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90
CYANIDE-BASED ELECTROPLATING ELIMINATION NORTHROP GRUMMAN CORPORATION Tecimical Report No. 20 1994 University of Massachusetts Lowell

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TOX

ICS

USE

RE

DU

C’IiO

NIN

SI

ITU

TE

TH

EM

AS

SA

CH

US

ET

TS

TO

XIC

SU

SE

RE

DU

CT

ION

INS

TIT

UT

E

CY

AN

IDE

-BA

SE

DE

LEC

TR

OP

LAT

ING

EL

IMIN

AT

ION

NO

RT

HR

OP

GR

UM

MA

NC

OR

PO

RA

TIO

N

TecimicalR

eportNo.

201994

University

ofMassachusetts

Lowell

CY

AN

IDE

-BA

SE

DE

LE

CT

RO

PL

AT

ING

EL

IMIN

AT

ION

NO

RTH

RO

PG

RU

MM

AN

CO

RP

OR

ATIO

NE

LEC

TR

ON

ICS

SY

STE

MS

DIV

ISIO

N-

PR

EC

ISIO

NP

RO

DU

CTS

PLA

NT

Dan

PierceM

anager,E

nvironmental,

Health

&Safety

Cruz

R.

Calderon

-Sr.

ProjectE

ngineerM

arthaL.

Jowett

-Sr.

Materials

Scientist

David

E.

Mahoney

-E

ngineeringA

ssistant

Northrop

Grum

man

Corporation

Norw

ood,M

assachusetts

Decem

ber1994

TheToxics

Use

Reduction

Institu

teM

atchingG

rantsP

rogram

TheToxics

Use

Reduction

InstituteU

niversityo

fMassachusetts

Lowell

TOXIC

SUSE

RED

UC

TION

Ns’rIrU

TE

NA

llrightsto

thisreportbelong

tothe

ToxicsUse

ReductionInstitute.

Them

aterialmay

beduplicated

with

permission

bycontacting

theInstitute.

TheToxics

UseReduction

Instituteis

am

ulti-disciplinaryresearch,education,

andpolicy

centerestablishedby

theM

assachusettsToxics

UseReduction

Actof1989.

TheInstitute

sponsorsand

conductsresearch,organizes

educationand

trainingprogram

s,andprovides

technicalsupporttoprom

otethe

reductionin

theuse

oftoxicchem

icalsorthe

generationoftoxic

chemicalbyproducts

inindustry

andcom

merce.

Furtherinformation

canbe

obtainedby

writing

theToxics

UseReduction

Institute,University

ofMassachusetts

Lowell,One

University

Avenue,Lowell,

Massachusetts

01854.

°ToxicsUse

ReductionInstitute,U

niversityofM

assachusettsLow

ell

Toxics

Use

Reduction

Institu

teM

atch

ing

Grants

Program

TheInstitute

annuallyprovides

directfunding

toM

assachusettsindustries

ona

matching

basisfor

toxicsuse

reduction(TU

R)

feasibilityand

technologystudies.

Them

atchingG

rantsProgram

wasinitiated

inFY

93to

facilitatethe

developmentand

useofinnovative

techniquesthatreduce

theuse

oftoxicchem

icalsorthe

generationoftoxic

byproductsin

Massachusetts

businesses.G

rantsare

awarded

ona

competitive

basisforcom

paniesto

conductTU

Rstudies

attheirfacilities.Recipients

prepareprojectreports

which

assistintransferring

toxicsuse

-ieductiontechnologies

andm

ethodsto

othercompanies.

Notice

Thisreporthas

beenreview

edby

theToxics

UseReduction

Instituteand

approvedfor

publication.Approvaldoes

notsignifythatthe

contentsnecessarily

reflecttheview

sand

policiesofthe

ToxicsUse

Reduction

Institute,nordoes

them

entionoftrade

names

orcom

mercialproducts

constituteendorsem

entorrecomm

endationfor

use.

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ckno

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dg

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zin

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ifica

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ht

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ase

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Th

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ava

riety

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ae

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plic

atio

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at

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ep

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tive

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st

cou

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uctio

np

arts

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lytic

al

testin

go

fb

oth

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ting

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ns

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plo

yed

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up

on

sa

nd

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du

ctio

np

arts

was

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rform

ed

.T

he

so

lutio

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gin

vo

lve

dve

rifyin

go

rd

eve

lop

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ds

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rou

tine

pla

ting

ba

tha

na

lysis

.T

he

eva

lua

tion

of

the

pa

rtse

nta

iled

vis

ua

la

pp

ea

ran

ce

ap

pra

isa

ls,

thic

kn

ess

me

asu

rem

en

ts,a

dh

esio

na

sse

ssm

en

ts,

so

lde

rab

ilityte

stin

g,

an

de

xa

min

atio

nb

ysca

nn

ing

Ele

ctro

nM

icro

sco

py

(SE

M)

for

the

inte

grity

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the

pa

rtsa

nd

the

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atin

g.

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mic

eva

lua

tion

of

the

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tive

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oco

nd

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AP

PL

ICA

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NO

FTE

CH

NO

LOG

IES

A.

No

rthro

pG

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anP

art

De

scrip

tion

s/R

eq

uire

me

nts

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rp

rima

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ce

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red

onid

en

tifyin

ga

no

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ide

pla

ting

pro

ce

ss

for

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min

um

.W

eu

tilize

a6

06

1a

lum

inu

mrib

bo

na

san

ele

ctric

al

cu

rren

tca

rrier

an

dfle

xe

lem

en

tw

ithin

ou

rp

rod

ucts

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he

60

61

alu

min

um

pro

vid

es

bo

thth

en

ece

ssa

ryco

rrosio

nre

sis

tan

ce

an

dm

ech

an

ica

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rop

ertie

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qu

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by

ou

ra

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e,

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me

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ate

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rt.T

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pp

er

pla

ting

of

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on

pe

rmits

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asse

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su

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en

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pe

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um

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ch

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ide

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STM

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rep

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ca

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fina

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rior

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ting

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cu

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ca

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tilize

dis

Alu

mo

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tho

ne

pro

du

ct

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ich

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er

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pe

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sin

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ch

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ica

cid

so

lutio

n.

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ure

s1

thro

ug

h4

dis

pla

yth

ea

lum

inu

mrib

bo

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tva

riou

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ge

sd

urin

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nu

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um

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osit

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ly.

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refo

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mu

stm

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tain

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ition

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pp

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ting

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sis

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ting

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re,

the

rep

lace

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nt

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ce

ss

mu

sta

lso

pro

du

ce

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od

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sio

n.

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ten

tial

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rna

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ce

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ide

ntify

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pro

pria

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ativ

ep

roce

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sa

litera

ture

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arc

hw

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nd

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mm

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ially

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len

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ltern

ativ

es.

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ne

rally

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ting

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ep

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g-

facto

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se

arc

h.

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cu

ssio

ns

of

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po

ten

tial

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tive

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llow

;

a.

Ele

ctro

less

Co

pp

er

Pla

ting

Ele

ctro

less

co

pp

er

so

lutio

ns

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prim

arily

use

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ithin

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prin

ted

circ

uit

bo

ard

ind

ustry

for

the

pla

ting

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nd

uctiv

em

ate

rial.

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ey

are

usu

ally

alk

alin

ein

na

ture

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dre

qu

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for

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po

sitio

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rod

uce

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hly

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osits

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atin

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atin

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ce

this

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um

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esig

ne

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rits

flexib

ility,

ab

rittle

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atin

gw

ou

ldb

eu

nsu

itab

le.

3

Fig

ure

1A

lum

inu

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ibb

on

onP

latin

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re

Fig

ure

2P

late

dA

lum

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ibb

on

onP

latin

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re

5

Fig

ure

3F

ina

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lexle

ad

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mb

lyA

fter

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pro

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e

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4.6

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ure

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mb

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lled

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onth

efe

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atio

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tw

ou

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atic

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um

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on

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fact,

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Allo

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nt

crite

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ithth

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so

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red

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mb

ly.

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ly.

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ote

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hw

ou

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e.

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ten

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ial

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ting

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tified

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ctro

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rica

ting

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du

ct

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ma

nd

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ow

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lectro

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inim

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at

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wre

nce

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erm

ore

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tion

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ne

the

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cid

ed

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rsu

eth

isp

roce

ss

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time

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en

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ima

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y,

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ort

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pra

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8

ca

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uire

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mp

lex

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tha

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lysis

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da

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urific

atio

nce

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isa

lso

se

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eto

zin

cco

nta

min

atio

n,

the

refo

rein

co

mp

atib

lew

ith.

ou

rzin

ca

teth

alu

imin

um

pro

ce

ss.

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su

sp

ecte

dth

at

itco

uld

ad

dco

nsid

era

ble

co

st

too

ur

pla

ting

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ce

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eE

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pro

du

ct,

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ed

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isp

rod

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pe

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rela

tive

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igh

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ithno

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mp

lica

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tha

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lysis

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pe

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de

lectro

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nce

ntra

tion

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lua

tion

sw

ere

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mm

en

de

da

na

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ctro

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nce

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dco

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er

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nte

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can

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ytitra

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ele

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ris

ne

ce

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oth

the

ele

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nd

mo

nito

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pH.

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eb

ath

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ore

se

nsitiv

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er

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ath

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uo

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ca

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de

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an

ics.

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nito

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ino

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ysp

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eansis

als

ore

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me

nd

ed

.B

ath

pe

rform

an

ce

can

be

eva

lua

ted

by

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llce

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sts

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his

ba

th’s

wa

ste

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tme

nt

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ited

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us

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nific

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isp

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roce

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cid

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en

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ithE

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the

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the

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ate

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hre

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eto

lack

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su

itab

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teria

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up

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2024a

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60

61

alu

min

um

.C

arp

en

ter

49

,a

no

the

riro

n-

nic

ke

la

lloy,

was

em

plo

yed

inlie

uo

fA

lloy

52

.T

ab

le1

de

scrib

es

the

cou

po

nco

nfig

ura

tion

s.

9

Ta

ble

I.C

ou

po

nT

ype

sa

nd

Co

nfig

ura

tion

s

Pa

rtC

ou

po

nA

pp

rox.

Co

up

on

Are

ato

Ma

teria

lM

ate

rial

Dim

en

sio

ns

be

Pla

ted

60

61

Al

•.2024

Al

1”

x4

”fla

tp

late

.02

7sq

.ft.

Allo

y52

Ca

rpe

nte

r49

.5”

dia

.x

.1”

thic

k.0

04

sq

.ft.

Ko

va

rK

ova

r.7

5”

dia

.x

1”

thic

k.0

08

sq

.ft.

The

pre

limin

ary

cou

po

nte

stin

gw

asp

erfo

rme

din

be

ake

rsto

eva

lua

ted

ep

ositio

nra

tes

an

da

pp

rop

riate

cu

rren

td

en

sitie

s.

Th

eco

up

on

sw

ere

cle

an

ed

inth

esam

em

an

ne

ra

sth

ep

arts

the

yre

pre

se

nte

d.

Th

ey

we

reth

en

imm

erse

din

the

E—

Brite

30

/30

pla

ting

ba

tha

t1

20

°F±

5°F

for

3m

inu

tes

±5

se

co

nd

s.

Th

ecu

rren

td

en

sity

was

va

ried

an

dth

ere

su

lting

co

atin

gth

ickn

esse

sm

ea

sure

d.

Fig

ure

s5

thro

ug

h7

pre

se

nt

the

resu

lts.

All

of

the

cou

po

ns,

reg

ard

less

of

ma

teria

lo

rcu

rren

td

en

sity

,e

xh

ibite

dg

oo

da

dh

esio

n.

Mo

std

isp

laye

da

cce

pta

ble

su

rface

ap

pe

ara

nce

sa

t6

tolo

xm

ag

nific

atio

ne

xce

pt

for

the

alu

min

um

wh

ich

exp

erie

nce

dsom

eb

urn

ing

at

40a

mp

ere

sp

er

sq

ua

refo

ot

(AS

F).

B.

Se

co

nd

ary

Co

up

on

Te

stin

g

Ne

xt,

utiliz

ing

ou

rp

relim

ina

ryre

su

lts,

am

inim

um

of

5m

ore

cou

po

ns

of

ea

chm

ate

rial

we

rep

late

din

bo

thth

eco

pp

er

cya

nid

ep

rod

uctio

nb

ath

an

dth

eE

-Brite

30

/30

ba

th.

Fo

rth

eE

—B

ritep

latin

g,

bo

thth

eC

arp

en

ter

49a

nd

Ko

va

rco

up

on

sw

ere

pro

ce

sse

din

the

be

ake

rse

tup

.T

he

alu

min

um

cou

po

ns

we

rep

erfo

rme

din

an11

liter

ba

th.

All

of

the

co

pp

er

cya

nid

ep

latin

gw

asp

erfo

rme

din

the

11lite

rp

rod

uctio

nb

ath

.

Th

e11

liter

ba

ths

are

loca

ted

inp

oly

pro

pyL

en

eta

nks

situ

ate

din

acu

stom

fou

rta

nk

Te

ch

nic

’sP

latin

gM

od

ule

.T

his

mo

du

leis

eq

uip

pe

dw

ith3

(0—12

vo

lt,0—

1a

mp

ere

DC

)re

ctifie

rs.

CA

L7

00

0te

mp

era

ture

co

ntro

llers

reg

ula

teb

ath

tem

pe

ratu

res

by

co

ntro

lling

500w

att

Te

ch

nic

(Mo

de

lH

XL511O

R11)

he

atin

ge

lem

en

ts.

Au

tom

atic

time

rsb

eg

intim

ing

asso

on

as

acu

rren

tis

ap

plie

dw

ithin

the

pla

ting

ba

th.

Se

rfilco

ch

em

ica

lso

lutio

np

um

ps,

(Mo

de

lA

PS

3000A—

ST

T)

with

ca

pa

citie

so

f55

ga

llon

sp

er

ho

ur,

circ

ula

tath

eb

ath

s.

When

inu

se

,th

eE

-Brite

30

/30

so

lutio

npum

psco

ntin

uo

usly

thro

ug

ha

3m

icro

nca

rbo

np

ack

filter

tore

mo

veo

rga

nic

co

nta

min

an

ts.

A15

mic

ron

po

lyp

rop

yle

ne

filter

isu

sed

on

the

co

pp

er

cya

nid

eb

ath

.B

oth

ba

ths

utiliz

eo

xyge

nfre

eco

pp

er

(OFC

)a

no

de

sw

hic

ha

rero

dsh

ap

ed

me

asu

ring

6in

ch

es

10

Fig

ure

5ca

rpe

nte

r49

—P

relim

ina

ryco

up

on

Te

stin

gin

E-B

rite3

0/3

0B

ath

E—Brite

30/30Bath

BethTem

p1

20

Fj

1OF

BathTim

e=

3mm

Estimated

Current

Plating

Density

Current

VisualThickness

RateSam

ple#

ASErn/a

AdhesionAppearance

uinuin/m

mn

115

60pass

ok16.1

54

220

80pass

ok23.5

7.83

25100

passok

31.010.3

430

120pass

ok35.0

11.75

40160

passok

58.419.5

E—

Brite

30

/30

Copper

Bath,

120F

Ca

rpe

nte

r49

Coupons

20.0~18.0

.216.0••

~1

4.0

~

~Q

10

.0~

~‘

8.0

;6

.0.•

E4.0~

.2.00

.0.

II

I10

2030

4050

Current

Density,

ASF

11

Fig

ure

6K

ova

r-

Ere

lintin

ary

Co

up

on

Te

stin

gin

E—

Brite

30

/30

Ba

th

E—Brite

30

/30

BathBath

Temp

=1

20

F~

bE

BathTim

e=

3mm

EsUm

atedC

urrentP

latingD

ensityC

urrentVisual

ThicknessRate

Sample

#ASF

rn/aAdhesion

Appearanceuin/m

in

115

120pass

ok20.8

6.92

20160

passok

28.09.3

325

200pass

ok38.4

12.64

30240

passok

50.917.0

540

320pass

oR60.0

20.0

E—

Brite

30

/30

Copper

Ba

th,

120F

Ko

var

Coupons

20.01

8.0

”•~

16.014.0

~~,

In

nN

‘‘“L

I.

°~

10.0~

8.0

.C

IS4

,0.

2.00

.0.10

2030

4050

Current

Density,

ASF

12

Fig

ure

7A

lum

inu

m—

Pre

limin

ary

Co

up

on

Te

stin

gin

E--B

rite3

0/3

0B

ath

E—

Brite.30/30

BathS

trikeat

3volts

for5

secondsBath

Temp

=1

20

F~

lOP

BethTim

e=

3mm

Estimeted

Current

Plating

Density

Current

VisualThickness

RateSam

ple~

ASPrn/a.

AdhesionAppearance

uinuin/m

in

115

405pass

Ok30.3

10.12

20540

passOk

37.612.5

325

675pass

ok5

Z4

17.54

30810

passok

60.320.1

540

1080pass

burning72.9

24.3

E—

Brite

30

/30

Copper

Bath,

120F

20

24

Alu

min

um

Coupons

25

ii~~10

.-B

E5

.

0-

II

I

1020

3040

50

Current

Density,

ASF

13

TABLE 2: RESULTS OF COPPER PLATING BATH COUPON STUDIES

PLATING PARAMETERS PLATING RESULTSCurrent? Current Average Ave. Plating

No. of Sample Bath Bath sarhple Density Time Visual Thickness Rate SolderabilityMaterial Samples Area, sgft Type Ternp, F rn/a ASF Mm. Adhesion Appearance uin uin/min w/o aging Comments

Carpenter 5 0.004 E—Brlte 30/30 120 00 25 9 pass pass I IC I 2.2 pass Plated individually49 500 ml Beaker

Carpenter 5 0.004 CucN 20 200 50 5 pass pass 84 8.4 pass All samples plated at once49 ii LiterBath 100 25 5

Kovar 5 0.008 E—Brite 30/30 120 200 25 7 pass pass I 12 I 6.0 pass Plated individually500 ml Beaker

Kovar 5 0.008 CuCN 120 400 50 5 pass pass 151 15.1 pass All samples plated at onceI I Liter Bath 200 25 5

Al 2024 6 0.014~ [—Brite 30/30 120 210 to 5 to 17 6 pass pass 74 12.3 pass Plated in PairsII Liter Bath 230

Al 2024 8 0.014 CuCN 120 420 30 0.5 pass pass 69 i9.7 pass Plated In PairsIi LiterBath 210 15 3

Test Methods

Adhesion — A grid was scribed onto the coupon using an exacto blade. Tape was then applied to the grid area. Subsequently, it was rapidly removed. The plating wasexamined for lifting. This Is similar to the method described in ASTM 6571—79 paragraph 13.

Visuai Appearance — The coupon was examined under a microscope at approximately OX. Any evidence of blisters, peeling, or pitting were noted.

Thickness — Thicknesses were measured using X—Ray Fluorescence on a Twintest XRF—PTG utilizing calibration standards.

Solderability — Soiderability was evaluated per the guidelines of ASTM B678 with the exception that the coupons remained in the solder pot for longer periods of time.

lon

gb

y0

.3in

ch

es

ind

iam

ete

r.

Bo

thth

eco

pp

er

cya

nid

ea

nd

E-B

rite3

0/3

0b

ath

sw

ere

ma

inta

ine

da

t1

20

°F±

5°F

.T

he

I(ova

ra

nd

Ca

rpe

nte

r49

cou

po

ns

pla

ted

ind

ivid

ua

llyin

the

500m

lb

ea

ke

ro

fth

eE

Brite

30

/30

ba

th.

All

five

cou

po

ns

(Ko

va

ra

nd

Ca

rpe

nte

r4

9)

we

rep

late

da

to

nce

inth

e11

liter

cya

nid

eb

ath

.T

he

alu

min

um

cou

po

ns

we

rep

late

din

pa

irsin

bo

thth

eE

-Brite

30

/30

an

dco

pp

er

cya

nid

e11

liter

ba

ths.

Ta

ble

2lis

tsb

oth

the

pla

ting

co

nd

ition

sa

nd

the

resu

ltsfo

rth

ese

co

up

on

s.

Th

ech

ose

np

latin

gco

nd

ition

sw

ere

su

fficie

nt

toyie

ldco

atin

gth

ickn

esse

sw

ithin

the

ran

ge

ssp

ecifie

dfo

rth

ein

div

idu

al

pa

rts.

Ta

ble

3co

nta

ins

the

thic

kn

ess

sp

ecific

atio

ns.

Ta

ble

3T

hic

kn

ess

sp

ecific

atio

ns

Co

pp

er

Pa

rtM

ate

rial

Co

up

on

Ma

teria

lT

hic

kn

ess

Sp

ec.,

uin

60

61

Alu

min

um

2024A

lum

inu

m30

to100

Allo

y52

ca

rpe

nte

r49

60to

200

Ko

va

rK

ova

r30

to200

Ad

he

sio

n,

vis

ua

la

pp

ea

ran

ce

,so

lde

rab

ility,

an

dth

ickn

esse

sw

ere

me

asu

red

ona

llo

fth

eco

up

on

s.

Ad

he

sio

nw

ase

va

lua

ted

by

scrib

ing

ag

ridon

the

cou

po

ns

with

an

exa

cto

bla

de

.A

pie

ce

of

tap

ew

asth

en

ap

plie

dto

the

are

aa

nd

rap

idly

lifted

off

at

a9

an

gle

.A

ny

lifting

or

pe

elin

go

fth

eco

atin

gw

asca

use

for

reje

ctio

n.

Th

ism

eth

od

issim

ilar

toth

em

eth

od

de

scrib

ed

inA

STM

B5

7l-7

9,

Pa

rag

rap

h.

13

,“S

tan

da

rdT

est

Me

tho

ds

for

Ad

he

sio

no

fM

eta

llicco

atin

gslT

.A

llo

fth

eco

up

on

sp

asse

da

dh

esio

nte

stin

g.

Vis

ua

la

pp

ea

ran

ce

was

exa

min

ed

un

de

ra

mic

rosco

pe

at

6to

10X

.A

ny

evid

en

ce

of

blis

ters

,p

ee

ling

,o

rp

itting

we

reca

use

sfo

rre

jectio

n.

None

of

the

cou

po

ns

dis

pla

ye

dth

ese

un

de

sira

ble

co

nd

ition

s.

So

lde

rab

ilityw

asa

pp

rais

ed

by

follo

win

gth

eg

uid

elin

es

of

AS

TMB

67

8-8

0,

“Sta

nd

ard

Te

st

Me

tho

dfo

rS

old

era

bility

of

Me

tallic

-Co

ate

dP

rod

ucts

”,w

ithth

efo

llow

ing

exce

ptio

n≤;

The

sam

ple

sw

ere

no

ta

ge

da

nd

the

cou

po

ns

we

reh

eld

inth

eso

lde

rp

ot

for

lon

ge

rth

an

the

sp

ecifie

d5

seco

nd

sd

ue

toth

eir

rela

tive

lyla

rge

ma

sses.

Th

esa

mp

les

we

reco

nsid

ere

da

cce

pta

ble

ifth

eso

lde

rco

atin

gw

asa

dh

ere

nt,

brig

ht,

an

du

nifo

rmo

ve

ra

tle

ast

95%o

fth

ete

ste

dsu

rface

.B

oth

the

E-B

rite3

0/3

0a

nd

the

co

pp

er

cya

nid

ep

iece

sw

hic

hw

ere

15

teste

dfu

lfilled

the

req

uire

me

nts

.

Co

atin

gth

ickn

esse

sw

ere

me

asu

red

usin

gX

—R

ayF

luo

resce

nce

on

aT

win

test

XR

F-P

TG

Mo

de

l6

00

0u

tilizin

ga

pp

rop

riate

ca

libra

tion

sta

nd

ard

s.

Th

ism

eth

od

isd

escrib

ed

inA

STM

A754—

79,“S

tan

da

rdT

est

Me

tho

dfo

rC

oa

ting

Th

ickn

ess

by

X—R

ayF

luo

resce

nce

”.T

he

ave

rag

eth

ickn

ess

are

rep

orte

din

Ta

ble

2.

Ta

ble

4p

rovid

es

the

ave

rag

ein

div

idu

al

cou

po

nth

ickn

esse

s.

Ap

pro

xim

ate

ly10

thic

kn

ess

me

asu

rem

en

tsw

ere

exe

cu

ted

one

ach

cou

po

n.

Fro

mth

em

ea

sure

me

nts,

the

E—

Brite

30

/30

seems

tob

ee

xp

erie

ncin

ga

gre

ate

rra

ng

ein

thic

kn

esse

sth

an

the

co

pp

er

cya

nid

eb

ath

.T

his

ap

pe

ars

tob

ea

tra

ito

fth

eE

-Brite

30

/30

ba

th.

C.

Alu

min

um

Pa

rtT

estin

g

Ba

sed

ono

ur

favo

rab

lere

su

ltsw

ithco

up

on

s,

we

pro

ce

ed

ed

toe

va

lua

tea

ctu

al-

60

61

alu

min

um

ribb

on

.T

he

sete

sts

we

rep

erfo

rme

din

the

11lite

rE

-Brite

30

/30

ba

th.

Prio

rto

pla

ting

the

actu

al

pa

rts,

the

11lite

rb

ath

was

an

aly

ze

dfo

rp

H,

co

pp

er

co

nte

nt,

an

de

lectro

lyte

co

nte

nt

tove

rifyth

ea

na

lysis

me

tho

ds

an

de

nsu

reth

ep

rop

er

ch

em

istry

of

the

ba

th.

Th

epH

was

me

asu

red

with

aC

ole

Pa

rme

rM

od

el

59

85

80

ele

ctro

nic

pHm

ete

rw

itha

uto

ma

ticte

mp

era

ture

co

mp

en

sa

tion

.T

he

me

ter

was

ca

libra

ted

with

NIS

Ttra

ce

ab

lesta

nd

ard

sp

rior

tou

se

.T

he

sta

rting

pHo

fth

eb

ath

was

8.5

,a

littlelo

we

rth

an

EP

I’sre

com

me

nd

ed

ran

ge

of

9to

10

.5.

Th

ete

ch

nic

al

litera

ture

no

tes

tha

tth

epH

will

eve

ntu

ally

incre

ase

with

use

into

the

reco

mm

en

de

do

pe

ratin

gra

ng

e.

AP

erk

inE

lme

rM

od

el

6500In

du

ctiv

ely

Co

up

led

Pla

sma

Ato

mic

Em

issio

ns

Sp

ectro

me

ter

(ICP

—A

ES

)m

ea

sure

dth

eco

pp

er

co

nte

nt

of

the

ba

tha

t1

.05

oz/g

al

(7.9

3g

/l).T

he

an

aly

sis

me

tho

dis

de

scrib

ed

inA

pp

en

dix

B.

Atitra

tion

me

tho

dd

ocu

me

nte

din

-th

e-

EP

Ite

ch

nic

al

litera

ture

orn

Ato

mic

-Ab

so

rptio

nS

pe

ctro

sco

py

may

als

obe

use

dto

eva

lua

teth

eco

pp

er

leve

l.T

his

co

pp

er

co

nce

ntra

tion

me

asu

red

was

with

inS

PIT

Sra

ng

eo

f1

.0to

1.5

oz/g

al.

Atitra

tion

was

exe

cu

ted

tom

ea

sure

the

E-B

rite3

0/3

1e

lectro

lyte

co

nce

ntra

tion

.A

pp

en

dix

Bco

nta

ins

ad

escrip

tion

of

this

tech

niq

ue

.4

2.2

%b

yvo

lum

ee

lectro

lyte

was

me

asu

red

.A

cco

rdin

gto

the

da

tain

the

EP

Ite

ch

nic

al

litera

ture

,p

rese

nte

dg

rap

hic

ally

inF

igu

re8

,th

eco

rresp

on

din

gm

inim

um

%e

lectro

lyte

exp

ecte

dfo

ra

co

pp

er

co

nce

ntra

tion

of

1.0

5o

z./g

al

(7.9

3g

/l)is

42

.4%

.W

ed

idn

ot

co

rrect

for

the

0.2%d

efic

itp

rior

top

latin

go

ur

pa

rts.

At

this

time

we

did

no

tte

st

for

me

tallic

co

nta

min

an

tssin

ce

16

Ta

ble

4:C

om

pa

rison

of

Copper

Co

atin

gT

hickn

esse

s

CouponBath

Sampl.e

ThicknessM

aterialType

No.M

eanStd

Dc’!M

inimum

Maxim

umRange

Carpenter

49E—

BMte

30/301

10714

90123

33S

OO

miB

eaker2

1074

103114

113

998

84108

244

11410

100134

345

1248

110141

31

Carpenter

49Copper

Cyanide1

8910

75105

3011

LiterBath

276

S69

8516

380

672

9119

491

583

10219

583

1165

10136

va’siW~

‘~,4

~4~

~OS

~‘,4

~v~

ç

KovarE—

Brite30/30

197

589

10314

SO

Om

iBeaker

2116

1098

13840

3105

889

11728

4122

16107

15346

5118

10106

13630

KovarCopper

Cyanide1

1557

143168

2511

Lite

rBath

2156

15143

19249

3165

15140

19151

4153

6139

16122

5128

8111

13625

r2024

E—Brite

30/301

655

5672

16A

luminum

11Liter

Bath2

617

5070

203

9016

76131

554

848

72103

315

6318

4195

546

839

76103

27

2024Copper

Cyanide1

665

6075

15A

luminum

11Liter

Bath2

707

6186

253

718

6489

254

718

6489

255

669

5888

306

706

6585

20~

<~

‘~‘~

~P1f:~~

3U~

ou

rb

ath

was

esse

ntia

llyn

ew

.In

the

futu

rew

ew

illp

rob

ab

lych

eck

for

iron

,n

icke

l,a

nd

zin

cb

yIC

P.

Th

isa

na

lysis

will

be

pe

rform

ed

co

ncu

rren

tlyw

ithth

eco

pp

er

co

nte

nt

ICP

an

aly

sis

.A

cco

rdin

gto

EP

I,m

eta

llica

nd

org

an

icim

pu

rities

wo

uld

req

uire

ad

ditio

na

le

lectro

lyte

(E—B

rite3

0/3

1)

ove

ra

nd

ab

ove

tha

tre

qu

ired

for

the

co

pp

er

co

nce

ntra

tion

.T

his

req

uire

da

dd

ition

al

ele

ctro

lyte

ad

ditio

nca

nbe

de

term

ine

du

tilizin

ga

Hu

llce

ll.

Ou

rfir

st

pla

ting

atte

mp

tin

the

E-B

rite3

0/3

0b

ath

resu

lted

ina

fair

loo

kin

grib

bo

nw

ithg

oo

da

dh

esio

n,

an

dth

eco

rrect

thic

kn

ess

bu

tsom

ed

ark

en

ed

are

as.

The

ba

thw

asm

ain

tain

ed

at

12

0°F

an

dth

ep

arts

we

rep

late

da

ta

cu

rren

td

en

sity

of

ap

pro

xim

ate

ly15

am

pe

res

pe

rsq

ua

refo

ot

(AS

F).

Th

ese

da

rke

ne

da

rea

sw

ere

evid

en

ton

bo

thth

erib

bo

nits

elf

an

dits

11

00

allo

ya

lum

inu

mfix

ture

.

Fig

ure

1d

isp

lays

the

ribb

on

co

iled

onits

fixtu

re.

Th

efix

ture

isa

.03

2in

ch

dia

me

ter

1100a

lum

inu

mro

d.

Fig

ure

9p

rese

nts

the

da

rke

ne

da

rea

son

the

fixtu

rea

to

ptic

al

ma

gn

ifica

tion

leve

ls.

Fig

ure

10p

rovid

es

asca

nn

ing

Ele

ctro

nM

icro

sco

pe

(SE

M).

ph

oto

.A

tth

ish

igh

er

ma

gn

ifica

tion

,th

ed

ark

en

ed

are

as

ap

pe

ar

rou

gh

er

an

dco

nta

ina

co

pp

er

oxid

ew

hile

the

bu

lkp

latin

go

fth

ero

dp

ictu

red

inF

igu

re11

ap

pe

ars

un

iform

.

As

are

su

lto

fth

efin

din

gs,

we

de

cid

ed

top

late

dumm

yfix

ture

sto

iso

late

the

cau

seo

fth

ed

ark

en

ed

are

as.

At

first,

we

su

sp

ecte

dth

at

en

trap

me

nt

of

pla

ting

or

cle

an

ing

so

lutio

ns

at

the

su

rface

ind

uce

db

yin

ad

eq

ua

terin

sin

gw

asth

ecu

lprit.

Su

bse

qu

en

tly,

we

imp

rove

do

ur

rinsin

ga

nd

dry

ing

tech

niq

ue

sw

hic

hp

artia

llye

nh

an

ced

the

ap

pe

ara

nce

of

the

rod

bu

td

idn

ot

alle

via

teth

ep

rob

lem

.N

ext,

we

su

rmis

ed

tha

tin

ad

eq

ua

tee

xcha

ng

eo

fth

eso

lutio

nw

aso

ccu

rring

at

the

su

rface

of

the

pa

rts.

As

are

su

ltw

eb

ub

ble

db

ottle

dw

eld

ing

gra

de

nitro

ge

nth

rou

gh

the

ba

th.

Th

ise

limin

ate

d-th

ed

ark

en

ed

are

as.

Afte

rth

esu

cce

ss

of

ou

rfix

ture

pla

ting

exp

erim

en

t,w

ep

late

do

ne

he

at

trea

tb

atc

ho

fth

erib

bo

n.

Th

isco

rresp

on

ds

to3

gro

up

so

ffiv

ero

ds

ea

cho

ra

pp

roxim

ate

ly150

to180

finis

h~

da

sse

mb

lies.

One

gro

up

isp

late

da

ta

time

,so

we

esse

ntia

llyp

erfo

rme

dth

ree

run

s.

We

ma

inta

ine

da

llo

fo

ur

cu

rren

tsu

rface

cle

an

ing

an

dp

rep

ara

tion

op

era

tion

so

nly

alte

ring

the

actu

al

pla

ting

ba

thin

wh

ich

the

pa

rtsa

rep

late

d.

Ta

ble

5p

rese

nts

the

pla

ting

co

nd

ition

sa

nd

the

resu

ltsfo

re

ach

gro

up

of

ribb

on

.

When

exa

min

ed

at

ap

pro

xim

ate

lylo

x,

no

ne

of

the

pa

rtsd

isp

laye

da

ny

evid

en

ce

of

blis

ters

,p

ee

ling

,o

rp

itting

.N

osig

ns

of

damage

toth

ea

lum

inu

mrib

bo

nw

ere

ob

se

rve

d.

Th

ea

dh

esio

nw

ase

va

lua

ted

ono

ne

sam

ple

from

ea

chg

rou

p.

A

18

Fig

ure

8E

-Brite

30

/31

Mm

..%

Re

qu

ired

for

Co

pp

er

Le

ve

l

Copper

Level,g

ram

s/liter

7.508.25

9.009.75

10.5011.25

100

19

0

LU80

—.—

--—

——

1’

10

601.001.50

2.002.50

-C

op

pe

rLe

vel,

ou

nce

s/ga

llon

19

Fig

ure

~D

ark

en

ed

Are

as

on

E—

Brite

30

/30

Co

op

er

Pla

ting

on

Alu

min

um

1100R

od

a.

9.6

z

b.

25

.6X

20

Fig

ure

10D

ark

en

ed

Are

as

on

E—

Brite

30

/30

Co

op

er

Pla

ting

on

Alu

min

um

11

00

Ro

d

a.

44

8X

b.

59

30

X

21

Fig

ure

12E

—B

rite3

0/3

0C

op

pe

rP

late

dA

lum

inu

mR

ibb

on

22

TABLE 5: RESULTS OF 6061 ALUMINUM RIBBON PLATING IN EBRITE 30/30 COPPER BATH

PLATING PARAMETERS PLATING RESULTSCurrent! Current Average

Sample Group Density Time Visual ThicknessGroup Area, sq ft m/a ASF Mm, Adhesion Appearance uin

A 0.027 320 12 5.8 pass pass 675 rods (.0051 per

flex lead)

5 0.027 320 12 6.3 pass pass 79S rods (.0051 per

flexlead)

C 0.027 320 12 5.8 pass pass 64S rods (.0051 per

flex lead)

Test Methods

Adhesion — A piece of masking tape was applied to a sample of aluminum ribbon from each group. Usingtweezers, the ribbon was rapidly removed. The plating was examined for lifting.

Visual Appearance — Every rod of ribbon was examined under a microscope at approximately lOX. Anyevidence of peeling, blisters, or pitting were noted.

Thickness — Thicknesses were measured on all rods using X—Ray Fluorescence on a Twintest XRF—PTGutilizing calibration standards.

TA

BL

E6

:C

OP

PE

RP

LA

TIN

GT

HIC

KN

ES

SE

SO

N6

06

1

AL

UM

INU

MR

IBB

ON

-E

-BR

ITE

30

/30

BA

TH

E-B

rite3

0/3

0B

athT

emperature

=120

FC

urrentper

Group

=320

millia

mp

ere

sC

urrentD

ensity=

12ASF

PLATING

THIC

KNESS

RESU

LTSG

roupID

Thickness,

uinP

latingS

ample

Reading

Reading

Overall

for

Group

Tim

eNo.

12

A1

8266

Average

Thickness

672

6566

Standard

Deviation

12.85.8

mm

.3

5483

Minim

um49

456

85M

aximum

855

6649

Range

37

B1

6393

Average

Thickness

792

9656

Standard

Deviation

16.46.3

mm

.3

9478

Minim

um53

481

87M

aximum

965

9353

Range

43

C1

6878

Average

Thickness

642

7873

Standard

Deviation

12.65.8

mm

.3

5842

Minim

um42

452

59M

aximum

785

7858

Range

36

Thickness

—T

hicknessesw

erem

easuredusing

X—Ray

Fluorescence

ona

Tw

inte

stXRF—

PTGu

tilizing

calib

ratio

nstandards.

TA

BL

E]:

CO

PP

ER

PLA

TIN

GT

HIC

KN

ES

SE

SO

N6

06

1A

LUM

INU

MR

IBB

ON

-C

OP

PE

RC

YA

NID

EB

AT

H

PLATING

THIC

KNESS

RESULTST

hickness,uin

LotID

Sam

pleR

eadingR

eadingO

verallfo

rG

roupNo.

12

9L7U1

8677

Average

Thickness

702

6180

Standard

Deviation

9.53

7466

Minim

um53

466

69M

aximum

865

6553

Range

32

9L7V1

6262

Average

Thickness

632

6959

Standard

Deviation

4.73

6060

Minim

um55

466

68M

aximum

695

6755

Range

14

9L7X1

7269

Average

Thickness

682

7466

Standard

Deviation

11.3

368

75M

inimum

404

8374

Maxim

um83

540

64R

ange43

Thickness

—T

hicknessesw

erem

easuredusing

X—Ray

Fluorescence

ona

Tw

inte

stXRF—

PTGu

tilizing

calib

ratio

nstandards.

pie

ce

of

ribb

on

was

pla

ce

don

some

ma

skin

gta

pe

.It

was

the

nre

mo

ved

rap

idly

.N

oliftin

go

fth

ep

latin

gw

aso

bse

rve

d.

The

thic

kn

esse

sw

ere

me

asu

red

by

X—

Ray

Flu

ore

sce

nce

.Tw

om

ea

sure

me

nts

we

rea

cq

uire

dp

er

alu

min

um

ribb

on

.T

ab

le6

co

nta

ins

the

thic

kn

ess

me

asu

rem

en

ts.S

ome

rece

nt

pro

du

ctio

nd

ata

from

the

co

pp

er

cya

nid

eb

ath

isin

clu

de

din

Ta

ble

7fo

rco

mp

aris

on

pu

rpo

se

s.

The

alu

min

um

ribb

on

like

the

cou

po

ns

exp

erie

nce

da

gre

ate

rva

riab

ilityin

thic

kn

esse

sin

the

EB

rite3

0/3

0b

ath

tha

nth

eco

pp

er

cya

nid

eb

ath

.

Asa

mp

leo

frib

bo

nfro

mo

ne

rod

of

ea

chg

rou

pw

ase

xam

ine

db

yS

EM

.F

igu

re12

dis

pla

ys

alo

wm

ag

nific

atio

nvie

w,

5.4

X,

of

the

E—

Brite

30

/30

ribb

on

.F

igu

res

13th

rou

gh

15p

rese

nt

SEMp

ho

tog

rap

hs

of

are

pre

se

nta

tive

are

ao

fsu

rface

from

ea

cho

fth

esa

mp

les.

Fig

ure

16p

rovid

es

aco

mp

aris

on

with

aco

pp

er

cya

nid

ep

late

drib

bo

n.

Bo

thth

eE

-Brite

30

/30

an

dth

eco

pp

er

cya

nid

eco

atin

gs

dis

pla

ye

dsom

ep

inh

ole

de

fects

at

ma

gn

ifica

tion

so

fa

pp

roxim

ate

ly5000

to6

00

0X

.T

he

EB

rite3

0/3

0a

pp

ea

red

tod

isp

lay

aslig

htly

larg

er

nu

mb

er

of

the

se

de

fects

inth

ea

rea

se

xa

min

ed

.

One

rod

from

ea

chg

rou

pw

asfa

bric

ate

din

tofle

xle

ad

asse

mb

lies.

See

Fig

ure

3fo

rth

ea

ssem

bly

co

nfig

ura

tion

.T

he

sero

ds

exp

erie

nce

dth

efu

llm

an

ufa

ctu

ring

pro

ce

ss.

Firs

t,th

ey

we

recu

tto

siz

ea

nd

so

lde

red

tob

ery

llium

co

pp

er

clip

su

tilizin

gan

R}~IAF

lux,

ALP

HA

61

1.

No

diffic

ultie

sw

ere

exp

erie

nce

din

this

ste

p.

Ato

tal

of

36a

sse

mb

lies,

12fro

me

ach

rod

we

rep

rod

uce

d.

Ne

xt,

the

exp

ose

dco

pp

er

co

atin

gw

ase

lectro

lytic

ally

strip

pe

din

ach

roi~

ica

cid

so

lutio

n.

Su

bse

qu

en

tly,

the

exce

ss

ribb

on

onth

ea

sse

mb

lye

xp

erie

nce

da

pu

llte

st

toe

nsu

reth

eb

on

dstre

ng

tho

fth

eso

lde

rjo

int.

All

of

the

sam

ple

ssu

rviv

ed

this

test.

Fin

ally

,th

ea

sse

mb

lies

we

rein

sp

ecte

da

ta

ma

gn

ifica

tion

of

SXfo

rco

pp

er

rem

ova

l,rib

bo

nsu

rface

co

nd

ition

;a

nd

ap

pe

ara

nce

of

so

lde

rjo

ints

.T

hirte

en

of

the

asse

mb

lies

we

rere

jecte

dfo

rin

su

fficie

nt

co

pp

er

rem

ova

l.T

he

seth

irtee

na

sse

mb

lies

the

ne

xp

erie

nce

da

seco

nd

strip

pin

go

pe

ratio

nto

rem

ove

all

of

the

co

pp

er.

Th

isco

rresp

on

ds

toa

pp

roxim

ate

ly26

to40

seco

nd

sto

tal

com

bin

ed

time

for

bo

thth

efir

st

an

dse

con

dstrip

pin

go

pe

ratio

n.

Ou

rcu

rren

tp

roce

ss

allo

ws

for

do

ub

lestrip

pin

gi.e

.,26

seco

nd

s-to

tal

with

inth

estrip

pin

gso

lutio

n.

All

of

the

se

asse

mb

lies

pa

ssed

ase

con

din

sp

ectio

n.

Ne

xt,

the

co

mp

lete

da

sse

mb

lies

we

ree

xam

ine

db

yS

EM

.P

artià

ula

ra

tten

tion

was

pa

idto

the

alu

min

um

ribb

on

.F

igu

res

17th

rou

gh

19d

isp

lay

the

alu

min

um

ribb

on

from

anE

Brite

30

/30

strip

pe

da

sse

mb

ly,

anE

—B

rite3

0/3

0d

ou

ble

strip

pe

da

sse

mb

ly,

an

da

co

pp

er

cya

nid

estrip

pe

da

sse

mb

ly.

All

of

the

se

ribb

on

se

xh

ibit

gra

inb

ou

nd

ary

etc

hin

g.

26

Fig

ure

13E

—B

rite3

0/3

0C

op

pe

rC

oa

ting

on

6062.A

lum

inu

mR

ibb

on

-

a.

42

5X

b.

53

00

X

Gro

up

A

27

N)03

01w00x

C?)x

a.a.0

Fig

ure

15

E—

Brite

30

/30

Co

pp

er

Co

atin

go

n6

06

1A

lum

inu

mR

ibb

on

-

a.

44

3X

b.

53

b0

X

Gro

up

C

29

XO

Ocg

-q

X6

~•~

Fig

ure

176

06

1A

lum

inu

mR

ibb

on

inE

-Brite

30

/30

Asse

mb

ly-

Afte

r3.

Strip

pin

gC

ycle

of

13S

eco

nd

s

a.

47

5X

b.

53

30

X

31

Fig

ure

18

60

61

Alu

nzjn

t,.jnR

ibb

on

inE

—B

rite3

0/3

0A

sse

mb

ly—

Afte

r2

Strip

pin

gC

ycle

sfro

m2

6to

40S

eco

nd

sT

ota

l

a.

443X

b.

5900X

32

Fig

ure

196

06

1A

lum

inu

mR

ibb

on

inco

pp

er

Cya

nid

eA

ssem

bly

-

Afte

ra

Strip

pin

gC

ycle

of

13to

26se

con

ds

a.4

43

X

b.

58

90

X

33

Th

eco

mp

lete

da

sse

mb

lies

we

reth

en

su

bm

itted

totw

oa

dd

ition

al

qu

alific

atio

nte

sts

,e

lectric

al

testin

ga

nd

so

lve

nt

cle

an

ing

testin

g.

Th

ee

lectric

al

testin

gin

vo

lve

dste

ad

ilyin

cre

asin

gth

ecu

rren

tth

rou

gh

the

flexle

ad

asse

mb

lies

un

tilfa

ilure

.T

hre

efie

xle

ad

sfro

me

ach

gro

up

we

reim

me

rsed

ina

bro

mo

trifluo

reth

yle

ne

da

mp

ing

fluid

.A

800h

ertz

cu

rren

tsta

rting

at

1a

mp

ere

was

ap

plie

dfo

r10

min

ute

s.

Th

ecu

rren

tw

asin

cre

ase

din

incre

me

nts

of

.25

am

pe

res

an

dre

pe

ate

du

ntil

3a

mp

ere

sw

asre

ach

ed

.N

ofu

sin

go

fa

ny

of

the

flexle

ad

asse

mb

lies

was

ob

se

rve

d.

Th

ecu

rren

tw

asth

en

slo

wly

incre

ase

du

ntil

fusin

gw

aso

bse

rve

d.

Th

efle

xle

ad

sfro

ma

llo

fth

eg

rou

ps

exp

erie

nce

dfu

sin

ga

t3

.5a

mp

ere

so

ra

bo

ve

.T

he

E—

Brite

30

/30

flexle

ad

asse

mb

lies,

reg

ard

less

of

strip

pin

gtim

e,

de

mo

nstra

ted

eq

uiv

ale

nt

cu

rren

tca

rryin

gp

rop

ertie

sto

the

co

pp

er

cya

nid

ea

sse

mb

lies.

Th

ere

fore

,th

eE

—B

ritep

latin

gp

roce

ss

pro

du

ce

dn

on

eg

ativ

ee

lectric

al

pro

pe

rtye

ffects

.

Th

eso

lve

nt

cle

an

ing

test

was

pe

rform

ed

ina

Cre

st

14

10

ultra

so

nic

de

gre

ase

ra

ta

po

we

ro

f75

±5

wa

ttsfo

ro

ne

min

ute

infre

on

11

3.

Th

isis

the

mo

sta

gg

ressiv

ecle

an

ing

tha

tth

efle

xle

ad

asse

mb

lies

wo

uld

en

co

un

ter

ino

ur

pro

du

ctio

nlin

e.

All

of

the

asse

mb

lies

en

du

red

the

cle

an

ing

pro

ce

ss

with

no

vis

ua

ldam

agea

tlO

X.

All

of

the

co

mp

reh

en

siv

ete

stin

go

fth

eE

—B

rite3

0/3

0co

pp

er

pla

ting

pro

ce

ss

onth

ezin

ca

ted

alu

min

um

flexle

ad

sh

as

pro

du

ce

dp

ositiv

ere

su

lts.

Th

eE

-Brite

30

/30

co

pp

er

pla

ting

pro

ce

ss

ha

sm

et

ou

rp

rima

ryre

qu

irem

en

tso

fg

oo

da

dh

esio

n,

acce

pta

ble

ap

pe

ara

nce

s,

an

dso

lde

rab

ility.

Som

ed

ifficu

lties

instrip

pin

gth

ed

ep

osit

we

ree

nco

un

tere

d.

Ho

we

ver,

the

se

strip

pin

gp

rob

lem

sa

ren

ot

un

usu

al.

Th

ey

occu

rp

erio

dic

ally

with

the

cu

rren

tco

pp

er

cya

nid

ep

roce

ss.

Ou

rp

rima

ryco

nce

rnw

ithstrip

pin

gth

ea

sse

mb

lyfo

rlo

ng

er

pe

riod

so

ftim

ein

vo

lve

sn

ot

the

flexle

ad

bu

tth

eb

ery

llium

co

pp

er

clip

sto

wh

ich

the

ya

reso

lde

red

.T

he

seclip

sa

rea

ttacke

dd

urin

gth

estrip

pin

gp

roce

ss.

To

oe

xte

nsiv

ea

du

ratio

nin

the

strip

pin

gso

lutio

nca

na

lter

the

dim

en

sio

ns

of

the

clip

sre

nd

erin

gth

ee

ntire

asse

mb

lyw

orth

less.

~K

ova

rP

art

Te

stin

g

Ou

rm

ajo

rte

ch

nic

al

req

uire

me

nts

for

the

Ko

va

rfe

ed

thru

sa

refo

rg

oo

da

dh

esio

no

fth

eco

atin

ga

nd

co

mp

atib

ilityo

fth

ep

latin

gso

lutio

ns

with

the

gla

ss

an

dg

lass

tom

eta

lse

als

.P

ho

tog

rap

hs

of

the

se

pa

rtsa

rep

rese

nte

din

Fig

ure

20

.T

he

sep

arts

are

use

dto

se

al

ana

rea

ino

ur

gyro

.E

lectric

al

lea

ds.

are

con

veye

dth

rou

gh

the

ho

les

inth

ep

ins

onth

isfe

ed

thru

he

ad

er.

Th

ele

ad

sa

reth

en

so

lde

red

into

34

pla

ce

an

dan

airtig

ht

se

al

isfo

rme

d.

Th

ep

ins

are

Ko

va

r,a

nic

ke

l—iro

n-c

ob

alt

gla

ss

se

alin

ga

lloy.

Th

ein

terio

rsu

rface

of

the

pin

isso

lde

rco

ate

dto

pro

mo

teg

oo

dse

alin

gp

rop

ertie

s.

-To

ach

ieve

this

so

lde

rco

atin

g,

we

ba

rrel

ele

ctro

pla

teth

ep

arts

inco

pp

er

cya

nid

eto

pro

vid

eg

oo

da

dh

esio

nfo

ra

su

bse

qu

en

tso

lde

re

lectro

pla

ting

pro

ce

ss.

The

orig

ina

lco

pp

er

pla

ted

Ko

va

rco

up

on

sth

at

we

pro

du

ce

dd

em

on

stra

ted

go

od

ad

he

sio

n.

We

ha

veno

rea

so

nn

ot

toe

xp

ect

the

actu

al

pa

rtsto

exh

ibit

the

same

qu

alitie

s.

As

me

ntio

ne

da

bo

veth

eco

pp

er

pla

ting

ste

pis

follo

we

db

yim

me

dia

tep

latin

gin

a6

0/4

0tin

lea

dso

lde

rb

ath

.T

his

ba

this

fluo

bo

rate

ba

sed

an

dh

as

ah

igh

tole

ran

ce

for

co

pp

er,

iron

an

dn

icke

lco

nta

min

atio

n.

No

pro

ble

ms

with

the

E-B

rite3

0/3

0co

atin

ga

rea

ntic

ipa

ted

with

this

so

lde

rb

ath

.

Th

eK

ova

rp

arts

are

cu

rren

tlyp

late

din

ab

arre

lfo

r65

min

ute

sin

the

co

pp

er

cya

nid

e.

Bo

thtim

eco

nstra

ints

an

dth

ed

esire

toke

ep

ou

rE

-Brite

ba

thcya

nid

efre

elim

ited

ou

ra

bility

toa

ttem

pt

tod

eve

lop

the

actu

al

ba

rrel

pla

ting

pro

ce

ss.

Cya

nid

ep

ois

on

sth

eE

-Brite

30

/30

ba

th.

We

on

lyp

osse

ss

on

ep

latin

gb

arre

lw

hic

his

use

dfo

rp

rod

uctio

n.

De

stro

yin

gth

ecya

nid

eis

qu

itea

len

gth

yp

roce

ss.

Itw

ou

ldre

qu

ireco

mp

lete

lyw

ash

ing

the

ba

rrel

with

sod

ium

hyp

och

lorite

the

nso

akin

git

ina

tan

ko

f2%

sod

ium

hyp

och

lorite

for

am

inim

um

of

24h

ou

rs.

Ne

xt,

wa

ter

rinsin

gfo

llow

ed

by

a2%

su

lfuric

acid

rinse

,fo

llow

ed

by

aw

ate

rrin

se

su

cce

ed

ed

by

an

oth

er

wa

ter

rinse

,a

5%p

ota

ssiu

mh

yd

roxid

erin

se

an

dm

ore

wa

ter

rinsin

gw

ou

ldb

en

ece

ssa

ry.

Inlig

ht

of

the

se

co

nsid

era

tion

s,

we

de

cid

ed

toh

an

dp

late

asm

all

qu

an

tityo

fth

ese

pa

rtsin

the

E-B

rite3

0/3

0b

ath

.

Tw

en

tyfe

ed

thru

he

ad

ers

an

dsom

ep

latin

gb

alls

we

rep

late

din

the

E-B

rite3

0/3

0b

ath

at

12

0°F

±5

°Fa

nd

1.5

am

pe

resfo

rth

irtym

inu

tes.

Hand

ag

itatio

no

fth

ep

arts

an

db

alls

inth

eir

me

tal

ba

ske

tw

asp

rovid

ed

.B

ottle

dn

itrog

en

was

bu

bb

led

thro

ug

hth

e-b

ath

;T

his

-was

no

ta

sim

ula

tion

of

the

ba

rrel

pro

ce

ss

bu

tan

atte

mp

tto

de

term

ine

the

co

rrosiv

ityo

fth

eso

lutio

nw

ithre

sp

ect

toth

eg

lass

an

dth

eg

lass

tom

eta

lse

als

.

Afte

rp

latin

g,

the

thic

kn

esse

so

fth

ed

ep

osits

onth

ep

ins

an

do

ute

rd

iam

ete

rw

ere

me

asu

red

by

X—

Ray

Flu

ore

sce

nce

.W

ere

qu

ire30

to200

mic

roin

ch

es

on

the

pin

s.

On

ly8

mic

roin

ch

es

we

red

ep

osite

don

the

pin

sw

hile

ap

pro

xim

ate

ly80

mic

roin

ch

es

we

red

ep

osite

do

nth

eo

ute

rd

iam

ete

r.T

he

vis

ua

la

pp

ea

ran

ce

an

da

dh

esio

no

fth

ed

ep

osit

we

ree

xce

llen

t.N

ext

toe

nsu

reth

ein

teg

rityo

fth

eg

lass

an

dth

eg

lass

tom

eta

lse

als

,w

eh

eliu

mle

ak

ch

ecke

dth

ed

evic

e.

Th

eh

ole

sin

the

pin

sw

ere

se

ale

dw

itha

ne

po

xy.

Th

ep

arts

35

Fig

ure

20K

ova

rF

ee

dth

ruH

ea

de

r

a.

Ap

pro

x.

Actu

al

Siz

e

b.

4.3

X

36

Fig

ure

21

Fe

ed

thru

Re

ad

er

with

Allo

y52

Pin

s

37

we

reth

en

mo

un

ted

ina

sp

ecia

llyd

esig

ne

dfix

ture

on

toa

he

lium

lea

kd

ete

cto

r.N

ole

aks

ine

xce

ss

of

1xl0

3cc

He

lium

/se

c/a

tma

tro

om

tem

pe

ratu

rew

ere

de

tecte

d.

No

damage

toth

eg

lass

or

gla

ss

tom

eta

lse

als

ha

do

ccu

rred

du

ring

ou

rp

latin

gp

roce

ss.

All

of

the

resu

ltsfro

mo

ur

limite

dp

latin

gte

sts

with

Ko

va

ra

nd

the

E-B

rite3

0/3

0co

pp

er

ba

tha

refa

vo

rab

le.

Th

ed

ep

osit

dis

pla

ys

go

od

ad

he

sio

n.

Th

ein

teg

rityo

fth

eg

lass

an

dg

lass

tom

eta

lse

als

rem

ain

su

nd

am

ag

ed

afte

rco

mp

letio

no

fth

isp

roce

ss.

E.

Allo

y52

Pa

rtT

estin

g

Cu

rren

tly,

the

pla

ting

of

this

fee

dth

ruh

ea

de

ris

be

ing

pe

rform

ed

at

ou

rsu

pp

liers

.T

his

su

pp

lier

pla

tes

the

Allo

y52

pin

so

nth

eh

ea

de

rp

ictu

red

inF

igu

re21

with

nic

ke

lp

rior

toso

lde

rp

latin

gth

em

.In

the

eve

nt

tha

tth

isp

roce

ss

ne

ed

ed

tob

ep

erfo

rme

don

site

,w

ea

reco

nfid

en

tfro

mo

ur

exp

erie

nce

with

pla

ting

the

Ca

rpe

nte

r49

cou

po

ns

an

dth

eK

ova

rg

lass

co

mp

atib

ilityte

sts

tha

tth

eE

-Brite

30

/30

Co

pp

er

co

uld

su

cce

ssfu

llyb

ea

pp

lied

wh

ilem

ain

tain

ing

bo

thg

oo

da

dh

esio

na

nd

the

inte

grity

of

ou

rg

lass

tom

eta

lse

als

.

V.

TO

XIC

SU

SE

RE

DU

CT

ION

AS

SE

SS

ME

NT

Th

isp

roje

ct

de

mo

nstra

tes

tha

tit

iste

ch

nic

ally

fea

sib

leto

co

pp

er

ele

ctro

pla

tea

va

riety

of

de

lica

tep

arts

with

ou

tth

en

ee

dfo

rcya

nid

e—

ba

sed

ele

ctro

pla

ting

so

lutio

ns.

Th

ere

pla

ce

me

nt

of

the

cya

nid

e-b

ase

de

lectro

pla

ting

ba

thw

ithth

eE

-Brite

30

/30

ba

thw

ou

ldre

du

ce

he

alth

an

de

nviro

nm

en

tal

risks.

Th

eco

mp

ositio

no

fth

eE

—B

riteb

ath

ise

sse

ntia

llyn

on

-h

aza

rdo

us

alth

ou

gh

sta

nd

ard

pre

ca

utio

ns

an

dp

rote

ctiv

ee

qu

ipm

en

ta

sa

reg

en

era

llyu

sed

ina

me

tal

finis

hin

go

pe

ratio

nsh

ou

ldb

ee

mp

loye

d.

Ho

we

ver,

the

sp

ecia

lp

reca

utio

ns

an

de

qu

ipm

en

tth

at

are

ne

ce

ssa

ryw

ork

ing

with

cya

nid

es

are

nolo

ng

er

ne

ed

ed

.T

hu

sa

ntid

ote

kits

,d

eco

nta

min

atio

nso

lutio

ns

an

dp

re—

arra

ng

em

en

tsw

ithth

elo

ca

lh

osp

ital

are

nolo

ng

er

req

uire

d.

Th

ep

rote

ctio

no

fw

ork

ers

from

accid

en

tal

exp

osu

reto

hig

hly

toxic

cya

nid

es

will

beo

ne

of

the

gre

ate

st

be

ne

fitsto

co

nve

rting

toth

eE

—B

ritep

roce

ss.

Ina

dd

ition

toth

ee

limin

atio

no

fcya

nid

es

from

the

wo

rkp

lace

the

follo

win

gb

en

efits

will

als

ob

ere

aliz

ed

:

38

•B

y—p

rod

uct

ge

ne

ratio

nin

the

form

of

co

nce

ntra

ted

so

lutio

ns,

rinse

wa

ters

an

da

ire

mis

sio

no

fcya

nid

es

are

co

mp

lete

lye

limin

ate

d.

•T

rea

tme

nt

of

the

E—

Brite

rinse

wa

ters

req

uire

so

nly

pHa

dju

stm

en

ta

nd

pre

cip

itatio

n.

Itco

nta

ins

noch

ela

ting

ag

en

ts.

Th

ise

limin

ate

sth

en

ee

dfo

rth

etw

o-s

tep

cya

nid

ed

estru

ctio

np

roce

ss

with

hyp

och

lorite

.

Th

eo

pe

ratio

na

llife

of

the

E-B

riteb

ath

ise

stim

ate

dto

be

the

same

as

acya

nid

eb

ath

.T

he

3-

Brite

ba

thca

nb

em

ain

tain

ed

with

ele

ctro

lyte

an

d•

co

pp

er

ad

ditio

ns.

••

Exis

ting

we

tted

eq

uip

me

nt

can

be

reu

se

dif

de

co

nta

min

ate

dto

rem

ove

all

trace

so

fcya

nid

e.

(Due

toth

esm

all

siz

eo

fo

ur

op

era

tion

s,

we

inte

nd

tore

pla

ce

ou

re

xis

ting

eq

uip

me

nt).

Fro

ma

toxic

su

sere

du

ctio

nsta

nd

po

int,

we

fou

nd

nore

aso

nn

ot

toco

nve

rto

ur

exis

ting

cyan

ide

—b

ase

dp

roce

ss.

VI.

EC

ON

OM

ICA

SS

ES

SM

EN

T

To

asse

ss

the

eco

no

mic

fea

sib

ilityo

fth

eco

nve

rsio

np

roce

ss,

we

eva

lua

ted

the

diffe

ren

ce

sb

etw

ee

nth

etw

om

eth

od

sfo

ra

lum

inu

mp

latin

ga

nd

de

term

ine

de

ithe

rth

ee

xpe

nse

co

sts

or

lab

or

ho

urs

invo

lve

d.

We

fou

nd

tha

tw

eco

uld

rea

lize

sa

vin

gin

dire

ct

exp

en

se

s,

alth

ou

gh

ad

ditio

na

lla

bo

rh

ou

rsw

ere

req

uire

dto

utiliz

eth

enew

pro

ce

ss.

Itsh

ou

ldb

en

ote

dth

at

as

are

su

lto

fth

esm

all

siz

eo

fo

ur

op

era

tion

s,

the

ab

so

lute

co

st

diffe

ren

ce

sa

ren

ot

as

imp

orta

nt

as

the

ym

igh

tbe

ina

larg

esca

lep

latin

go

pe

ratio

n.

Asu

mm

ary

of

the

ad

ditio

na

lco

sts

an

dsa

vin

gs

isp

rese

nte

din

Ta

ble

8.

Fu

rthe

rb

rea

kdo

wn

of

the

co

sts

isp

rese

nte

din

Ta

ble

9.

Th

esig

nific

an

tfa

cto

rsa

ffectin

gth

ee

co

no

mic

so

fth

eco

nve

rsio

na

re:

Ha

zard

ou

sw

aste

dis

po

sa

l

La

bo

rre

du

ctio

ns

from

red

uce

db

ath

an

aly

sis

prim

arily

for

ca

rbo

na

tes

an

dR

och

elle

sa

lts.

Incre

ase

dla

bo

rfo

ra

lum

inu

me

lectro

pla

ting

resu

lting

from

the

slo

we

rp

latin

gsp

ee

do

fth

e3

-B

rite3

0/3

0p

roce

ss.

39

Wh

ileth

ela

tter

facto

ris

the

mo

stsig

nific

an

tin

ou

rp

roce

ss,

itm

aybe

less

sofo

rp

arts

req

uirin

gth

icke

rd

ep

osits

sin

ce

ad

ditio

na

lw

ork

co

uld

be

pe

rform

ed

.In

ou

ra

lum

inu

mo

pe

ratio

ns

we

fou

nd

the

incre

ase

from

on

em

inu

te(c

ya

nid

eb

ath

)to

six

min

ute

s(E

—B

rite)

was

too

sh

ort

top

erfo

rmo

the

ra

ctiv

ities.

It

rem

ain

so

ur

inte

ntio

nto

co

nve

rtto

the

no

n—

cyan

ide

ba

sed

pro

ce

ss

for

the

wo

rkp

lace

sa

fety

rea

so

ns

dis

cu

sse

dp

revio

usly

eve

nth

ou

gh

the

co

sts

of

this

co

nve

rsio

nin

dic

ate

noo

ve

rall

sa

vin

gs

at

ou

rla

bo

rra

tes.

Ta

ble

8A

dd

ition

al

Co

sts

/Sa

vin

gs

of

E—

Erite

30

/30

Pro

ce

ss

An

nu

al

sa

vin

gs

Dire

ct

Exp

en

ses

(Ad

ditio

na

lC

osts

)

Pla

ting

Ba

th$

50W

aste

Dis

po

sa

l570

Cya

nid

eA

ntid

ote

Kits

200F

iltratio

nS

up

plie

s(5

0)

Nitro

ge

n(N

ote

1)(4

5)

Ne

tS

avin

gs

$7

25

/yr.

LAB

OR

Ele

ctro

pla

ting

Alu

min

um

(No

te2)

$(3

74

8)

An

aly

tica

l2397

Ne

tA

dd

ition

al

Co

st

$(l3

5l/y

r)

To

tal

Ad

ditio

na

lC

ost

$(6

26

/yr)

NO

TE

S:

1.

Nitro

ge

nw

asus~ed

inlie

uo

fd

lea

nd

rya

ir.In

sta

llatio

no

fa

co

ale

scin

gfilte

ron

aco

mp

resse

da

irso

urc

ew

ou

ldre

du

ce

co

sts

.

2.

Ad

ditio

na

le

lectro

pla

ting

lab

or

for

the

alu

min

um

pa

rtsb

ase

don

sh

ort

(6m

inu

te)

cycle

wh

ich

pre

clu

de

sco

ncu

rren

ta

ctiv

ity.

40

Ta

ble

9E

con

om

icC

om

pa

rison

of

Co

pp

er

Cya

nid

eB

ath

toE

—E

rite3

0/3

0

Ba

thM

ake—U

p-

Ch

em

ica

lsfo

ran

11lite

rB

ath

Co

pp

er

Cya

nid

eE

-Brite

30

/30

462gins

CuC

N@

$9

7/kg

5.5

liters

E—

Brite

30

/30

@$

11

/i5

50

ginsN

aCN

@$

55

/kg

De

ion

ize

Wa

ter

toM

akeU

p330

ginsN

a2CO

3@

$3

8/k

g660

gutsR

och

elle

Sa

lts@

$3

3/k

gD

eio

niz

ed

Wa

ter

toM

akeU

p

To

tal

Co

st

=$

11

0T

ota

lC

ost

=$61

Ba

thA

na

lysis

Fre

cTu

en

cya

nd

Ap

pro

xim

ate

Ho

urs

pH

,e

ve

rylo

t,.2

5h

rspH

,d

aily

when

inu

se

,.2

5h

rsF

ree

crc,e

ve

rylo

t,.5h

rsC

u,F

e,N

i,Zn

,m

on

thly

,1

hr

Cu,

mo

nth

ly,

1h

rE

-Brite

30

/31

,m

on

thly

,1

hr

Ca

rbo

na

tes,

qu

arte

rly,

4h

rsR

och

elle

Sa

lts,

qu

arte

rly,

4h

rs

Dis

po

sa

lC

ost

of

Dra

go

ut

Rin

se

&C

on

ce

ntra

te-

55G

al.

Drum

$6

90

$120

41

AP

PE

ND

IXA

Te

ch

nic

al

Da

taS

he

ets

HP

!E

lectm

che

mica

lP,”o

du

cts,In

c17000

LincolnA

venueN

ewB

erlin,W

I53151-2781(414)

786-0330FA

X(414)

786-9403

No

n—

Cya

nid

eA

lka

line

Co

pp

er

Pla

ting

E—

Brite

30

/30

E—

Brite

30

/30

pla

tes

dire

ctly

onste

el,

bra

ss,sta

inle

ssste

el,

zinca

ted

aluminum

andm

osth

igh

qu

ality

pro

pe

rl:prepared

zinc

die

castin

gs

inb

oth

rack

andb

arre

lin

sta

llatio

ns.

Leada

lloys

canbe

pla

ted

inra

cklin

es.

Ite

limin

ate

sth

en

ece

ssityo

fstrik

ing

incyanide

copper.E

—B

rite3

0/3

0e

limin

ate

sp

ote

ntia

lh

ea

lthand

en

viron

me

nta

llia

bility

andthe

hig

hco

sto

fw

astetre

atin

gthe

cyan

ide

.

Accid

en

tal

dra

g-in

of

E—

Brite

30/30in

toan

acid

copperso

lutio

nposes

noh

ea

lthhazards

dueto

evo

lutio

no

fpoisonous

cyan

ide

gasas

with

cyanideco

pp

er.

Theso

lutio

ndoes

no

thave

tobe

trea

ted

for

carbonatesas

with

cyan

ide

so

lutio

ns.

E—

Brite

30

/30

producesa

Lin

eg

rain

ed

,sm

ooth,dense

andd

uctile

copperd

ep

osit

which

isnon-porous

with

exce

llcbonding

pro

pe

rties.

Thep

late

may

beb

uffed

ea

sily

for

ah

igh

luste

r.It

hase

xce

llen

tth

row

ing

andco

verin

gpow

er.-It

isused

asa

pre

pla

tefo

rn

icke

land

acid

copper.

TheE

—B

rite3

0/3

0p

late

isan

exce

llen

th

ea

ttre

at

sto

p-o

ffand

EMI

sh

ield

.It

isa

lsoan

exce

llen

td

eco

rative

finis

hfo

rb

utto

ns,

rive

ts,

etc

.The

copperp

late

canbe

rea

dily

blackenedo

ro

xidize

dfo

ra

va

riety

of

attra

ctiv

ea

ntiq

ue

dfin

ish

es

suchas

thosefound

onw

all

pla

tes,

ligh

ting

fixtu

res

andb

uild

ers

hardware.

Zin

cd

ieca

stsu

rface

sm

ustbe

pro

pe

rlycleaned

with

EP

Vs

E-K

lee

n152

soakcle

an

er

anda

ctiv

ate

dw

ithE

-Pik

233.a

cidsa

ltfo

rmu

latio

n.

Some

die

cast

surfa

ces

may

req

uire

an

od

iccle

an

ing

with

E—Kleen

122.E

—E

rite3

0/3

0process

doesn

ot

req

uire

ana

uxilia

ryta

nk

andsp

ecia

lexpensive

ceramic

anodesfo

rco

ntin

uo

us

dumm

yp

latin

gas

oth

er

processesdo.

E—

Brite

30

/30

doesn

ot

req

uire

coatedanode

ba

skets

or

the

useo

fD

Iw

ateias

oth

er

pro

cesse

sdo.

TheE

—B

rite3

0/3

0b

ath

issta

ble

anddoes

no

thave

tobe

pe

riod

ica

llydum

pedand

rechar&as

with

oth

er

no

n-cya

nid

ea

lka

line

copperp

roce

sses.

E—

Brite

30

/30

issu

pp

lied

asa

liqu

idco

nce

ntra

tew

hichis

dilu

ted

with

tap

wa

ter.

PLATING

SP

EC

IYIC

AE

IOR

S

RAG

KP

LAT

ING

BA

RR

EL

PlA

TIN

G

Optim

umR

ange

60%50

to~75%by

volume

byvolum

e

1.5

oz/g

al.

1.2

to1

.8o

x/g

al.

9.8

9.5to

10

.01

40

°F120

to150°F

5to

10ASP

EQUIPM

ENT&

OPER

ATION

Copper

Anodes:

Anode/C

athodera

tio:

Filtra

tion

:

OPTICo

rE

flb

ar

stock

1.5

:1N

ote:In

ba

rrel

pla

ting

itis

imp

orta

nt

tohave

thep

rop

er

ratio

.C

alcu

late

them

aximum

cathodearea

be

fore

se

tting

upth

eprocess

andin

sure

tha

tth

eanode

areaequals

the

maxim

umcathode

area.A

lsoit

isre

qu

ired

tha

tth

eanode

areabe

suchth

at

the

anodecu

rren

td

en

sityis

su

fficie

nt

toco

rrod

ethe

anodes.

Continuous

10m

icron

,2-3

turn

sper

ho

ur.

Newfilte

rca

rtridg

es

must

beflu

she

dp

rior

touse

byre

circ

ula

ting

warm

wa

ter

thro

ug

hth

eca

rtridg

es.

Asu

lfur-fre

ecarbon

packm

ustbe

ma

inta

ine

don

the

ba

th--o

ne

poundp

er

100g

allo

ns

-change

we

ekly.

When

pla

ting

heavycopper

ConeC

i)n

il,or

more)

a1

micro

nfilte

ris

recomm

ended.

Co

nce

ntra

tion

.E

-Brite

30

/30

Copper

Me

tal

Optim

um

50%by

volume

Range

40to

60%by

volume

1.2

os/g

al.

1.0

to1

.5o

x/ga

l.pH

9.5

9to

10.5T

e,~

era

cure

120°F100

to150°F

Ca

tho

de

-Cu

rren

tD

en

sity--

l5to

3O

AS

P

An

od

e-C

urre

nt

Density-

--

5to

15ASP

Vo

ltag

e--

1-6

Vo

ltsA

gita

tion

Vigorous

Air

Pla

teT

hickn

ess

Minim

umo

f0.0002

inch

es

for

strik

e

5to

15ASP

5-

to18

Vo

lts2

-6

RPM

’sand

air

ag

itatio

n

(ove

r)

t—.tsrxte

.SU/JO(c

on

tinu

ed

)

Be

atin

g:

Sta

inle

ss

ste

el

or

titan

ium

ele

me

nts

or

co

ils.

Tank:

Mild

ste

el

line

dw

ithru

bb

er,

ko

rose

al

or

po

lypro

pyle

ne

ora

dropin

line

r.A

llp

lastic

tan

ksm

aybe

used.Large

po

lypro

pyle

ne

tanksm

ustbe

rein

forc

ed

.

Ve

ntila

tion

:N

otre

qu

ire,

butit

isa

goodp

ractic

eas

with

all

heatedp

latin

gso

lutio

ns.

Co

nta

ina

tion

:Lead

andcyanide

areco

nta

min

an

ts-

bathp

late

sw

ithb

lack

smut

when

con

tam

ina

ted

.

rn

AD

DITIvE

S-

-E

—B

rite3

0/3

0:,

Co

nce

ntra

teused

inm

ake-upo

fnew

ba

ths

andre

ple

nish

me

nt.

Contains

thecopper

me

tal

and-~

.the

oth

er

balancedcom

ponentso

fth

eb

ath

.

E—

Erite

30

/31

:E

lectro

lyte

rep

len

ishe

r.P

erio

dic

addsover~

E—

Brite

30

/32

:H

ighC

urre

nt

De

nsity

(MCD)

areab

oo

ster

usedw

ithra

ckp

latin

g.

.Charge

newra

ckbaths

with

3%by

volume.

Added

the

rea

fter

asneeded

basçdon

Bu

llce

llte

sts

for

burnin

HCD.F

orb

arre

lin

sta

llatio

ns

EE

lla

bw

illreco,m

uendle

ve

lo

f30/32.

E—

Erite

30

/35

:B

uffe

rto

co

ntro

lpH

.A

dd

ition

sdeterm

inedby

pHm

easurement.

Added

tora

ise

thep11

uponb

ath

make-up

andw

henthe

pHdecreases

froma

ciddrag

in.

pHC

ON

ThOL

FOR

E-E

RIT

h30/30

PLATING

SOLU

TION

ThepH

will

incre

ase

gra

du

ally

asthe

ba

this

usedand

thensta

biliz

ein

the

rangeo

f9

to1

0.5

.An

ele

ctro

nic

pHm

eterm

ustbe

used.p11

papershould

beused

on

lyfo

rspot

checks.E

Elw

illm

akerecom

mendations

for

low

erin

gpH

,if

ne

cessa

ry.

REPLENISHMENT

OF

PLATING

SOLU

TION

7E

-~rite

30/30co

nce

ntra

tehas

acopper

con

cen

tratio

no

f2

.4o

z/g

allo

n.

Ifthe

copperco

nce

ntra

tion

inth

ebath

decreases,a

dd

ition

so

fE

—B

rite30/30

con

cen

trate

arere

qu

ired

tore

ple

nish

the

copperand

the

oth

er

balancedcom

ponentsin

the

wo

rking

so

lutio

n.

Thestre

ng

tho

fth

ew

orkin

gso

lutio

nis

mo

nito

red

byd

ete

rmin

ing

the

copperco

nce

ntra

tion

.An

anodeto

cathodera

tiog

rea

ter

than1

.5:1

(example:

2:1

)w

illcause

the

copperto

climb

inth

eb

ath

,n

ece

ssita

ting

the

freq

ue

nt

ad

ditio

ns

of

E—

Brite

30

/31

ele

ctro

lyte

.E

—~

rite3

0/3

1e

lectro

lyte

isadded

ona

reg

ula

rb

asis

(da

ily)

tocom

plexthe

copperd

issolve

dfrom

the

anodesand

tore

pla

ced

rag

-ou

t.It’s

consumption

will

dependupon

dra

g-o

ut,

copperm

eta

lco

nte

nt

andm

eta

llicco

nta

jain

atio

nin

the

ba

th..

Thep

rop

er

leve

lo

fE

—B

rite3

0/3

1p

latin

gso

lutio

nm

ustbe

ma

inta

ine

dfo

rm

aximum

adhesi•

tothe

basem

eta

l.G

LEANIN

GP

AR

ISU

nlike

cyanideb

ath

s,th

eE

HB

rite30/30

so

lutio

ndoes

no

to

ffer

anycle

an

ing

.T

he

refo

re,

itis

extre

me

lyim

porta.to

eva

lua

teth

ecle

an

ing

inan

exis

ting

line

.C

leanersm

ustbe

free

-rinsin

g.

REThas

soakand

ele

ctro

cle

an

ers

,as

we

llas

acid

sa

lts,

tha

tare

com

pa

tible

with

the

E~

Zrite

30

/30

so

lutio

n.

ME

tAlLIC

CO

PP

flAN

ALYSIS.

--

..

--.

.-~

1.

Pip

ette

a5

ml.

sample

of

thep

latin

gso

lutio

nin

toa

250m

l.E

rlenmeyer

flask.

Add25

mls.

dis

tilled

or

de

ion

ized

wa

ter.

-.

-..

.-

2.A

dd2

to3

gram~

Amm

oniumE

ersü

lfate

-le

tstand

for

10to

15m

inu

tes.

(Sw

irla

fewtim

es

wh

ilew

aitin

g.)

3.A

dda

pp

roxim

ate

ly5

mls.

of

Am

monia.

So

lutio

nw

illbe

acle

ar

deepb

lue

.4

.Add

50m

Is.d

istille

do

rd

eio

nize

dw

ate

r.5

.A

dd4

to6

dropsPan

Ind

ica

tor.

(Do

no

tadd

more

tha

n6

dropsas

itw

illa

ffect

theend

po

int.)

6.S

olu

tion

sho

uld

bep

urp

leor

pa

lere

din

co

lor.

7.T

itrate

with

0.1NE

DIA

so

lutio

nto

aye

llow

-gre

en

endp

oin

t.C

alc

ula

tion

:-o

z/ga

l.o

fcopper

(mls.

of

ED

IA)

x0.170

No

te:

When

E—

Brite

30/30copper

isused

asa

rep

lace

me

nt

for

acyanide

copperp

latin

gso

lutio

n,

the

tan

ks,anodes

andanode

ba

rs,b

aska

tsand

ba

rrels

must

befre

eo

fcya

nid

eb

efo

rech

arg

ing

the

tan

kw

ithth

e30/30

so

lutic

Afte

rthe

removal

of

thecya

nid

eso

lutio

n,

the

equipment

shouldbe

washed

with

Hyp

och

lorite

so

lutio

nand

the

tan

ksoaked

for

24hours

in2%

Sodium

Hy-p

och

lorite

tod

estro

yre

sid

ua

lcya

nid

e.

Don

ot

ne

gle

ctra

cks,b

arre

ls,

he

atin

gand

filterin

gequipm

ent.A

fter

removal

of

the

Hyp

och

lorite

so

lutio

nand

wa

ter

rinsin

g,

ad

ilute

1to

2%S

ulfu

ricA

cidrin

se

shouldbe

used,fo

llow

ed

with

an

oth

er

rinse

with

cold

wa

ter

andthen

a5%

Potassium

Hydroxi

rinse

shouldbe

usedto

elim

ina

teth

ea

cid

.R

emove

the

alk

alin

erin

se

,rin

sew

ithco

ldw

ate

rand

thenm

akeup

the

tan

kw

ithth

eE

-l3rite

30/30so

lutio

n.

I~hend

estro

ying

cyan

ide

,fo

rced

ve

ntila

tion

sho

uld

beused

at

all

time

s,to

pre

ven

tto

xic

cyanidefum

esIto

,,a

ccum

ula

ting

.P

erso

nn

el

shouldbe

equippedw

ithse

lfco

nta

ine

db

rea

thin

ga

pp

ara

tus.

Be

stre

su

ltsare

ob

tain

ed

with

anew

tan

ko

rby

insta

lling

anew

flexib

lelin

er

ina

tan

kw

hich

pre

vio

usly

con

tain

acyanide

copperp

latin

gso

lutio

n.

Newanodes

andb

aske

tsa

rea

lsorecom

mended.

Copper

fromE

—B

rite30/30

rinse

wa

ter

byits

elf

or

mixed

with

oth

er

me

tallic

rinse

waters

isp

recip

itate

dby

con

ven

tion

al

Sodium

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roxid

etre

atm

en

tw

ithREX

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andREX

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sp

illo

fE

—B

rite30/30

req

uire

stre

atm

en

tw

ithlin

e.

-

CAU

TION

:-The

ErE

rite:

30/30co

nce

ntra

teis-

am

ildskin

irritan

t.,D

DN

~t

work

with

.E

-Brite

30/30w

itho

ut

first

rea

din

gand

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rstan

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gth

eN

ate

rial

Sa

fety

Data

Sheet

furn

ishe

dby

RET.

-.

PACKAGING

..

.:

.-

Five

(5)

and55

ga

llon

non—returnable

con

tain

ers.

-.

-

IHP

OIttA

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NO

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!

Thefo

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ine

thesu

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atso

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the

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irect

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6/9

3

JAN

—12—

19941

6:4

5FRO

MTO

16

17

76

91

70

9P

.01

MA

TER

IAL

SA

FETY

DATA

SH

EE

TS

ection1.

IdentityofM

aterialI

PR

OD

IJCrN

AM

EO

RN

UM

BE

RE

—S

rite3

0/3

0

DO

TP

MO

PE

RS

HIP

PIN

GN

AM

EC

ompounds

orA

gents,P

rop

rieta

ryE

lectro

pla

ting

Ad

ditiv

es,

Liq

uid

RC

CU

LA

T8

DF

IDE

NT

IFIC

AT

ION

$HIP

PJN

SID

NU

MB

ER

UN

--

-N

A-

--

OCTK

AZA

RD

CLA

SS

N0

N-R

’2A

RD

OU

S

Section

2.H

azardS

pecificationsS

ectIon313

SupplIer

Notification:

Thisproductcontains

thefollow

ingtoxic

chemicals

subjectto

thereporting

requirements

of

sectio

n3

13

oftheE

moryonw

Planning

andC

omm

unityR

ighI-To.knowActof

1986and

of40C

FR372

orother

hazardsunder

29C

FR1910.1200.

%S

TC

AS

NU

MS

EP

CH

EM

ICA

LN

AM

EW

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HT

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t..T

LY..

CA

RC

INO

GE

N

74

40

-50

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CuC

opper,g

asic

Sa

lto

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ectio

n313

~4

1.0

mg

/N3

1.0

mg

/N3

NO

-—

—-

Noo

the

rslis

ted

inS

ectio

n313

——

--

-—

—-

—-

-

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--

None

liste

din

1910.1200-

—-

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Water

&o

the

rnon-hazardous

no

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&tc

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96-

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uld

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RE

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TIVE

MATERIAL

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EP

RO

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CT

IVE

TO

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beo

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tthe

problemo

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nw

ouldbe

rela

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all

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el

OXIO

IZER—

XB

L000WX

INand

most

pla

stic

s.

-

OR

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NIC

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MS

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IBLE

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NG

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OM

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ITAN

T-

KIONEYTO

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-~

-_

__

__

RE

SP

IRA

TOR

YS

~T

EM

—x

Section

3.Safe

Usage

Da

taS

afe

tyg

lasse

s.It

isg

en

era

llyre

cog

nize

dth

at

con

tact

len

ses

sho

uld

no

tbe

wo

rnw

henEYES

wpzking

with

chemicals

becauseth

ey

may

co

ntrib

ute

toth

ese

verity

of

aneye

inju

ty.

PROTECTIVE

RES~R

4OR

YUse

on

lyw

ithve

ntila

tion

ad

eq

ijieto

keepa

irco

nce

ntra

tion

belowThY

ifuse

EQ

UIP

ME

NT

~encrate$

vaporo

rm

ists.If

XLVabove

isexceeded.

wear

NIO

SUapproved

resp

irato

r.TYPES

GLOVESR

ubber

OTHER

.Lang-sleeved

sh

irt,tro

use

rs,ru

bb

er

safe

tyshoes,

rub

be

rapron

GENERALM

ECHANICALYes

VEICTIUTIO

N

LOC

ALE

XH

AU

Sr

Pre

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dto

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inta

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tp

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to

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ashth

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PR

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AU

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NS

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;

The“lfO

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furnishedvn7houtw

arranty~,(~r~’kind.

Em

ployersshould

usethis

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4.E

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Data

EXTING

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ater

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STEPS109ETAKENS

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esp

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ilo

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all

amounts

of

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pe

rco

nta

min

ate

da

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nt

or

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‘S

ection5.

PhysicalH

azardD

ataF

LAM

MA

BILIT

YFLASH

PVINT

NONEM

ETHO

DU

SED:

STABLEx

CO

NO

mO

NS

TO*SO

IDNO

NE;T

AB

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I4AZARD

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ase

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LO

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ON

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CC

UR

xj*vO

IO:

~S

ection6:

Health

Hazard

Data

EFFECTS0~E

XP

OS

UA

E.SiG

NSAN

DSYM

PTOMS:

Human

ind

ustria

leX

periencehas

shown

nosig

nific

an

tin

ha

latio

nhazard

or

skin

irritatio

nw

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pe

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na

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es

are

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PR

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Nii

SK

INA

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OR

PTIO

N[3

SK

INO

REYE

CONThC~

Section

7.P

hysicaand

Chem

icalProperties

BOILING

PT..S

PE

CIF

ICG

RP

Ifl1.35

VOLATILECO

MPO

NENISW

ater

pH9

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MATERIAL

1SLIQUID

XPO

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ER

00

CR

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mu

sty

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8.M

anufacturerD

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NP

MS

NA

ME

SM

AIL

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Electrockietnicat

Products

Inc.17000

Lin

co

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irec8O

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~_Day

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ight

TE

CH

NIC

AL

DA

TAS

HE

ET

CU

PR

AL®

Alkaline,

non-cyanidecopper

platingprocess

CU

PR

AL”4

isa

non-cyanide,alkaline

processdesigned

toplate

thick,adherent,

fine-graincopper

depositsdirectly

onsteel,

brass,and

zincatedalum

inumin

rackand

barrelapplications.C

UP

RA

Lis

excellentasa

non-cyanide

copperstrike

andin

decorativecopper

platingapplications.

Itis

idealform

askingsteel

partsprior

toheat

treatingand

performs

well

incontinuous

stripapplications.

READ

ENTIR

ETE

CH

NIC

AL

DATA

SHEET

BE

FOR

EU

SING

ThiS

PRO

DU

CT.

HO

WTO

USE

CU

PR

AL

OP

ER

ATIN

GC

ON

DITIO

NS

Make-up

Com

positionPotassium

Carbonate

CU

PR

AL

Make-up

CU

PR

AL

GR

CU

PR

AL

Wetter

Carbonate

CIJP

RA

LM

aintenanceIndex

CU

PR

AL

Com

plexorC

UP

RA

LG

RC

UP

RA

LW

etterpH

at140°F

(60°C

)Tem

peratureC

athodeC

urrentDensity

SolubleA

nodeC

urrentD

ensityC

UP

RA

LA

uxiliaryA

nodeC

urrentDensity

Auxiliary

Cathode

toC

UP

RA

LA

uxiliaryA

nodeA

reaR

atioPlating

CellC

urrenttoA

uxiliaryC

ellCurrent

Ratio

Foreach100

gallons(378

L)Potassium

Carbonate

CU

PR

AL

Make-U

pC

UP

RA

LG

RC

UP

RA

LW

eller

38lb

(17kg)

33gallons

(125L)

1pint(473

mL)

1pint(473

mL)

6.0oz/gal(45

W1~)33%

byvolum

e0.1%

byvolum

e0.1%

byvolum

e

115to

4.5oz/gal(13

to34

gIL)75

to140

Units

20to

28%by

volume

0.05to

0.2%by

volume

0.05to

0.2%by

volume

9.5to

10.0l2O

to150

°F(49

to66

°C)S

to35

A/ft25

to15

A/ft2

50to

100A/ft2

1.To

aclean

processtank,add

33gallons

(125L)ofdeionized

water.

NO

TE:C

yanideIs

acontam

inanttothis

process.Ifthe

processtank

hasbeen

previouslyused

fora

coppercyanide

process,the

tankm

ustbe

scrubbedand

leachedw

itha

hotcaustic

sodasolution

[4ozigal(30

gIL)caustic

sodaat120

°F(49

°C)]

untilnotrace

ofcyaniderem

ainson

thetank

walls,

bottom,

oredges.

Theanode

andcathode

railsm

ustalso

befree

ofcyanide

encrustations.The

leachateand

anyother

cyanide-bearingm

aterialsm

ustbe

treatedand

dischargedIn

accordancew

itheffluentregulations

pertinenttothe

pointsourcedIscharge.

Optim

umR

ange2.5

ozlgal(19gIL)

100U

nits22%

byvolurhe

0.1%by

volume

0.1%by

volume

9.8140°F

(60°C

)20

A/ft210

AIft275

A/ft2

20:110:1

MA

KE

-UP

10:1to

25:110:1

to3:1

C1993

Enthone-OM

IInc.

CU

PRAL®

TechnicalDataSheet

Page2

of14

MA

KE

-UP

(Cant.)

2.A

dd33

gallons(125..L)

CU

PR

AL

Make-up

andstir

untildissolved.

DO

NO

TH

AVETH

EC

UP

RA

LA

UX

ILIAR

YA

NO

DE

SIN

THE

TANK

WH

EN~t4KlN

GU

PTH

EO

PE

RA

TING

BATH.

Check

thepH

;then

slowly

andcarefully

addliquid

potassiumhydroxide

(causticpotash

-45%solution)

untilthesolution

pHreaches

7.5to

8.0.9)o

notusesodium

hydroxideas

precipitationm

ayoccur.

3.A

dd37

pounds(11kg)

potassiumcarbonate

andm

ixuntildissolved.

4.H

angthe

baggedcopperanodes

onthe

anoderails

ofthem

aincell

(Process

Tank).Insertthe

CU

PR

AL

Auxiliary

Anodes

andsteel

orcopper

cathodesinto

theauxiliary

cell,w

hichw

illbe

operatedon

aseparate

auxiliaryrectifier.

5.B

ringthe

operatingsolution

closeto

itsoperating

volume

byadding

deionizedw

ater.S

tirthoroughly.6.

AdjustpH

to9.8

with

liquidpotassium

hydroxideand

thenadjustthe

solutionlevelto

operatingvolum

e.7.

Add

1pint

(473m

L)C

UP

RA

LG

R.

8.A

dd1

pint(473

mL)

CU

PR

AL

Wetter.

9.S

tirwelland

heattheoperating

solutionto

therecom

mended

temperature.

10.B

egincirculating

solutionbetw

eenthe

platingcelland

theauxiliary

platingcell.

ii.P

rocessis

nowready

forplating

operations.OPER

ATION

CU

PR

AL

Make-up

suppliesthe

copperions,

complexor,

andelectrolyte

neededfor

solutionm

ake-up.C

UP

RA

LM

ake-upshould

onlybe

usedfor

make-up

orw

henrecom

mended

bya

UD

YLITE

TechnicalR

epresentative.C

UP

RA

LM

aintenancesupplies

thecopper

ionsand

stabilizerneeded

forsolutionm

aintenance.C

UP

RA

LM

aintenanceis

depletedby

electrolysisand

dragout.Low

concentrationof

copperm

etaland

electrolytew

illproduce

lowcathode

efficiencyand

grainydeposits.

High

concentrationw

illresult

inpooradhesion.

CU

PR

AL

MaIntenance

must

becontrolled

bydaily

analysisand

additions.The

additionof

5gallons/i00

gallonsC

UP

RA

LM

ake-upw

illincreasethe

Maintenance

Indexby

8units.

CU

PR

AL

Com

plexoris

usedto

complex

thecopper

ions,thus,

providingadhesion

ofcopperm

etalto

theferrous

basem

etal.C

UP

RA

LC

omplexor

isdepleted

byelectrolysis

anddragout.

InsufficientC

UP

RA

LC

omplexor

will

resultinpoor

adhesion.H

ighconcentration

ofC

UP

RA

LC

omplexor

will

producelow

cathodeefficiency

andgrainy

deposits.C

arbonatesalts

areused

to-bufferthe

pH,

provideconductivity,

andprom

otedissolution

oftheelectrolytic

copperanodes.

Lowconcentration

ofcarbonates

will

causepH

fluctuationand

will

adverselyaffect

theappearance

ofthe

copperdeposit.

Potassiumcarbonate

isrecom

mended

forsolution

make-up.

Potassium

Bicarbonate

isrecom

mended

forcarbonatem

aintenance.C

UP

RA

LG

Ris

usedto

producea

fine-grained,lustrous

appearanceand

makes

thecopper

deposita

suitablesubstrate

forsubsequentplating.

InsufficientCU

PR

AL

GR

willresultina

grainy,dullappearance

which

yieldsunacceptable

subsequentplates.N

ormalconsum

ptionrate

is1

quartper1,300

ampere-hours.

CU

PR

AL

Wetter

isused

toreduce

pittingby

lowering

thesurface

tensionofthe

platingsolution.

Ifpittingis

observedin

platedparts,

0.1%(vlv)

CU

PR

AL

Wetter

shouldbe

added.If

excessiveam

ountsof

CU

PR

AL

Wetter

arerequired,

itm

aybe

indicativethat

thesolution

isseverely

contaminated

andis

inneed

ofabatch

carbontreatm

ent.O

peratingtem

peraturesbelow

therecom

mended

rangem

ayproduce

grainyand

burntdeposits.

Temperatures

abovethe

recomm

endedrange

may

resultingrainy

deposits.D

eionized/distilled

water

mustbe

usedfor

make-up

andallvolum

em

aintenanceadditions.

i~iQtaD

water

isto

beadded

tothe

CU

PR

AL

tank.IfpH

adjustment

becomes

necessary,use

liquidpotassium

hydroxide(45%

Wv)to

raisethe

solutionpH

andglacialacetic

acidto

lower

pH.V

ariationsin

pHm

ayresultin

agrainydepositand

pooradhesion.O

bserveC

UP

RA

LA

uxiliaryA

nodesonce

am

onthfor

degradationof

thesurface,

causingattack

ofthe

substrate,

CU

PRAL~

TechnicalDataSheet

Page3

of14

EQ

UIP

ME

NT

TankKoroseal,

PVClined

orapprovedrubber

lined

WA

RN

ING

:O

peratingtem

peratureover160°F

(71°C

)m

ayrequire

specialhigh

temperature

tanklining.

Auxiliary

Piating

CeIl*

Seepages

10and

11fora

detaileddescription.

Heating

Coils

Teflon

Heating

Control

Autom

atic

Ventilation

Required.

Solutionis

classifiedas

3-2by

OSH

A.

Plating

CellR

ectifierForfullrange

with

lessthan

5%ripple

Auxiliary

CellR

ectifier0

to6

Voltrectifierwith

lessthan

5%ripple

andcurrentcapabilities

ofatleast

10percentoftotalPlating

Cellcurrent

AirA

gitation&

Spiders*

PVDC

Anodes

PlatingC

ell:110

Alloy

ETPC

opperA

uxiliaryC

ell:C

UP

RA

LA

uxiliaryA

nodes

Auxiliary

CellC

athodeExpanded

steelorcopper

CopperA

nodeBags

Ifplatingto

thicknessof:

a)less

than0.2

Mils

Style100

7.5ounce

cottonw

ith48/80

threadcount

orStyle

120nylon

210denierw

ith58/62

threadcount

b)greaterthan

0.2M

ilsStyle

7020napped

polypropylene

Allbagsm

ustbedesized

andw

ashed.

FiltrationM

inimum

2turnovers

ofsolution

perhour

througha

linedor

nonmetallic

packableplate

filter.Filter

packingrnust

becom

posedof

cellulosem

ediasuch

asU

DYFIN

®984.

1to

2pounds

ofU

DY

SO

RB

®activated

carbonper

1,000gallons

operatingsolution

perweek

isrequired.

Consultan

Enthone-O

MlTechnicalService

Representative

fordesignand/or

materialrecom

mendations.

CO

NTR

OL

Thefollow

inganalyticalprocedures

arerecom

mended

foruse

bypersonnelw

hohave

beentrained

touse

laboratorypractices

which

areconsidered

safeand

prudentby

chemicalindustry

standards.S

uchpractices

includesuitable

personalprotective

equipment,

theuse

ofproper

equipment,

theuse

ofproper

methods

ofhandling

allchemicals

andproper

laboratoryprocedures.

CA

UTIO

N:

The

follo

wIn

gprocedures

involvethe

useof

po

ten

tially

hazardouschem

icals;m

anufacturer’sm

aterialsafety

datasheet

shouldbe

consultedand

theappropriate

safetycautions

followed.

CU

PRAL®

TechnicalDataSheet

Page4

of14

DE

TER

MIN

ATIO

NO

FM

AIN

TEN

AN

CE

IND

EXE

quipmentN

eeded

10m

Lpipet50

mL

burst50

mL

graduatedcylinder

300m

LE

rlenmeyerflask

Reagents

Needed

0.1N

ormality

ofSodiumThiosulfate

Solution1%

Soluble

StarchSolution

(1g/l00

mL)

10%P

otassiumIodide

Solution

(100giL)

Concentrated

Hydrochloric

Acid

-R

eagentGrade

Am

monium

Bifluoride-

Reagent

Grade

Procedure

1.Pipet

10.0m

Lofthe

sample

tobe

analyzedinto

a300

mL

Erlenm

eyerflask.2.

Add

0.5gram

sofam

monium

bifluoride,50m

Lofdeionized

water,

15m

Lofconcentrated

hydrochloricacid,

15m

Lofpotassium

iodidesolution,and

ito2

dropsofstarch

indicator.3.

Titratew

ith0.1

Norm

alityofsodium

thiosulfatesolution

toa

milky

white

endpoint.

4.M

aintenanceIndex

=V

x6.4

Where

V=

mL

ofsodiumthiosulfate

solutionused

inStep

3.The

additionof

5gallons

ofC

IJPR

AL

Maintenance

will

increasethe

Maintenance

Indexby

Sunits/lO

Ggallons.

DE

TER

MIN

ATIO

NO

FTO

TAL

CO

MP

LEX

OR

Equipm

entNeeded

10rnLpipet

50niL

buret300

mL

Erlenm

eyerflask1000

mL

volumetric

flask

Reagents

Needed

10%P

otassiumC

yanideS

olution-D

issolve100

grams

ofreagentgrade

potassiumcyanide

inabout700

ccofdeionized

water.

Dilute

to1

literusinga

volumetric

flask.C

AU

TION

:P

otassiumcyanide

solutionIs

extremely

toxic.A

voidcontact

with

skinor

eyes.D

onot

Ingest.R

emove

anddisposeofcontam

inatedclothing.

Incase

ofcontactoringestion,

seekm

edicalattentionim

mediately!

Magnesium

Chloride

Solution

-D

issolve20.3

grams

±01

grams

ofreagent

gradem

agnesiumchloride

hexahydrate(M

gCI26H

2O)

inabout500

mL

deionizedw

ater.D

iluteto

1liter

usinga

volumetric

flask.S

tandardizeagainsta

known

EDTA.

Am

monium

Chloride-A

mm

oniumH

ydroxideB

ufferS

olution-

Dissolve

50gram

sof

reagentam

monium

chloridein

400m

Lof

deionizedw

aterand

add400

mL

ofreagent

grade(28%

)am

monium

hydroxide.D

iluteto

1literusing

avolum

etricflask.

Eriochrom

eB

lackT

Indicator-

To100

grams

ofreagent

gradesodium

chlorideadd

0.20gram

sof

Eriochrom

eB

lackT

dye.M

ixthoroughly

andstore

ina

closedam

berbottle.

DE

TER

MIN

ATIO

NO

FTO

TAL

CO

MP

LEX

OR

Procedure

1.Pipet10

mL

ofthesam

pleto

beanalyzed

intoa

300m

LE

rlenmeyerflask.

2.U

singa

graduatedcylinder,

add15

mL

ofamm

oniumhydroxide

bufferand15

mL

ofdeionizedw

ater.

CUPRAL®Technical Data

SheetPage5

of14

DE

TER

MIN

ATIO

NO

FTO

TAL

CO

MP

LEX

OR

(Cont.)

3.S

lowly

add10%

potassiumcyanide

untiltheblue

coloris

dischargedarid

thesolution

becomes

colorless;then

add1

mL

more

ofthecyanide

solution.Do

notadd

anexcess.

Approxim

ately5

to10

mL

will

benecessary.

4.A

dda

smallam

ount(0.1)

ofthesolid

Eriochrome

BlackT

indicatoruntilthe

solutiondevelops

ablue

color.Too

intensea

colorwillm

akethe

endpointhard

tosee.

5.Titrate

with

0.1M

oLarm

agnesiumchloride

solutionuntilthe

solutionturns

fromblue

topurple.

(Iftheend

pointispassed,the

solutionturns

apink

color.The

trueend

pointisthe

changefrom

blueto

purple.)

6.P

roperlydiscard

thesolution

asa

cyanide-containingw

aste.

7.%

byvolum

etotalC

UP

RA

LC

omplexor

=V

xM

x14.3

Vis

theV

olume

ofmagnesium

chloride.M

isthe

Molarity

ofmagnesium

chloride.

DE

TER

MIN

ATIO

NO

FC

AR

BO

NA

TE

Equipm

entN

eeded

5m

Lpipet25

mL

graduatedcylinder

Chittick

Gasom

etricA

pparatus-see

page12

fordesignofthis

apparatus.~‘W

RC

atalog#19750-00

Carbon

Dioxide

Apparatus)

Reaaents

Needed

6N

ormalS

ulfuricAcid

(100m

11500deionized

water)

Procedure

1.Pipet5.0

mL

ofthesam

pleto

beanalyzed

intothe

gasevolution

flaskA

(seediagram

onpage

6).

2.C

onnectflask

Ato

theC

hittickG

asometric

Apparatus,

allowto

standfor

severalm

inutesto

attainequilibrium

,open

stopcockC

andadjust

theliquid

levelin

theburette

Dto

15.0m

Labove

0by

raisingleveling

bulbE.

3.C

losestopcock

Cand

slowly

add15

mL

of6N

ormality

ofsulfuric

acidsolution

fromburette

Fto

flaskA

while

slowly

lowering

theleveling

bulbE,

keepingthe

liquidlevelin

Eslightly

lowerthan

theliquid

levelin

buretteD.

4.V

igorouslysw

irlthecontents

inflask

Ato

evolveallthe•C

02arid

allowto

standforseveralm

inutesto

attainequilibrium

.

s.R

aisethe

levelingbulb

Funtilthe

liquidlevel

initis

atthesam

elevelas

theliquid

levelin

buretteD.

Read

thevolum

eofgas

evolvedin

mL

inburette

Dw

hichis

thereading

oftheliquid

levelinD

.

6.ozfgalC

arbonate=

Vx

0.070V

isthe

Volum

eofC

O2

gasevolved

asm

easuredin

Step5.

NO

TE:

Accuracy

of

them

ethodIs

sufficientw

ithoutusing

atem

peratureor

atmospheric

pressurecorrection

when

measuring

thegas

volume

inS

tep5.

CU

PRAL®

TechnicalDataSheet

Page6of14

CU

PR

AL

CA

RB

ON

AT

EE

QU

IVA

LEN

TS

PO

TA

SS

IUM

PO

TA

SS

IUM

CA

RB

ON

AT

EC

AR

BO

NA

TE

BIC

AR

BO

NA

TE

AD

DIT

ION

(43.5%C

03)(60%

CO

3)

0.25az/gal

0.57az/gal

0.42az/gal

0.5ozlgal

1.1oz!gal

0.83az/gal

1az/gal

2.3az/gal

1.7az/gal

2oz!gal

4.5az/gal

3.4az/gal

2.61az/gal

6az/gal

4.35az/gal

(standard)

3ozlgal

6.9ozlgal

5az/gal

3.5az/gal

8az/gal

5.8az/gal

4az/gal

9.2az/gal

6.7az/gal

DETERMINATIO

NO

FW

iiitH

INC

UPR

AL

Priortousing

thestalagm

ometertube,

thoroughlyclean

itbysoaking

ftforseveralhours

inchrom

icacid

solutionfollow

edby

thoroughand

carefulrinsing.This

cleaningoperation

neednotbe

carriedoutfor

eachuse

ofthestalagm

ometer.

Aftertheprim

arycleansing

ofthestalagm

ometer,

athorough

rinsingwith

distilledwater

issufficient.

How

ever,priorto

determination

ofthesurface

tension,the

stalagmom

eterm

ustbe

rinsedw

itha

portionofthe

solutionto

betested.

Donottouch

thepolished

droppingsurface

with

thefingers

sinceitm

ustbeclearand

freeofgrease.

Mount the

stalagmom

etersolidlyin

averticalposition

ona

ringstand.

Make

surethere

isno

vibration.

Procedure

1.A

djustthetem

peratureofallsolutions

tobe

testedto

68°F

(25±

1°C

).

2.R

insethe

stalagmom

eterwith

thetestsolution.

3.Fillthe

stalagmom

eterw

ithC

UP

RA

Ltest

solution.A

djustthe

solutionlevelto

theupper

zero.W

ipethe

baseofthe

stalagmom

eter.

4.N

owallow

thesolution

todrain

outofthe

stalagmom

eter,counting

thenum

berof

dropsdelivered

asthe

solutionflow

sbetw

eenthe

upperzerolevelto

thelowerzero

leveloftheinstrum

ent.

5.R

ecordthe

numberofdrops.

6.To

insurethat

theresults

areconsistent,

Steps

3to

5should

berepeated

threem

oretim

es.C

alculatethe

averageofallthe

attempts

tothe

nearestdrop.

7.R

insethe

stalagmom

eterseveraltimes

usingdistilled

water.

8.R

epeatS

teps1

to6

substitutingdistilled

waterto

calibratethe

stalagmom

eter.This

isdone

infrequentlyin

ordertocalibrate

theinstrum

ent.

9.U

singa

hydrometer,

determine

thespecific

gravityofthe

CU

PR

AL

solution.U

sethis

valueforthe

density(D

tc)ofthe

solution.

DE

TER

MIN

ATIO

NO

FW

ElT

ER

INC

LJPR

AL(C

ont.)

~CaIculation

Calculate

thesurface

tension(ST)

indyneslcm

usingthe

following

formula:

ST

=S

Tw

xDtcxN

wD

Wx

Ntc

Where:

ST

=S

urfacetension

ofCU

PR

AL

chromium

solutionS

Tw=

Surfacetension

ofdistilledw

aterD

tc=

Density

ofCU

PF1ALsolution

Dw

=D

ensityofdistilled

water

Nw

=N

umberofdrops

ofdistilledw

aterN

tc=

Num

berofdropsofC

UP

RA

L

Standard

Solution

SurfaceTension

Density

Distilled

Water

721.0

EX

AM

PLE

:

Drops

CU

PR

AL

solution74

Density

CU

PR

AL

solution1.310

Drops

ofdistilledw

ater36

ST=72

x1.310

X36=

~dynes/cm

1.0x

74

Determ

ineconcentration

ofCU

PR

AL

Wetterfrom

thefollow

ingchart.

CU

PRAL®

TechnicalDataSheet

Page

7cf

14

SURFACE TENSION EFFECT OF CUPkAL WETTING AGENT

-0-Incue(0 0o ~ -Dmoar

0.~ 0)

0)C’,Zr00

1~)0)wz>-0z0U)2LUILiiC)4Li~it:DU,

75

70

65

60

55

50 I—— - I

0 0_OS 01 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5

WETTING AGENT ADDITION (PERCENT)

CUPRAL SCHEMA1L~ DESIGN USINGOVERFLOW WEIR AS AUXILIARY TANK

-U-joD)OC

CD

o

4,.

000

FILTERANODE BAR

/

/ PLATING TANKB ARCATHODE

OVERFLOWSL00019O—A

UCzCzCF-

CU

PR

AL®

TechnicalData

SheetPage

lOaf

14

LDzIID

z

ci

II

>-

cCII

-JII><0C0~CC0-JC—;

C)

U)0

m-i

C,

>-ø

>1

>1

-4CC’)

zCl)-4

11~oc

03-.4

7~)

~ocCo (3

a0a,C,,00

•T1

C

C)

rn

CUPRAL®TechnicalD

ataSheet

Pagel2

of

14

PR

EC

AU

TIO

NA

RY

INF

OR

MA

TIO

N

DA

NG

ER

!C

UP

RA

LG

RM

AYC

AU

SE

SE

VE

RE

BU

RN

S.

CU

PR

AL

MA

KE

-UP

,C

UP

RA

LW

etter,C

UP

RA

LC

omplexor,

CU

PR

AL

Maintenance

IndexO

RTH

EO

PE

RA

TING

SO

LUTIO

NM

AY

CA

US

EIR

RITA

TION

,EYE

DA

MA

GE

.

HA

ZAR

DS

:C

UP

RA

LG

Ilm

aycause

severeburns

toskin

andeyes.

Inhalationm

aycause

respiratorytract

Irritation.Ingestion

may

causesevere

burns.C

UP

RA

LM

AK

E-U

P,

CU

PR

AL

Wetter,

CU

PR

AL

Com

plexor,C

UP

RA

LM

aintenanceIndex

orthe

operatingsolution

may

causeirritation

toskin

andeyes,

possibleeye

damage.

Inhalationofvapors

may

causeIrritation

tothe

respiratorytract.

Ingestionm

aycause

severeirritation

tothe

géstro-intestinaltract.

CO

NS

ULT

SU

PP

LIER

SM

SD

S’s

FOR

AD

DITIO

NA

LIN

FOR

MA

TION

.D

onotget

ineyes,on

skin,or

onclothing.

Do

notinhale

ortake

internally.

FIRS

TA

ID:

Incase

ofcontact

ofC

UP

RA

LG

R,

CU

PR

AL

MA

KE

’UP

,C

UP

RA

LW

etter,C

UP

RA

LC

omplexor,

CU

PR

AL

Maintenance

Indexor

theoperating

solutionw

ithskin

oreyes,flush

with

plentyof

clean,cool

water

for15

minutes.

Get

medical

attentionfor

eyes.R

emove

andw

ashcontam

inatedclothing

andshoes.

HA

ND

LING

INFO

RM

ATIO

N:

When

handlingC

UP

RA

LG

RC

UP

RA

LM

AK

E-U

P,

CU

PR

AL

Wetter,

CU

PR

AL

Com

plexor,C

UP

RA

LM

aintenanceIndex

orthe

operatingsolution,

wear

protectiveclothing,

chemical

safetygoggles,

respirator,face

shieldand

rubbergloves.

Exhaust

ventilationis

recomm

endedto

remove

vaporsthat

may

bogenerated

duringM

ake-Up

andO

peration.W

henpreparing

oradding

tosolutions,

always

addC

UP

RA

LG

RC

UP

RA

LM

AK

E-U

P,

CU

PR

AL

Wetter,

CU

PR

AL

Com

plexor,C

UP

RA

LM

aintenanceIndex

slowly

andcautiously.

Avoid

breathingvapors.

Avoid

contactw

ithacids,

oxidingagents,

alkaliesor

anyother

foreignm

aterial.D

onot

getin

eyes,on

skin,or

onclothing.

Do

nottakeInternally.

CO

NTA

INE

RIN

FOR

MA

TION

:K

eepcontainers

tightlyclosed.

Keep

closedw

hennot

inuse

toavoid

moisture

absorption.S

toreIndoors

Ina

cool,dry

area.Loosen

closurecautiously

when,opening.

Wash

thoroughlyafter

handling.D

onot

reusecontainers,

wash

beforedisposal.

Improper

disposalorreuse

ofthis

containerm

aybe

dangerousand

illegal.

RE

FER

TOM

SDS

FOR

FUR

THER

SA

FETY

AN

DH

AN

DLIN

GIN

FOR

MA

TION

.

Issued:11/05/93

Spsds:

02/03/92

CUPH

AL®

TechnicalData

SheetPage

13of

14

CUPRAL®

TechnicalDataSheet

Pagel4of

14

~MATER

IALSAFETY

DA

TASH

EETS

Form

oredetailed

information

onthe

toxicologicalpropertiesofthe

productsdescribed

herein,reference

canbe

made

tothe

MaterialS

afetyD

ataSheet

(MSD

S)for

eachproduct.

Ifyoudo

nothave

theproperM

SD

S,

itcanbe

requestedfrom

:E

nthone-OM

IInc.,

attention:R

egulatoryA

ffairsD

epartment,

P.O.

Box1900,

New

Haven,

CT

06508.For

emergency

assistancecallC

HEM

TREC

(800)424-9300.

WA

RR

AN

TYAN

DD

ISC

LAIM

ER

Theinform

ationpresented

hereinis

tothe

bestof

ourknow

ledgetrue

andaccurate

andall

recomm

endationsand

suggestionsappearing

inthis

bulletincovering

theuse

ofourproductsare

basedupon

information

believedto

bereliable.

How

ever,since

theconditions

ofuse

arebeyond

ourcontrol,

thisinform

ationis

givenon

theexpress

conditionand

agreement

thatE

nthone’OM

lInc.

will

notbe

liableto

anyperson

incontract,

tortQ

ncludingnegligence),

strictliability

orotherwise

foranyclaim

s,dam

agesor

lossesw

hatsoever.N

othingherein

shallbe

deemed

arecom

mendation

touse

anyproduct

orprocess

inviolation

ofanyexisting

patentrights

andno

warranties,

expressedor

implied,

arem

aderegarding

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ation,product,

processes,recom

mendations,

descriptionand

safetynotations

containedherein.

Theabove

includesproprietary

information

ofE

nthone-OM

lInc.

andis

furnishedto

youfor

youruse

solelyon

productsor

processessupplied

byus

toyou.

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MI(C

anada)M

ATE

RIA

LS

AFE

TYD

ATA

SH

EE

TS

Form

oredetailed

information

onthe

toxicologicalpropertiesofthe

productsdescribed

herein,reference

canbe

made

tothe

MaterialS

afetyD

ataSheet

(MSD

S)foreach

product.Ifyou

donothave

acurrent

MSD

S,itcan

berequested

fromthe

W.H

.M.I.S

.co-ordinator,

Enthone-OM

I(C

anada)Inc.

,58A

dessoD

rive,C

oncord,O

ntario,L4K

-3C6.

Forem

ergencyassistance

regardingaccidents

with

thisproduct

resultingin

containerrupture,

spills,poisoning,

bodilyinjury

orthreatsto

healthcall:

CH

EMTR

EC(800)

424-9300.

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(Canada)

WA

RR

AN

TYA

ND

DIS

CLA

IME

R

Theinform

ationpresented

hereinis

tothe

bestofour

knowledge

trueand

accurateand

allrecom

mendations

andsuggestions

appearingin

thisbulletin

coveringthe

useofourproducts

arebased

uponinform

ationbelieved

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reliable.H

owever,

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isgiven

onthe

expresscondition

andagreem

entthat

Enthone-OM

I(C

anada)Inc.

willnot

beliable

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strictliability

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whatsoever.

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hereinshall

bedeem

eda

recomm

endationto

useany

productor

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violationof

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patentrights

andno

warranties,

expressedor

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arem

aderegarding

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ation,product,

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mendations,

descriptionand

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containedherein.

Theabove

includesproprietary

information

ofE

nthone-OM

l(C

anada)’lnc.‘~and-is

furnishedto

youtoryour’use

solelyon

productsor

processessupplied

byus

toyou.

CU

STOM

ERO

RD

ERC

ENTER

SE

AS

TER

NR

EGIO

NP.O

.Box

1900,N

ewH

aven,C

T06508

(203)934-8611

CE

NTR

AL

RE

GIO

N21441

-Hoover

Road,

Warren,

Ml48089

(313)497-9100

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WE

ST

RE

GIO

N9809

IndustrialDrive,

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WE

STE

RN

RE

GIO

N2779

ElPresidio,Long

Beach,C

A90810

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CA

NA

DA

Enthone-OM

l(C

anada)Inc.,58,

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Drive,(416)

738-1400C

oncord(Toronto),

Ontario

L4K-3C6

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131Brunsw

ick,Pointe

Claire,

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(514)426-1451

ME

XIC

OEnthone-O

MI

deM

exico,S.A.,

Norte

59No.

896,(011-52-5)

587-1700C

oloniaIndustrialVallejo,

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Y16-260,

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®R

egisteredTradem

arkof

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MlInc.

“‘4Tradem

arkofE

nthone-OM

lInc.

fEnthone-O

Ml

(Canada)

Inc.is

theregistered

userinC

anadaunder

licensefrom

Enthone-O

MI

Inc.]

Enthone-O

MI

Knc.-

—A

subsidiaryofk

a~

EE

NTH

ON

E.S

EL.R

Ex.uD

YLITE

I

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ath

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sis

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EP

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lectro

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lPm

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17000Lincoln

Avenue

New

Beffin,

WI53151-2781

(414)786-9330

FAX

(414)786-9403

-D

ete

rmin

atio

no

fE

—B

rite3

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30

13

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et

10m

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30

/30

pla

ting

so

lutio

nand

pla

ce

itin

a600

ml.

be

ake

r.A

dd50

ml.

of

ILI.

wa

ter

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mp

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de

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nce

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ted

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.

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the

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Sodium

Hyd

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efro

ma

bp

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andra

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pHo

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4.6

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4.

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roth

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ter,

topH

11

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5.

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cord

the

nu

mb

er

of

mis

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use

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Erite

30

/31

,%

by

vo

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mis

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Hx

3.8

Minim

uma

mo

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to

f-E

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1.8

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mg

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Te

stin

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ep

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To:M

arthaJow

ett6/I4/94

4240:WJ:94-050

From:

BillJundzilS

ubject:G

6Flexleads

-P

rocessC

hangeToxic

Chem

icalE

limination

Program

SU

MM

AR

Y:

Inorderto

reducetoxic

chemical

use,a

newprocess

ofplatingG

6flexleads

was

tried.As

partofthe

testingofthis

newplating

process,m

easurements

were

made

todeterm

ineifthe

currentcarrying

capabilityofthe

flexleadsw

asdegraded.

No

degradationresulted

fromthe

newprocess.

Both

thestandard

processand

thenew

processflexleads

performed

thesam

e.The

averagefuse

currentforthestandard

processflexleads

was

4.1am

ps.The

newprocess

flexleadshad

anaverage

fusecurrentof4.0

amps.

TES

TP

RO

CE

DU

RE

:Three

groupsof

G6

flexleads,partno.

69387,w

eresentto

theEM

Labfor

analysis.G

roupI

flexleads,control

group,w

ereplated

usingthe

standardm

ethodcopper

cyanidesolution.

Groups

2and

3w

ereplated

inthe

newsolution,

E-Brite30/30.

Group

3flexleads

receivedextra

strippingtim

ein

thechrom

icacid

solution.G

roups2

and3

were

fabricatedunder

OC

N6666.

Thetestconsisted

ofim

mersing

3flexleads

fromthe

same

groupin

apetri

dishfull

ofgyrobrom

ofluid.

(Due

todegradation

ofthebrom

ofrom

theheat,the

bromo

was

replacedafter

eachtest.)

A800

Hz

current,starting

at1am

p,w

asapplied

for10

minutes.

ifno

fusingofthe

leadsoccurred,

thecurrentw

asincreased

by1/4

amp

andheld

foranother

10m

inutes.This

was

repeatedup

tothe

3am

plevel

(pasthistory

shows

leadsfusing

at2.5am

psand

above).The

currentwas

thenslow

lyincreased

untiltheflexleads

fused.This

testwas

repeated,3

newflexleads

pertest,

untilall

leadsw

erem

easured.The

fusecurrentfor

eachlead

isshow

nbelow

.

FUSE

CU

RR

EN

T(AM

P-TRM

S)C

uCn

E-B

riteE

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(restrip)4/13/93

Past

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roup2

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