version 15/3/2000 ccd2 - evaporators 1 evaporator:component of the ac loop

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Version 15/3/2000 CCD2 - EVAPORATORS 1 EVAPORATOR:COMPONENT OF THE AC LOOP

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Page 1: Version 15/3/2000 CCD2 - EVAPORATORS 1 EVAPORATOR:COMPONENT OF THE AC LOOP

Version 15/3/2000 CCD2 - EVAPORATORS

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EVAPORATOR:COMPONENT OF THE AC LOOP

Page 2: Version 15/3/2000 CCD2 - EVAPORATORS 1 EVAPORATOR:COMPONENT OF THE AC LOOP

Version 15/3/2000 CCD2 - EVAPORATORS

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HISTORY OF EVAPORATOR TECHNOLOGIES

ERA of the INNOVATION : - Compactness

2001

1999

1995

ERA OF THE TUBE/FIN

ERA OF THE PLATE/FIN :JAPANESE TECHNOLOGY

Thickness: 68mm to 90 mm AMERICAN

Thickness: 75mm & 80mm EUROPEAN

Thickness:65mm

ERA : the search for size reductionwith the same performance

JAPANESE TECHNOLOGY Thickness: 58mm &60 mm

EUROPEAN Thickness:60mm

GLOBALIZATION OF THE O.E.M s OF THE AUTOMOTIVE SUPPLIER

OF THE TECHNOLOGIES

QUALITY IMPROVEMENT

COMPACTNESS OF COMPONENTS

COSTS PRESSURE

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COMPARISON BETWEEN TUBE/FIN &PLATE/FIN

COMPONENTS PROCESSTubes/Fin Plates Tubes/Fin Plates

Packaging 80 mm 75 & 60mmCircuiting 3,4 or 5 rows 6 pass

Air exchanger Flat fins fins Stamping RollsFreon exchanger Hairpins Plates Extruded Stamping

Exchangersinterface

Mechanicalcontact

Clad 4045 onplates

Tube expansion Nocolokbrazing

Fluiddistribution

CapillariesElbows

Distribution platesTank

FlameUltrasonic brazing

Stamping

Connectingcores/pipes

Capillaries SleeveInsert

BrazingLockring

LockringStamping

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CIRCUITING 75mm & 60mm

SIDE-SIDE PLATE/FIN EVAPORATOR

Gas + Liquid Gas

G1AIR Inlet compressorOutlet TXV

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CIRCUITING (60mm only)

END-END PLATE/FIN EVAPORATOR

AIR

Inlet compressor

Outlet TXV

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TECHNOLOGIES OF EVAPORATORS

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60mm RANGE THERMAL PERFORMANCE

( 30°C, 60% )

200 mm

225 mm

245 mm

Qair=600kg/h

5,45,65,8

66,26,46,66,8

77,27,47,67,8

P (kW)

1.23.6 1.25.6+ 1.28.6+ 2.20.6 2.23.6+ 2.30.6+ 3.25.6+ 3.27.6+ 3.30.6+

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SURFACE TREATMENT

PHOSPHO-CHROMATISATION AND RESIN

3003 aluminum

phosphochromatisation anticorrosion

resin : mixture of mineral silicate andan organic polymer

hydrophilicity : to decrease the wet pressure drop to avoid the splashing of condensate (water carryover)fungicidal compound : to fight against growth of fungi and yeastsbacteriostatical effect : to avoid growth of some types of bacteria

0.8-1.2µm

0.1-0.5µm

G3

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SURFACE TREATMENT

Evaporatortype

Corrosionresistance

Hydrophilicity Antimicrobialeffect

Environment Odort=0

Odor afteraged test

Chromatisation+ silicate T/F CASS = 240 hSWAAT = 30 d

++ N Cr6 restrictedby ISO 14001

2 3

Phosphochromatisation+ silicate

T/F CASS = 240 hSWAAT = 30 d

++ N Cr3 2 3

Phosphochromatisation+ PU

T/F CASS = 240 hSWAAT = 40 d

_ Y Cr3 1 2

Phosphochromatisation+resin

Plate/fin CASS = 480 hSWAAT = 43 d

++ Y Cr3 2 2

FUTUREFUTURENew chromiumfree hydrophilic coatingNew chromiumfree hydrophilic coating+amtimicrobial effect+amtimicrobial effect+adhering on Nocolok aluminim+adhering on Nocolok aluminim

FUTUREFUTURENew chromiumfree hydrophilic coatingNew chromiumfree hydrophilic coating+amtimicrobial effect+amtimicrobial effect+adhering on Nocolok aluminim+adhering on Nocolok aluminim

Odor > 2 not conform

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PLATE DESIGNS

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CONCLUSION

TECHNOLOGY OF THE EVAPORATORSThe volume of the evaporators was decreased while keeping the

same level of performance. This was due to the technological advantages of the plate/fin evaporator over the tube/fin evaporator.

The optimization of the different parameters allows us to produce today evaporators with a thickness of 60 mm.

The range of the 60mm evaporators covers all the needs of the market.

This technology facilitates the standardisation of a range of evaporators and allows a large volume production process with a decrease in costs.

This last item is a strong demand from our customers.In the future, the dimensions of the evaporator are going to

decrease just like the costs.