whiteled,0.2mm., 8layer.pdf

7/28/2019 WhiteLED,0.2mm., 8Layer.pdf

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T E C H N O L O G Y U P D A T E A P R I L 2 0 1 3

As we had previously informed

about our 2012 investment and Start

up run of Multilayer PCB production.

We had launched our Multilayer PCB

4-6 Layers boards into the market and

the responses are very positive

towards this technology improvement.

Customers are interested and eager to

start the development of their new

products and technology to improve

the Competency in the Electronics

market both Local and Worldwide.

Circuit Industries Co., Ltd. had set

up a Technology Roadmap to

Continuously improve in our Products

Quality and Production&Technical

Capabilities in order to support our

High Technology demanding market.

Our technology Road map &

Improvement for 2013 is to increase

our capabilities as Follows:

1)Test Run&Launch 8 Layer PCB

2) Confirm 0.2mm. Drill hole

(Aspect Ratio 1:8)

3) Change all White Solder

Mask ink to a special White

Solder Mask for LED

Application (Better reflection

and less Discoloration)

In April 2013, We had complete

all of our 3 targets and all products are

NOW AVAILABLE

Improved Production Capabilities

FIRST TIME IN THAILAND.

FOR SMALL-MEDIUM VOLUME

MULTILAYER 4-8 LAYER PCB

ARE NOW AVAILABLE.

0.2 MM. DRILL MULTILAYER8LAYERWHITE SOLDERMASK FOR L.E.D.

CIRCUIT INDUSTRIES

FOR MOREINFORMATION:

[email protected]

HTTP://WWW.CIPCB.COMTEL: 02-8101406

-Multilayer 8 Layer-Now Available at CI

(1)
http://www.cipcb.com/http://www.cipcb.com/mailto:[email protected]:[email protected]


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HDI PCB is becoming more and

more important to the modern world

of electronics products. As the signal

transmission speed (Clock speed) has

become a very important criteria to

consider and also size restriction of the

product with higher need of application

are forcing the Electronics product

manufacturer to turn to HDI and High

Layer Count PCB for the solution.

HDI PCB consist of Blind via and

Buried via which helps transmit the

signal from one layer to another

without wasting the space with drilled

hole of PTH on the other side of the

PCB.

Blind Via requires a very high

accuracy CNC Drilling machine to drill

the exact depth that given so the signal

can transmit from Outer Layer to the

desire Inner layer without drilling

through the board. The drilled hole will

be plated so the signal can now

transmits from Layer to layer. If the

Depth is not controlled properly, it

could result a short circuit between

layer.

Buried Via can be easily

described as a PTH board inside the

Multilayer. As Mentioned, Buried via

already has a interconnection between

layer in their inner core. These PTH

holes cannot be seen from outer layer.

Only way to access these internal

circuit is to drill PTH or Blind via to the

internal PAD

High Density Interconnect (HDI)

HDI (HIGH DENSITY

INTERCONNECT) PCB

BLIND VIA, BURIED VIA

CCD PINLESS BONDING CCD EXPOSURE

NEXT DEVELOPMENT

AUTOMATICOPTICAL INSPECTION

(AOI)

FOR MOREINFORMATION:

[email protected]

HTTP://WWW.CIPCB.COMTEL: 02-8101406
http://www.cipcb.com/http://www.cipcb.com/mailto:[email protected]:[email protected]


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CAPABILITIES

website: ttp://ww .cipcb.com Email: [email protected] om

Circuit I dustries Co., L d.

Produ tion apabili ies

Small Volume Mass Volume

Max. Laye Count 8 Layer 8 Layer

Aspect Ratio 1:8 1:8

Min. Drill size 0.2 mm. 0.3 mm.

Min. boar thicknes 0.8 mm. 0.8 mm.

Min. Prep eg thickn ss 0.075 mm. 0.075 mm.

Min. copp r thickne s 1oz(35um) 1oz(35um)

Max Copp r thickne s 2 oz(70um) 2 oz (70um)

Min. line/spacing (in er layer) 0.1mm. (4mil) 0.125mm (5mil)

Min. line/spacing (Outer Layer) 0.1mm. (4mil) 0.125mm (5mil)

Min. Annu ar Ring 0.125mm (5mil) 0.125mm (5mil)

Drill Acc racy (+/-) 35 um 35 um

image registration ( /-) 75 um 75 um

Solderma k Registr tion (+/-) 75 um 75 um

Rout/Sco e Tolerance (+/-) 0.2 mm. 0.2 mm.

Blind Via yes no

Buried via yes no

Production Lead time Small Volume Mass Volume

Single Si ed 7-10 Days 10-12 days

Double Si ed 9-11 days 12-15 days

Multilaye 4 Layer 16 days 18 days


mailto:[email protected]:[email protected]://www.cipcb.com/http://www.cipcb.com/

whiteled,0.2mm., 8layer.pdf

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