Standard
Deviation
11.3
368
75M
inimum
404
8374
Maxim
um83
540
64R
ange43
Thickness
—T
hicknessesw
erem
easuredusing
X—Ray
Fluorescence
ona
Tw
inte
stXRF—
PTGu
tilizing
calib
ratio
nstandards.
pie
ce
of
ribb
on
was
pla
ce
don
some
ma
skin
gta
pe
.It
was
the
nre
mo
ved
rap
idly
.N
oliftin
go
fth
ep
latin
gw
aso
bse
rve
d.
The
thic
kn
esse
sw
ere
me
asu
red
by
X—
Ray
Flu
ore
sce
nce
.Tw
om
ea
sure
me
nts
we
rea
cq
uire
dp
er
alu
min
um
ribb
on
.T
ab
le6
co
nta
ins
the
thic
kn
ess
me
asu
rem
en
ts.S
ome
rece
nt
pro
du
ctio
nd
ata
from
the
co
pp
er
cya
nid
eb
ath
isin
clu
de
din
Ta
ble
7fo
rco
mp
aris
on
pu
rpo
se
s.
The
alu
min
um
ribb
on
like
the
cou
po
ns
exp
erie
nce
da
gre
ate
rva
riab
ilityin
thic
kn
esse
sin
the
EB
rite3
0/3
0b
ath
tha
nth
eco
pp
er
cya
nid
eb
ath
.
Asa
mp
leo
frib
bo
nfro
mo
ne
rod
of
ea
chg
rou
pw
ase
xam
ine
db
yS
EM
.F
igu
re12
dis
pla
ys
alo
wm
ag
nific
atio
nvie
w,
5.4
X,
of
the
E—
Brite
30
/30
ribb
on
.F
igu
res
13th
rou
gh
15p
rese
nt
SEMp
ho
tog
rap
hs
of
are
pre
se
nta
tive
are
ao
fsu
rface
from
ea
cho
fth
esa
mp
les.
Fig
ure
16p
rovid
es
aco
mp
aris
on
with
aco
pp
er
cya
nid
ep
late
drib
bo
n.
Bo
thth
eE
-Brite
30
/30
an
dth
eco
pp
er
cya
nid
eco
atin
gs
dis
pla
ye
dsom
ep
inh
ole
de
fects
at
ma
gn
ifica
tion
so
fa
pp
roxim
ate
ly5000
to6
00
0X
.T
he
EB
rite3
0/3
0a
pp
ea
red
tod
isp
lay
aslig
htly
larg
er
nu
mb
er
of
the
se
de
fects
inth
ea
rea
se
xa
min
ed
.
One
rod
from
ea
chg
rou
pw
asfa
bric
ate
din
tofle
xle
ad
asse
mb
lies.
See
Fig
ure
3fo
rth
ea
ssem
bly
co
nfig
ura
tion
.T
he
sero
ds
exp
erie
nce
dth
efu
llm
an
ufa
ctu
ring
pro
ce
ss.
Firs
t,th
ey
we
recu
tto
siz
ea
nd
so
lde
red
tob
ery
llium
co
pp
er
clip
su
tilizin
gan
R}~IAF
lux,
ALP
HA
61
1.
No
diffic
ultie
sw
ere
exp
erie
nce
din
this
ste
p.
Ato
tal
of
36a
sse
mb
lies,
12fro
me
ach
rod
we
rep
rod
uce
d.
Ne
xt,
the
exp
ose
dco
pp
er
co
atin
gw
ase
lectro
lytic
ally
strip
pe
din
ach
roi~
ica
cid
so
lutio
n.
Su
bse
qu
en
tly,
the
exce
ss
ribb
on
onth
ea
sse
mb
lye
xp
erie
nce
da
pu
llte
st
toe
nsu
reth
eb
on
dstre
ng
tho
fth
eso
lde
rjo
int.
All
of
the
sam
ple
ssu
rviv
ed
this
test.
Fin
ally
,th
ea
sse
mb
lies
we
rein
sp
ecte
da
ta
ma
gn
ifica
tion
of
SXfo
rco
pp
er
rem
ova
l,rib
bo
nsu
rface
co
nd
ition
;a
nd
ap
pe
ara
nce
of
so
lde
rjo
ints
.T
hirte
en
of
the
asse
mb
lies
we
rere
jecte
dfo
rin
su
fficie
nt
co
pp
er
rem
ova
l.T
he
seth
irtee
na
sse
mb
lies
the
ne
xp
erie
nce
da
seco
nd
strip
pin
go
pe
ratio
nto
rem
ove
all
of
the
co
pp
er.
Th
isco
rresp
on
ds
toa
pp
roxim
ate
ly26
to40
seco
nd
sto
tal
com
bin
ed
time
for
bo
thth
efir
st
an
dse
con
dstrip
pin
go
pe
ratio
n.
Ou
rcu
rren
tp
roce
ss
allo
ws
for
do
ub
lestrip
pin
gi.e
.,26
seco
nd
s-to
tal
with
inth
estrip
pin
gso
lutio
n.
All
of
the
se
asse
mb
lies
pa
ssed
ase
con
din
sp
ectio
n.
Ne
xt,
the
co
mp
lete
da
sse
mb
lies
we
ree
xam
ine
db
yS
EM
.P
artià
ula
ra
tten
tion
was
pa
idto
the
alu
min
um
ribb
on
.F
igu
res
17th
rou
gh
19d
isp
lay
the
alu
min
um
ribb
on
from
anE
Brite
30
/30
strip
pe
da
sse
mb
ly,
anE
—B
rite3
0/3
0d
ou
ble
strip
pe
da
sse
mb
ly,
an
da
co
pp
er
cya
nid
estrip
pe
da
sse
mb
ly.
All
of
the
se
ribb
on
se
xh
ibit
gra
inb
ou
nd
ary
etc
hin
g.
26
Fig
ure
13E
—B
rite3
0/3
0C
op
pe
rC
oa
ting
on
6062.A
lum
inu
mR
ibb
on
-
a.
42
5X
b.
53
00
X
Gro
up
A
27
Fig
ure
15
E—
Brite
30
/30
Co
pp
er
Co
atin
go
n6
06
1A
lum
inu
mR
ibb
on
-
a.
44
3X
b.
53
b0
X
Gro
up
C
29
Fig
ure
176
06
1A
lum
inu
mR
ibb
on
inE
-Brite
30
/30
Asse
mb
ly-
Afte
r3.
Strip
pin
gC
ycle
of
13S
eco
nd
s
a.
47
5X
b.
53
30
X
31
Fig
ure
18
60
61
Alu
nzjn
t,.jnR
ibb
on
inE
—B
rite3
0/3
0A
sse
mb
ly—
Afte
r2
Strip
pin
gC
ycle
sfro
m2
6to
40S
eco
nd
sT
ota
l
a.
443X
b.
5900X
32
Fig
ure
196
06
1A
lum
inu
mR
ibb
on
inco
pp
er
Cya
nid
eA
ssem
bly
-
Afte
ra
Strip
pin
gC
ycle
of
13to
26se
con
ds
a.4
43
X
b.
58
90
X
33
Th
eco
mp
lete
da
sse
mb
lies
we
reth
en
su
bm
itted
totw
oa
dd
ition
al
qu
alific
atio
nte
sts
,e
lectric
al
testin
ga
nd
so
lve
nt
cle
an
ing
testin
g.
Th
ee
lectric
al
testin
gin
vo
lve
dste
ad
ilyin
cre
asin
gth
ecu
rren
tth
rou
gh
the
flexle
ad
asse
mb
lies
un
tilfa
ilure
.T
hre
efie
xle
ad
sfro
me
ach
gro
up
we
reim
me
rsed
ina
bro
mo
trifluo
reth
yle
ne
da
mp
ing
fluid
.A
800h
ertz
cu
rren
tsta
rting
at
1a
mp
ere
was
ap
plie
dfo
r10
min
ute
s.
Th
ecu
rren
tw
asin
cre
ase
din
incre
me
nts
of
.25
am
pe
res
an
dre
pe
ate
du
ntil
3a
mp
ere
sw
asre
ach
ed
.N
ofu
sin
go
fa
ny
of
the
flexle
ad
asse
mb
lies
was
ob
se
rve
d.
Th
ecu
rren
tw
asth
en
slo
wly
incre
ase
du
ntil
fusin
gw
aso
bse
rve
d.
Th
efle
xle
ad
sfro
ma
llo
fth
eg
rou
ps
exp
erie
nce
dfu
sin
ga
t3
.5a
mp
ere
so
ra
bo
ve
.T
he
E—
Brite
30
/30
flexle
ad
asse
mb
lies,
reg
ard
less
of
strip
pin
gtim
e,
de
mo
nstra
ted
eq
uiv
ale
nt
cu
rren
tca
rryin
gp
rop
ertie
sto
the
co
pp
er
cya
nid
ea
sse
mb
lies.
Th
ere
fore
,th
eE
—B
ritep
latin
gp
roce
ss
pro
du
ce
dn
on
eg
ativ
ee
lectric
al
pro
pe
rtye
ffects
.
Th
eso
lve
nt
cle
an
ing
test
was
pe
rform
ed
ina
Cre
st
14
10
ultra
so
nic
de
gre
ase
ra
ta
po
we
ro
f75
±5
wa
ttsfo
ro
ne
min
ute
infre
on
11
3.
Th
isis
the
mo
sta
gg
ressiv
ecle
an
ing
tha
tth
efle
xle
ad
asse
mb
lies
wo
uld
en
co
un
ter
ino
ur
pro
du
ctio
nlin
e.
All
of
the
asse
mb
lies
en
du
red
the
cle
an
ing
pro
ce
ss
with
no
vis
ua
ldam
agea
tlO
X.
All
of
the
co
mp
reh
en
siv
ete
stin
go
fth
eE
—B
rite3
0/3
0co
pp
er
pla
ting
pro
ce
ss
onth
ezin
ca
ted
alu
min
um
flexle
ad
sh
as
pro
du
ce
dp
ositiv
ere
su
lts.
Th
eE
-Brite
30
/30
co
pp
er
pla
ting
pro
ce
ss
ha
sm
et
ou
rp
rima
ryre
qu
irem
en
tso
fg
oo
da
dh
esio
n,
acce
pta
ble
ap
pe
ara
nce
s,
an
dso
lde
rab
ility.
Som
ed
ifficu
lties
instrip
pin
gth
ed
ep
osit
we
ree
nco
un
tere
d.
Ho
we
ver,
the
se
strip
pin
gp
rob
lem
sa
ren
ot
un
usu
al.
Th
ey
occu
rp
erio
dic
ally
with
the
cu
rren
tco
pp
er
cya
nid
ep
roce
ss.
Ou
rp
rima
ryco
nce
rnw
ithstrip
pin
gth
ea
sse
mb
lyfo
rlo
ng
er
pe
riod
so
ftim
ein
vo
lve
sn
ot
the
flexle
ad
bu
tth
eb
ery
llium
co
pp
er
clip
sto
wh
ich
the
ya
reso
lde
red
.T
he
seclip
sa
rea
ttacke
dd
urin
gth
estrip
pin
gp
roce
ss.
To
oe
xte
nsiv
ea
du
ratio
nin
the
strip
pin
gso
lutio
nca
na
lter
the
dim
en
sio
ns
of
the
clip
sre
nd
erin
gth
ee
ntire
asse
mb
lyw
orth
less.
~K
ova
rP
art
Te
stin
g
Ou
rm
ajo
rte
ch
nic
al
req
uire
me
nts
for
the
Ko
va
rfe
ed
thru
sa
refo
rg
oo
da
dh
esio
no
fth
eco
atin
ga
nd
co
mp
atib
ilityo
fth
ep
latin
gso
lutio
ns
with
the
gla
ss
an
dg
lass
tom
eta
lse
als
.P
ho
tog
rap
hs
of
the
se
pa
rtsa
rep
rese
nte
din
Fig
ure
20
.T
he
sep
arts
are
use
dto
se
al
ana
rea
ino
ur
gyro
.E
lectric
al
lea
ds.
are
con
veye
dth
rou
gh
the
ho
les
inth
ep
ins
onth
isfe
ed
thru
he
ad
er.
Th
ele
ad
sa
reth
en
so
lde
red
into
34
pla
ce
an
dan
airtig
ht
se
al
isfo
rme
d.
Th
ep
ins
are
Ko
va
r,a
nic
ke
l—iro
n-c
ob
alt
gla
ss
se
alin
ga
lloy.
Th
ein
terio
rsu
rface
of
the
pin
isso
lde
rco
ate
dto
pro
mo
teg
oo
dse
alin
gp
rop
ertie
s.
-To
ach
ieve
this
so
lde
rco
atin
g,
we
ba
rrel
ele
ctro
pla
teth
ep
arts
inco
pp
er
cya
nid
eto
pro
vid
eg
oo
da
dh
esio
nfo
ra
su
bse
qu
en
tso
lde
re
lectro
pla
ting
pro
ce
ss.
The
orig
ina
lco
pp
er
pla
ted
Ko
va
rco
up
on
sth
at
we
pro
du
ce
dd
em
on
stra
ted
go
od
ad
he
sio
n.
We
ha
veno
rea
so
nn
ot
toe
xp
ect
the
actu
al
pa
rtsto
exh
ibit
the
same
qu
alitie
s.
As
me
ntio
ne
da
bo
veth
eco
pp
er
pla
ting
ste
pis
follo
we
db
yim
me
dia
tep
latin
gin
a6
0/4
0tin
lea
dso
lde
rb
ath
.T
his
ba
this
fluo
bo
rate
ba
sed
an
dh
as
ah
igh
tole
ran
ce
for
co
pp
er,
iron
an
dn
icke
lco
nta
min
atio
n.
No
pro
ble
ms
with
the
E-B
rite3
0/3
0co
atin
ga
rea
ntic
ipa
ted
with
this
so
lde
rb
ath
.
Th
eK
ova
rp
arts
are
cu
rren
tlyp
late
din
ab
arre
lfo
r65
min
ute
sin
the
co
pp
er
cya
nid
e.
Bo
thtim
eco
nstra
ints
an
dth
ed
esire
toke
ep
ou
rE
-Brite
ba
thcya
nid
efre
elim
ited
ou
ra
bility
toa
ttem
pt
tod
eve
lop
the
actu
al
ba
rrel
pla
ting
pro
ce
ss.
Cya
nid
ep
ois
on
sth
eE
-Brite
30
/30
ba
th.
We
on
lyp
osse
ss
on
ep
latin
gb
arre
lw
hic
his
use
dfo
rp
rod
uctio
n.
De
stro
yin
gth
ecya
nid
eis
qu
itea
len
gth
yp
roce
ss.
Itw
ou
ldre
qu
ireco
mp
lete
lyw
ash
ing
the
ba
rrel
with
sod
ium
hyp
och
lorite
the
nso
akin
git
ina
tan
ko
f2%
sod
ium
hyp
och
lorite
for
am
inim
um
of
24h
ou
rs.
Ne
xt,
wa
ter
rinsin
gfo
llow
ed
by
a2%
su
lfuric
acid
rinse
,fo
llow
ed
by
aw
ate
rrin
se
su
cce
ed
ed
by
an
oth
er
wa
ter
rinse
,a
5%p
ota
ssiu
mh
yd
roxid
erin
se
an
dm
ore
wa
ter
rinsin
gw
ou
ldb
en
ece
ssa
ry.
Inlig
ht
of
the
se
co
nsid
era
tion
s,
we
de
cid
ed
toh
an
dp
late
asm
all
qu
an
tityo
fth
ese
pa
rtsin
the
E-B
rite3
0/3
0b
ath
.
Tw
en
tyfe
ed
thru
he
ad
ers
an
dsom
ep
latin
gb
alls
we
rep
late
din
the
E-B
rite3
0/3
0b
ath
at
12
0°F
±5
°Fa
nd
1.5
am
pe
resfo
rth
irtym
inu
tes.
Hand
ag
itatio
no
fth
ep
arts
an
db
alls
inth
eir
me
tal
ba
ske
tw
asp
rovid
ed
.B
ottle
dn
itrog
en
was
bu
bb
led
thro
ug
hth
e-b
ath
;T
his
-was
no
ta
sim
ula
tion
of
the
ba
rrel
pro
ce
ss
bu
tan
atte
mp
tto
de
term
ine
the
co
rrosiv
ityo
fth
eso
lutio
nw
ithre
sp
ect
toth
eg
lass
an
dth
eg
lass
tom
eta
lse
als
.
Afte
rp
latin
g,
the
thic
kn
esse
so
fth
ed
ep
osits
onth
ep
ins
an
do
ute
rd
iam
ete
rw
ere
me
asu
red
by
X—
Ray
Flu
ore
sce
nce
.W
ere
qu
ire30
to200
mic
roin
ch
es
on
the
pin
s.
On
ly8
mic
roin
ch
es
we
red
ep
osite
don
the
pin
sw
hile
ap
pro
xim
ate
ly80
mic
roin
ch
es
we
red
ep
osite
do
nth
eo
ute
rd
iam
ete
r.T
he
vis
ua
la
pp
ea
ran
ce
an
da
dh
esio
no
fth
ed
ep
osit
we
ree
xce
llen
t.N
ext
toe
nsu
reth
ein
teg
rityo
fth
eg
lass
an
dth
eg
lass
tom
eta
lse
als
,w
eh
eliu
mle
ak
ch
ecke
dth
ed
evic
e.
Th
eh
ole
sin
the
pin
sw
ere
se
ale
dw
itha
ne
po
xy.
Th
ep
arts
35
we
reth
en
mo
un
ted
ina
sp
ecia
llyd
esig
ne
dfix
ture
on
toa
he
lium
lea
kd
ete
cto
r.N
ole
aks
ine
xce
ss
of
1xl0
3cc
He
lium
/se
c/a
tma
tro
om
tem
pe
ratu
rew
ere
de
tecte
d.
No
damage
toth
eg
lass
or
gla
ss
tom
eta
lse
als
ha
do
ccu
rred
du
ring
ou
rp
latin
gp
roce
ss.
All
of
the
resu
ltsfro
mo
ur
limite
dp
latin
gte
sts
with
Ko
va
ra
nd
the
E-B
rite3
0/3
0co
pp
er
ba
tha
refa
vo
rab
le.
Th
ed
ep
osit
dis
pla
ys
go
od
ad
he
sio
n.
Th
ein
teg
rityo
fth
eg
lass
an
dg
lass
tom
eta
lse
als
rem
ain
su
nd
am
ag
ed
afte
rco
mp
letio
no
fth
isp
roce
ss.
E.
Allo
y52
Pa
rtT
estin
g
Cu
rren
tly,
the
pla
ting
of
this
fee
dth
ruh
ea
de
ris
be
ing
pe
rform
ed
at
ou
rsu
pp
liers
.T
his
su
pp
lier
pla
tes
the
Allo
y52
pin
so
nth
eh
ea
de
rp
ictu
red
inF
igu
re21
with
nic
ke
lp
rior
toso
lde
rp
latin
gth
em
.In
the
eve
nt
tha
tth
isp
roce
ss
ne
ed
ed
tob
ep
erfo
rme
don
site
,w
ea
reco
nfid
en
tfro
mo
ur
exp
erie
nce
with
pla
ting
the
Ca
rpe
nte
r49
cou
po
ns
an
dth
eK
ova
rg
lass
co
mp
atib
ilityte
sts
tha
tth
eE
-Brite
30
/30
Co
pp
er
co
uld
su
cce
ssfu
llyb
ea
pp
lied
wh
ilem
ain
tain
ing
bo
thg
oo
da
dh
esio
na
nd
the
inte
grity
of
ou
rg
lass
tom
eta
lse
als
.
V.
TO
XIC
SU
SE
RE
DU
CT
ION
AS
SE
SS
ME
NT
Th
isp
roje
ct
de
mo
nstra
tes
tha
tit
iste
ch
nic
ally
fea
sib
leto
co
pp
er
ele
ctro
pla
tea
va
riety
of
de
lica
tep
arts
with
ou
tth
en
ee
dfo
rcya
nid
e—
ba
sed
ele
ctro
pla
ting
so
lutio
ns.
Th
ere
pla
ce
me
nt
of
the
cya
nid
e-b
ase
de
lectro
pla
ting
ba
thw
ithth
eE
-Brite
30
/30
ba
thw
ou
ldre
du
ce
he
alth
an
de
nviro
nm
en
tal
risks.
Th
eco
mp
ositio
no
fth
eE
—B
riteb
ath
ise
sse
ntia
llyn
on
-h
aza
rdo
us
alth
ou
gh
sta
nd
ard
pre
ca
utio
ns
an
dp
rote
ctiv
ee
qu
ipm
en
ta
sa
reg
en
era
llyu
sed
ina
me
tal
finis
hin
go
pe
ratio
nsh
ou
ldb
ee
mp
loye
d.
Ho
we
ver,
the
sp
ecia
lp
reca
utio
ns
an
de
qu
ipm
en
tth
at
are
ne
ce
ssa
ryw
ork
ing
with
cya
nid
es
are
nolo
ng
er
ne
ed
ed
.T
hu
sa
ntid
ote
kits
,d
eco
nta
min
atio
nso
lutio
ns
an
dp
re—
arra
ng
em
en
tsw
ithth
elo
ca
lh
osp
ital
are
nolo
ng
er
req
uire
d.
Th
ep
rote
ctio
no
fw
ork
ers
from
accid
en
tal
exp
osu
reto
hig
hly
toxic
cya
nid
es
will
beo
ne
of
the
gre
ate
st
be
ne
fitsto
co
nve
rting
toth
eE
—B
ritep
roce
ss.
Ina
dd
ition
toth
ee
limin
atio
no
fcya
nid
es
from
the
wo
rkp
lace
the
follo
win
gb
en
efits
will
als
ob
ere
aliz
ed
:
38
•B
y—p
rod
uct
ge
ne
ratio
nin
the
form
of
co
nce
ntra
ted
so
lutio
ns,
rinse
wa
ters
an
da
ire
mis
sio
no
fcya
nid
es
are
co
mp
lete
lye
limin
ate
d.
•T
rea
tme
nt
of
the
E—
Brite
rinse
wa
ters
req
uire
so
nly
pHa
dju
stm
en
ta
nd
pre
cip
itatio
n.
Itco
nta
ins
noch
ela
ting
ag
en
ts.
Th
ise
limin
ate
sth
en
ee
dfo
rth
etw
o-s
tep
cya
nid
ed
estru
ctio
np
roce
ss
with
hyp
och
lorite
.
Th
eo
pe
ratio
na
llife
of
the
E-B
riteb
ath
ise
stim
ate
dto
be
the
same
as
acya
nid
eb
ath
.T
he
3-
Brite
ba
thca
nb
em
ain
tain
ed
with
ele
ctro
lyte
an
d•
co
pp
er
ad
ditio
ns.
••
Exis
ting
we
tted
eq
uip
me
nt
can
be
reu
se
dif
de
co
nta
min
ate
dto
rem
ove
all
trace
so
fcya
nid
e.
(Due
toth
esm
all
siz
eo
fo
ur
op
era
tion
s,
we
inte
nd
tore
pla
ce
ou
re
xis
ting
eq
uip
me
nt).
Fro
ma
toxic
su
sere
du
ctio
nsta
nd
po
int,
we
fou
nd
nore
aso
nn
ot
toco
nve
rto
ur
exis
ting
cyan
ide
—b
ase
dp
roce
ss.
VI.
EC
ON
OM
ICA
SS
ES
SM
EN
T
To
asse
ss
the
eco
no
mic
fea
sib
ilityo
fth
eco
nve
rsio
np
roce
ss,
we
eva
lua
ted
the
diffe
ren
ce
sb
etw
ee
nth
etw
om
eth
od
sfo
ra
lum
inu
mp
latin
ga
nd
de
term
ine
de
ithe
rth
ee
xpe
nse
co
sts
or
lab
or
ho
urs
invo
lve
d.
We
fou
nd
tha
tw
eco
uld
rea
lize
sa
vin
gin
dire
ct
exp
en
se
s,
alth
ou
gh
ad
ditio
na
lla
bo
rh
ou
rsw
ere
req
uire
dto
utiliz
eth
enew
pro
ce
ss.
Itsh
ou
ldb
en
ote
dth
at
as
are
su
lto
fth
esm
all
siz
eo
fo
ur
op
era
tion
s,
the
ab
so
lute
co
st
diffe
ren
ce
sa
ren
ot
as
imp
orta
nt
as
the
ym
igh
tbe
ina
larg
esca
lep
latin
go
pe
ratio
n.
Asu
mm
ary
of
the
ad
ditio
na
lco
sts
an
dsa
vin
gs
isp
rese
nte
din
Ta
ble
8.
Fu
rthe
rb
rea
kdo
wn
of
the
co
sts
isp
rese
nte
din
Ta
ble
9.
Th
esig
nific
an
tfa
cto
rsa
ffectin
gth
ee
co
no
mic
so
fth
eco
nve
rsio
na
re:
Ha
zard
ou
sw
aste
dis
po
sa
l
La
bo
rre
du
ctio
ns
from
red
uce
db
ath
an
aly
sis
prim
arily
for
ca
rbo
na
tes
an
dR
och
elle
sa
lts.
Incre
ase
dla
bo
rfo
ra
lum
inu
me
lectro
pla
ting
resu
lting
from
the
slo
we
rp
latin
gsp
ee
do
fth
e3
-B
rite3
0/3
0p
roce
ss.
39
Wh
ileth
ela
tter
facto
ris
the
mo
stsig
nific
an
tin
ou
rp
roce
ss,
itm
aybe
less
sofo
rp
arts
req
uirin
gth
icke
rd
ep
osits
sin
ce
ad
ditio
na
lw
ork
co
uld
be
pe
rform
ed
.In
ou
ra
lum
inu
mo
pe
ratio
ns
we
fou
nd
the
incre
ase
from
on
em
inu
te(c
ya
nid
eb
ath
)to
six
min
ute
s(E
—B
rite)
was
too
sh
ort
top
erfo
rmo
the
ra
ctiv
ities.
It
rem
ain
so
ur
inte
ntio
nto
co
nve
rtto
the
no
n—
cyan
ide
ba
sed
pro
ce
ss
for
the
wo
rkp
lace
sa
fety
rea
so
ns
dis
cu
sse
dp
revio
usly
eve
nth
ou
gh
the
co
sts
of
this
co
nve
rsio
nin
dic
ate
noo
ve
rall
sa
vin
gs
at
ou
rla
bo
rra
tes.
Ta
ble
8A
dd
ition
al
Co
sts
/Sa
vin
gs
of
E—
Erite
30
/30
Pro
ce
ss
An
nu
al
sa
vin
gs
Dire
ct
Exp
en
ses
(Ad
ditio
na
lC
osts
)
Pla
ting
Ba
th$
50W
aste
Dis
po
sa
l570
Cya
nid
eA
ntid
ote
Kits
200F
iltratio
nS
up
plie
s(5
0)
Nitro
ge
n(N
ote
1)(4
5)
Ne
tS
avin
gs
$7
25
/yr.
LAB
OR
Ele
ctro
pla
ting
Alu
min
um
(No
te2)
$(3
74
8)
An
aly
tica
l2397
Ne
tA
dd
ition
al
Co
st
$(l3
5l/y
r)
To
tal
Ad
ditio
na
lC
ost
$(6
26
/yr)
NO
TE
S:
1.
Nitro
ge
nw
asus~ed
inlie
uo
fd
lea
nd
rya
ir.In
sta
llatio
no
fa
co
ale
scin
gfilte
ron
aco
mp
resse
da
irso
urc
ew
ou
ldre
du
ce
co
sts
.
2.
Ad
ditio
na
le
lectro
pla
ting
lab
or
for
the
alu
min
um
pa
rtsb
ase
don
sh
ort
(6m
inu
te)
cycle
wh
ich
pre
clu
de
sco
ncu
rren
ta
ctiv
ity.
40
Ta
ble
9E
con
om
icC
om
pa
rison
of
Co
pp
er
Cya
nid
eB
ath
toE
—E
rite3
0/3
0
Ba
thM
ake—U
p-
Ch
em
ica
lsfo
ran
11lite
rB
ath
Co
pp
er
Cya
nid
eE
-Brite
30
/30
462gins
CuC
N@
$9
7/kg
5.5
liters
E—
Brite
30
/30
@$
11
/i5
50
ginsN
aCN
@$
55
/kg
De
ion
ize
Wa
ter
toM
akeU
p330
ginsN
a2CO
3@
$3
8/k
g660
gutsR
och
elle
Sa
lts@
$3
3/k
gD
eio
niz
ed
Wa
ter
toM
akeU
p
To
tal
Co
st
=$
11
0T
ota
lC
ost
=$61
Ba
thA
na
lysis
Fre
cTu
en
cya
nd
Ap
pro
xim
ate
Ho
urs
pH
,e
ve
rylo
t,.2
5h
rspH
,d
aily
when
inu
se
,.2
5h
rsF
ree
crc,e
ve
rylo
t,.5h
rsC
u,F
e,N
i,Zn
,m
on
thly
,1
hr
Cu,
mo
nth
ly,
1h
rE
-Brite
30
/31
,m
on
thly
,1
hr
Ca
rbo
na
tes,
qu
arte
rly,
4h
rsR
och
elle
Sa
lts,
qu
arte
rly,
4h
rs
Dis
po
sa
lC
ost
of
Dra
go
ut
Rin
se
&C
on
ce
ntra
te-
55G
al.
Drum
$6
90
$120
41
HP
!E
lectm
che
mica
lP,”o
du
cts,In
c17000
LincolnA
venueN
ewB
erlin,W
I53151-2781(414)
786-0330FA
X(414)
786-9403
No
n—
Cya
nid
eA
lka
line
Co
pp
er
Pla
ting
E—
Brite
30
/30
E—
Brite
30
/30
pla
tes
dire
ctly
onste
el,
bra
ss,sta
inle
ssste
el,
zinca
ted
aluminum
andm
osth
igh
qu
ality
pro
pe
rl:prepared
zinc
die
castin
gs
inb
oth
rack
andb
arre
lin
sta
llatio
ns.
Leada
lloys
canbe
pla
ted
inra
cklin
es.
Ite
limin
ate
sth
en
ece
ssityo
fstrik
ing
incyanide
copper.E
—B
rite3
0/3
0e
limin
ate
sp
ote
ntia
lh
ea
lthand
en
viron
me
nta
llia
bility
andthe
hig
hco
sto
fw
astetre
atin
gthe
cyan
ide
.
Accid
en
tal
dra
g-in
of
E—
Brite
30/30in
toan
acid
copperso
lutio
nposes
noh
ea
lthhazards
dueto
evo
lutio
no
fpoisonous
cyan
ide
gasas
with
cyanideco
pp
er.
Theso
lutio
ndoes
no
thave
tobe
trea
ted
for
carbonatesas
with
cyan
ide
so
lutio
ns.
E—
Brite
30
/30
producesa
Lin
eg
rain
ed
,sm
ooth,dense
andd
uctile
copperd
ep
osit
which
isnon-porous
with
exce
llcbonding
pro
pe
rties.
Thep
late
may
beb
uffed
ea
sily
for
ah
igh
luste
r.It
hase
xce
llen
tth
row
ing
andco
verin
gpow
er.-It
isused
asa
pre
pla
tefo
rn
icke
land
acid
copper.
TheE
—B
rite3
0/3
0p
late
isan
exce
llen
th
ea
ttre
at
sto
p-o
ffand
EMI
sh
ield
.It
isa
lsoan
exce
llen
td
eco
rative
finis
hfo
rb
utto
ns,
rive
ts,
etc
.The
copperp
late
canbe
rea
dily
blackenedo
ro
xidize
dfo
ra
va
riety
of
attra
ctiv
ea
ntiq
ue
dfin
ish
es
suchas
thosefound
onw
all
pla
tes,
ligh
ting
fixtu
res
andb
uild
ers
hardware.
Zin
cd
ieca
stsu
rface
sm
ustbe
pro
pe
rlycleaned
with
EP
Vs
E-K
lee
n152
soakcle
an
er
anda
ctiv
ate
dw
ithE
-Pik
233.a
cidsa
ltfo
rmu
latio
n.
Some
die
cast
surfa
ces
may
req
uire
an
od
iccle
an
ing
with
E—Kleen
122.E
—E
rite3
0/3
0process
doesn
ot
req
uire
ana
uxilia
ryta
nk
andsp
ecia
lexpensive
ceramic
anodesfo
rco
ntin
uo
us
dumm
yp
latin
gas
oth
er
processesdo.
E—
Brite
30
/30
doesn
ot
req
uire
coatedanode
ba
skets
or
the
useo
fD
Iw
ateias
oth
er
pro
cesse
sdo.
TheE
—B
rite3
0/3
0b
ath
issta
ble
anddoes
no
thave
tobe
pe
riod
ica
llydum
pedand
rechar&as
with
oth
er
no
n-cya
nid
ea
lka
line
copperp
roce
sses.
E—
Brite
30
/30
issu
pp
lied
asa
liqu
idco
nce
ntra
tew
hichis
dilu
ted
with
tap
wa
ter.
PLATING
SP
EC
IYIC
AE
IOR
S
RAG
KP
LAT
ING
BA
RR
EL
PlA
TIN
G
Optim
umR
ange
60%50
to~75%by
volume
byvolum
e
1.5
oz/g
al.
1.2
to1
.8o
x/g
al.
9.8
9.5to
10
.01
40
°F120
to150°F
5to
10ASP
EQUIPM
ENT&
OPER
ATION
Copper
Anodes:
Anode/C
athodera
tio:
Filtra
tion
:
OPTICo
rE
flb
ar
stock
1.5
:1N
ote:In
ba
rrel
pla
ting
itis
imp
orta
nt
tohave
thep
rop
er
ratio
.C
alcu
late
them
aximum
cathodearea
be
fore
se
tting
upth
eprocess
andin
sure
tha
tth
eanode
areaequals
the
maxim
umcathode
area.A
lsoit
isre
qu
ired
tha
tth
eanode
areabe
suchth
at
the
anodecu
rren
td
en
sityis
su
fficie
nt
toco
rrod
ethe
anodes.
Continuous
10m
icron
,2-3
turn
sper
ho
ur.
Newfilte
rca
rtridg
es
must
beflu
she
dp
rior
touse
byre
circ
ula
ting
warm
wa
ter
thro
ug
hth
eca
rtridg
es.
Asu
lfur-fre
ecarbon
packm
ustbe
ma
inta
ine
don
the
ba
th--o
ne
poundp
er
100g
allo
ns
-change
we
ekly.
When
pla
ting
heavycopper
ConeC
i)n
il,or
more)
a1
micro
nfilte
ris
recomm
ended.
Co
nce
ntra
tion
.E
-Brite
30
/30
Copper
Me
tal
Optim
um
50%by
volume
Range
40to
60%by
volume
1.2
os/g
al.
1.0
to1
.5o
x/ga
l.pH
9.5
9to
10.5T
e,~
era
cure
120°F100
to150°F
Ca
tho
de
-Cu
rren
tD
en
sity--
l5to
3O
AS
P
An
od
e-C
urre
nt
Density-
--
5to
15ASP
Vo
ltag
e--
1-6
Vo
ltsA
gita
tion
Vigorous
Air
Pla
teT
hickn
ess
Minim
umo
f0.0002
inch
es
for
strik
e
5to
15ASP
5-
to18
Vo
lts2
-6
RPM
’sand
air
ag
itatio
n
(ove
r)
t—.tsrxte
.SU/JO(c
on
tinu
ed
)
Be
atin
g:
Sta
inle
ss
ste
el
or
titan
ium
ele
me
nts
or
co
ils.
Tank:
Mild
ste
el
line
dw
ithru
bb
er,
ko
rose
al
or
po
lypro
pyle
ne
ora
dropin
line
r.A
llp
lastic
tan
ksm
aybe
used.Large
po
lypro
pyle
ne
tanksm
ustbe
rein
forc
ed
.
Ve
ntila
tion
:N
otre
qu
ire,
butit
isa
goodp
ractic
eas
with
all
heatedp
latin
gso
lutio
ns.
Co
nta
ina
tion
:Lead
andcyanide
areco
nta
min
an
ts-
bathp
late
sw
ithb
lack
smut
when
con
tam
ina
ted
.
rn
AD
DITIvE
S-
-E
—B
rite3
0/3
0:,
Co
nce
ntra
teused
inm
ake-upo
fnew
ba
ths
andre
ple
nish
me
nt.
Contains
thecopper
me
tal
and-~
.the
oth
er
balancedcom
ponentso
fth
eb
ath
.
E—
Erite
30
/31
:E
lectro
lyte
rep
len
ishe
r.P
erio
dic
addsover~
E—
Brite
30
/32
:H
ighC
urre
nt
De
nsity
(MCD)
areab
oo
ster
usedw
ithra
ckp
latin
g.
.Charge
newra
ckbaths
with
3%by
volume.
Added
the
rea
fter
asneeded
basçdon
Bu
llce
llte
sts
for
burnin
HCD.F
orb
arre
lin
sta
llatio
ns
EE
lla
bw
illreco,m
uendle
ve
lo
f30/32.
E—
Erite
30
/35
:B
uffe
rto
co
ntro
lpH
.A
dd
ition
sdeterm
inedby
pHm
easurement.
Added
tora
ise
thep11
uponb
ath
make-up
andw
henthe
pHdecreases
froma
ciddrag
in.
pHC
ON
ThOL
FOR
E-E
RIT
h30/30
PLATING
SOLU
TION
ThepH
will
incre
ase
gra
du
ally
asthe
ba
this
usedand
thensta
biliz
ein
the
rangeo
f9
to1
0.5
.An
ele
ctro
nic
pHm
eterm
ustbe
used.p11
papershould
beused
on
lyfo
rspot
checks.E
Elw
illm
akerecom
mendations
for
low
erin
gpH
,if
ne
cessa
ry.
REPLENISHMENT
OF
PLATING
SOLU
TION
7E
-~rite
30/30co
nce
ntra
tehas
acopper
con
cen
tratio
no
f2
.4o
z/g
allo
n.
Ifthe
copperco
nce
ntra
tion
inth
ebath
decreases,a
dd
ition
so
fE
—B
rite30/30
con
cen
trate
arere
qu
ired
tore
ple
nish
the
copperand
the
oth
er
balancedcom
ponentsin
the
wo
rking
so
lutio
n.
Thestre
ng
tho
fth
ew
orkin
gso
lutio
nis
mo
nito
red
byd
ete
rmin
ing
the
copperco
nce
ntra
tion
.An
anodeto
cathodera
tiog
rea
ter
than1
.5:1
(example:
2:1
)w
illcause
the
copperto
climb
inth
eb
ath
,n
ece
ssita
ting
the
freq
ue
nt
ad
ditio
ns
of
E—
Brite
30
/31
ele
ctro
lyte
.E
—~
rite3
0/3
1e
lectro
lyte
isadded
ona
reg
ula
rb
asis
(da
ily)
tocom
plexthe
copperd
issolve
dfrom
the
anodesand
tore
pla
ced
rag
-ou
t.It’s
consumption
will
dependupon
dra
g-o
ut,
copperm
eta
lco
nte
nt
andm
eta
llicco
nta
jain
atio
nin
the
ba
th..
Thep
rop
er
leve
lo
fE
—B
rite3
0/3
1p
latin
gso
lutio
nm
ustbe
ma
inta
ine
dfo
rm
aximum
adhesi•
tothe
basem
eta
l.G
LEANIN
GP
AR
ISU
nlike
cyanideb
ath
s,th
eE
HB
rite30/30
so
lutio
ndoes
no
to
ffer
anycle
an
ing
.T
he
refo
re,
itis
extre
me
lyim
porta.to
eva
lua
teth
ecle
an
ing
inan
exis
ting
line
.C
leanersm
ustbe
free
-rinsin
g.
REThas
soakand
ele
ctro
cle
an
ers
,as
we
llas
acid
sa
lts,
tha
tare
com
pa
tible
with
the
E~
Zrite
30
/30
so
lutio
n.
ME
tAlLIC
CO
PP
flAN
ALYSIS.
--
..
--.
.-~
1.
Pip
ette
a5
ml.
sample
of
thep
latin
gso
lutio
nin
toa
250m
l.E
rlenmeyer
flask.
Add25
mls.
dis
tilled
or
de
ion
ized
wa
ter.
-.
-..
.-
2.A
dd2
to3
gram~
Amm
oniumE
ersü
lfate
-le
tstand
for
10to
15m
inu
tes.
(Sw
irla
fewtim
es
wh
ilew
aitin
g.)
3.A
dda
pp
roxim
ate
ly5
mls.
of
Am
monia.
So
lutio
nw
illbe
acle
ar
deepb
lue
.4
.Add
50m
Is.d
istille
do
rd
eio
nize
dw
ate
r.5
.A
dd4
to6
dropsPan
Ind
ica
tor.
(Do
no
tadd
more
tha
n6
dropsas
itw
illa
ffect
theend
po
int.)
6.S
olu
tion
sho
uld
bep
urp
leor
pa
lere
din
co
lor.
7.T
itrate
with
0.1NE
DIA
so
lutio
nto
aye
llow
-gre
en
endp
oin
t.C
alc
ula
tion
:-o
z/ga
l.o
fcopper
(mls.
of
ED
IA)
x0.170
No
te:
When
E—
Brite
30/30copper
isused
asa
rep
lace
me
nt
for
acyanide
copperp
latin
gso
lutio
n,
the
tan
ks,anodes
andanode
ba
rs,b
aska
tsand
ba
rrels
must
befre
eo
fcya
nid
eb
efo
rech
arg
ing
the
tan
kw
ithth
e30/30
so
lutic
Afte
rthe
removal
of
thecya
nid
eso
lutio
n,
the
equipment
shouldbe
washed
with
Hyp
och
lorite
so
lutio
nand
the
tan
ksoaked
for
24hours
in2%
Sodium
Hy-p
och
lorite
tod
estro
yre
sid
ua
lcya
nid
e.
Don
ot
ne
gle
ctra
cks,b
arre
ls,
he
atin
gand
filterin
gequipm
ent.A
fter
removal
of
the
Hyp
och
lorite
so
lutio
nand
wa
ter
rinsin
g,
ad
ilute
1to
2%S
ulfu
ricA
cidrin
se
shouldbe
used,fo
llow
ed
with
an
oth
er
rinse
with
cold
wa
ter
andthen
a5%
Potassium
Hydroxi
rinse
shouldbe
usedto
elim
ina
teth
ea
cid
.R
emove
the
alk
alin
erin
se
,rin
sew
ithco
ldw
ate
rand
thenm
akeup
the
tan
kw
ithth
eE
-l3rite
30/30so
lutio
n.
I~hend
estro
ying
cyan
ide
,fo
rced
ve
ntila
tion
sho
uld
beused
at
all
time
s,to
pre
ven
tto
xic
cyanidefum
esIto
,,a
ccum
ula
ting
.P
erso
nn
el
shouldbe
equippedw
ithse
lfco
nta
ine
db
rea
thin
ga
pp
ara
tus.
Be
stre
su
ltsare
ob
tain
ed
with
anew
tan
ko
rby
insta
lling
anew
flexib
lelin
er
ina
tan
kw
hich
pre
vio
usly
con
tain
acyanide
copperp
latin
gso
lutio
n.
Newanodes
andb
aske
tsa
rea
lsorecom
mended.
Copper
fromE
—B
rite30/30
rinse
wa
ter
byits
elf
or
mixed
with
oth
er
me
tallic
rinse
waters
isp
recip
itate
dby
con
ven
tion
al
Sodium
Hyd
roxid
etre
atm
en
tw
ithREX
Coagulants
andREX
Polym
ers.A
sp
illo
fE
—B
rite30/30
req
uire
stre
atm
en
tw
ithlin
e.
-
CAU
TION
:-The
ErE
rite:
30/30co
nce
ntra
teis-
am
ildskin
irritan
t.,D
DN
~t
work
with
.E
-Brite
30/30w
itho
ut
first
rea
din
gand
un
de
rstan
din
gth
eN
ate
rial
Sa
fety
Data
Sheet
furn
ishe
dby
RET.
-.
PACKAGING
..
.:
.-
Five
(5)
and55
ga
llon
non—returnable
con
tain
ers.
-.
-
IHP
OIttA
RI
NO
TICE
!
Thefo
llow
ing
ism
adein
lieu
of
all
wa
rran
ties,
expressedo
rim
plie
d,
inclu
din
gthe
imp
lied
wa
rran
ties
of
mer.—
~nand
fitne
ss
for
pu
rpo
se:
se
ller’s
andm
an
ufa
cture
r’so
nly
ob
liga
tion
sh
all
beto
rep
lace
suchq
ua
ntity
of
the?
rod
uct
asproved
tobe
de
fectiv
e.
Be
fore
usin
g,
use
rsh
all
de
term
ine
thesu
itab
ilityo
fth
ep
rod
uct
for
itsin
ten
de
duse,
andu
ser
assumes
all
risk
andlia
bility
wh
atso
eve
rin
con
ne
ction
the
rew
ith.
Ne
ithe
rse
ller
no
rm
an
ufa
cture
rsh
all
bic~lia
ble
eith
er
into
rto
rin
com
tract
for
anylo
sso
rdam
age,d
irect
incid
en
tal
or
consequenta
risin
go
ut
of
the
useo
rth
ein
ab
ilityto
useth
ep
rod
uct.
6/9
3
JAN
—12—
19941
6:4
5FRO
MTO
16
17
76
91
70
9P
.01
MA
TER
IAL
SA
FETY
DATA
SH
EE
TS
ection1.
IdentityofM
aterialI
PR
OD
IJCrN
AM
EO
RN
UM
BE
RE
—S
rite3
0/3
0
DO
TP
MO
PE
RS
HIP
PIN
GN
AM
EC
ompounds
orA
gents,P
rop
rieta
ryE
lectro
pla
ting
Ad
ditiv
es,
Liq
uid
RC
CU
LA
T8
DF
IDE
NT
IFIC
AT
ION
$HIP
PJN
SID
NU
MB
ER
UN
--
-N
A-
--
OCTK
AZA
RD
CLA
SS
N0
N-R
’2A
RD
OU
S
Section
2.H
azardS
pecificationsS
ectIon313
SupplIer
Notification:
Thisproductcontains
thefollow
ingtoxic
chemicals
subjectto
thereporting
requirements
of
sectio
n3
13
oftheE
moryonw
Planning
andC
omm
unityR
ighI-To.knowActof
1986and
of40C
FR372
orother
hazardsunder
29C
FR1910.1200.
%S
TC
AS
NU
MS
EP
CH
EM
ICA
LN
AM
EW
EIG
HT
PE
t..T
LY..
CA
RC
INO
GE
N
74
40
-50
-Sas
CuC
opper,g
asic
Sa
lto
f:S
ectio
n313
~4
1.0
mg
/N3
1.0
mg
/N3
NO
-—
—-
Noo
the
rslis
ted
inS
ectio
n313
——
--
-—
—-
—-
-
--
--
None
liste
din
1910.1200-
—-
—-
--
--
-—
Water
&o
the
rnon-hazardous
no
n-
-.1
IstM
~r
000re
pn
rt~a
b1
em
&tc
rials
96-
--
--
--
--
-
KN
OW
NH
AZA
RO
•SU
ND
~M29
CFR
1910.1200H
MIS
-H
AZA
RD
SIG
NA
LSYES
No
YE
SNO
HEALTHI
IFL
AM
MA
BIL
ITY
CO
RR
OS
IVE
MA
TER
IAl..
XS
KIN
HA
ZAR
DX
1I
I0
FL~
AM
AB
LEM
ATE
RIA
LEYE
HA
ZAR
DR
EA
aIVITY
PERSONAL
PRO
TEaION
PY
PO
PH
OR
ICM
A3tP
IAL
—TO
XICA
GE
NT
—..L_.
0-MInIm
all..S
JIg
Ifl2-M
odorale3
-Se
riou
s4
.So
wrn
EXPLOSIVEM
ATE
RIA
LX
HIG
HLY
TOXIC
AG
EN
TX
UN
SThBLEM
ATE
RIA
LS
EN
SITIZE
RT
he
so
lutio
nis
ve
rym
ildly
alk
alin
eand
wo
uld
WATER
RE
AC
TIVE
MATERIAL
XR
EP
RO
DU
CT
IVE
TO
XIN
beo
nly
slig
htly
co
rrosiv
e,
bu
tthe
problemo
fco
rrosio
nw
ouldbe
rela
tive
lysm
all
toste
el
OXIO
IZER—
XB
L000WX
INand
most
pla
stic
s.
-
OR
GA
NIC
PEROXIDENEP?.VUS
SYSTEMTO
XIN
—
CO
MS
t)ST
IBLE
LIOIJIO
XLU
NG
TOXIN
KC
OM
PR
ES
SE
DG
AS
LiVE
RTO
XIN
IRR
ITAN
T-
KIONEYTO
XIN-
-~
-_
__
__
RE
SP
IRA
TOR
YS
~T
EM
—x
Section
3.Safe
Usage
Da
taS
afe
tyg
lasse
s.It
isg
en
era
llyre
cog
nize
dth
at
con
tact
len
ses
sho
uld
no
tbe
wo
rnw
henEYES
wpzking
with
chemicals
becauseth
ey
may
co
ntrib
ute
toth
ese
verity
of
aneye
inju
ty.
PROTECTIVE
RES~R
4OR
YUse
on
lyw
ithve
ntila
tion
ad
eq
ijieto
keepa
irco
nce
ntra
tion
belowThY
ifuse
EQ
UIP
ME
NT
~encrate$
vaporo
rm
ists.If
XLVabove
isexceeded.
wear
NIO
SUapproved
resp
irato
r.TYPES
GLOVESR
ubber
OTHER
.Lang-sleeved
sh
irt,tro
use
rs,ru
bb
er
safe
tyshoes,
rub
be
rapron
GENERALM
ECHANICALYes
VEICTIUTIO
N
LOC
ALE
XH
AU
Sr
Pre
ferre
dto
ma
inta
inem
issionsa
tp
oin
to
fuse
belowth
eP
Et
HAN
OLIN
G&STO
MAG
EK
eepin
close
dco
nta
ine
rin
ad
ryw
ell-v
en
tilate
darea
away
fromin
com
pa
tible
Ina
teriils
.W
ashth
oro
ug
hly
afte
rh
an
dlin
g.
PR
EC
AU
TIO
NS
OTHER
Avoid
con
tact
with
eyes,skin
andclo
thin
g.
MA
TER
IAtS
~O.tV
IDS
trongo
xid
ize
rsand
acid
sIN
CO
MP
AT
ISIL
.fly
SW
AT
TN
:M
arth
a
HP
;
The“lfO
tn?arioncontained
hereinIs
furnishedvn7houtw
arranty~,(~r~’kind.
Em
ployersshould
usethis
infom7aztot7
oa
frasa
supplementto
otherinlorrnaflv,,cafhered
bvthern2
nd
mu
,tnr,k
ph
vla
na
nd
am
,,~
aA
ap
mT
hn
ffnn
e#
4e
.Ji.-s
,.11
t.s~
..A~
#.
S:_
_.,
-—
JRN
—12—
1994iG
~4
5FRO
MTO
16
17
76
91
70
9P
.02
SectIon
4.E
mergency
Response
Data
EXTING
UISH
iNG
MED
IAW
ater
FIRE
SP
EC
IAL
PP
~E0U
RE
SNONE
UN
USU
ALH
AZARD
SNO
NS
EYEZIm
me
dia
tely
Slu
she
yes
with
ple
nty
of
wa
ter
for
at
lea
st
iSm
inu
tes
“hU
eo
ccn
sio
nn
llyliftin
g,
up
pe
rand
low
er
eyelid
.If
irritatio
no
ccu
rsand
pe
rsis
ts,
ob
tain
me
dic
al
atte
ntio
n.
SXIN~W
asho
ff‘4
thru
nn
ing
wa
ter.
Ifirrito
tion
occu
rsand
pe
rsis
ts,
ob
tain
me
dic
al
atte
ntio
n.
EX
PO
SU
RE
FIR
ST
INH
ALnTION
:R
emove
from
exp
osu
re.
Ifd
isco
mfo
rto
ccu
rsand
pe
rsis
ts,
ob
tain
me
dica
la
tten
tion
.A
ID
ING
ESTION
:R
inse
mouth
andd
ilute
stomach
con
ten
ts‘4
thw
ate
r,o
rp
refe
rab
lyw
armm
ilkif
ava
ilab
le.
Ca
lla
ph
ysician
.
STEPS109ETAKENS
na
ilsp
illsm
aybe
disposedo
fby
flush
ing
with
wa
ter.
For
larg
esp
ills,
splu..s.
co
nta
inby
so
ilo
ro
the
rabsorbant
ma
teria
l.
RQ
=I.66
,00
0t
Wt.S
TEO
ISP
OS
ALM
ETH
OD
Co
nsu
ltn
pp
rop
riate
fcd
ern
l,sta
teand
loca
lre
gu
latio
ns
for
dis
po
sa
lo
f.sm
all
amounts
of
cop
pe
rco
nta
min
ate
da
bso
rba
nt
or
so
lutio
n.
‘S
ection5.
PhysicalH
azardD
ataF
LAM
MA
BILIT
YFLASH
PVINT
NONEM
ETHO
DU
SED:
STABLEx
CO
NO
mO
NS
TO*SO
IDNO
NE;T
AB
ILITY
I4AZARD
OU
SDEC
OM
POStT)O
NPR
OD
UC
IS:T
he
rma
ld
eco
mp
ositio
nnay
rele
ase
CC
,CO2
or
UN
SrASLEo
the
rh
aza
rdo
us
ga
ses.
LO
WM
ON
MAVO
CC
UM
)W
IU.N
OTO
CC
UR
xj*vO
IO:
~S
ection6:
Health
Hazard
Data
EFFECTS0~E
XP
OS
UA
E.SiG
NSAN
DSYM
PTOMS:
Human
ind
ustria
leX
periencehas
shown
nosig
nific
an
tin
ha
latio
nhazard
or
skin
irritatio
nw
hengood
pe
rso
na
lh
yzie
nc
pra
ctic
es
are
follo
we
d.
Lo
cal
irritatio
no
fth
eeye
may
occu
rfrom
con
tact
with
theso
lutio
n.
PR
IMA
RY
RO
UTE
SO
FE
NTR
YC
INH
AlA
TIO
NC
ING
E$TIQ
Nii
SK
INA
BS
OR
PTIO
N[3
SK
INO
REYE
CONThC~
Section
7.P
hysicaand
Chem
icalProperties
BOILING
PT..S
PE
CIF
ICG
RP
Ifl1.35
VOLATILECO
MPO
NENISW
ater
pH9
.0‘~
20~0E
NS
IVY
(AIR
1)N
/AE
~P
O~
TIO
NR
nE
,i~L
ate
r.1)
ApD
roX.
1S
0LUB
ILIrYlN
W~rE
RC
om
ple
teW
ILIDIS
SO
LVE
INW
ate
r
APPEARAN
CE
Blu
eS
olu
tion
MATERIAL
1SLIQUID
XPO
WD
ER
00
CR
ilild-
mu
sty
Sectlon
8.M
anufacturerD
ata•
NP
MS
NA
ME
SM
AIL
ING
AD
DR
ES
S:
Electrockietnicat
Products
Inc.17000
Lin
co
ln.
New
Be
rlin.
WI
53151
~Dale
PresaredSupercedes
EM
ER
GE
NC
YIE
LEP
HO
NE
NO
:B
US
INE
SS
HO
UR
&4
14
48
6-9
33
0~
owFlw
asod:7
/15
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ThoseD
ated:NO
NEO
therlim
es:
Chem
irec8O
O•42d’93@
~_Day
orN
ight
TE
CH
NIC
AL
DA
TAS
HE
ET
CU
PR
AL®
Alkaline,
non-cyanidecopper
platingprocess
CU
PR
AL”4
isa
non-cyanide,alkaline
processdesigned
toplate
thick,adherent,
fine-graincopper
depositsdirectly
onsteel,
brass,and
zincatedalum
inumin
rackand
barrelapplications.C
UP
RA
Lis
excellentasa
non-cyanide
copperstrike
andin
decorativecopper
platingapplications.
Itis
idealform
askingsteel
partsprior
toheat
treatingand
performs
well
incontinuous
stripapplications.
READ
ENTIR
ETE
CH
NIC
AL
DATA
SHEET
BE
FOR
EU
SING
ThiS
PRO
DU
CT.
HO
WTO
USE
CU
PR
AL
OP
ER
ATIN
GC
ON
DITIO
NS
Make-up
Com
positionPotassium
Carbonate
CU
PR
AL
Make-up
CU
PR
AL
GR
CU
PR
AL
Wetter
Carbonate
CIJP
RA
LM
aintenanceIndex
CU
PR
AL
Com
plexorC
UP
RA
LG
RC
UP
RA
LW
etterpH
at140°F
(60°C
)Tem
peratureC
athodeC
urrentDensity
SolubleA
nodeC
urrentD
ensityC
UP
RA
LA
uxiliaryA
nodeC
urrentDensity
Auxiliary
Cathode
toC
UP
RA
LA
uxiliaryA
nodeA
reaR
atioPlating
CellC
urrenttoA
uxiliaryC
ellCurrent
Ratio
Foreach100
gallons(378
L)Potassium
Carbonate
CU
PR
AL
Make-U
pC
UP
RA
LG
RC
UP
RA
LW
eller
38lb
(17kg)
33gallons
(125L)
1pint(473
mL)
1pint(473
mL)
6.0oz/gal(45
W1~)33%
byvolum
e0.1%
byvolum
e0.1%
byvolum
e
115to
4.5oz/gal(13
to34
gIL)75
to140
Units
20to
28%by
volume
0.05to
0.2%by
volume
0.05to
0.2%by
volume
9.5to
10.0l2O
to150
°F(49
to66
°C)S
to35
A/ft25
to15
A/ft2
50to
100A/ft2
1.To
aclean
processtank,add
33gallons
(125L)ofdeionized
water.
NO
TE:C
yanideIs
acontam
inanttothis
process.Ifthe
processtank
hasbeen
previouslyused
fora
coppercyanide
process,the
tankm
ustbe
scrubbedand
leachedw
itha
hotcaustic
sodasolution
[4ozigal(30
gIL)caustic
sodaat120
°F(49
°C)]
untilnotrace
ofcyaniderem
ainson
thetank
walls,
bottom,
oredges.
Theanode
andcathode
railsm
ustalso
befree
ofcyanide
encrustations.The
leachateand
anyother
cyanide-bearingm
aterialsm
ustbe
treatedand
dischargedIn
accordancew
itheffluentregulations
pertinenttothe
pointsourcedIscharge.
Optim
umR
ange2.5
ozlgal(19gIL)
100U
nits22%
byvolurhe
0.1%by
volume
0.1%by
volume
9.8140°F
(60°C
)20
A/ft210
AIft275
A/ft2
20:110:1
MA
KE
-UP
10:1to
25:110:1
to3:1
C1993
Enthone-OM
IInc.
CU
PRAL®
TechnicalDataSheet
Page2
of14
MA
KE
-UP
(Cant.)
2.A
dd33
gallons(125..L)
CU
PR
AL
Make-up
andstir
untildissolved.
DO
NO
TH
AVETH
EC
UP
RA
LA
UX
ILIAR
YA
NO
DE
SIN
THE
TANK
WH
EN~t4KlN
GU
PTH
EO
PE
RA
TING
BATH.
Check
thepH
;then
slowly
andcarefully
addliquid
potassiumhydroxide
(causticpotash
-45%solution)
untilthesolution
pHreaches
7.5to
8.0.9)o
notusesodium
hydroxideas
precipitationm
ayoccur.
3.A
dd37
pounds(11kg)
potassiumcarbonate
andm
ixuntildissolved.
4.H
angthe
baggedcopperanodes
onthe
anoderails
ofthem
aincell
(Process
Tank).Insertthe
CU
PR
AL
Auxiliary
Anodes
andsteel
orcopper
cathodesinto
theauxiliary
cell,w
hichw
illbe
operatedon
aseparate
auxiliaryrectifier.
5.B
ringthe
operatingsolution
closeto
itsoperating
volume
byadding
deionizedw
ater.S
tirthoroughly.6.
AdjustpH
to9.8
with
liquidpotassium
hydroxideand
thenadjustthe
solutionlevelto
operatingvolum
e.7.
Add
1pint
(473m
L)C
UP
RA
LG
R.
8.A
dd1
pint(473
mL)
CU
PR
AL
Wetter.
9.S
tirwelland
heattheoperating
solutionto
therecom
mended
temperature.
10.B
egincirculating
solutionbetw
eenthe
platingcelland
theauxiliary
platingcell.
ii.P
rocessis
nowready
forplating
operations.OPER
ATION
CU
PR
AL
Make-up
suppliesthe
copperions,
complexor,
andelectrolyte
neededfor
solutionm
ake-up.C
UP
RA
LM
ake-upshould
onlybe
usedfor
make-up
orw
henrecom
mended
bya
UD
YLITE
TechnicalR
epresentative.C
UP
RA
LM
aintenancesupplies
thecopper
ionsand
stabilizerneeded
forsolutionm
aintenance.C
UP
RA
LM
aintenanceis
depletedby
electrolysisand
dragout.Low
concentrationof
copperm
etaland
electrolytew
illproduce
lowcathode
efficiencyand
grainydeposits.
High
concentrationw
illresult
inpooradhesion.
CU
PR
AL
MaIntenance
must
becontrolled
bydaily
analysisand
additions.The
additionof
5gallons/i00
gallonsC
UP
RA
LM
ake-upw
illincreasethe
Maintenance
Indexby
8units.
CU
PR
AL
Com
plexoris
usedto
complex
thecopper
ions,thus,
providingadhesion
ofcopperm
etalto
theferrous
basem
etal.C
UP
RA
LC
omplexor
isdepleted
byelectrolysis
anddragout.
InsufficientC
UP
RA
LC
omplexor
will
resultinpoor
adhesion.H
ighconcentration
ofC
UP
RA
LC
omplexor
will
producelow
cathodeefficiency
andgrainy
deposits.C
arbonatesalts
areused
to-bufferthe
pH,
provideconductivity,
andprom
otedissolution
oftheelectrolytic
copperanodes.
Lowconcentration
ofcarbonates
will
causepH
fluctuationand
will
adverselyaffect
theappearance
ofthe
copperdeposit.
Potassiumcarbonate
isrecom
mended
forsolution
make-up.
Potassium
Bicarbonate
isrecom
mended
forcarbonatem
aintenance.C
UP
RA
LG
Ris
usedto
producea
fine-grained,lustrous
appearanceand
makes
thecopper
deposita
suitablesubstrate
forsubsequentplating.
InsufficientCU
PR
AL
GR
willresultina
grainy,dullappearance
which
yieldsunacceptable
subsequentplates.N
ormalconsum
ptionrate
is1
quartper1,300
ampere-hours.
CU
PR
AL
Wetter
isused
toreduce
pittingby
lowering
thesurface
tensionofthe
platingsolution.
Ifpittingis
observedin
platedparts,
0.1%(vlv)
CU
PR
AL
Wetter
shouldbe
added.If
excessiveam
ountsof
CU
PR
AL
Wetter
arerequired,
itm
aybe
indicativethat
thesolution
isseverely
contaminated
andis
inneed
ofabatch
carbontreatm
ent.O
peratingtem
peraturesbelow
therecom
mended
rangem
ayproduce
grainyand
burntdeposits.
Temperatures
abovethe
recomm
endedrange
may
resultingrainy
deposits.D
eionized/distilled
water
mustbe
usedfor
make-up
andallvolum
em
aintenanceadditions.
i~iQtaD
water
isto
beadded
tothe
CU
PR
AL
tank.IfpH
adjustment
becomes
necessary,use
liquidpotassium
hydroxide(45%
Wv)to
raisethe
solutionpH
andglacialacetic
acidto
lower
pH.V
ariationsin
pHm
ayresultin
agrainydepositand
pooradhesion.O
bserveC
UP
RA
LA
uxiliaryA
nodesonce
am
onthfor
degradationof
thesurface,
causingattack
ofthe
substrate,
CU
PRAL~
TechnicalDataSheet
Page3
of14
EQ
UIP
ME
NT
TankKoroseal,
PVClined
orapprovedrubber
lined
WA
RN
ING
:O
peratingtem
peratureover160°F
(71°C
)m
ayrequire
specialhigh
temperature
tanklining.
Auxiliary
Piating
CeIl*
Seepages
10and
11fora
detaileddescription.
Heating
Coils
Teflon
Heating
Control
Autom
atic
Ventilation
Required.
Solutionis
classifiedas
3-2by
OSH
A.
Plating
CellR
ectifierForfullrange
with
lessthan
5%ripple
Auxiliary
CellR
ectifier0
to6
Voltrectifierwith
lessthan
5%ripple
andcurrentcapabilities
ofatleast
10percentoftotalPlating
Cellcurrent
AirA
gitation&
Spiders*
PVDC
Anodes
PlatingC
ell:110
Alloy
ETPC
opperA
uxiliaryC
ell:C
UP
RA
LA
uxiliaryA
nodes
Auxiliary
CellC
athodeExpanded
steelorcopper
CopperA
nodeBags
Ifplatingto
thicknessof:
a)less
than0.2
Mils
Style100
7.5ounce
cottonw
ith48/80
threadcount
orStyle
120nylon
210denierw
ith58/62
threadcount
b)greaterthan
0.2M
ilsStyle
7020napped
polypropylene
Allbagsm
ustbedesized
andw
ashed.
FiltrationM
inimum
2turnovers
ofsolution
perhour
througha
linedor
nonmetallic
packableplate
filter.Filter
packingrnust
becom
posedof
cellulosem
ediasuch
asU
DYFIN
®984.
1to
2pounds
ofU
DY
SO
RB
®activated
carbonper
1,000gallons
operatingsolution
perweek
isrequired.
Consultan
Enthone-O
MlTechnicalService
Representative
fordesignand/or
materialrecom
mendations.
CO
NTR
OL
Thefollow
inganalyticalprocedures
arerecom
mended
foruse
bypersonnelw
hohave
beentrained
touse
laboratorypractices
which
areconsidered
safeand
prudentby
chemicalindustry
standards.S
uchpractices
includesuitable
personalprotective
equipment,
theuse
ofproper
equipment,
theuse
ofproper
methods
ofhandling
allchemicals
andproper
laboratoryprocedures.
CA
UTIO
N:
The
follo
wIn
gprocedures
involvethe
useof
po
ten
tially
hazardouschem
icals;m
anufacturer’sm
aterialsafety
datasheet
shouldbe
consultedand
theappropriate
safetycautions
followed.
CU
PRAL®
TechnicalDataSheet
Page4
of14
DE
TER
MIN
ATIO
NO
FM
AIN
TEN
AN
CE
IND
EXE
quipmentN
eeded
10m
Lpipet50
mL
burst50
mL
graduatedcylinder
300m
LE
rlenmeyerflask
Reagents
Needed
0.1N
ormality
ofSodiumThiosulfate
Solution1%
Soluble
StarchSolution
(1g/l00
mL)
10%P
otassiumIodide
Solution
(100giL)
Concentrated
Hydrochloric
Acid
-R
eagentGrade
Am
monium
Bifluoride-
Reagent
Grade
Procedure
1.Pipet
10.0m
Lofthe
sample
tobe
analyzedinto
a300
mL
Erlenm
eyerflask.2.
Add
0.5gram
sofam
monium
bifluoride,50m
Lofdeionized
water,
15m
Lofconcentrated
hydrochloricacid,
15m
Lofpotassium
iodidesolution,and
ito2
dropsofstarch
indicator.3.
Titratew
ith0.1
Norm
alityofsodium
thiosulfatesolution
toa
milky
white
endpoint.
4.M
aintenanceIndex
=V
x6.4
Where
V=
mL
ofsodiumthiosulfate
solutionused
inStep
3.The
additionof
5gallons
ofC
IJPR
AL
Maintenance
will
increasethe
Maintenance
Indexby
Sunits/lO
Ggallons.
DE
TER
MIN
ATIO
NO
FTO
TAL
CO
MP
LEX
OR
Equipm
entNeeded
10rnLpipet
50niL
buret300
mL
Erlenm
eyerflask1000
mL
volumetric
flask
Reagents
Needed
10%P
otassiumC
yanideS
olution-D
issolve100
grams
ofreagentgrade
potassiumcyanide
inabout700
ccofdeionized
water.
Dilute
to1
literusinga
volumetric
flask.C
AU
TION
:P
otassiumcyanide
solutionIs
extremely
toxic.A
voidcontact
with
skinor
eyes.D
onot
Ingest.R
emove
anddisposeofcontam
inatedclothing.
Incase
ofcontactoringestion,
seekm
edicalattentionim
mediately!
Magnesium
Chloride
Solution
-D
issolve20.3
grams
±01
grams
ofreagent
gradem
agnesiumchloride
hexahydrate(M
gCI26H
2O)
inabout500
mL
deionizedw
ater.D
iluteto
1liter
usinga
volumetric
flask.S
tandardizeagainsta
known
EDTA.
Am
monium
Chloride-A
mm
oniumH
ydroxideB
ufferS
olution-
Dissolve
50gram
sof
reagentam
monium
chloridein
400m
Lof
deionizedw
aterand
add400
mL
ofreagent
grade(28%
)am
monium
hydroxide.D
iluteto
1literusing
avolum
etricflask.
Eriochrom
eB
lackT
Indicator-
To100
grams
ofreagent
gradesodium
chlorideadd
0.20gram
sof
Eriochrom
eB
lackT
dye.M
ixthoroughly
andstore
ina
closedam
berbottle.
DE
TER
MIN
ATIO
NO
FTO
TAL
CO
MP
LEX
OR
Procedure
1.Pipet10
mL
ofthesam
pleto
beanalyzed
intoa
300m
LE
rlenmeyerflask.
2.U
singa
graduatedcylinder,
add15
mL
ofamm
oniumhydroxide
bufferand15
mL
ofdeionizedw
ater.
CUPRAL®Technical Data
SheetPage5
of14
DE
TER
MIN
ATIO
NO
FTO
TAL
CO
MP
LEX
OR
(Cont.)
3.S
lowly
add10%
potassiumcyanide
untiltheblue
coloris
dischargedarid
thesolution
becomes
colorless;then
add1
mL
more
ofthecyanide
solution.Do
notadd
anexcess.
Approxim
ately5
to10
mL
will
benecessary.
4.A
dda
smallam
ount(0.1)
ofthesolid
Eriochrome
BlackT
indicatoruntilthe
solutiondevelops
ablue
color.Too
intensea
colorwillm
akethe
endpointhard
tosee.
5.Titrate
with
0.1M
oLarm
agnesiumchloride
solutionuntilthe
solutionturns
fromblue
topurple.
(Iftheend
pointispassed,the
solutionturns
apink
color.The
trueend
pointisthe
changefrom
blueto
purple.)
6.P
roperlydiscard
thesolution
asa
cyanide-containingw
aste.
7.%
byvolum
etotalC
UP
RA
LC
omplexor
=V
xM
x14.3
Vis
theV
olume
ofmagnesium
chloride.M
isthe
Molarity
ofmagnesium
chloride.
DE
TER
MIN
ATIO
NO
FC
AR
BO
NA
TE
Equipm
entN
eeded
5m
Lpipet25
mL
graduatedcylinder
Chittick
Gasom
etricA
pparatus-see
page12
fordesignofthis
apparatus.~‘W
RC
atalog#19750-00
Carbon
Dioxide
Apparatus)
Reaaents
Needed
6N
ormalS
ulfuricAcid
(100m
11500deionized
water)
Procedure
1.Pipet5.0
mL
ofthesam
pleto
beanalyzed
intothe
gasevolution
flaskA
(seediagram
onpage
6).
2.C
onnectflask
Ato
theC
hittickG
asometric
Apparatus,
allowto
standfor
severalm
inutesto
attainequilibrium
,open
stopcockC
andadjust
theliquid
levelin
theburette
Dto
15.0m
Labove
0by
raisingleveling
bulbE.
3.C
losestopcock
Cand
slowly
add15
mL
of6N
ormality
ofsulfuric
acidsolution
fromburette
Fto
flaskA
while
slowly
lowering
theleveling
bulbE,
keepingthe
liquidlevelin
Eslightly
lowerthan
theliquid
levelin
buretteD.
4.V
igorouslysw
irlthecontents
inflask
Ato
evolveallthe•C
02arid
allowto
standforseveralm
inutesto
attainequilibrium
.
s.R
aisethe
levelingbulb
Funtilthe
liquidlevel
initis
atthesam
elevelas
theliquid
levelin
buretteD.
Read
thevolum
eofgas
evolvedin
mL
inburette
Dw
hichis
thereading
oftheliquid
levelinD
.
6.ozfgalC
arbonate=
Vx
0.070V
isthe
Volum
eofC
O2
gasevolved
asm
easuredin
Step5.
NO
TE:
Accuracy
of
them
ethodIs
sufficientw
ithoutusing
atem
peratureor
atmospheric
pressurecorrection
when
measuring
thegas
volume
inS
tep5.
CU
PRAL®
TechnicalDataSheet
Page6of14
CU
PR
AL
CA
RB
ON
AT
EE
QU
IVA
LEN
TS
PO
TA
SS
IUM
PO
TA
SS
IUM
CA
RB
ON
AT
EC
AR
BO
NA
TE
BIC
AR
BO
NA
TE
AD
DIT
ION
(43.5%C
03)(60%
CO
3)
0.25az/gal
0.57az/gal
0.42az/gal
0.5ozlgal
1.1oz!gal
0.83az/gal
1az/gal
2.3az/gal
1.7az/gal
2oz!gal
4.5az/gal
3.4az/gal
2.61az/gal
6az/gal
4.35az/gal
(standard)
3ozlgal
6.9ozlgal
5az/gal
3.5az/gal
8az/gal
5.8az/gal
4az/gal
9.2az/gal
6.7az/gal
DETERMINATIO
NO
FW
iiitH
INC
UPR
AL
Priortousing
thestalagm
ometertube,
thoroughlyclean
itbysoaking
ftforseveralhours
inchrom
icacid
solutionfollow
edby
thoroughand
carefulrinsing.This
cleaningoperation
neednotbe
carriedoutfor
eachuse
ofthestalagm
ometer.
Aftertheprim
arycleansing
ofthestalagm
ometer,
athorough
rinsingwith
distilledwater
issufficient.
How
ever,priorto
determination
ofthesurface
tension,the
stalagmom
eterm
ustbe
rinsedw
itha
portionofthe
solutionto
betested.
Donottouch
thepolished
droppingsurface
with
thefingers
sinceitm
ustbeclearand
freeofgrease.
Mount the
stalagmom
etersolidlyin
averticalposition
ona
ringstand.
Make
surethere
isno
vibration.
Procedure
1.A
djustthetem
peratureofallsolutions
tobe
testedto
68°F
(25±
1°C
).
2.R
insethe
stalagmom
eterwith
thetestsolution.
3.Fillthe
stalagmom
eterw
ithC
UP
RA
Ltest
solution.A
djustthe
solutionlevelto
theupper
zero.W
ipethe
baseofthe
stalagmom
eter.
4.N
owallow
thesolution
todrain
outofthe
stalagmom
eter,counting
thenum
berof
dropsdelivered
asthe
solutionflow
sbetw
eenthe
upperzerolevelto
thelowerzero
leveloftheinstrum
ent.
5.R
ecordthe
numberofdrops.
6.To
insurethat
theresults
areconsistent,
Steps
3to
5should
berepeated
threem
oretim
es.C
alculatethe
averageofallthe
attempts
tothe
nearestdrop.
7.R
insethe
stalagmom
eterseveraltimes
usingdistilled
water.
8.R
epeatS
teps1
to6
substitutingdistilled
waterto
calibratethe
stalagmom
eter.This
isdone
infrequentlyin
ordertocalibrate
theinstrum
ent.
9.U
singa
hydrometer,
determine
thespecific
gravityofthe
CU
PR
AL
solution.U
sethis
valueforthe
density(D
tc)ofthe
solution.
DE
TER
MIN
ATIO
NO
FW
ElT
ER
INC
LJPR
AL(C
ont.)
~CaIculation
Calculate
thesurface
tension(ST)
indyneslcm
usingthe
following
formula:
ST
=S
Tw
xDtcxN
wD
Wx
Ntc
Where:
ST
=S
urfacetension
ofCU
PR
AL
chromium
solutionS
Tw=
Surfacetension
ofdistilledw
aterD
tc=
Density
ofCU
PF1ALsolution
Dw
=D
ensityofdistilled
water
Nw
=N
umberofdrops
ofdistilledw
aterN
tc=
Num
berofdropsofC
UP
RA
L
Standard
Solution
SurfaceTension
Density
Distilled
Water
721.0
EX
AM
PLE
:
Drops
CU
PR
AL
solution74
Density
CU
PR
AL
solution1.310
Drops
ofdistilledw
ater36
ST=72
x1.310
X36=
~dynes/cm
1.0x
74
Determ
ineconcentration
ofCU
PR
AL
Wetterfrom
thefollow
ingchart.
CU
PRAL®
TechnicalDataSheet
Page
7cf
14
SURFACE TENSION EFFECT OF CUPkAL WETTING AGENT
-0-Incue(0 0o ~ -Dmoar
0.~ 0)
0)C’,Zr00
1~)0)wz>-0z0U)2LUILiiC)4Li~it:DU,
75
70
65
60
55
50 I—— - I
0 0_OS 01 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5
WETTING AGENT ADDITION (PERCENT)
CUPRAL SCHEMA1L~ DESIGN USINGOVERFLOW WEIR AS AUXILIARY TANK
-U-joD)OC
CD
o
4,.
000
FILTERANODE BAR
/
/ PLATING TANKB ARCATHODE
OVERFLOWSL00019O—A
CUPRAL®TechnicalD
ataSheet
Pagel2
of
14
PR
EC
AU
TIO
NA
RY
INF
OR
MA
TIO
N
DA
NG
ER
!C
UP
RA
LG
RM
AYC
AU
SE
SE
VE
RE
BU
RN
S.
CU
PR
AL
MA
KE
-UP
,C
UP
RA
LW
etter,C
UP
RA
LC
omplexor,
CU
PR
AL
Maintenance
IndexO
RTH
EO
PE
RA
TING
SO
LUTIO
NM
AY
CA
US
EIR
RITA
TION
,EYE
DA
MA
GE
.
HA
ZAR
DS
:C
UP
RA
LG
Ilm
aycause
severeburns
toskin
andeyes.
Inhalationm
aycause
respiratorytract
Irritation.Ingestion
may
causesevere
burns.C
UP
RA
LM
AK
E-U
P,
CU
PR
AL
Wetter,
CU
PR
AL
Com
plexor,C
UP
RA
LM
aintenanceIndex
orthe
operatingsolution
may
causeirritation
toskin
andeyes,
possibleeye
damage.
Inhalationofvapors
may
causeIrritation
tothe
respiratorytract.
Ingestionm
aycause
severeirritation
tothe
géstro-intestinaltract.
CO
NS
ULT
SU
PP
LIER
SM
SD
S’s
FOR
AD
DITIO
NA
LIN
FOR
MA
TION
.D
onotget
ineyes,on
skin,or
onclothing.
Do
notinhale
ortake
internally.
FIRS
TA
ID:
Incase
ofcontact
ofC
UP
RA
LG
R,
CU
PR
AL
MA
KE
’UP
,C
UP
RA
LW
etter,C
UP
RA
LC
omplexor,
CU
PR
AL
Maintenance
Indexor
theoperating
solutionw
ithskin
oreyes,flush
with
plentyof
clean,cool
water
for15
minutes.
Get
medical
attentionfor
eyes.R
emove
andw
ashcontam
inatedclothing
andshoes.
HA
ND
LING
INFO
RM
ATIO
N:
When
handlingC
UP
RA
LG
RC
UP
RA
LM
AK
E-U
P,
CU
PR
AL
Wetter,
CU
PR
AL
Com
plexor,C
UP
RA
LM
aintenanceIndex
orthe
operatingsolution,
wear
protectiveclothing,
chemical
safetygoggles,
respirator,face
shieldand
rubbergloves.
Exhaust
ventilationis
recomm
endedto
remove
vaporsthat
may
bogenerated
duringM
ake-Up
andO
peration.W
henpreparing
oradding
tosolutions,
always
addC
UP
RA
LG
RC
UP
RA
LM
AK
E-U
P,
CU
PR
AL
Wetter,
CU
PR
AL
Com
plexor,C
UP
RA
LM
aintenanceIndex
slowly
andcautiously.
Avoid
breathingvapors.
Avoid
contactw
ithacids,
oxidingagents,
alkaliesor
anyother
foreignm
aterial.D
onot
getin
eyes,on
skin,or
onclothing.
Do
nottakeInternally.
CO
NTA
INE
RIN
FOR
MA
TION
:K
eepcontainers
tightlyclosed.
Keep
closedw
hennot
inuse
toavoid
moisture
absorption.S
toreIndoors
Ina
cool,dry
area.Loosen
closurecautiously
when,opening.
Wash
thoroughlyafter
handling.D
onot
reusecontainers,
wash
beforedisposal.
Improper
disposalorreuse
ofthis
containerm
aybe
dangerousand
illegal.
RE
FER
TOM
SDS
FOR
FUR
THER
SA
FETY
AN
DH
AN
DLIN
GIN
FOR
MA
TION
.
Issued:11/05/93
Spsds:
02/03/92
CUPRAL®
TechnicalDataSheet
Pagel4of
14
~MATER
IALSAFETY
DA
TASH
EETS
Form
oredetailed
information
onthe
toxicologicalpropertiesofthe
productsdescribed
herein,reference
canbe
made
tothe
MaterialS
afetyD
ataSheet
(MSD
S)for
eachproduct.
Ifyoudo
nothave
theproperM
SD
S,
itcanbe
requestedfrom
:E
nthone-OM
IInc.,
attention:R
egulatoryA
ffairsD
epartment,
P.O.
Box1900,
New
Haven,
CT
06508.For
emergency
assistancecallC
HEM
TREC
(800)424-9300.
WA
RR
AN
TYAN
DD
ISC
LAIM
ER
Theinform
ationpresented
hereinis
tothe
bestof
ourknow
ledgetrue
andaccurate
andall
recomm
endationsand
suggestionsappearing
inthis
bulletincovering
theuse
ofourproductsare
basedupon
information
believedto
bereliable.
How
ever,since
theconditions
ofuse
arebeyond
ourcontrol,
thisinform
ationis
givenon
theexpress
conditionand
agreement
thatE
nthone’OM
lInc.
will
notbe
liableto
anyperson
incontract,
tortQ
ncludingnegligence),
strictliability
orotherwise
foranyclaim
s,dam
agesor
lossesw
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anada)’lnc.‘~and-is
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ewH
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a~
EE
NTH
ON
E.S
EL.R
Ex.uD
YLITE
I
EP
IA
lectro
ch
em
ica
lPm
du
cts
Inc
17000Lincoln
Avenue
New
Beffin,
WI53151-2781
(414)786-9330
FAX
(414)786-9403
-D
ete
rmin
atio
no
fE
—B
rite3
0/3
1in
E—
Brite
30
13
0
1.
Pip
et
10m
l.o
fth
eE
.-Brite
30
/30
pla
ting
so
lutio
nand
pla
ce
itin
a600
ml.
be
ake
r.A
dd50
ml.
of
ILI.
wa
ter
toth
issa
mp
le.
2.
Un
de
rm
ag
ne
ticstirrin
gand
usin
ga
pHm
ete
ra
dju
st
pHto
just
be
low
4.0
with
co
nce
ntra
ted
Hyd
roch
loric
Acid
.
3.
Add
the
l.ON
Sodium
Hyd
roxid
efro
ma
bp
rette
andra
ise
the
pHo
fth
eso
lutio
nto
4.6
.
4.
Ze
roth
eb
ure
ttew
ith1.O
NS
odiumH
yd
roxid
eand
titrate
the
so
lutio
nu
sin
ga
sta
nd
ard
ize
dpH
me
ter,
topH
11
.2.
5.
Re
cord
the
nu
mb
er
of
mis
.o
f1.O
NN
aOH
use
dto
titrate
.
E—
Erite
30
/31
,%
by
vo
l.=
mis
.1.011
NaO
Hx
3.8
Minim
uma
mo
un
to
f-E
—B
rite3
0/3
1e
lectro
lyte
req
uire
dto
op
era
teE
—B
rite3
0/3
0b
ath
.co
rresp
on
din
gto
the
amount
•ofco
pp
er
me
tal
co
nta
ine
din
it.
CO
PPERM
ETA
L(a
z/g
al.)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
E—
Erite
30
/31
,Z
by
volu
me
40%44%48%52%56%60%64%68%72%76%80%84%88%92%96%
100%
Exa
mp
le:
Ifth
eco
pp
er
me
tal
is1
.7o
z/g
al.,
yo
ur
E—
Brite
30
/30
ba
thsh
ou
ldh
ave
am
inim
um
of
68%b
yvo
lum
eE
—E
rite3
0/3
1.
Th
isis
yo
ur
the
ore
tica
lva
lue
.-
Le
t’ssa
yyo
utitra
ted
16
.8m
ls.
of
1.ON
NaO
H.
Yo
ur
actu
al
va
lue
E-4
rite3
0/3
1is
64%.
To
de
term
ine
am
ou
nt
of
30
/31
ne
ed
ed
,ta
ke
yo
ur
the
ore
tica
lva
lue
min
us
yo
ur
actu
al
va
lue
eq
ua
lsth
e%
30
/31
ne
ed
ed
tobe
ad
de
d.
Fo
rth
istitra
tion
68—64%
4%b
yvo
lum
eE
—B
rjte3
0/3
1n
ee
de
dto
bea
dd
ed
toth
eb
ath
.
NO
TE:
Pre
sen
ceo
fm
eta
llicand
org
an
icim
pu
rities,
wh
icha
ren
orm
al
inE
—B
rite3
0/3
0p
rod
uctio
np
latin
g,
will
req
uire
ad
ditio
na
lE
—B
rite3
0/3
1o
ver
andb
eyo
nd
tha
tn
ee
de
dfo
rth
eco
pp
er
inso
lutio
n.
Such
ad
ditio
ns
of
E—
Brite
30
/31
are
tobe
de
term
ine
db
ase
don
I-lull
ce
llp
latin
gand
testin
gfo
rp
late
ad
he
sio
n.
3/94—
2—
%by
Vol
.E
-Brite
30/3
1E
lect
roly
te
01
0)
OD
(00
00
00
0
o01
o-
-:
.HH
....
—.ii
(31
cc
--
--
--
--
--
--
--
--
--
--
-0
g)~
.
~0
~
De
term
ina
tion
of
co
pp
er
Co
nte
nt
an
dO
the
rM
eta
llicIm
pu
rities,
inth
eE
-Brite
30
/30
Ba
thb
yIC
P-A
ES
Pre
pa
re100
mis
of
am
uitie
lem
en
tsta
nd
ard
for
co
pp
er
(Cu)
,iro
n(F
e),
nic
ke
l(N
i),a
nd
zin
c(Z
n).
Pip
et
the
qu
an
tities
of
10
00
ppmsin
gle
ele
me
nt
sta
nd
ard
sre
qu
ired
inT
ab
leI
into
a100
ml
vo
lum
etric
flask.
Dilu
teto
100m
im
ark
with
18m
egaohmd
eio
niz
ed
wa
ter.
La
be
lth
esta
nd
ard
with
itsco
nce
ntra
tion
s,
an
de
xp
iratio
nd
ate
.
Ta
ble
I100
ml
Mu
ltiele
me
nt
Sta
nd
ard
for
E—
Brite
30
/30
Ba
th
Mu
ltiele
me
nt
Sta
nd
ard
Am
ou
nt
of
10
00
ppmS
ing
leC
on
ce
ntra
tion
Ele
me
nt
Sta
nd
ard
Re
qu
ired
20ppm
Cu
2.0
mis
2ppm
Fe
0.2
mis
2ppm
Ni
0.2
mis
2ppm
Zn
0.2
mis
Pip
et
100u
lso
fth
eE
—B
rite3
0/3
0b
ath
into
a1
00
ml
vo
lum
etric
flask.
Th
esa
mp
leo
fth
eb
ath
sh
ou
ldb
ea
tro
om
tem
pe
ratu
re.
Dilu
teto
the
10
0m
lm
ark
with
18m
egaohmd
eio
niz
ed
wa
ter.
La
be
lth
esa
mp
lew
ithits
ide
ntity
an
dd
ate
.
Utiliz
eth
ew
ave
len
gth
sin
Ta
ble
IIfo
ra
na
lysis
of
the
sam
ple
onth
eP
erk
inE
lme
rIC
P(M
od
el
65
00
)se
qu
en
tial
sp
ectro
me
ter.
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ble
IIE
lem
en
tW
ave
len
gth
sfo
rE
—B
rite3
0/3
0B
ath
ICP
An
aly
sis
Ele
me
nt
Wa
ve
len
gth
,nm
.
Co
pp
er
32
4.7
54
Iron
25
9.9
40
Zin
c2
06
.20
0N
icke
l2
31
.60
4
Co
nve
rtth
eo
bta
ine
dre
su
ltsin
toth
ed
esire
du
nits
utiliz
ing
the
follo
win
gfo
rmu
las.
ICP
resu
ltin
ppms
or
mg
/lx
.13
34
=o
z/g
al
ICP
resu
ltin
ppms
or
mg
/ix
1=
g/l
To:M
arthaJow
ett6/I4/94
4240:WJ:94-050
From:
BillJundzilS
ubject:G
6Flexleads
-P
rocessC
hangeToxic
Chem
icalE
limination
Program
SU
MM
AR
Y:
Inorderto
reducetoxic
chemical
use,a
newprocess
ofplatingG
6flexleads
was
tried.As
partofthe
testingofthis
newplating
process,m
easurements
were
made
todeterm
ineifthe
currentcarrying
capabilityofthe
flexleadsw
asdegraded.
No
degradationresulted
fromthe
newprocess.
Both
thestandard
processand
thenew
processflexleads
performed
thesam
e.The
averagefuse
currentforthestandard
processflexleads
was
4.1am
ps.The
newprocess
flexleadshad
anaverage
fusecurrentof4.0
amps.
TES
TP
RO
CE
DU
RE
:Three
groupsof
G6
flexleads,partno.
69387,w
eresentto
theEM
Labfor
analysis.G
roupI
flexleads,control
group,w
ereplated
usingthe
standardm
ethodcopper
cyanidesolution.
Groups
2and
3w
ereplated
inthe
newsolution,
E-Brite30/30.
Group
3flexleads
receivedextra
strippingtim
ein
thechrom
icacid
solution.G
roups2
and3
were
fabricatedunder
OC
N6666.
Thetestconsisted
ofim
mersing
3flexleads
fromthe
same
groupin
apetri
dishfull
ofgyrobrom
ofluid.
(Due
todegradation
ofthebrom
ofrom
theheat,the
bromo
was
replacedafter
eachtest.)
A800
Hz
current,starting
at1am
p,w
asapplied
for10
minutes.
ifno
fusingofthe
leadsoccurred,
thecurrentw
asincreased
by1/4
amp
andheld
foranother
10m
inutes.This
was
repeatedup
tothe
3am
plevel
(pasthistory
shows
leadsfusing
at2.5am
psand
above).The
currentwas
thenslow
lyincreased
untiltheflexleads
fused.This
testwas
repeated,3
newflexleads
pertest,
untilall
leadsw
erem
easured.The
fusecurrentfor
eachlead
isshow
nbelow
.
FUSE
CU
RR
EN
T(AM
P-TRM
S)C
uCn
E-B
riteE
-Brite
(restrip)4/13/93
Past
Group
1G
roup2
Group
3D
ataH
istory3.6
3.53.9
3.8>2.5
3.73.7
44.2
3.93.7
4.14.3
4.23.8
4.24.4
4.53.9
4.54.4
44.4
4.14.2
Electrom
ag
N
cc:W
.Walker
:sE
ngineeringLab
Fig
ure
3F
ina
lF
lexle
ad
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mb
lyA
fter
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er
Strip
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gP
roce
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a.
Ap
pro
x.
Actu
al
Siz
e
b.
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X
6
Fig
ure
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ark
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Are
as
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rite3
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oo
pe
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latin
go
nA
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od
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20
Fig
ure
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arke
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rea
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rite3
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oo
pe
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gon
Alu
min
um
1100R
od
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8X
b.
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21
Fig
ure
13E
—B
rite3
0/3
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co
atin
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60
61
Alum
inumR
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00
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Gro
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27
Fig
ure
14E
—B
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0/3
0C
op
pe
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oa
ting
on6061
Alu
min
um
Rib
bo
n—
Gro
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B
a.
443X
b.
5300X
28
Fig
ure
15
E-B
rite3
0/3
0C
op
pe
rC
oa
ting
on
60
61
Alu
min
um
Rib
bo
n-
a.
443X
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00
X
Gro
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C
29
Fig
ure
176
06
1A
lum
inu
mR
ibb
on
inE
—B
rite3
0/3
0A
ssem
bly
—A
fter
1S
tripp
ing
Cycle
of
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con
ds
a.
475X
b.
5330X
31
Fig
ure
186061
Alu
min
um
Rib
bo
nin
E—
Brite
30
/30
Asse
mb
ly-
Afte
r2
Strip
pin
gC
ycle
sfro
m26
to40
Se
con
ds
To
tal
a.
443X
b.
5900X
32
Fig
ure
196061
Alu
min
um
Rib
bo
nin
co
pp
er
Cya
nid
eA
ssem
bly
-
Afte
ra
Strip
pin
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ycle
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13to
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eco
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s
a.
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b.
5890X
33