why we clean; what we clean. selecting a winning combination for electronic assembly

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Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

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Page 1: Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

Why we clean; What we clean.

Selecting a Winning Combination for Electronic Assembly

Page 2: Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

Why clean?

Performance Cosmetics

Contractual Reliability

It Pays to It Pays to CLEANCLEAN

Page 3: Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

IPC/EIA J-STD 001/DRequires Clean BoardsClass B & C Electronics

• 8.3.1 No Particulate matter (all classes)– No lint, solder splash, dross, wire clippings– No loose or dislogable solder balls

• 8.3.2 Unless otherwise specified (all classes), assemblies shall be cleaned and be:– Free from flux residue (1X)– < 1.56 micrograms/cm2 NaCl equivalent ionizables

Appendix B standardizes a testing protocol to be used when implementing new flux materials or validating a cleaning process change

SIR, ROSE, Ion Chromatography

Page 4: Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

Confusion leads to poor Confusion leads to poor choiceschoices

• Saving a dollar by not cleaning may Saving a dollar by not cleaning may cost $100’s of repairs or worst, lost cost $100’s of repairs or worst, lost customerscustomers– Exponential rule of repairExponential rule of repair

• Repair @ board level = $1Repair @ board level = $1

• Repair @ assembly level = $10Repair @ assembly level = $10

• Repair @ customer level = $100Repair @ customer level = $100

Page 5: Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

Soils to Clean

Dust & Dirt Solder ballsOils Solder Paste Plating salts

Adhesives Finger prints Fluxes

Page 6: Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

Flux Type Hand solder

Wave solder

Wire solder

SMTPaste

Notes

Water soluble-Must be cleanedAbout 1/3 of market

Common Common Common Common Residues usually water solubleHigh temperature can change to non-water solubleCan use chemistry 1-5%

No-clean low residue

Common-Should be cleaned

Common Available Unusual -because of dull solder

Low solids no-cleans require heat to de-activate flux activity as the active agent evaporate only if heated

No-cleanbulk

Common Unusual because low residue is preferred

Common Common High solids no-cleans encapsulate activators in hardened flux matrixCould be a rosin or resin based flux

RRMARA

RMA commonNeeds cleaning

RMA on old military projects

Common Common Mil-F-14256 military classificationsR – Rosin non-activatedRMA – Rosin mildly activatedRA – Rosin Fully activated

Lead-free Any of the above made For higher temperature

Page 7: Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

Catagory Kyzen Petroferm Zestron other Applications Notes

AqueousWater only

Water – tapWater - DI

Water Soluble FluxesResidues usually water solubleHeat usually requiredSometimes need defoamer

Aqueous MixturesNon-reactive

I3330 AxarelEC-7RSP50

VigonSC200SC202

Some LF Fluxes, Most RMA’sWork by dissolvingmay need heatNon-foamingneutral pHDoes not affect metalsLess aggressiveLess complicated waste disposal

AqueousMixturesReactive

XJN, XJN+, 4625

Hydrex LFNew*

Atron 205, Vigon 200+

ALL FluxesReferred to as saponifierAmines react with fluxHigh pH -10 to 12Can attach metalsNeeds heat 125 to 200FMore difficult to close loop

OrganicSolvents

Cybersol MegaSolvLenium

DS-100 IPAToluene

Water Soluble and RMA Some Lead-free & no-cleanNo water – water freeClosed loop with Mega resins Combustible or flammable designAlways closed-loop

Page 8: Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

Soil type Key to success

Fluxes Process FlexibilityTime, temp, concentration, Automation

Solder balls High energy, good flux cleaning

Solder paste High energy, Process Flexibility and Waste management

Dirt & Dust High energy, Automation

Finger prints Polar/non-polar solvent

Plating salts Polar solvent - heated

Machine Oils & lubricants

Organic solvent unless water soluble

Adhesives Organic solvent, low temperatures

Page 9: Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

Soil type Key to success AAT cleaner(s)

Reflowed Fluxes Process selectionTime, temp, concentration, Automation

InlineAquaThermMegaX-CleanerEmulsionator

Solder balls High energy, good flux cleaning InlineX-cleanerAquaTherm

Solder paste High energy, chemistry selection, waste management X-cleaner

Dirt & Dust High energy CycloneInlineX-cleanerAquaTherm

Finger prints Polar/non-polar solvent MegaAquaThermInlineX-cleanerEmuslionator

Plating salts Polar solvent - heated InlineAquaThermX-cleaner

Machine Oils & lubricants Organic solvent unless water soluble MegaEmulsionatorAquaTherm

Adhesives Organic solvent, wash and rinse, high energy, time, temp X-cleanerEmulusionator

Page 10: Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

Critical Questions to answer in Selecting a Winning Cleaning Process

1. What are we cleaning?2. What standard(s) apply?3. What solvent are we using?4. What equipment is selected?5. How are we going to qualify

and control the process?