WSST200Q

CONFERENCE: February 27-March 2, 2000 • EXHIBITION: February 29-March 2,2000

Anaheim Convention Center • Anaheim, California USA

UB/TIB Hannover119 996 626

89

Technical Session 18

Advances in Flip Chip Underfills and Processing

Chairperson: John Lau, Express Packaging Systems, Inc.

"Fracture Mechanics Analysis of Low Cost Solder Bumped Flip ChipAssemblies with Imperfect Underfills"

Shi-Wei Ricky Lee, The Hong Kong University of Science and Technology, &John Lau, Express Packaging Systems 653

"Stress Measurements in Flip Chip on Board Assemblies Using PiezoresistiveTest Chip"Yida Zou, Ph.D., Jeffery C. Suhling, A. K. M. Mian, M. Kaysar Rahim, Nokia

Research Center, & R. Wayne Johnson, Richard Jaeger, & Srikanth Ragam, Dept.of Electrical Engineering- Auburn University 661

"Implementation of Flip Chip Bumping for Volume Production: Design and

Reliability Aspects"Hong Yang, Ph.D., J. Leal, Ph.D. & H. Balkan, Ph.D., Flip Chip Technologies 674

"Issues in Wafer Level Flip Chip Underfills"

Luu Nguyen, Ph.D., H. Nguyen, C. Quentin & E. Warner, National Semiconductor

Corp.

1

685

"Reliability of Eutectic Sn-Pb Solder Bumped Flip Chip Assemblies"

Shi-Wei Ricky Lee, Xingjia Huang, The Hong Kong University of Science and

Technology, & Christine Kallmayer & Rolf Aschenbrenner, Fraunhofer-Institute

for Reliability and Microintegration IZM- Berlin, Germany 700

* Paper not available at time of publication; contact speaker for more information

Technical Session 19

PCB Test Strategies and Alternatives

Chairperson: Ray Dellecker, JTAG Technologies

"Boundary Scan as a Practical PCB Test Strategy"Ray Dellecker, JTAG Technologies 709

"IEEE 1394 as a Test Technology"Greg Hill, Agilent Technologies 716

"Test Strategies for the Modern PCB Manufacturer"

John Ledden, GenRad, Inc. 724

"Building Hybrid Test Systems with VXI, PXI, and GPIB"

Chandran Nair, National Instruments 735

"PXI Technology in Action"

Robert Stasonis, GenRad, Inc. 741

"Process Optimization for Assembly of Advanced Packages at OptimalQuality and Costs"

Robert Feuerstein & Klaus Feldman, Institute for Manufacturing Automation

and Production Systems, University Erlangen, Nuremberg 752

1

* Paper not available at time of publication; contact speaker for more information

Technical Session 20

Accelerated Reliability Techniques and Results

Chairperson: Harry McLean, AT&T Wireless

"HALT and HASS- Testing With a Different Purpose"Neill Doertenbach, Qualmark Corp. 765

"Why Continue to Try Proving that HALT Really Works for Electronic Parts?"Robert Gusciora, Ultimate Technology Corporation 774

"Crackled Multilayer Chip Capacitors- How to Avoid Them"

Kent Langston, PRECO, & Joe Keller, Joe Keller Associates, Inc. 785

"Effectiveness of Halt & Hass"

Mark Morelli, Otis Elevator Company 801

"HASS Development Methodology: How To Develop A Screen, When To

Change A Screen, And When To Re-Prove A Screen"

Mike Silverman, Qualmark Corp. 806

"Why HALT Cannot Produce A Meaningful MTBF Number and Why This

Should Not Be A Concern"

Mike Silverman, Qualmark Corp. 813

* Paper not available at time of publication; contact speaker for more information

Technical Session 21

PWB Surface Finishes That Meet the Requirementsof High Density Interconnection

Chairperson: James Langan, J.P. Langan & Associates, Inc.

"SIPAD ssd.: Technology Update: Applications and Experiences in the Field"Matthew Kehoe, Midwest Printed Circuit Services, Atlanta 821

"Solderability and Technical Advantages of Various Surface Finishes on PWB's" *

Gerard O'Brian, Photocircuits Corporation

"Production Application of Flat Solderable Tin Finishes"David Ormerod, Dexter Electronic Materials 860

"Introduction of the Immersion Silver Solderability Coating Into Production"Dr. J. Lee Parker, Visionsystems 871

"OSP-The Next Generation"

Karl Wengenroth & Eric Stafstrom, Enthone OMI 875

* Paper not available at time of publication; contact speaker for more information

3 Technical Session 22 1

Advancement in Microelectronic Packaging

Chairperson: Tom Chung, First International Computer Test and Assembly (FICTA)

"Process Strategies: Attaching Thermally Enhanced Packages to Surface

Mount Pads"

Jeff Kennedy & Francis Khoo, Manufacturers' Services Ltd. 887

"High Reliability, High Density, Low Cost Packaging Systems for Matrix

Systems for Matrix BGA and CSP by Vacuum Printing EncapsulationSystems (VPES)"Atsushi Okuno, Japan REC Co, Ltd. 894

"Evaluation and Stress Analysis of Adhesives and Encapsulants for LargeArea Device Bonding in Chip-on-Board Applications"Dale Swanson, Boeing North America, & Leonard Enlow, Electronic PackagingAssociates oyo

"Flip Chip Diversity: Effects on Assembly"Kris Slesinger, Solectron Corporation 907

"A Low Cost and Reliable Wafer Level Chip Scale Package"Chris Chang, Ph.D., John Lau, Express Packaging Systems, Inc., & Tom Chung,

FICTA, Ricky Lee, The Hong Kong University of Science and Technology 920

* Paper not available at time of publication; contact speaker for more information

Technical Session 23

Stencil Printing Issues

Chairperson: Mark Whitmore, DEK Printing Machines, Ltd.

"Evaluation of the Printability Of No-Clean and Water Soluble Solder Pastes"

Jasbir Bath & Emmanuelle Crombez, Solectron Corporation 931

"Stencil Related to % Paste Release and Aspect/Area Ratio"William Coleman, Photo Stencil, Inc. 946

"Process Optimization Using Automated Post Print Inspection Techniques"Clive Ashmore, DEK Printing Machines Ltd. 954

"Towards the Automation of Wafer Bumping using Stencil Printing andEnclosed Printheads"

Jeff Schake & Mark A. Whitmore, Dover Technologies (DEK)- Dover

Technologies SMT Laboratory 957

]

I Technical Session 24 i

Factory Manufacturing Line

Chairperson: Robert Hanson, Americom Test & SMT Technology, Inc.

"In-Circuit Boundary SCAN Connection Test Ground Bounce: A Case Studyin Prevention and Cures"

Raymond Balzer & Phil King, Agilent Technologies 973

"Designing for Testability Using Flying Probes"

Dave Sigillo, GenRad, & Luca Corli, Seica, s.r.l 984

"A Novel Method for Determining the Pin Testability of Solder Flux Residue"

Richard Lathrop, Heraeus 1000

"You Say You Want A Revolution "

Bob Neal, Agilent Technologies 1008

"The Process Benefits and Implementation Issues of Automated Board

Handling In-Circuit Test"

David Dooley, TSL-America 1018

"ICT is Dead, Long Live ICT" *

Mike Smith, GenRad

* Paper not available at time of publication; contact speaker for more information

I Technical Session 25 I

Advances in Soldering Technology

Chairperson: Phil Zarrow, ITM, Inc.

"Thermal Profiling in the Twenty-first Century"Greg Jones, KIC Thermal Profiling 1035

"Case Study on Water Soluble Paste"

Heather Wuttke, Kester Solder 1044

"Metal Stencil Overview"

Barry Goukler, Metal Etching Technology 1057

"Ceramic Ball Grid Array Solder Joint Thermal Fatigue Life Enhancement"T. Eric Wong & A.H. Matsunaga, Raytheon Systems 1066

§ Technical Session 26 B

Electronics Manufacturing Management 101

Chairperson: TBD

"Supplemental Staffing: When You Have To Choose"

Bill Zavatchin, Manpower International, Inc. 1081

* Paper not available at time of publication; contact speaker for more information

Technical Session 27

Lead Free Global Impact

Chairperson: Robert Herber, Alpha Metals

"Wetting Characteristics of Lead Free Solders for High Volume SurfaceMount Application"Mulugeta Abtew, SCI Systems, Inc. 1089

"Lead-Alloy Trends for The Assembly of Mixed Technology PWB's"Robert Herber. Alpha Metals 1091

"Lead-Free Solder and Potential Effect on X-Ray Imaging"Jeremy Jessen & Richard Pease, Agilent Technologies 1094

"Economics and Implications of Moving to Lead-Free Assembly"Alan Rae & Ronald Lasky, Ph.D., P.E., Cookson Electrics 1099

1

1Technical Session 28

Electronics Manufacturing Service Providers: New Technology Introduction

Sponsored by Advanced Packaging Magazine

Chairperson: Greg Reed, IHS Publishing

"Challenges in Technology Evolution in the EMS Environment" *

TBA

"Flip Chip" *

TBA

"CSP Technology" *

TBA

* Paper not available at time of publication; contact speaker for more information

Technical Session 29

Vision Testing

Chairperson: Michael Keller, ASTE, Inc.

"Design for Testability Guidelines in a Combined X-Ray and In-Circuit Test

Environment"

Joe Kirschling, Agilent Technologies 1111

"Test Strategies: Leveraging Distributed Test Solutions for Limited Access

Designs"Kevin Unwin, Manufacturers' Services Ltd. 1126

"Economics of Automated X-Ray Inspection (AXI)"Colin Charette, Agilent Technologies 1133

"Implementation Strategies for Automated Optical Inspection: Case Studies

and Results"

Wesley Huffstutter, Hank Ortiz & Thomas Eskridge, Intelligent Reasoning

Systems, Inc. 1138

1

1Technical Session 30

Specific Soldering Methods

Chairperson: Armin Rahn, Ph.D., rahn-tec

"Is Nitrogen Necessary for Lead-Free"

Jochen Elbert, SEHO GmbH 1149

"Full-Tunnel N2-Technology"Medhet Said, Visteon Automotive Systems, & Armin Rahn, Ph.D., rahn-tec 1156

"Evaluating Nitrogen Storage As An Alternative To Baking Moisture/Reflow

Sensitive Components"Martin Theriault, C. Carsac & P. Blostein, Air Liquide 1162

"Selective Soldering with Softbeam Technology: A User's Perspective"Lothar Baer, kiekert AG, Germany 1164

"Two Side Printed Circuit Board Assembly of uBGA on RIMM(TM)"Chris Chang, Ph.D., John Lau, Henry Chao, Express Packaging Systems, &Nader Gamini, Rambus, Inc. 1172

Paper not available at time of publication; contact speaker for more information

Technical Session 31 1Design for Manufacturability

Chairperson: Bob Barnes, Northrop Grumman Electronic Systems

"Design Robustness for Improving Manufacturing Rolled Yield"Ivan Chambers, Munro & Associates 1183

"Lean Enterprise"Rick Grimes & Angelo Angeleri, IBM Corporation 1189

"Linking SPC in Product Design and Manufacture"

William Hultgren, Concourse Corp. 1195

"Technical Aspects in Designing for Manufacturability" *

Dan Shea, Celestica Inc.

Technical Session 32

Microvia Materials and Fabrication

Chairperson: Harvey Miller, Kirk-Miller Associates

"High Density PBC Cost Performance Tradeoffs" *

George Dudnikov, Sanmina Corporation

"The Impact of Material and Via Formation Choices on Microvia Capabilityand Capacity"Brian McDermott, Dynamic Details 1201

"Innovations in Microvia Substrates"

Bill Varnell, Ph.D., Polyclad Laminates 1210

"Microvia Friendly Materials and Process"

Todd Young, Isola Laminate Systems 1211

"An Overview of Microvia Technologies"Chris Chang, Ph.D., John Lau, Express Packaging Systems, Inc. 1221

1

* Paper not available at time of publication; contact speaker for more information

I Technical Session 33 §

Outsourcing Session

Chairperson: Roy Rimington, International Management Services

"Managing a Test Organization in a Electronic Contract ManufacturingEnvironment"

Francisco Javier Hernandez, K*TEC Electronics, Inc. 1247

"Economic Value Brings Bacon Home to Capital Equipment Manufacturers

Who Outsource"

Milt Gregory, Gregory Associates 1252

"Low Cost Entry Level for Outsourcing" *

P.T. Tan, Far East Network

"Using Web-Based SPC Deliverables to Satisfy Customer AcceptanceRequirements"Jeffery Cawley, Northwest Analytical, Inc. 1255

"Recent Trends and Field Findings in Outsourcing"Randall Sherman, New Venture Consulting 1260

1Technical Session 34

Machine Vision as it Applies to the Electronics Industry—Part 2

Chairperson: Michelle Chaput, Imaging Technology, Inc.

"Image Is Everything: Machine Vision Lightning Techniques for Electronic

Assembly"Roger Allen Burns, RVSI Northwest Robotics 1271

"Specification and Qualifications of Machine Vision Technology in the SMT

Process"

David Clark & Donald Rohrer, GSI Lumonics 1283

"Traceability Options for PCB and Electronics Assembly"Scott McGill & Luis A. Figarella, RVSI Acuity-CiMatrix 1290

* Paper not available at time of publication; contact speaker for more information