vacuum cleanliness in the semiconductor industry
TRANSCRIPT
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Vacuum Cleanliness in the Semiconductor Industry
Alan Webb
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Caswell
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Semiconductor Processing
• Dry process techniques are fundamental in being able to produce the desired architectures required for today's and future semiconductor devices
• Economic considerations dictate large device
densities on wafers, implying smaller and smaller chips.
• As device sizes shrink, the need to work in cleaner
conditions becomes more apparent.
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Completed Wafers – 2, 3 and 6”
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High Yield – Low Cost
Smaller chip size - enhanced performance
Larger packing density - more chips per wafer
Contamination and cleanliness - becomes a major yield limiting factor
Protecting the wafer is the prime concern
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A Bonded Chip
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Layer Structures
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Device Fabrication • Key Process Steps
• Lithography
• Etching
• Contact
technologies
• Annealing
• Dielectrics
• Implantation
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Contamination and Cleanliness
• Minimise Contamination and Enhance Cleanliness
• Work in a controlled environment (e.g. a cleanroom )
• Tight specification of temperature, humidity and
particle control
• Temperature controlled to 1-2 °c
• Humidity within a 5% range
• Cleanroom designated “Class”
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Cleanroom Specification
• Defined by “Class”, which is a particulate measurement
• US Federal Standard No. 209 (BSI BS 5295) “Environmental Cleanliness in Enclosed Spaces”
• A Cleanroom of Specification Class X has no more than X particles of size 0.5 μm present in a cubic
foot of air
• Example : Class 10 cleanroom Particle count NOT to exceed a total of 10 particles per cu. ft. of size 0.5 μm
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Process Equipment in the Cleanroom
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Process Equipment in the Cleanroom
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Residual Gases
• The number of unwanted atoms and molecules within the environment can have a detrimental effect on dry processing.
• Both gas phase and surface effects can occur, which produce unwanted results.
• Poor quality etching could be the result or poor characteristic films could be produced.
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Monitoring and Control In-situ measuring and monitoring Non obtrusive for example : Optical Emission Spectroscopy (OES) Residual Gas Analysis (RGA) A method that provides a unique “fingerprint” of the constituents within the plasma. This consists of the source gases, products of
surface interactions and contaminants.
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Schematic of RGA Monitoring
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Mass Spectrometry Data
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Identification of Contamination
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A Methane Hydrogen Etch Process
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High Resolution Mass Scan
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Batch Processing
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Time Resolved ‘Specta’
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Complex Features Realised
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Chip-on-tile for Angled Waveguide Output
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Summary
Lots of nothing is a vacuum A good vacuum implies good cleanliness Clean processes produces enhanced yield Greater yield gives greater profitability More profit means more money Lots of nothing making lots of money Good for Business !
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All Clear ?
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Questions ?